CN207305058U - Metal core circuit board - Google Patents
Metal core circuit board Download PDFInfo
- Publication number
- CN207305058U CN207305058U CN201721288371.XU CN201721288371U CN207305058U CN 207305058 U CN207305058 U CN 207305058U CN 201721288371 U CN201721288371 U CN 201721288371U CN 207305058 U CN207305058 U CN 207305058U
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- CN
- China
- Prior art keywords
- circuit board
- metal core
- layer
- bearing bed
- core circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a kind of metal core circuit board, it includes metal core, first circuit board, second circuit board and heat dissipation hole body；Metal core includes first surface and the second surface being oppositely arranged with first surface；First circuit board is set on the first surface, and first circuit board includes the first bearing bed of setting on the first surface and the first circuit layer for being formed at the first bearing bed；Second circuit board is set on a second surface, and second circuit board includes the second bearing bed of setting on a second surface and the second circuit layer for being formed at the second bearing bed；The hole body that radiates is used for for the big component heat dissipation of caloric value, and heat dissipation hole body is penetrated through to second circuit layer, heat dissipation hole body from the first circuit layer includes thermal vias, the first insulating layer for covering thermal vias inner wall and the heat dissipating layer being arranged on the first insulating layer；At least one component connects the heat dissipating layer.The metal core circuit board of the utility model improves the radiating efficiency of the utility model by the setting of the hole body that radiates.
Description
Technical field
Field of circuit boards is the utility model is related to, more particularly to a kind of metal core circuit board.
Background technology
Traditional printed circuit board (PCB) (PCB, Printed Circuit Board) is by layers of copper, epoxy resin and glass-fiber-fabric
Composition.Its epoxy resin and glass-fiber-fabric are the non-conductor of heat, and heat dissipation performance is poor；Such as work long hours in high temperature shape
Under state, epoxy resin can accelerated ageing so that the service life of printed circuit board (PCB) can greatly shorten, simultaneously as epoxy resin and
The coefficient of expansion is inconsistent between glass-fiber-fabric, works at high operating temperatures, and the possibility for functional disorder occur greatly increases.
The existing printed circuit board (PCB) with Metal Substrate, its Metal Substrate are arranged on the side of printed circuit board (PCB).It is such to set
Although heat dissipation can be achieveed the purpose that by putting, heating element apart from Metal Substrate relatively far away from, heat conduction on it is more slow,
It has impact on the effect of heat dissipation.
Therefore, it is necessary to a kind of metal core circuit board with great heat radiation effect is provided, to solve above-mentioned technical problem.
Utility model content
The utility model embodiment provides a kind of metal core circuit board with great heat radiation effect；To solve existing gold
Belong to the bad technical problem of the heat dissipation effect of core circuit board.
The utility model embodiment provides a kind of metal core circuit board, it includes：
Metal core, including first surface and the second surface that is oppositely arranged with the first surface；
First circuit board, is set on the first surface, and the first circuit board includes being arranged on the first surface
On the first bearing bed and be formed at the first circuit layer of first bearing bed；
Second circuit board, is arranged on the second surface, and the second circuit board includes being arranged on the second surface
On the second bearing bed and be formed at the second circuit layer of second bearing bed；
Radiate hole body, for being penetrated through for the big component heat dissipation of caloric value, the heat dissipation hole body from first circuit layer
To the second circuit layer, the heat dissipation hole body includes a thermal vias, the first insulating layer of the covering thermal vias inner wall
With the heat dissipating layer being arranged on first insulating layer；
At least one component connects the heat dissipating layer.
In the utility model, the heat dissipating layer is cylindrical in shape structure, and the both ends of the heat dissipating layer are to outer circumferential sides direction
Cricoid lug is provided with, the component is connected to the lug by a pin.
In the utility model, the heat dissipating layer, which encloses to set, to be defined to form a heat-dissipating space, and the heat-dissipating space interior sealing is set
It is equipped with phase-change material.
In the utility model, first bearing bed is connected to the first surface by adhesive linkage.
In the utility model, second bearing bed is connected to the second surface by adhesive linkage.
In the utility model, the metal core circuit board further includes the through hole for penetrating through the metal core circuit board, institute
State covering on the hole wall of through hole and be provided with a layers of copper, the layers of copper electrically connects with first circuit layer and second circuit layer
Connect；
Wherein, the layers of copper is connected by the second insulating layer with the metal core.
In the utility model, the first surface and second surface are coarse surface.
In the utility model, first bearing bed and the second bearing bed are that insulating materials is made.
In the utility model, first circuit layer and second circuit layer be copper into.
In the utility model, the adhesive linkage is pure glue prepreg.
Compared to the metal core circuit board of the prior art, metal core circuit board the setting by the hole body that radiates of the utility model
Put, improve the radiating efficiency of the utility model；The bad technology of heat dissipation effect for solving existing metal core circuit board is asked
Topic.
Brief description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below in embodiment
Required attached drawing is briefly described.Drawings in the following description are only the section Example of the utility model, for
For those of ordinary skill in the art, without creative efforts, other can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is the structure diagram of the preferred embodiment of the metal core circuit board of the utility model.
Embodiment
The schema in attached drawing is refer to, wherein identical element numbers represent identical component.The following description is to be based on
Illustrated the utility model specific embodiment, it is not construed as limitation the utility model other specific realities not detailed herein
Apply example.
Fig. 1 is refer to, Fig. 1 is the structure diagram of the preferred embodiment of the metal core circuit board of the utility model.This reality
Applying the metal core circuit board of example includes metal core 10, first circuit board 20, second circuit board 30 and heat dissipation hole body 40.
Metal core 10 includes first surface and the second surface being oppositely arranged with first surface；
First circuit board 20 is set on the first surface, and first circuit board 20 includes setting on the first surface first to hold
Carrier layer 21 and the first circuit layer 22 for being formed at the first bearing bed 21；Second circuit board 30 is set on a second surface, the second electricity
Road plate 30 includes the second bearing bed 31 of setting on a second surface and the second circuit floor 32 for being formed at the second bearing bed 31；
Heat dissipation hole body 40 is used to radiate for the big component 50 of caloric value, heat dissipation hole body 40 from the first circuit layer 22 penetrate through to
Second circuit layer 32, heat dissipation hole body 40 include a thermal vias 41, the first insulating layer 42 for covering 41 inner wall of thermal vias and set
Put the heat dissipating layer 43 on the first insulating layer 42；
At least one component 50 connects heat dissipating layer 43.
In the present embodiment, passing through the setting for the hole body 40 that radiates so that component 40 connects heat dissipation hole body 40 by a pin,
Conduct into heat dissipation hole body 40, radiate so as to reach the caloric value of part component 40, so as to improve dissipating for the present embodiment
The thermal efficiency.
In addition, the setting of metal core 10 so that printed circuit board (PCB) has good thermal diffusivity, electromagnetic shielding capability and height
Heat endurance under temperature.Meanwhile metal core 10 is arranged between first circuit board 20 and second circuit board 30, and pass through adhesive linkage
60 are attached, when printed circuit board (PCB) is worked alternatively in the condition of high temperature and low-temperature condition, the first surface of metal core 10 and the
The direction of the internal stress on two surfaces is on the contrary, cancel out each other so that metal core 10 forms the connection of stabilization with adhesive linkage 60, avoids
The appearance of lamination.
The setting of first insulating layer 42, plays the role of insulation to metal core 10.The setting of heat dissipating layer 43, is played good
Heat dissipation effect, optional heat dissipating layer 43 are metal layer, preferably aluminium lamination.
In the present embodiment, heat dissipating layer 43 is cylindrical in shape structure, and the both ends of heat dissipating layer 43 are provided with to outer circumferential sides direction
Cricoid lug 431, component 50 are connected to lug 431 by a pin.The setting of lug 431 not only increases heat dissipating layer 43
With the connection area of component 50, and the stability that heat dissipating layer 43 is arranged on the first insulating layer 42 is improved.
Wherein, heat dissipating layer 43 encloses to set and defines to form a heat-dissipating space, and heat-dissipating space interior sealing is provided with phase-change material 44.Phase
Become the setting of material so that the heat that component 50 is spread out of is absorbed, so as to reach under the transmission of heat dissipating layer 43 by phase-change material
The purpose of heat dissipation.Certainly, in the utility model, phase-change material can not also be set in heat-dissipating space, is radiated by gravity-flow ventilation.But
The efficiency of gravity-flow ventilation heat dissipation is unsatisfactory.
In the present embodiment, the first bearing bed 21 is connected to first surface by adhesive linkage 60.Second bearing bed 31 passes through
Adhesive linkage 60 is connected to second surface.Adhesive linkage 60 is pure glue prepreg.
Further, first surface and second surface are coarse surface.For example when metal core 10 is aluminium base, it can pass through
Anodized, makes roughened layer on the aluminium base surface, can so strengthen the stable connection of metal core 10 and adhesive linkage 60
Property, improve the two combination power bonded.
In the present embodiment, metal core circuit board further includes the through hole 71 of perforation metal core circuit board, through hole 71
Covering is provided with a layers of copper 72 on hole wall, and layers of copper 72 is electrically connected with the first circuit layer 22 and second circuit layer 32；Wherein, layers of copper
72 are connected by the second insulating layer 73 and metal core 10.
In the present embodiment, the first bearing bed 21 and the second bearing bed 31 are that insulating materials is made.
In the present embodiment, the first circuit layer 22 and second circuit layer 32 be copper into.
The manufacturing process of the present embodiment is：
First, drilling processing is carried out to metal core 10, has formed the thermal vias 41 on follow-up printed circuit board (PCB) and perforation
Hole 71, after with insulating resin filling through hole 71 drilling；
Then, first circuit board 20 and second circuit board 30 are passed through into adhesive linkage 60 respectively corresponding and metal core 10 the
One surface carries out lamination with second surface and connects；
Then, heavy copper covering is carried out to through hole 71 so that the first circuit layer 22 and second circuit layer 32 turn on；
Secondly, drill to printed circuit board (PCB), open up out through hole 71 and thermal vias 41, and in thermal vias 41
Covering insulating resin is to form the first insulating layer 42；The endoporus then formed in the first insulating layer 42 sets heat dissipating layer 43 and filling
Phase-change material, and seal.
Finally, the first circuit layer 22 on printed circuit board (PCB) and second circuit layer 32 are performed etching and forms circuit.
In this way, just complete the manufacturing process of the present embodiment.
Compared to the metal core circuit board of the prior art, metal core circuit board the setting by the hole body that radiates of the utility model
Put, improve the radiating efficiency of the utility model；The bad technology of heat dissipation effect for solving existing metal core circuit board is asked
Topic.
In conclusion although the utility model is disclosed above with preferred embodiment, above preferred embodiment is not used
To limit the utility model, those of ordinary skill in the art, without departing from the spirit and scope of the utility model, can make
It is various to change and retouch, therefore the scope of protection of the utility model is subject to the scope that claim defines.
Claims (10)
- A kind of 1. metal core circuit board, it is characterised in that including：Metal core, including first surface and the second surface that is oppositely arranged with the first surface；First circuit board, is set on the first surface, and the first circuit board includes setting on the first surface First bearing bed and the first circuit layer for being formed at first bearing bed；Second circuit board, is arranged on the second surface, and the second circuit board includes being arranged on the second surface Second bearing bed and the second circuit layer for being formed at second bearing bed；Radiate hole body, for being penetrated through for the big component heat dissipation of caloric value, the heat dissipation hole body from first circuit layer to institute Second circuit layer is stated, the heat dissipation hole body includes a thermal vias, the first insulating layer for covering the thermal vias inner wall and sets Put the heat dissipating layer on first insulating layer；At least one component connects the heat dissipating layer.
- 2. metal core circuit board according to claim 1, it is characterised in that the heat dissipating layer is cylindrical in shape structure, and described The both ends of heat dissipating layer are provided with cricoid lug to outer circumferential sides direction, and the component is connected to described convex by a pin Ear.
- 3. metal core circuit board according to claim 2, it is characterised in that the heat dissipating layer, which encloses to set, to be defined to form a heat dissipation Space, the heat-dissipating space interior sealing are provided with phase-change material.
- 4. metal core circuit board according to claim 1, it is characterised in that first bearing bed is connected by adhesive linkage In the first surface.
- 5. metal core circuit board according to claim 1, it is characterised in that second bearing bed is connected by adhesive linkage In the second surface.
- 6. metal core circuit board according to claim 1, it is characterised in that the metal core circuit board further includes perforation institute The through hole of metal core circuit board is stated, is covered on the hole wall of the through hole and is provided with a layers of copper, the layers of copper and described first Circuit layer and second circuit layer are electrically connected；Wherein, the layers of copper is connected by the second insulating layer with the metal core.
- 7. metal core circuit board according to claim 1, it is characterised in that the first surface and second surface are thick Change surface.
- 8. metal core circuit board according to claim 1, it is characterised in that first bearing bed and the second bearing bed are equal It is made of insulating materials.
- 9. metal core circuit board according to claim 1, it is characterised in that first circuit layer and second circuit layer are equal For copper into.
- 10. metal core circuit board according to claim 4 or 5, it is characterised in that the adhesive linkage is pure glue semi-solid preparation Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721288371.XU CN207305058U (en) | 2017-09-30 | 2017-09-30 | Metal core circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721288371.XU CN207305058U (en) | 2017-09-30 | 2017-09-30 | Metal core circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207305058U true CN207305058U (en) | 2018-05-01 |
Family
ID=62414620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721288371.XU Expired - Fee Related CN207305058U (en) | 2017-09-30 | 2017-09-30 | Metal core circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207305058U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110740564A (en) * | 2019-10-28 | 2020-01-31 | 珠海杰赛科技有限公司 | dense network multilayer printed circuit board and processing method thereof |
| WO2021035762A1 (en) * | 2019-08-31 | 2021-03-04 | 庆鼎精密电子（淮安）有限公司 | Circuit board having heat-dissipation structure and preparation method therefor |
| CN116779756A (en) * | 2023-07-12 | 2023-09-19 | 东莞市谷麦光学科技有限公司 | LED luminescent plate and display device |
-
2017
- 2017-09-30 CN CN201721288371.XU patent/CN207305058U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021035762A1 (en) * | 2019-08-31 | 2021-03-04 | 庆鼎精密电子（淮安）有限公司 | Circuit board having heat-dissipation structure and preparation method therefor |
| CN110740564A (en) * | 2019-10-28 | 2020-01-31 | 珠海杰赛科技有限公司 | dense network multilayer printed circuit board and processing method thereof |
| CN110740564B (en) * | 2019-10-28 | 2021-09-24 | 珠海杰赛科技有限公司 | Processing method of dense network multilayer printed circuit board |
| CN116779756A (en) * | 2023-07-12 | 2023-09-19 | 东莞市谷麦光学科技有限公司 | LED luminescent plate and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180501 Termination date: 20190930 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |