CN1080937C - 球格阵列集成电路元件的印刷电路基板承载盘 - Google Patents
球格阵列集成电路元件的印刷电路基板承载盘 Download PDFInfo
- Publication number
- CN1080937C CN1080937C CN97119612A CN97119612A CN1080937C CN 1080937 C CN1080937 C CN 1080937C CN 97119612 A CN97119612 A CN 97119612A CN 97119612 A CN97119612 A CN 97119612A CN 1080937 C CN1080937 C CN 1080937C
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- substrate
- grid array
- carrier
- ball grid
- row
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN97119612A CN1080937C (zh) | 1997-09-23 | 1997-09-23 | 球格阵列集成电路元件的印刷电路基板承载盘 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN97119612A CN1080937C (zh) | 1997-09-23 | 1997-09-23 | 球格阵列集成电路元件的印刷电路基板承载盘 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1212463A CN1212463A (zh) | 1999-03-31 |
CN1080937C true CN1080937C (zh) | 2002-03-13 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97119612A Expired - Fee Related CN1080937C (zh) | 1997-09-23 | 1997-09-23 | 球格阵列集成电路元件的印刷电路基板承载盘 |
Country Status (1)
Country | Link |
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CN (1) | CN1080937C (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1106164A (zh) * | 1993-11-18 | 1995-08-02 | 三星电子株式会社 | 半导体器件及其制造方法 |
JPH08162566A (ja) * | 1994-12-09 | 1996-06-21 | Hitachi Ltd | 半導体装置 |
JPH08203644A (ja) * | 1995-01-20 | 1996-08-09 | Nhk Spring Co Ltd | Lsiパッケージ用ソケット |
JPH08340164A (ja) * | 1995-06-09 | 1996-12-24 | Fujitsu General Ltd | Bga型パッケージの面実装構造 |
-
1997
- 1997-09-23 CN CN97119612A patent/CN1080937C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1106164A (zh) * | 1993-11-18 | 1995-08-02 | 三星电子株式会社 | 半导体器件及其制造方法 |
JPH08162566A (ja) * | 1994-12-09 | 1996-06-21 | Hitachi Ltd | 半導体装置 |
JPH08203644A (ja) * | 1995-01-20 | 1996-08-09 | Nhk Spring Co Ltd | Lsiパッケージ用ソケット |
JPH08340164A (ja) * | 1995-06-09 | 1996-12-24 | Fujitsu General Ltd | Bga型パッケージの面実装構造 |
Also Published As
Publication number | Publication date |
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CN1212463A (zh) | 1999-03-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: UNIMICRON ELECTRONICS CO., LTD. Free format text: FORMER OWNER: QUNCE ELECTRONIC CO., LTD. Effective date: 20011210 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20011210 Address after: Taoyuan County of Taiwan Province Patentee after: Xinxing Electronics Co., Ltd. Address before: Taipei city of Taiwan Province Patentee before: Qunce Electronic Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20020313 Termination date: 20091023 |