CN108084688A - 一种led封装用高散热性绝缘复合材料及其制备方法 - Google Patents
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- 239000000463 material Substances 0.000 claims abstract description 25
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 13
- 229920006380 polyphenylene oxide Polymers 0.000 claims abstract description 13
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- 239000003963 antioxidant agent Substances 0.000 claims abstract description 7
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- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920000570 polyether Polymers 0.000 claims abstract description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 4
- 229960004643 cupric oxide Drugs 0.000 claims abstract description 3
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 claims abstract 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 6
- 238000004513 sizing Methods 0.000 claims description 6
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- 239000012467 final product Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 229940058020 2-amino-2-methyl-1-propanol Drugs 0.000 claims description 2
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
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- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
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Abstract
本发明公开了一种LED封装用高散热性绝缘复合材料，由以下重量份的原料制备得到：三羟甲基丙烷聚醚50‑60、聚苯醚粉料12‑19、羟基氟硅油0.3‑0.7、纳米氢氧化铝3‑8、2‑氨基‑2‑甲基‑1‑丙醇0.4‑0.9、马来酸酐0.2‑0.4、纳米氧化铜1.2‑1.6、硅烷偶联剂0.1‑0.2、氯仿适量、抗氧剂0.01‑0.02、固化剂DDS 16‑24。本发明制备的复合材料作为LED封装材料具有优良的力学性能和介电性能，同时具备高散热性和耐水性，使用寿命长，经济耐用。
Description
技术领域
本发明涉及LED封装材料技术领域，尤其涉及一种LED封装用高散热性绝缘复合材料及其制备方法。
背景技术
LED封装是指发光芯片的封装，LED的封装不同于其他集成电路的封装，不仅要保护芯片，还具有透光性，因此对LED用的封装材料的性能有特殊的要求，对封装材料的要求主要体现在要尽可能多的提取芯片发出的光，还要能降低热阻，达到提高散热能力和出光效率的功效，随着LED产业的飞速发展，对新型的高品质封装材料的需求日益强烈，目前常用的封装材料主要有环氧树脂和有机硅树脂，环氧树脂成本较低，其耐紫外、耐老化能力较差，而有机硅树脂具备优异的耐热老化、耐紫外老化、光透过率高等优点，但其生产成本较高。
发明内容
本发明的目的在于克服现有技术中所存在的上述不足，提供一种LED封装用高散热性绝缘复合材料及其制备方法。
为了实现上述发明目的，本发明提供了以下技术方案：
一种LED封装用高散热性绝缘复合材料，该复合材料由以下重量份的原料制备得到：三羟甲基丙烷聚醚50-60、聚苯醚粉料12-19、羟基氟硅油0.3-0.7、纳米氢氧化铝3-8、2-氨基-2-甲基-1-丙醇0.4-0.9、马来酸酐0.2-0.4、纳米氧化铜1.2-1.6、硅烷偶联剂0.1-0.2、氯仿适量、抗氧剂0.01-0.02、固化剂DDS 16-24。
所述的一种LED封装用高散热性绝缘复合材料的制备方法，所述的制备方法为：
(1)先将聚苯醚粉料进行预辐照处理，辐照条件为：以电子加速器作为辐照源，在常温、常压、空气氛围下利用β射线进行照射处理，预辐照剂量范围为20-30kGy，得预辐照聚苯醚料；
(2)将预辐照后的聚苯醚料与马来酸酐、硅烷偶联剂、纳米氢氧化铝、2-氨基-2-甲基-1-丙醇、抗氧剂一起投入搅拌机中高速搅拌混合均匀，随后一起投入双螺杆挤出机中挤出造粒，得接枝聚苯醚料；
(3)将步骤(2)制备的接枝聚苯醚、三羟甲基丙烷聚醚及除固化剂DDS外的其它剩余物料一起投入氯仿中，升温至120-130℃，混合搅拌1.5-2h，随后降温至100-110℃，投入固化剂DDS，继续搅拌混合20-30min后将胶料保温并经真空脱泡处理，脱泡后的胶料倒入模具中，先升温至120-130℃，固化40-50min后再加热至150-180℃，继续固化2-3h后即得。
与现有技术相比，本发明的有益效果：
本发明制备的复合材料作为LED封装材料具有优良的力学性能和介电性能，同时具备高散热性和耐水性，使用寿命长，经济耐用。
具体实施方式
下面结合试验例及具体实施方式对本发明作进一步的详细描述。但不应将此理解为本发明上述主题的范围仅限于以下的实施例，凡基于本发明内容所实现的技术均属于本发明的范围。
实施例1
该实施例的复合材料由以下重量份的原料制备得到： 三羟甲基丙烷聚醚53、聚苯醚粉料16、羟基氟硅油0.5、纳米氢氧化铝4、2-氨基-2-甲基-1-丙醇0.7、马来酸酐0.3、纳米氧化铜1.4、硅烷偶联剂0.1、氯仿适量、抗氧剂0.02、固化剂DDS 19。
所述的一种LED封装用高散热性绝缘复合材料的制备方法，所述的制备方法为：
(1)先将聚苯醚粉料进行预辐照处理，辐照条件为：以电子加速器作为辐照源，在常温、常压、空气氛围下利用β射线进行照射处理，预辐照剂量范围为20kGy，得预辐照聚苯醚料；
(2)将预辐照后的聚苯醚料与马来酸酐、硅烷偶联剂、纳米氢氧化铝、2-氨基-2-甲基-1-丙醇、抗氧剂一起投入搅拌机中高速搅拌混合均匀，随后一起投入双螺杆挤出机中挤出造粒，得接枝聚苯醚料；
(3)将步骤(2)制备的接枝聚苯醚、三羟甲基丙烷聚醚及除固化剂DDS外的其它剩余物料一起投入氯仿中，升温至120℃，混合搅拌1.5h，随后降温至100℃，投入固化剂DDS，继续搅拌混合20min后将胶料保温并经真空脱泡处理，脱泡后的胶料倒入模具中，先升温至120℃，固化40min后再加热至150℃，继续固化2h后即得。
Claims (2)
1.一种LED封装用高散热性绝缘复合材料，其特征在于，该复合材料由以下重量份的原料制备得到：三羟甲基丙烷聚醚50-60、聚苯醚粉料12-19、羟基氟硅油0.3-0.7、纳米氢氧化铝3-8、2-氨基-2-甲基-1-丙醇0.4-0.9、马来酸酐0.2-0.4、纳米氧化铜1.2-1.6、硅烷偶联剂0.1-0.2、氯仿适量、抗氧剂0.01-0.02、固化剂DDS 16-24。
2.根据权利要求1所述的一种LED封装用高散热性绝缘复合材料的制备方法，其特征在于，所述的制备方法为：
（1）先将聚苯醚粉料进行预辐照处理，辐照条件为：以电子加速器作为辐照源，在常温、常压、空气氛围下利用β射线进行照射处理，预辐照剂量范围为20-30kGy，得预辐照聚苯醚粉料；
（2）将预辐照后的聚苯醚粉料与马来酸酐、硅烷偶联剂、纳米氢氧化铝、2-氨基-2-甲基-1-丙醇、抗氧剂一起投入搅拌机中高速搅拌混合均匀，随后一起投入双螺杆挤出机中挤出造粒，得接枝聚苯醚料；
（3）将步骤（2）制备的接枝聚苯醚、三羟甲基丙烷聚醚及除固化剂DDS外的其它剩余物料一起投入氯仿中，升温至120-130℃，混合搅拌1.5-2h，随后降温至100-110℃，投入固化剂DDS，继续搅拌混合20-30min后将胶料保温并经真空脱泡处理，脱泡后的胶料倒入模具中，先升温至120-130℃，固化40-50min后再加热至150-180℃，继续固化2-3h后即得。
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Application publication date: 20180529 |
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