CN105789145B - 一种新型电子封装复合材料及其制备方法 - Google Patents
一种新型电子封装复合材料及其制备方法 Download PDFInfo
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Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 对比例1 | 对比例2 | |
热膨胀系数/10-6(K-1) | 7.1 | 7.0 | 6.9 | 6.8 | 7.0 | 7.8 | 7.2 |
热导率(W/(m·k)) | 156.3 | 156.5 | 156.5 | 156.6 | 156.4 | 154.3 | 149.8 |
密度(g/cm3) | 3.1 | 3.1 | 3.2 | 3.2 | 3.1 | 3.1 | 3.0 |
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CN106591746A (zh) * | 2016-11-11 | 2017-04-26 | 合肥龙多电子科技有限公司 | 一种防污电子封装用石墨纤维AlSiC复合材料及其制备方法 |
CN106636994A (zh) * | 2016-11-11 | 2017-05-10 | 合肥龙多电子科技有限公司 | 一种抗弯折电子封装用石墨纤维AlSiC复合材料及其制备方法 |
CN106567018A (zh) * | 2016-11-11 | 2017-04-19 | 合肥龙多电子科技有限公司 | 一种抗氧化电子封装用石墨纤维AlSiC复合材料及其制备方法 |
CN106567019A (zh) * | 2016-11-11 | 2017-04-19 | 合肥龙多电子科技有限公司 | 一种热稳定性好电子封装用石墨纤维AlSiC复合材料及其制备方法 |
CN106567017A (zh) * | 2016-11-11 | 2017-04-19 | 合肥龙多电子科技有限公司 | 一种耐磨电子封装用石墨纤维AlSiC复合材料及其制备方法 |
CN106567016A (zh) * | 2016-11-11 | 2017-04-19 | 合肥龙多电子科技有限公司 | 一种易加工电子封装用石墨纤维AlSiC复合材料及其制备方法 |
CN106567021A (zh) * | 2016-11-11 | 2017-04-19 | 合肥龙多电子科技有限公司 | 一种高强度电子封装用石墨纤维AlSiC复合材料及其制备方法 |
CN106567020A (zh) * | 2016-11-11 | 2017-04-19 | 合肥龙多电子科技有限公司 | 一种耐腐蚀电子封装用石墨纤维AlSiC复合材料及其制备方法 |
CN107602128A (zh) * | 2017-09-18 | 2018-01-19 | 原晋波 | 一种复合电子封装材料的制备方法 |
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WO1991017276A2 (en) * | 1990-05-09 | 1991-11-14 | Lanxide Technology Company, Lp | Filler materials for metal matrix composites |
CN102585485B (zh) * | 2012-01-06 | 2014-04-02 | 华南理工大学 | 高机械性能淀粉/热塑性聚氨酯复合材料及制备方法 |
CN102628137A (zh) * | 2012-04-24 | 2012-08-08 | 南昌航空大学 | 一种制备碳化硅颗粒增强铝基复合材料的方法 |
CN103060596A (zh) * | 2012-12-17 | 2013-04-24 | 华南理工大学 | 一种SiC增强Al基复合材料的制备方法 |
CN103435353A (zh) * | 2013-07-09 | 2013-12-11 | 华南理工大学 | 一种用于SiC增强Al基复合材料的SiC预制件的制备方法 |
CN103367270B (zh) * | 2013-07-11 | 2016-03-23 | 中国人民解放军国防科学技术大学 | 带激光焊接层的铝碳化硅复合材料及其制备方法 |
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