CN108106757B - 力检测传感器、力传感器、扭矩传感器及机器人 - Google Patents

力检测传感器、力传感器、扭矩传感器及机器人 Download PDF

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Publication number
CN108106757B
CN108106757B CN201711019828.1A CN201711019828A CN108106757B CN 108106757 B CN108106757 B CN 108106757B CN 201711019828 A CN201711019828 A CN 201711019828A CN 108106757 B CN108106757 B CN 108106757B
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China
Prior art keywords
force
force detection
detection sensor
comb
sensor
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CN201711019828.1A
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English (en)
Chinese (zh)
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CN108106757A (zh
Inventor
神谷俊幸
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Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN108106757A publication Critical patent/CN108106757A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/085—Force or torque sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • G01L1/162—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators
    • G01L1/165—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators with acoustic surface waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
    • G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
    • G01G3/13—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing having piezoelectric or piezoresistive properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
    • G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
    • G01G3/16—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing measuring variations of frequency of oscillations of the body
    • G01G3/165—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • G01L1/162—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators
    • G01L1/167—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators optical excitation or measuring of vibrations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L3/00—Measuring torque, work, mechanical power, or mechanical efficiency, in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061—Force sensors associated with industrial machines or actuators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
    • G01L5/226—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Human Computer Interaction (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Manipulator (AREA)
CN201711019828.1A 2016-11-24 2017-10-26 力检测传感器、力传感器、扭矩传感器及机器人 Active CN108106757B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016228406A JP6862794B2 (ja) 2016-11-24 2016-11-24 力検出センサー、力覚センサー、トルクセンサーおよびロボット
JP2016-228406 2016-11-24

Publications (2)

Publication Number Publication Date
CN108106757A CN108106757A (zh) 2018-06-01
CN108106757B true CN108106757B (zh) 2022-03-08

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Family Applications (1)

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CN201711019828.1A Active CN108106757B (zh) 2016-11-24 2017-10-26 力检测传感器、力传感器、扭矩传感器及机器人

Country Status (4)

Country Link
US (1) US10682768B2 (enExample)
EP (1) EP3327416B1 (enExample)
JP (1) JP6862794B2 (enExample)
CN (1) CN108106757B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6789853B2 (ja) * 2017-03-08 2020-11-25 日本電産コパル電子株式会社 力覚センサ
CN108917668B (zh) * 2018-06-12 2024-07-05 重庆大学 一种差分式双谐振器声波拉伸应变传感器芯片
JP7127513B2 (ja) * 2018-11-30 2022-08-30 トヨタ自動車株式会社 センサシステムおよびロボットハンド
CN110274717A (zh) * 2019-01-17 2019-09-24 上海肇擎传感技术有限公司 一种单轴力矩传感器及其敏感方法
JP7375345B2 (ja) * 2019-06-27 2023-11-08 セイコーエプソン株式会社 ロボット
US11491663B2 (en) * 2020-06-16 2022-11-08 Ati Industrial Automation, Inc. Robotic force/torque sensor with controlled thermal conduction
US11796378B1 (en) * 2021-06-25 2023-10-24 Amazon Technologies, Inc. Piezoelectric weight sensing apparatus

Citations (10)

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JPS5381281A (en) * 1976-12-20 1978-07-18 Gould Inc Power checking instrument
US4623813A (en) * 1983-12-22 1986-11-18 Kabushiki Kaisha Ishida Koki Seisakusho Load sensor using a piezoelectric S.A.W. device
US4775961A (en) * 1985-06-24 1988-10-04 Vysoka Skola Dopravy A Spojov V Ziline Tactile sensor
JPH07209166A (ja) * 1993-12-13 1995-08-11 Hewlett Packard Co <Hp> 基体表面への被検体の結合方法、低分子量被検体の定量方法、及びビオチン−被検体複合体
WO2001067058A8 (de) * 2000-03-10 2002-07-18 Siemens Ag Verfahren und vorrichtung zur messung eines an einem bauteil wirkenden moments
JP2006518846A (ja) * 2003-02-05 2006-08-17 ブルーネル ユニバーシティ 共振センサーアセンブリー
CN101018045A (zh) * 2006-02-08 2007-08-15 精工爱普生株式会社 弹性表面波元件及电子设备
GB2451861A (en) * 2007-08-14 2009-02-18 Transense Technologies Plc Surface acoustic wave based sensor in vented housing
CN102195601A (zh) * 2010-03-12 2011-09-21 精工爱普生株式会社 振动片、振子、传感器以及电子设备
JP5713615B2 (ja) * 2010-09-17 2015-05-07 大和製衡株式会社 ロードセル

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US4096740A (en) * 1974-06-17 1978-06-27 Rockwell International Corporation Surface acoustic wave strain detector and gage
JPS57133329A (en) * 1981-02-12 1982-08-18 Yokogawa Hokushin Electric Corp Power converter
JPS5873821A (ja) * 1981-10-28 1983-05-04 Yamato Scale Co Ltd ロ−ドセル式はかり
JPH05322670A (ja) 1992-05-21 1993-12-07 Ishida Co Ltd 荷重検出器
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JP2004274696A (ja) * 2002-10-04 2004-09-30 Seiko Epson Corp 弾性表面波装置および弾性表面波装置の温度特性調整方法
JP2005184340A (ja) 2003-12-18 2005-07-07 Seiko Epson Corp 弾性表面波チップ
JP4826194B2 (ja) 2005-03-04 2011-11-30 凸版印刷株式会社 弾性表面波素子とその使用方法
GB2426590B (en) 2005-05-26 2009-01-14 Transense Technologies Plc Pressure sensor
JP5310572B2 (ja) 2010-01-13 2013-10-09 凸版印刷株式会社 圧力センサ
JP5880935B2 (ja) 2011-12-20 2016-03-09 セイコーエプソン株式会社 センサーデバイス、センサーモジュール、ロボット、センサーデバイスの製造方法
JP5895615B2 (ja) * 2012-03-09 2016-03-30 セイコーエプソン株式会社 センサーモジュール、力検出装置及びロボット
JP6051678B2 (ja) * 2012-08-22 2016-12-27 セイコーエプソン株式会社 センサーデバイス、センサーモジュール、力検出装置およびロボット
JP6102341B2 (ja) 2013-02-27 2017-03-29 セイコーエプソン株式会社 力検出装置、ロボット、電子部品搬送装置、電子部品検査装置、部品加工装置および移動体
US9381647B2 (en) 2013-02-19 2016-07-05 Seiko Epson Corporation Force detection device, robot, and moving object
JP6163900B2 (ja) * 2013-06-13 2017-07-19 セイコーエプソン株式会社 力検出装置およびロボット
US20150013461A1 (en) * 2013-07-12 2015-01-15 Environetix Technologies Corp. Device and method for measuring physical parameters using saw sensors
JP5459890B1 (ja) * 2013-09-10 2014-04-02 株式会社ワコー 力覚センサ
US9705069B2 (en) * 2013-10-31 2017-07-11 Seiko Epson Corporation Sensor device, force detecting device, robot, electronic component conveying apparatus, electronic component inspecting apparatus, and component machining apparatus
JP6349979B2 (ja) 2014-06-05 2018-07-04 株式会社デンソー 弾性表面波式センサ

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5381281A (en) * 1976-12-20 1978-07-18 Gould Inc Power checking instrument
US4623813A (en) * 1983-12-22 1986-11-18 Kabushiki Kaisha Ishida Koki Seisakusho Load sensor using a piezoelectric S.A.W. device
US4775961A (en) * 1985-06-24 1988-10-04 Vysoka Skola Dopravy A Spojov V Ziline Tactile sensor
JPH07209166A (ja) * 1993-12-13 1995-08-11 Hewlett Packard Co <Hp> 基体表面への被検体の結合方法、低分子量被検体の定量方法、及びビオチン−被検体複合体
WO2001067058A8 (de) * 2000-03-10 2002-07-18 Siemens Ag Verfahren und vorrichtung zur messung eines an einem bauteil wirkenden moments
JP2006518846A (ja) * 2003-02-05 2006-08-17 ブルーネル ユニバーシティ 共振センサーアセンブリー
CN101018045A (zh) * 2006-02-08 2007-08-15 精工爱普生株式会社 弹性表面波元件及电子设备
GB2451861A (en) * 2007-08-14 2009-02-18 Transense Technologies Plc Surface acoustic wave based sensor in vented housing
CN102195601A (zh) * 2010-03-12 2011-09-21 精工爱普生株式会社 振动片、振子、传感器以及电子设备
JP5713615B2 (ja) * 2010-09-17 2015-05-07 大和製衡株式会社 ロードセル

Also Published As

Publication number Publication date
JP6862794B2 (ja) 2021-04-21
CN108106757A (zh) 2018-06-01
EP3327416A1 (en) 2018-05-30
JP2018084519A (ja) 2018-05-31
EP3327416B1 (en) 2019-07-31
US10682768B2 (en) 2020-06-16
US20180141217A1 (en) 2018-05-24

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