CN108084651A - 一种led封装用高弹性绝缘复合材料及其制备方法 - Google Patents

一种led封装用高弹性绝缘复合材料及其制备方法 Download PDF

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CN108084651A
CN108084651A CN201611019554.1A CN201611019554A CN108084651A CN 108084651 A CN108084651 A CN 108084651A CN 201611019554 A CN201611019554 A CN 201611019554A CN 108084651 A CN108084651 A CN 108084651A
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irradiation
led encapsulation
composite material
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oxide powder
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王鸥
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Chengdu Water World Technology Co Ltd
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C08F283/08—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Abstract

本发明公开了一种LED封装用高弹性绝缘复合材料，由以下重量份的原料制备得到：E‑12环氧树脂50‑60、聚苯醚粉料12‑19、苯胺甲基三乙氧基硅烷0.3‑0.7、纳米凹凸棒土3‑8、聚氧四亚甲基二醇0.4‑0.9、马来酸酐0.2‑0.4、纳米海泡石1.2‑1.6、硅烷偶联剂0.1‑0.2、氯仿适量、抗氧剂0.01‑0.02、固化剂DDS 16‑24。本发明制备的复合材料作为LED封装材料具有优良的力学性能和介电性能，同时具备高柔软性、高弹性和耐水性，使用寿命长，经济耐用。

Description

一种LED封装用高弹性绝缘复合材料及其制备方法
技术领域
本发明涉及LED封装材料技术领域，尤其涉及一种LED封装用高弹性绝缘复合材料及其制备方法。
背景技术
LED封装是指发光芯片的封装，LED的封装不同于其他集成电路的封装，不仅要保护芯片，还具有透光性，因此对LED用的封装材料的性能有特殊的要求，对封装材料的要求主要体现在要尽可能多的提取芯片发出的光，还要能降低热阻，达到提高散热能力和出光效率的功效，随着LED产业的飞速发展，对新型的高品质封装材料的需求日益强烈，目前常用的封装材料主要有环氧树脂和有机硅树脂，环氧树脂成本较低，其耐紫外、耐老化能力较差，而有机硅树脂具备优异的耐热老化、耐紫外老化、光透过率高等优点，但其生产成本较高。
发明内容
本发明的目的在于克服现有技术中所存在的上述不足，提供一种LED封装用高弹性绝缘复合材料及其制备方法。
为了实现上述发明目的，本发明提供了以下技术方案：
一种LED封装用高弹性绝缘复合材料，该复合材料由以下重量份的原料制备得到：E-12环氧树脂50-60、聚苯醚粉料12-19、苯胺甲基三乙氧基硅烷0.3-0.7、纳米凹凸棒土3-8、聚氧四亚甲基二醇0.4-0.9、马来酸酐0.2-0.4、纳米海泡石1.2-1.6、硅烷偶联剂0.1-0.2、氯仿适量、抗氧剂0.01-0.02、固化剂DDS 16-24。
所述的一种LED封装用高弹性绝缘复合材料的制备方法，所述的制备方法为：
(1)先将聚苯醚粉料进行预辐照处理，辐照条件为：以电子加速器作为辐照源，在常温、常压、空气氛围下利用β射线进行照射处理，预辐照剂量范围为20-30kGy，得预辐照聚苯醚料；
(2)将预辐照后的聚苯醚料与马来酸酐、硅烷偶联剂、纳米凹凸棒土、聚氧四亚甲基二醇、抗氧剂一起投入搅拌机中高速搅拌混合均匀，随后一起投入双螺杆挤出机中挤出造粒，得接枝聚苯醚料；
(3)将步骤(2)制备的接枝聚苯醚、E-12环氧树脂及除固化剂DDS外的其它剩余物料一起投入氯仿中，升温至120-130℃，混合搅拌1.5-2h，随后降温至100-110℃，投入固化剂DDS，继续搅拌混合20-30min后将胶料保温并经真空脱泡处理，脱泡后的胶料倒入模具中，先升温至120-130℃，固化40-50min后再加热至150-180℃，继续固化2-3h后即得。
与现有技术相比，本发明的有益效果：
本发明制备的复合材料作为LED封装材料具有优良的力学性能和介电性能，同时具备高柔软性、高弹性和耐水性，使用寿命长，经济耐用。
具体实施方式
下面结合试验例及具体实施方式对本发明作进一步的详细描述。但不应将此理解为本发明上述主题的范围仅限于以下的实施例，凡基于本发明内容所实现的技术均属于本发明的范围。
实施例1
该实施例的复合材料由以下重量份的原料制备得到： E-12环氧树脂53、聚苯醚粉料16、苯胺甲基三乙氧基硅烷0.5、纳米凹凸棒土4、聚氧四亚甲基二醇0.7、马来酸酐0.3、纳米海泡石1.4、硅烷偶联剂0.1、氯仿适量、抗氧剂0.02、固化剂DDS 19。
所述的一种LED封装用高弹性绝缘复合材料的制备方法，所述的制备方法为：
(1)先将聚苯醚粉料进行预辐照处理，辐照条件为：以电子加速器作为辐照源，在常温、常压、空气氛围下利用β射线进行照射处理，预辐照剂量范围为20kGy，得预辐照聚苯醚料；
(2)将预辐照后的聚苯醚料与马来酸酐、硅烷偶联剂、纳米凹凸棒土、聚氧四亚甲基二醇、抗氧剂一起投入搅拌机中高速搅拌混合均匀，随后一起投入双螺杆挤出机中挤出造粒，得接枝聚苯醚料；
(3)将步骤(2)制备的接枝聚苯醚、E-12环氧树脂及除固化剂DDS外的其它剩余物料一起投入氯仿中，升温至120℃，混合搅拌1.5h，随后降温至100℃，投入固化剂DDS，继续搅拌混合20min后将胶料保温并经真空脱泡处理，脱泡后的胶料倒入模具中，先升温至120℃，固化40min后再加热至150℃，继续固化2h后即得。

Claims (2)

1.一种LED封装用高弹性绝缘复合材料，其特征在于，该复合材料由以下重量份的原料制备得到：E-12环氧树脂50-60、聚苯醚粉料12-19、苯胺甲基三乙氧基硅烷0.3-0.7、纳米凹凸棒土3-8、聚氧四亚甲基二醇0.4-0.9、马来酸酐0.2-0.4、纳米海泡石1.2-1.6、硅烷偶联剂0.1-0.2、氯仿适量、抗氧剂0.01-0.02、固化剂DDS 16-24。
2.根据权利要求1所述的一种LED封装用高弹性绝缘复合材料的制备方法，其特征在于，所述的制备方法为：
（1）先将聚苯醚粉料进行预辐照处理，辐照条件为：以电子加速器作为辐照源，在常温、常压、空气氛围下利用β射线进行照射处理，预辐照剂量范围为20-30kGy，得预辐照聚苯醚粉料；
（2）将预辐照后的聚苯醚粉料与马来酸酐、硅烷偶联剂、纳米凹凸棒土、聚氧四亚甲基二醇、抗氧剂一起投入搅拌机中高速搅拌混合均匀，随后一起投入双螺杆挤出机中挤出造粒，得接枝聚苯醚料；
（3）将步骤（2）制备的接枝聚苯醚、E-12环氧树脂及除固化剂DDS外的其它剩余物料一起投入氯仿中，升温至120-130℃，混合搅拌1.5-2h，随后降温至100-110℃，投入固化剂DDS，继续搅拌混合20-30min后将胶料保温并经真空脱泡处理，脱泡后的胶料倒入模具中，先升温至120-130℃，固化40-50min后再加热至150-180℃，继续固化2-3h后即得。
CN201611019554.1A 2016-11-22 2016-11-22 一种led封装用高弹性绝缘复合材料及其制备方法 Withdrawn CN108084651A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111004465A (zh) * 2019-12-03 2020-04-14 淮阴工学院 一种凹凸棒土复合材料及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111004465A (zh) * 2019-12-03 2020-04-14 淮阴工学院 一种凹凸棒土复合材料及其制备方法

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