CN108102195B - 一种含自修复微胶囊的电缆绝缘材料及制备方法 - Google Patents
一种含自修复微胶囊的电缆绝缘材料及制备方法 Download PDFInfo
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- CN108102195B CN108102195B CN201711456204.6A CN201711456204A CN108102195B CN 108102195 B CN108102195 B CN 108102195B CN 201711456204 A CN201711456204 A CN 201711456204A CN 108102195 B CN108102195 B CN 108102195B
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Classifications
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- C—CHEMISTRY; METALLURGY
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
Abstract
Description
将电缆线划伤24h后 | 将电缆线划伤48h后 | |
实施例1 | 伤口部分自动愈合 | 伤口全部自动愈合 |
实施例2 | 伤口全部自动愈合 | 伤口全部自动愈合 |
实施例3 | 伤口部分自动愈合 | 伤口全部自动愈合 |
实施例4 | 伤口部分自动愈合 | 伤口全部自动愈合 |
对比例1 | 伤口未愈合 | 伤口少量愈合 |
Claims (4)
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CN201711456204.6A CN108102195B (zh) | 2017-12-28 | 2017-12-28 | 一种含自修复微胶囊的电缆绝缘材料及制备方法 |
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CN201711456204.6A CN108102195B (zh) | 2017-12-28 | 2017-12-28 | 一种含自修复微胶囊的电缆绝缘材料及制备方法 |
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CN108102195A CN108102195A (zh) | 2018-06-01 |
CN108102195B true CN108102195B (zh) | 2020-10-23 |
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Families Citing this family (3)
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CN108822820B (zh) * | 2018-05-22 | 2020-11-03 | 东莞理工学院 | 一种隔离型水合物动力学抑制胶囊及其制备方法与应用 |
CN110391045A (zh) * | 2019-08-06 | 2019-10-29 | 深圳市爱因派科技有限公司 | 一种带自行修复绝缘击穿功能的服务机器人本体线缆 |
CN110752073B (zh) * | 2019-11-01 | 2021-01-12 | 深圳联颖通讯有限公司 | 一种电缆绝缘失效修复材料的制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005046457A3 (en) * | 2003-11-05 | 2007-08-16 | Texas Scottish Rite Hospital | A biomimetic biosynthetic nerve implant |
CN102019160A (zh) * | 2010-10-13 | 2011-04-20 | 上海工程技术大学 | 聚乳酸-辣椒素纳米胶囊及其制备方法 |
CN103254372A (zh) * | 2013-04-08 | 2013-08-21 | 中山大学 | 一种自修复聚合物材料用多层微胶囊及其制备方法 |
CN104610703A (zh) * | 2015-01-22 | 2015-05-13 | 清华大学 | 一种微放电缺陷光致自修复的电气绝缘层材料的制备方法 |
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2017
- 2017-12-28 CN CN201711456204.6A patent/CN108102195B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005046457A3 (en) * | 2003-11-05 | 2007-08-16 | Texas Scottish Rite Hospital | A biomimetic biosynthetic nerve implant |
CN102019160A (zh) * | 2010-10-13 | 2011-04-20 | 上海工程技术大学 | 聚乳酸-辣椒素纳米胶囊及其制备方法 |
CN103254372A (zh) * | 2013-04-08 | 2013-08-21 | 中山大学 | 一种自修复聚合物材料用多层微胶囊及其制备方法 |
CN104610703A (zh) * | 2015-01-22 | 2015-05-13 | 清华大学 | 一种微放电缺陷光致自修复的电气绝缘层材料的制备方法 |
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