CN108165192A - Heat-conducting glue band and preparation method thereof - Google Patents
Heat-conducting glue band and preparation method thereof Download PDFInfo
- Publication number
- CN108165192A CN108165192A CN201711459574.5A CN201711459574A CN108165192A CN 108165192 A CN108165192 A CN 108165192A CN 201711459574 A CN201711459574 A CN 201711459574A CN 108165192 A CN108165192 A CN 108165192A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting glue
- glue band
- nanometer
- sensitive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
Abstract
A kind of heat-conducting glue band in function tape technology field and preparation method thereof, the heat-conducting glue band include heat conduction functional layer and the pressure sensitive adhesive for being coated on one side surface of heat conduction functional layer, the nanometer magnetic metal line aligned are provided in the pressure sensitive adhesive.The present invention in pressure sensitive adhesive by setting the nanometer magnetic metal aligned line to improve the heat conductivility of pressure sensitive adhesive, and so as to improve the radiating efficiency of heat-conducting glue band entirety, radiating efficiency can improve 10%~30%.
Description
Technical field
The present invention relates to a kind of technology of function adhesive tape area, specifically a kind of heat-conducting glue bands and preparation method thereof.
Background technology
OLED technology is widely used in portable device at present.In the design of OLED screen curtain, often using glass or
PI is as substrate, and the radiating efficiency of glass and PI is not high, needs to take cooling measure, is typically employed in OLED screen backstage face paste
The mode of heat-conducting glue band reaches heat dissipation effect.
Current heat-conducting glue band needs pressure-sensitive adhesive coating mainly using copper foil as functional layer.Although copper foil radiating efficiency
It is higher, but pressure sensitive adhesive is high-molecular compound, heat transfer efficiency is relatively low, therefore current heat-conducting glue band synthesis radiating efficiency is not
It is high.
Invention content
The present invention is directed to deficiencies of the prior art, it is proposed that a kind of heat-conducting glue band and preparation method thereof, it can
The heat conductivility of pressure sensitive adhesive is improved, so as to improve the radiating efficiency of heat-conducting glue band entirety.
The present invention is achieved by the following technical solutions：
The present invention relates to a kind of heat-conducting glue band, the heat-conducting glue band includes heat conduction functional layer and is coated on heat conduction functional layer
The pressure sensitive adhesive of one side surface is provided with nanometer magnetic metal line in the pressure sensitive adhesive.
The nanometer magnetic metal line aligns in pressure sensitive adhesive；
The angular range of the nanometer magnetic metal line aligned and heat conduction functional layer thickness direction is 70 °~90 °.
The nanometer magnetic metal line draw ratio is 300~500.
The nanometer magnetic metal line is nanometer iron wire, nanometer cobalt line, nanometer nickel wire, nanosized iron alloy line, nanometer cobalt close
Gold thread and nanometer nickeline wire；Preferably, it is nanometer nickel wire.
The pressure sensitive adhesive is fitted with release film on the surface far from heat conduction functional layer side.
The heat conduction functional layer is copper foil or aluminium foil；Preferably, it is copper foil.
The present invention relates to a kind of preparation methods of heat-conducting glue band, and nanometer magnetic metal line is dispersed in volatile organic solvent
In obtain coating fluid, be then coated in heat conduction functional layer；After organic matter volatilization, it is coated in heat conduction functional layer side pressure-sensitive
Glue, the pressure sensitive adhesive covering nanometer magnetic metal line of coating；Apply magnetic field in pressure sensitive adhesive front later so that nanometer magnetic metal line
It is arranged as far as possible along heat conduction functional layer thickness direction, is then bonded release film winding.
The volatile organic solvent is selected from ethyl acetate, butyl acetate, butanone, toluene, ethyl alcohol.
The conventional technical means such as ultrasonic wave dispersion, mechanical dispersion can be used in the decentralized processing.
Preferably, the rotating speed of mechanical dispersion is 1000~3000rpm.
Weight ratio of the nanometer magnetic metal line in coating fluid is 1%~3%.
The intensity in the magnetic field is 0.1~0.3T.
Preferably, the present invention is coated coating fluid and pressure sensitive adhesive using slot die technique.
Technique effect
Compared with prior art, the present invention in pressure sensitive adhesive by setting the nanometer magnetic metal aligned line to improve
The heat conductivility of pressure sensitive adhesive, so as to improve the radiating efficiency of heat-conducting glue band entirety, radiating efficiency can improve 10%~30%.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the process flow chart of the present invention；
In figure：Heat conduction functional layer 1, pressure sensitive adhesive 2, nanometer magnetic metal line 3, release film 4.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention will be described in detail.And it is adopted with reference to GB/T-2792/2014
180 ° of peel test forces of heat-conducting glue band are carried out with tensilon, reference standard ASTM5470 uses the heat conduction of model LW9389
Coefficient tester carries out Determination of conductive coefficients of the heat-conducting glue with Z-direction.
Embodiment 1
As shown in Figure 1, the present embodiment is related to a kind of heat-conducting glue band, the heat-conducting glue band includes heat conduction functional layer 1 and applies
Cloth is provided with the nanometer magnetic metal aligned in the pressure sensitive adhesive 2 in the pressure sensitive adhesive 2 of 1 one side surface of heat conduction functional layer
Line 3, and the pressure sensitive adhesive 2 is fitted with release film 4 on the surface far from 1 side of heat conduction functional layer.
The angular range of the nanometer magnetic metal line 3 aligned and 1 thickness direction of heat conduction functional layer for 70 °~
90°。
Preferably, the length of the nanometer magnetic metal line 3 is 50 microns, 100 nanometers a diameter of, draw ratio 500.
Preferably, the nanometer magnetic metal line 3 is nanometer nickel wire.
Preferably, the heat conduction functional layer 1 is copper foil.
The heat-conducting glue band is 20w/ (mk) in the thermal conductivity factor of Z-direction, and 180 ° of peeling forces are 1200gf.
As depicted in figs. 1 and 2, the present embodiment is related to a kind of preparation method of heat-conducting glue band, includes the following steps：
S1, nanometer magnetic metal line 3 is dispersed in volatile organic solvent and obtains coating fluid, using slit coating skill
Art is by coating solution in 1 side of heat conduction functional layer；
S2, after organic matter volatilization, using slot die technique in 1 side pressure-sensitive adhesive coating 2 of heat conduction functional layer, coating
Pressure sensitive adhesive 2 cover nanometer magnetic metal line 3；
S3, apply magnetic field in 2 front of pressure sensitive adhesive, magnetic field intensity is 0.1~0.3T so that nanometer magnetic metal line 3 to the greatest extent may be used
It can be arranged along heat conduction functional layer thickness direction；
S4, finally it is bonded release film 4 and winds.
Preferably, weight ratio of the nanometer magnetic metal line 3 in coating fluid is 1%~3%.
Preferably, the volatile organic solvent uses ethyl alcohol.
It is emphasized that：It the above is only presently preferred embodiments of the present invention, not the present invention made in any form
Limitation, any simple modification, equivalent change and modification that every technical spirit according to the present invention makees above example,
In the range of still falling within technical solution of the present invention.
Claims (10)
1. a kind of heat-conducting glue band, which is characterized in that the heat-conducting glue band includes heat conduction functional layer and is coated on heat conduction functional layer
The pressure sensitive adhesive of one side surface is provided with nanometer magnetic metal line in the pressure sensitive adhesive.
2. heat-conducting glue band according to claim 1, it is characterized in that, the nanometer magnetic metal line orients in pressure sensitive adhesive
Arrangement；
The angular range of the nanometer magnetic metal line aligned and heat conduction functional layer thickness direction is 70 °~90 °.
3. heat-conducting glue band according to claim 2, it is characterized in that, the nanometer magnetic metal line draw ratio for 300~
500。
4. heat-conducting glue band according to claim 3, it is characterized in that, the nanometer magnetic metal line is nanometer iron wire, nanometer
Cobalt line, nanometer nickel wire, nanosized iron alloy line, nanometer cobalt alloy wire and nanometer nickeline wire；Preferably, it is nanometer nickel wire.
5. heat-conducting glue band according to claim 1, it is characterized in that, the pressure sensitive adhesive is in the table far from heat conduction functional layer side
Face is fitted with release film.
6. heat-conducting glue band according to claim 5, it is characterized in that, the heat conduction functional layer is copper foil or aluminium foil；It is preferred that
Ground is copper foil.
7. the preparation method of heat-conducting glue band described in a kind of any of the above-described claim, which is characterized in that by nanometer magnetic metal line
It is dispersed in volatile organic solvent and obtains coating fluid, be then coated in heat conduction functional layer；After organic matter volatilization, in heat conduction
Functional layer side pressure-sensitive adhesive coating, the pressure sensitive adhesive covering nanometer magnetic metal line of coating；Apply magnetic field in pressure sensitive adhesive front later,
So that nanometer magnetic metal line arranges as far as possible along heat conduction functional layer thickness direction, it is then bonded release film winding.
8. the preparation method of heat-conducting glue band according to claim 7, it is characterized in that, the nanometer magnetic metal line is in coating fluid
In weight ratio be 1%~3%.
9. the preparation method of heat-conducting glue band according to claim 7, it is characterized in that, the intensity in the magnetic field is 0.1~0.3T.
10. the preparation method of heat-conducting glue band according to claim 7, it is characterized in that, the coating method is applied for slit
Cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711459574.5A CN108165192A (en) | 2017-12-28 | 2017-12-28 | Heat-conducting glue band and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711459574.5A CN108165192A (en) | 2017-12-28 | 2017-12-28 | Heat-conducting glue band and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108165192A true CN108165192A (en) | 2018-06-15 |
Family
ID=62518997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711459574.5A Withdrawn CN108165192A (en) | 2017-12-28 | 2017-12-28 | Heat-conducting glue band and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108165192A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120018666A1 (en) * | 2010-07-23 | 2012-01-26 | International Business Machines Corporation | Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance |
| CN102838958A (en) * | 2012-09-17 | 2012-12-26 | 北京宇极科技发展有限公司 | Preparation method of silver colloid for LED (Light Emitting Diode) with high thermal conductivity |
| CN106626583A (en) * | 2016-11-16 | 2017-05-10 | 广州宏庆电子有限公司 | Ultra-thin heat dissipation film and preparation method thereof |
| CN106700957A (en) * | 2017-01-22 | 2017-05-24 | 上海大学 | Heat conduction material doped conductive adhesive and preparation method thereof and application |
| CN106928867A (en) * | 2017-03-28 | 2017-07-07 | 镓特半导体科技（上海）有限公司 | A kind of carbon nanotube conducting glue and its preparation method and application |
-
2017
- 2017-12-28 CN CN201711459574.5A patent/CN108165192A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120018666A1 (en) * | 2010-07-23 | 2012-01-26 | International Business Machines Corporation | Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance |
| CN102838958A (en) * | 2012-09-17 | 2012-12-26 | 北京宇极科技发展有限公司 | Preparation method of silver colloid for LED (Light Emitting Diode) with high thermal conductivity |
| CN106626583A (en) * | 2016-11-16 | 2017-05-10 | 广州宏庆电子有限公司 | Ultra-thin heat dissipation film and preparation method thereof |
| CN106700957A (en) * | 2017-01-22 | 2017-05-24 | 上海大学 | Heat conduction material doped conductive adhesive and preparation method thereof and application |
| CN106928867A (en) * | 2017-03-28 | 2017-07-07 | 镓特半导体科技（上海）有限公司 | A kind of carbon nanotube conducting glue and its preparation method and application |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180615 |
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| WW01 | Invention patent application withdrawn after publication |