CN108074830A - A kind of wafer position detection device and its detection method - Google Patents
A kind of wafer position detection device and its detection method Download PDFInfo
- Publication number
- CN108074830A CN108074830A CN201611020691.7A CN201611020691A CN108074830A CN 108074830 A CN108074830 A CN 108074830A CN 201611020691 A CN201611020691 A CN 201611020691A CN 108074830 A CN108074830 A CN 108074830A
- Authority
- CN
- China
- Prior art keywords
- wafer
- supporting platform
- lifting
- range sensor
- process cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to semicon industry wafer wet process fields, specifically a kind of wafer position detection device and its detection method, including spindle motor, process cavity, lifting CUP, wafer-supporting platform, range sensor and lifting cylinder, spindle motor and lifting cylinder are separately mounted on process cavity, CUP and wafer-supporting platform is lifted respectively to be located in process cavity, the output terminal of spindle motor is connected with for placing the wafer-supporting platform of wafer, wafer-supporting platform is driven to rotate, lifting CUP is located at wafer-supporting platform periphery, is connected with the piston of lifting cylinder, drives lifting by lifting cylinder；Range sensor is equipped in the top of wafer-supporting platform, range sensor is located at the outside of process cavity.The present invention is realized by the continuous detection to distance between wafer and range sensor to whether wafer placement location correctly checks；Structure of the detecting device is simple, convenient for disassembly and assembly；It is non-contact detecting to wafer during detection, detection speed is fast, and accuracy rate is high.
Description
Technical field
The invention belongs to semicon industry wafer wet process field, specifically a kind of wafer position detection device and
Its detection method.
Background technology
At present, wafer wet processing equipment is directed to the position detection of wafer in process cavity in semicon industry.It is passing
Under the vacuum suction mode of system, wafer can judge whether wafer is placed on correct position by the size of vacuum pressure value
On.And for the wafer-supporting platform of antivacuum absorption type, it cannot be had detected by way of pressure value, it is necessary to a kind of non-
The detection mode of contact judges whether wafer is placed correctly.
The content of the invention
In order to solve the problems, such as antivacuum absorption type wafer-supporting platform wafer detection, it is an object of the invention to provide a kind of wafers
Position detecting device and its detection method
The purpose of the present invention is what is be achieved through the following technical solutions：
The detection device of the present invention includes spindle motor, process cavity, lifting CUP, wafer-supporting platform, range sensor and lifting
Cylinder, wherein spindle motor and lifting cylinder are separately mounted on process cavity, and the lifting CUP and wafer-supporting platform are located at work respectively
In skill cavity, the output terminal of the spindle motor is connected with for placing the wafer-supporting platform of wafer, the wafer-supporting platform is driven to rotate, described
Lifting CUP is located at wafer-supporting platform periphery, is connected with the piston of the lifting cylinder, drives lifting by the lifting cylinder；It is held described
The top of piece platform is equipped with range sensor, which is located at the outside of the process cavity, and the range sensor exists
Wafer is with the spacing continuously measured in wafer-supporting platform rotary course between wafer and range sensor.
Wherein：Upper cover is equipped at the top of the process cavity；
The detection method of wafer position detection device of the present invention is：
The wafer is transferred to outside process cavity on the in vivo wafer-supporting platform of process cavity by manipulator, the spindle motor
Drive wafer-supporting platform rotation, while the wafer is with wafer-supporting platform synchronous rotary, the range sensor continuously detect wafer with away from
From the distance values between sensor, when the distance values fed back to are more than presetting numerical value, judge the wafer without level
It places, it is necessary to readjust.
Wherein：The time interval of distance samples is between 10~2000ms；It is passed in the wafer from manipulator to wafer-supporting platform
When passing, the lifting cylinder drives lifting CUP to drop to lowest order, and the upper edge of the lifting CUP is less than the height of wafer-supporting platform；When
After manipulator is withdrawn, the lifting cylinder drives lifting CUP to rise to highest order.
Advantages of the present invention is with good effect：
By the continuous detection to distance between wafer and range sensor, realize is the present invention to wafer placement location
No correct inspection；Structure of the detecting device is simple, convenient for disassembly and assembly；It is non-contact detecting to wafer during detection, detection speed is fast,
Accuracy rate is high.
Description of the drawings
Fig. 1 is the structure diagram of detection device of the present invention；
Wherein：1 is spindle motor, and 2 be process cavity, and 3 be lifting CUP (collection cups), and 4 be wafer-supporting platform, and 5 be wafer, and 6 are
Upper cover, 7 be range sensor, and 8 be shaft coupling, and 9 be lifting cylinder.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.
As shown in Figure 1, the present invention detection device include spindle motor 1, process cavity 2, lifting CUP3, wafer-supporting platform 4, on
Cover 6, range sensor 7 and lifting cylinder 9, wherein spindle motor 1 and lifting cylinder 9 are separately mounted on process cavity 2, are lifted
CUP3 and wafer-supporting platform 4 are located in process cavity 2 respectively, and the output terminal of spindle motor 1 places wafer 5 by shaft coupling 8 with being used for
Wafer-supporting platform 4 (wafer-supporting platform 4 of the invention be clipping wafer-supporting platform) be connected, the wafer-supporting platform 4 driven to rotate.Lifting CUP3, which is located at, to be held
4 periphery of piece platform is coaxially disposed with wafer-supporting platform 4, and the bottom surface for lifting CUP3 is connected with the piston of lifting cylinder 9, by the lifting cylinder 9
Driving lifting.The top of process cavity 2 is equipped with transparent upper cover 6, and the fixed position above wafer-supporting platform 4 is equipped with range sensor
7, which is located at the outside of process cavity 2 and upper cover 6, and range sensor 7 is in wafer 5 with 4 rotary course of wafer-supporting platform
In continuously measure spacing between wafer 5 and range sensor 7.
The detection method of wafer position detection device of the present invention is：
Wafer 5 by manipulator from the wafer-supporting platform 4 that the outside of process cavity 2 is transferred in process cavity 2, at this point, lifting air
Cylinder 9 drives lifting CUP3 to drop to lowest order, and the upper edge for lifting CUP3 is less than the height of wafer-supporting platform 4.After manipulator is withdrawn, rise
Sending down abnormally ascending cylinder 9 drives lifting CUP3 to rise to highest order.Spindle motor 1 drives wafer-supporting platform 4 to start to rotate by shaft coupling 8, in crystalline substance
While circle 5 is with 4 synchronous rotary of wafer-supporting platform, range sensor 7 starts between continuously detecting between wafer 5 and range sensor 7
Away from value；When the distance values fed back to have continuous multiple spot be more than presetting numerical value when, judge wafer 5 it is not horizontal positioned, it is necessary to
It readjusts.The time interval of distance samples is between 10~2000ms.
It may be employed to take relative value after resetting and take absolute value using numerical value and wait various ways.Range sensor is triggered to start
When, if position was zero at that time, using this position as start detect data.
If data judging can also be done the percentage for the numerical value that goes beyond the scope or go beyond the scope and the side such as be confirmed using continuous
Formula.Monitoring data are sampled by range sensor, the sampling period is 0.01 second, and after sampling, statistics value is more than threshold
The number of the point of value, if the number is more than setting value (10%) with the ratio that sampling is all counted, then it is assumed that wafer is placed not just
Really, otherwise it is assumed that wafer is placed correctly.
Claims (5)
1. a kind of wafer position detection device, it is characterised in that：Including spindle motor (1), process cavity (2), lifting CUP (3),
Wafer-supporting platform (4), range sensor (7) and lifting cylinder (9), wherein spindle motor (1) and lifting cylinder (9) are separately mounted to work
On skill cavity (2), the lifting CUP (3) and wafer-supporting platform (4) are located in process cavity (2) respectively, the spindle motor (1)
Output terminal is connected with for placing the wafer-supporting platform (4) of wafer (5), the wafer-supporting platform (4) is driven to rotate, and the lifting CUP (3) is located at
Wafer-supporting platform (4) periphery is connected with the piston of the lifting cylinder (9), drives lifting by the lifting cylinder (9)；Piece is held described
The top of platform (4) is equipped with range sensor (7), which is located at the outside of the process cavity (2), it is described away from
It is continuously measured between wafer (5) and range sensor (7) in wafer (5) is with wafer-supporting platform (4) rotary course from sensor (7)
Spacing.
2. by wafer position detection device described in claim 1, it is characterised in that：It is equipped at the top of the process cavity (2) upper
It covers (6).
3. a kind of detection method of wafer position detection device described in claim 1, it is characterised in that：The wafer (5) is by machine
On the wafer-supporting platform (4) that tool hand is transferred to outside process cavity (2) in process cavity (2), the spindle motor (1) drives and holds piece
Platform (4) rotates, and while the wafer (5) is with wafer-supporting platform (4) synchronous rotary, the range sensor (7) continuously detects wafer
(5) distance values between range sensor (7) when the distance values fed back to are more than presetting numerical value, judge the crystalline substance
Circle (5) is not horizontal positioned, it is necessary to readjust.
4. the detection method as described in claim 3, it is characterised in that：The time interval of distance samples 10~2000ms it
Between.
5. the detection method as described in claim 3, it is characterised in that：It is passed in the wafer (5) from manipulator to wafer-supporting platform (4)
When passing, the lifting cylinder (9) drives lifting CUP (3) to drop to lowest order, and the upper edge of the lifting CUP (3) is less than wafer-supporting platform
(4) height；After manipulator is withdrawn, the lifting cylinder (9) drives lifting CUP (3) to rise to highest order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611020691.7A CN108074830B (en) | 2016-11-18 | 2016-11-18 | Wafer position detection device and detection method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611020691.7A CN108074830B (en) | 2016-11-18 | 2016-11-18 | Wafer position detection device and detection method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108074830A true CN108074830A (en) | 2018-05-25 |
| CN108074830B CN108074830B (en) | 2020-08-11 |
Family
ID=62160495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611020691.7A Active CN108074830B (en) | 2016-11-18 | 2016-11-18 | Wafer position detection device and detection method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108074830B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933549A (en) * | 2020-07-28 | 2020-11-13 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and method for detecting sliding sheet |
| CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080152474A1 (en) * | 2005-02-22 | 2008-06-26 | Bart Scholte Van Mast | Method for Positioning a Wafer |
| CN101241840A (en) * | 2007-02-05 | 2008-08-13 | 东京毅力科创株式会社 | Vacuum processing apparatus and method, and storage medium |
| CN101539400A (en) * | 2009-04-17 | 2009-09-23 | 上海微电子装备有限公司 | Method for calibrating vertical survey system of photo-etching machine stage |
| CN103730334A (en) * | 2012-10-11 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Chemical solution recycling device suitable for square substrate |
| CN103811290A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Spray liquid recovery device |
-
2016
- 2016-11-18 CN CN201611020691.7A patent/CN108074830B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080152474A1 (en) * | 2005-02-22 | 2008-06-26 | Bart Scholte Van Mast | Method for Positioning a Wafer |
| CN101241840A (en) * | 2007-02-05 | 2008-08-13 | 东京毅力科创株式会社 | Vacuum processing apparatus and method, and storage medium |
| CN101539400A (en) * | 2009-04-17 | 2009-09-23 | 上海微电子装备有限公司 | Method for calibrating vertical survey system of photo-etching machine stage |
| CN103730334A (en) * | 2012-10-11 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Chemical solution recycling device suitable for square substrate |
| CN103811290A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Spray liquid recovery device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933549A (en) * | 2020-07-28 | 2020-11-13 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and method for detecting sliding sheet |
| CN111933549B (en) * | 2020-07-28 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and method for detecting sliding sheets |
| CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108074830B (en) | 2020-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10766108B2 (en) | Automatic fault diagnosable integrated sheet body punching and grinding assembly | |
| US11235434B2 (en) | Fault detectable sheet body fixed distance conveying and punching assembly | |
| CN101794721A (en) | Alignment apparatus for semiconductor wafer | |
| JP2020001089A (en) | Fixed-distance transport punching machine for piece shape body which can detect failure | |
| CN103599891B (en) | A kind of device picked for bearing outside diameter size | |
| CN106737195B (en) | A kind of emery wheel location position system and method | |
| CN103196399B (en) | A kind of product appearance size detects machine | |
| CN115083941B (en) | Plastic package chip pin detection equipment | |
| CN108074830A (en) | A kind of wafer position detection device and its detection method | |
| CN204479054U (en) | Precision bearing axial clearance checkout equipment | |
| CN203364806U (en) | Carrying disc detection device | |
| CN107234470B (en) | Rotary positioning device | |
| CN106783706B (en) | A kind of wafer takes the control system and method for piece | |
| CN211437071U (en) | Conveying device with aluminum film bag thickness detection device | |
| CN207280402U (en) | Mobile phone battery cover flatness detecting device | |
| CN109545729A (en) | A kind of semi-conductor silicon chip dry method plugs in basket equipment automatically | |
| CN215179193U (en) | Automatic line detection equipment for spiral spring | |
| CN202527608U (en) | Machine for automatically feeding and outputting stamping parts | |
| CN203127642U (en) | Rotating mechanism capable of providing standard position quickly | |
| CN214848501U (en) | Semiconductor chip template direction detection device | |
| CN106571314B (en) | Silicon wafer line mark detection device and detection method | |
| CN217561384U (en) | Non-contact semiconductor ingot and wafer integrated analysis and measurement equipment | |
| CN203132503U (en) | Product appearance size detection machine | |
| CN105698854B (en) | A kind of three-dimensional measuring instrument automation circulation point inspection device and its method | |
| CN215542843U (en) | Chip testing and sorting equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |