CN108074830B - Wafer position detection device and detection method thereof - Google Patents
Wafer position detection device and detection method thereof Download PDFInfo
- Publication number
- CN108074830B CN108074830B CN201611020691.7A CN201611020691A CN108074830B CN 108074830 B CN108074830 B CN 108074830B CN 201611020691 A CN201611020691 A CN 201611020691A CN 108074830 B CN108074830 B CN 108074830B
- Authority
- CN
- China
- Prior art keywords
- wafer
- bearing table
- lifting
- distance sensor
- process cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the field of wafer wet processing in the semiconductor industry, in particular to a wafer position detection device and a detection method thereof, wherein the wafer position detection device comprises a spindle motor, a process cavity, a lifting CUP (compute unified device for processing), a wafer bearing table, a distance sensor and a lifting cylinder, wherein the spindle motor and the lifting cylinder are respectively arranged on the process cavity; and a distance sensor is arranged above the wafer bearing table and is positioned outside the process cavity. The invention realizes the check whether the wafer placement position is correct or not by continuously detecting the distance between the wafer and the distance sensor; the detection device has simple structure and convenient assembly and disassembly; during detection, the wafer is subjected to non-contact detection, the detection speed is high, and the accuracy is high.
Description
Technical Field
The invention belongs to the field of wafer wet processing in the semiconductor industry, and particularly relates to a wafer position detection device and a wafer position detection method.
Background
At present, wafer wet processing equipment in the semiconductor industry relates to position detection of wafers in a process chamber. Under the traditional vacuum adsorption mode, whether the wafer is placed at the correct position can be judged according to the size of the vacuum pressure value. For the non-vacuum-adsorption type wafer bearing table, the pressure value cannot be used for detecting, and a non-contact detection method is needed for judging whether the wafer is correctly placed.
Disclosure of Invention
In order to solve the problem of wafer detection of the non-vacuum adsorption type wafer bearing platform, the invention aims to provide a wafer position detection device and a detection method thereof
The purpose of the invention is realized by the following technical scheme:
the detection device comprises a spindle motor, a process cavity, a lifting CUP, a wafer bearing table, a distance sensor and a lifting cylinder, wherein the spindle motor and the lifting cylinder are respectively arranged on the process cavity; and a distance sensor is arranged above the wafer bearing table and positioned outside the process cavity, and the distance sensor continuously measures the distance between the wafer and the distance sensor in the process that the wafer rotates along with the wafer bearing table.
Wherein: the top of the process cavity is provided with an upper cover;
the detection method of the wafer position detection device comprises the following steps:
the wafer is transferred to a wafer bearing table in the process cavity from the outside of the process cavity by a manipulator, the spindle motor drives the wafer bearing table to rotate, the wafer synchronously rotates along with the wafer bearing table, meanwhile, the distance sensor continuously detects a distance value between the wafer and the distance sensor, and when the fed back distance value exceeds a preset value, the wafer is judged not to be horizontally placed and needs to be readjusted.
Wherein: the distance sampling time interval is 10-2000 ms; when the wafer is transferred to the wafer bearing table by the manipulator, the lifting air cylinder drives the lifting CUP to descend to the lowest position, and the upper edge of the lifting CUP is lower than the height of the wafer bearing table; when the manipulator is removed, the lifting cylinder drives the lifting CUP to ascend to the highest position.
The invention has the advantages and positive effects that:
the invention realizes the check whether the wafer placement position is correct or not by continuously detecting the distance between the wafer and the distance sensor; the detection device has simple structure and convenient assembly and disassembly; during detection, the wafer is subjected to non-contact detection, the detection speed is high, and the accuracy is high.
Drawings
FIG. 1 is a schematic structural diagram of a detecting device according to the present invention;
wherein: the device comprises a spindle motor 1, a process cavity 2, a lifting CUP (collecting CUP) 3, a wafer bearing table 4, a wafer 5, an upper cover 6, a distance sensor 7, a coupler 8 and a lifting cylinder 9.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, the detection apparatus of the present invention includes a spindle motor 1, a process chamber 2, a lifting CUP3, a wafer supporting table 4, an upper cover 6, a distance sensor 7, and a lifting cylinder 9, wherein the spindle motor 1 and the lifting cylinder 9 are respectively installed on the process chamber 2, the lifting CUP3 and the wafer supporting table 4 are respectively located in the process chamber 2, and an output end of the spindle motor 1 is connected to the wafer supporting table 4 (the wafer supporting table 4 of the present invention is a clamping type wafer supporting table) for placing a wafer 5 through a coupling 8, so as to drive the wafer supporting table 4 to rotate. The lifting CUP3 is positioned at the periphery of the wafer bearing table 4 and is coaxially arranged with the wafer bearing table 4, the bottom surface of the lifting CUP3 is connected with a piston of the lifting cylinder 9, and the lifting cylinder 9 drives the lifting to ascend and descend. The top of the process cavity 2 is provided with a transparent upper cover 6, a distance sensor 7 is arranged at a fixed position above the wafer bearing table 4, the distance sensor 7 is positioned outside the process cavity 2 and the upper cover 6, and the distance sensor 7 continuously measures the distance between the wafer 5 and the distance sensor 7 in the process that the wafer 5 rotates along with the wafer bearing table 4.
The detection method of the wafer position detection device comprises the following steps:
the wafer 5 is transferred to the wafer bearing table 4 in the process chamber 2 from the outside of the process chamber 2 by the manipulator, at this time, the lifting cylinder 9 drives the lifting CUP3 to descend to the lowest position, and the upper edge of the lifting CUP3 is lower than the height of the wafer bearing table 4. When the manipulator is removed, the lifting cylinder 9 drives the lifting CUP3 to rise to the highest position. The spindle motor 1 drives the wafer bearing table 4 to rotate through the coupler 8, and the distance sensor 7 starts to continuously detect a distance value between the wafer 5 and the distance sensor 7 while the wafer 5 synchronously rotates along with the wafer bearing table 4; when the fed back distance value has continuous multiple points exceeding the preset value, it is determined that the wafer 5 is not horizontally placed and needs to be readjusted. The time interval of distance sampling is between 10 and 2000 ms.
The numerical value can adopt various modes such as taking a relative value and taking an absolute value after zero clearing. When the trigger distance sensor is started, the current position is set to be zero, and the position is used as the starting detection data.
The data determination can also be confirmed by continuously determining that a plurality of points are out of range or percentage of out-of-range values. Sampling the monitoring data through a distance sensor, wherein the sampling period is 0.01 second, counting the number of points with the data value larger than a threshold value after the sampling is finished, and if the ratio of the number to all the sampled points is larger than a set value (10%), considering that the wafer is placed incorrectly, otherwise, considering that the wafer is placed correctly.
Claims (4)
1. A wafer position detecting device is characterized in that: the automatic wafer lifting device comprises a spindle motor (1), a process cavity (2), a lifting CUP (unified power supply) (3), a wafer bearing table (4), a distance sensor (7) and a lifting cylinder (9), wherein the spindle motor (1) and the lifting cylinder (9) are respectively installed on the process cavity (2), the lifting CUP (3) and the wafer bearing table (4) are respectively positioned in the process cavity (2), the output end of the spindle motor (1) is connected with the wafer bearing table (4) for placing a wafer (5) and drives the wafer bearing table (4) to rotate, the lifting CUP (3) is positioned on the periphery of the wafer bearing table (4), is connected with a piston of the lifting cylinder (9) and is driven to lift by the lifting cylinder (9); a distance sensor (7) is arranged above the wafer bearing table (4), the distance sensor (7) is positioned outside the process cavity (2), and the distance sensor (7) continuously measures the distance between the wafer (5) and the distance sensor (7) in the process that the wafer (5) rotates along with the wafer bearing table (4); an upper cover (6) is arranged at the top of the process cavity (2).
2. A method for inspecting a wafer position inspecting device according to claim 1, comprising: the wafer (5) is transferred to a wafer bearing table (4) in the process cavity (2) from the outside of the process cavity (2) through a mechanical arm, the spindle motor (1) drives the wafer bearing table (4) to rotate, the distance sensor (7) continuously detects a distance value between the wafer (5) and the distance sensor (7) while the wafer (5) synchronously rotates along with the wafer bearing table (4), and when the fed back distance value exceeds a preset value, the wafer (5) is judged not to be horizontally placed and needs to be readjusted.
3. The detection method according to claim 2, characterized in that: the time interval of distance sampling is between 10 and 2000 ms.
4. The detection method according to claim 2, characterized in that: when the wafer (5) is transferred to the wafer bearing table (4) by the mechanical arm, the lifting air cylinder (9) drives the lifting CUP (3) to descend to the lowest position, and the upper edge of the lifting CUP (3) is lower than the height of the wafer bearing table (4); when the manipulator is removed, the lifting air cylinder (9) drives the lifting CUP (3) to ascend to the highest position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611020691.7A CN108074830B (en) | 2016-11-18 | 2016-11-18 | Wafer position detection device and detection method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611020691.7A CN108074830B (en) | 2016-11-18 | 2016-11-18 | Wafer position detection device and detection method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108074830A CN108074830A (en) | 2018-05-25 |
| CN108074830B true CN108074830B (en) | 2020-08-11 |
Family
ID=62160495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611020691.7A Active CN108074830B (en) | 2016-11-18 | 2016-11-18 | Wafer position detection device and detection method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108074830B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933549B (en) * | 2020-07-28 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and method for detecting sliding sheets |
| CN113467199B (en) * | 2021-09-06 | 2021-11-12 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006089435A1 (en) * | 2005-02-22 | 2006-08-31 | Oc Oerlikon Balzers Ag | Method for positioning a wafer |
| JP2008192840A (en) * | 2007-02-05 | 2008-08-21 | Tokyo Electron Ltd | Vacuum processing apparatus, method for vacuum processing and storage medium |
| CN101539400B (en) * | 2009-04-17 | 2010-12-29 | 上海微电子装备有限公司 | Method for calibrating vertical survey system of photo-etching machine stage |
| CN103730334B (en) * | 2012-10-11 | 2016-08-03 | 沈阳芯源微电子设备有限公司 | A kind of chemical liquid recovery device being applicable to square substrate |
| CN103811290A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Spray liquid recovery device |
-
2016
- 2016-11-18 CN CN201611020691.7A patent/CN108074830B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108074830A (en) | 2018-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108074830B (en) | Wafer position detection device and detection method thereof | |
| CN106272166A (en) | A kind of aircraft long beam multistation automatic fixture | |
| CN108724961B (en) | Marking device | |
| CN109883369B (en) | Test bench for detecting jumping performance of electronic water pump | |
| CN207067352U (en) | A kind of optoelectronic switch detection device | |
| CN209804602U (en) | wafer conductive film processing equipment | |
| CN113029047A (en) | Flatness detector and using method | |
| CN218646205U (en) | Optical lens piece thickness detection device | |
| CN112033611A (en) | Automatic check out test set of leakproofness | |
| CN216015297U (en) | Chip multistation test system | |
| CN110508498A (en) | One kind is for quick-fried pearl quality testing rejection device in quick-fried pearl cigarette filter | |
| KR101266583B1 (en) | Semiconductor chip pick-up apparatus | |
| CN212321017U (en) | Automatic check out test set of leakproofness | |
| CN209973684U (en) | Two-piece battery detection and discharge device | |
| JP2010201557A (en) | Workpiece pickup device and method | |
| CN214066483U (en) | Full automatic check out test set of motor shaft | |
| CN110364448B (en) | Wafer conductive film processing system | |
| CN209815575U (en) | Jacking rotary mechanism and wheel detection device | |
| CN108996181B (en) | Automatic turnover device for detecting surface defects of bearing | |
| CN108918325B (en) | Full-automatic on-line detection device for powder brin value | |
| CN212578098U (en) | Accurate positioning and feeding device | |
| CN220678616U (en) | Chip outward appearance check out test set | |
| CN214276831U (en) | Flatness detector | |
| CN219574399U (en) | Automatic detect inside groove foreign matter detection device | |
| CN211504005U (en) | Product overall dimension check out test set |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |