CN108172675A - Automobile lamp pcb board radiator structure - Google Patents
Automobile lamp pcb board radiator structure Download PDFInfo
- Publication number
- CN108172675A CN108172675A CN201711047630.4A CN201711047630A CN108172675A CN 108172675 A CN108172675 A CN 108172675A CN 201711047630 A CN201711047630 A CN 201711047630A CN 108172675 A CN108172675 A CN 108172675A
- Authority
- CN
- China
- Prior art keywords
- copper
- epoxy resin
- cabling
- resin board
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Abstract
The present invention provides a kind of automobile lamp pcb board radiator structure, including epoxy resin board, copper cabling is provided between the epoxy resin board, LED is arranged on epoxy resin board upper end, the LED lower parts are provided with nitridation aluminium sheet, copper cabling is again provided at the top of the epoxy resin board, the nitridation aluminium sheet lower end is provided with copper-clad plate.Nitridation aluminium block interlayer is located at immediately below LED light, to realize best heat dissipation effect.Because aln surface is covered with layers of copper, therefore cabling still can be etched, but because aluminium nitride cannot drill in top layer, therefore can realize and drill in the FR4 regions outside aluminium nitride, to realize heat dissipation and necessary cabling is led to internal layer.Because aluminium nitride insulate in itself, therefore internal layer nitridation aluminium zones, without copper, the intermediate copper layer of all internal layer cablings, via and paving copper in periphery FR4 regions is completed, and satisfaction can radiate but also the design requirement of highly dense cabling.
Description
Technical field
The present invention relates to automobile lamp pcb board base material laminated construction fields more particularly to a kind of automobile lamp pcb board to radiate
Structure.
Background technology
Pcb board is the core component of electronic product, and most electrical properties of electronic product, hot property are determined by it.It passes
The glass epoxy materials substrate such as FR4 of system is merely able to support the LED of below 0.5W.It is more next with the increase of LED luminance
More LED powers has been more than this limit value, although LED particle and plate face contact area very little, total consumption electric energy is not also high,
But it is only inadequate by FR4 layers of copper heat dissipation areas because circuit board size is limited by practical structures space, lead to local pyrexia amount very
Greatly, heat dissipation performance becomes an important consideration factor of current board design, therefore has started gradually to use high heat radiating metal
Substrate and ceramic substrate are to solve heat dissipation problem.Especially aluminium nitride material, thermal conductivity is good, and thermal conductivity factor is up to 120-180w/
Mk, coefficient of thermal expansion is small, is good heat shock resistance material, can reduce thermal stress and thermal deformation, is very suitable for LED applications.Mesh
It is preceding to have there is quite a lot of LED product to use really, but 2~3 times of price, about metal substrate, and inconvenient punching and can not
Internal layer is created, the pcb board of cabling complexity is not applied to.
Invention content
The object of the present invention is to provide a kind of automobile lamp pcb board radiator structure, by only under the position where LED light
Aluminium nitride is embedded in the FR4 substrates of side, to reduce cost, while retains the advantage that FR4 other parts can punch, realizes PCB
Plate internal layer cabling and can improve its heat dissipation performance.
The present invention provides a kind of automobile lamp pcb board radiator structure, including epoxy resin board, between the epoxy resin board
Copper cabling is provided with, LED is arranged on epoxy resin board upper end, and the LED lower parts are provided with nitridation aluminium sheet, the epoxy resin board
Top is again provided with copper cabling, and the nitridation aluminium sheet lower end is provided with copper-clad plate.
Further improvement lies in that：It is provided on the copper cabling being located at the top of epoxy resin board on the left of the nitridation aluminium sheet logical
Hole, described nitrogenize are provided with blind hole on the right side of aluminium sheet on the copper cabling at the top of epoxy resin board.
Further improvement lies in that：Copper cabling of the copper cabling area between epoxy resin board at the top of the epoxy resin board
Area 80 ~ 100%,
Further improvement lies in that：Polypropylene resin layer is provided between the epoxy resin board and nitridation aluminium sheet.
Further improvement lies in that：The nitridation surface of aluminum plate is provided with marker, and nitridation aluminium sheet is carried out by marker
Instruction.
Top layer copper sheet area should ensure that the 80%-100% of bottom copper sheet area, and the area of several internal layer copper sheets is close as possible.
The copper sheet thickness of non-cabling internal layer is adjusted, to adjust the thickness in FR4 regions, to ensure and nitrogenize the thickness of aluminium zones
Unanimously.
In gerber files, one layer is created, nitridation aluminium zones are indicated, so as to supplier's making sheet.
Beneficial effects of the present invention：Nitridation aluminium block interlayer is located at immediately below LED light, to realize best heat dissipation effect.Because of nitrogen
Change aluminium surface and be covered with layers of copper, therefore cabling still can be etched, but because aluminium nitride cannot drill, therefore can be in aluminium nitride in top layer
Drilling is realized in outer FR4 regions, to realize heat dissipation and necessary cabling is led to internal layer.Because aluminium nitride insulate, therefore interior in itself
Layer nitridation aluminium zones are completed without copper, the intermediate copper layer of all internal layer cablings, via and paving copper in periphery FR4 regions, and satisfaction can
Heat dissipation and the design requirement of the highly dense cabling of energy.
Description of the drawings
Fig. 1 is the structure diagram of the present invention.
Fig. 2 is the mounting structure schematic diagram of the nitridation aluminium sheet of the present invention.
Wherein：1- epoxy resin boards, 2- copper cablings, 3-LED, 4- nitridation aluminium sheet, 5- copper-clad plates, 6- through-holes, 7- blind holes, 8-
Marker, 9- polypropylene resin layers.
Specific embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be further described, the embodiment
It is only used for explaining the present invention, be not intended to limit the scope of the present invention..
As shown in Figs. 1-2, the present embodiment provides a kind of automobile lamp pcb board radiator structure, including epoxy resin board 1, institute
It states and is provided with copper cabling 2 between epoxy resin board 1, LED3 is arranged on 1 upper end of epoxy resin board, and the LED3 lower parts are provided with nitrogen
Change aluminium sheet 4,1 top of epoxy resin board is again provided with copper cabling 2, and 4 lower end of the nitridation aluminium sheet is provided with copper-clad plate 5.
Being located on the copper cabling 2 at 1 top of epoxy resin board for 4 left side of nitridation aluminium sheet is provided with through-hole 6, and the nitridation aluminium sheet 4 is right
Being located on the copper cabling 2 at 1 top of epoxy resin board for side is provided with blind hole 7.2 face of copper cabling at 1 top of epoxy resin board
The 80 ~ 100% of the area of copper cabling 2 of the product between epoxy resin board 1 are set between the epoxy resin board 1 and nitridation aluminium sheet 4
It is equipped with polypropylene resin layer 9.4 surface of the nitridation aluminium sheet is provided with marker 8, and nitridation aluminium sheet 4 is referred to by marker 8
Show.Nitridation aluminium block interlayer is located at immediately below LED light, to realize best heat dissipation effect.Because aln surface is covered with layers of copper, therefore
Top layer still can etch cabling, but because aluminium nitride cannot drill, therefore can realize and drill in the FR4 regions outside aluminium nitride, with
It realizes heat dissipation and necessary cabling is led into internal layer.Because aluminium nitride insulate in itself, therefore internal layer nitridation aluminium zones are without copper, all interior
The intermediate copper layer of layer cabling, via and paving copper in periphery FR4 regions is completed, and satisfaction can radiate but also the design of highly dense cabling will
It asks.
Claims (5)
1. a kind of automobile lamp pcb board radiator structure, including epoxy resin board（1）, the epoxy resin board（1）Between be provided with
Copper cabling（2）, LED（3）It is arranged on epoxy resin board（1）Upper end, it is characterised in that：The LED（3）Lower part is provided with aluminium nitride
Plate（4）, the epoxy resin board（1）Top is again provided with copper cabling（2）, the nitridation aluminium sheet（4）Lower end, which is provided with, covers copper
Plate（5）.
2. automobile lamp pcb board radiator structure as described in claim 1, it is characterised in that：The nitridation aluminium sheet（4）Left side
Positioned at epoxy resin board（1）The copper cabling at top（2）On be provided with through-hole（6）, the nitridation aluminium sheet（4）Right side is located at epoxy
Resin plate（1）The copper cabling at top（2）On be provided with blind hole（7）.
3. automobile lamp pcb board radiator structure as described in claim 1, it is characterised in that：The epoxy resin board（1）Top
Copper cabling（2）Area is epoxy resin board（1）Between copper cabling（2）Area 80 ~ 100%.
4. automobile lamp pcb board radiator structure as described in claim 1, it is characterised in that：The nitridation aluminium sheet（4）Surface is set
It is equipped with marker（8）, pass through marker（8）To nitrogenizing aluminium sheet（4）It is indicated.
5. automobile lamp pcb board radiator structure as described in claim 1, it is characterised in that：The epoxy resin board（1）With nitrogen
Change aluminium sheet（4）Between be provided with polypropylene resin layer（9）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711047630.4A CN108172675A (en) | 2017-10-31 | 2017-10-31 | Automobile lamp pcb board radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711047630.4A CN108172675A (en) | 2017-10-31 | 2017-10-31 | Automobile lamp pcb board radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108172675A true CN108172675A (en) | 2018-06-15 |
Family
ID=62526794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711047630.4A Withdrawn CN108172675A (en) | 2017-10-31 | 2017-10-31 | Automobile lamp pcb board radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108172675A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056418A (en) * | 2010-11-30 | 2011-05-11 | 乐健线路板〔珠海〕有限公司 | Preparation method for printed circuit board with insulating miniature radiators |
| CN104470215A (en) * | 2014-11-26 | 2015-03-25 | 乐健科技（珠海）有限公司 | Manufacturing method for printed circuit board with micro radiators and obtained product |
| CN106063387A (en) * | 2013-12-12 | 2016-10-26 | At&S奥地利科技与系统技术股份公司 | Method for embedding a component in a printed circuit board |
| CN107222983A (en) * | 2017-06-09 | 2017-09-29 | 深圳市景旺电子股份有限公司 | The pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module |
-
2017
- 2017-10-31 CN CN201711047630.4A patent/CN108172675A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056418A (en) * | 2010-11-30 | 2011-05-11 | 乐健线路板〔珠海〕有限公司 | Preparation method for printed circuit board with insulating miniature radiators |
| CN106063387A (en) * | 2013-12-12 | 2016-10-26 | At&S奥地利科技与系统技术股份公司 | Method for embedding a component in a printed circuit board |
| CN104470215A (en) * | 2014-11-26 | 2015-03-25 | 乐健科技（珠海）有限公司 | Manufacturing method for printed circuit board with micro radiators and obtained product |
| CN107222983A (en) * | 2017-06-09 | 2017-09-29 | 深圳市景旺电子股份有限公司 | The pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180615 |