CN103811290A - Spray liquid recovery device - Google Patents
Spray liquid recovery device Download PDFInfo
- Publication number
- CN103811290A CN103811290A CN201210455236.5A CN201210455236A CN103811290A CN 103811290 A CN103811290 A CN 103811290A CN 201210455236 A CN201210455236 A CN 201210455236A CN 103811290 A CN103811290 A CN 103811290A
- Authority
- CN
- China
- Prior art keywords
- protective cover
- wafer
- internal layer
- spindle motor
- brace table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the field of wafer wet processing of the semiconductor industry and particularly relates to a spray liquid recovery device for recovering liquids thrown from wafers. The device comprises an inner protection cover connected with a lifting air cylinder which can select to rise or descend according to different usage liquids. Wafer position detectors are arranged on an outer protection cover and can detect wafer positions through the rising and descending of a supporting platform with telescopic air cylinders. When the telescopic air cylinders of the supporting platform are in a stretching state, the supporting platform is at the upper position, wafers can be put on the supporting platform through an external manipulator, the telescopic air cylinders contract, the supporting platform descends, and the wafer position detectors on the outer protection cover detect whether the wafer positions are accurate during descending and send signals if the wafer positions deviate. By means of the device, throwing away of the wafers during rotation of the supporting platform can be prevented; a row of exhaust rings is arranged below the supporting platform, protection air can be exhausted to the cavity, and a motor connected with the supporting platform is prevented from being eroded.
Description
Technical field
The invention belongs to semicon industry wafer wet treatment field, specifically a kind of spray liquid retracting device that gets rid of liquid from wafer that reclaims.
Background technology
At present, wet treatment wafer adopts antivacuum mode to clamp, and in wafer is placed on the process of brace table, may wafer be put partially because of error, and in the time that brace table rotates, wafer is easy to be thrown out of, thereby produces dangerous.In addition, wet treatment wafer adopts corrosive liquids mostly, can exert an influence to device security.
Summary of the invention
Put because of wafer the problem being partially thrown out of in order to solve antivacuum mode holding chip existence, the object of the present invention is to provide a kind of spray liquid retracting device.Whether this body sprinkling retracting device can detect the position of wafer on brace table and be offset, and interior outer protective cover is set simultaneously, recycles the liquid of wafer by changing the jacking condition of internal layer protective cover.
Another object of the present invention is to provide a kind of spray liquid retracting device.This body sprays retracting device can blow protective gas in cavity, prevents that the spindle motor that connects brace table from being corroded.
The object of the invention is to be achieved through the following technical solutions:
The present invention includes internal layer protective cover, outer protective cover, wafer prober, brace table, supporting bracket, lift cylinder, telescopic cylinder, base plate and spindle motor, wherein supporting bracket and telescopic cylinder lay respectively at the below of base plate and are connected on base plate, described spindle motor is connected in the output of telescopic cylinder, the output of spindle motor passes, is connected with by described base plate the brace table of placing wafer, and the brace table of this placement wafer is driven rotation and driven lifting with spindle motor by telescopic cylinder by spindle motor; Described internal layer protective cover and outer protective cover are located at the periphery of brace table from inside to outside successively, and outer protective cover is arranged on described base plate, and internal layer protective cover is connected with the output that is arranged on the lift cylinder in supporting bracket, drives lifting by lift cylinder; The top of described internal layer protective cover and outer protective cover all has the hole for brace table lifting, and on outer protective cover, the edge in hole is provided with the wafer prober that detects wafer position.
Wherein: on the output of described spindle motor, air exhaust loop is installed, is provided with vertically to the pore of internal layer protective cover internal cavity blow gas on this air exhaust loop, described pore is connected with source of the gas; Described pore is at least two, and each pore is all connected with source of the gas; The clean dry gas being blown out by described pore enters internal layer protective cover internal cavity by the gap between spindle motor and base plate; Described wafer prober is provided with to the tracheae of wafer prober top blow gas, and one end of this tracheae is connected with source of the gas, and the other end is to the top bending of wafer prober; On described outer protective cover, the edge in hole is provided with a pair of symmetrically arranged wafer prober, and the connection between two wafer probers is through the center of circle of described hole and wafer; The top of described internal layer protective cover and outer protective cover is taper type, inner hollow, and internal layer protective cover, outer protective cover, brace table and spindle motor arrange with one heart; Described support edge of table is along the bumping post that is circumferentially evenly equipped with multiple positions wafer; Described internal layer protective cover is connected with the output of lift cylinder by guide pillar.
Advantage of the present invention and good effect are:
1. the present invention has a pair of wafer prober at outer protective cover top, and wafer is placed on after brace table, and brace table declines, the light that wafer prober sends can be stopped by wafer, the power of the light stopping according to wafer can judge whether wafer is set level, and whether position is accurate, prevents fragment; Internal layer protective cover is connected with lift cylinder with supporting bracket by guide pillar, and outer protective cover is placed in internal layer protective cover outside, can control the flow direction of getting rid of liquid from wafer by the jacking condition that changes internal layer protective cover.
2. there is an air exhaust loop spindle motor outer ring being connected with brace table in the present invention, has the pore that is no less than two on this air exhaust loop, can blow out clean dry gas from pore, and these gases can play a protective role to the device of cavity.
3. the present invention has a tracheae each wafer prober is other, and this tracheae can alignment wafer detector top blows out the gas of dry cleansing, can play to wafer prober the effect of protection.
4. brace table of the present invention can carry out lifting by telescopic cylinder, can adopt manipulator that wafer transferring is arrived to brace table.
Accompanying drawing explanation
Fig. 1 is overall perspective view of the present invention;
Fig. 2 is the structure cutaway view of the present invention in the time that manipulator send wafer;
Fig. 3 is the structure cutaway view of supporting platform of the present invention in service position;
Fig. 4 is the structure cutaway view that internal layer protective cover of the present invention is in lifting position;
Wherein: 1A is internal layer protective cover, 1B is outer protective cover, and 2 is wafer, and 3 is wafer position detector, and 4 is brace table, 5 is air exhaust loop, and 6 is guide pillar, and 7 is supporting bracket, and 8 is lift cylinder, and 9 is telescopic cylinder, 10 is tracheae, and 11 is base plate, and 12 is spindle motor, and 13 is connector.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figure 1 and Figure 2, the present invention includes and comprise internal layer protective cover 1A, outer protective cover 1B, wafer prober 3, brace table 4, air exhaust loop 5, guide pillar 6, supporting bracket 7, lift cylinder 8, telescopic cylinder 9, tracheae 10, base plate 11 and spindle motor 12, wherein supporting bracket 7 and telescopic cylinder 9 lay respectively at the below of base plate 11 and are connected on base plate 11; Spindle motor 12 is connected in the output of telescopic cylinder 9 by connector 13, the output of spindle motor 12 passes, is connected with by described base plate 11 brace table 4 of placing wafer 2, circumferentially be evenly equipped with the bumping post of multiple positions wafer 2 on the edge, edge of brace table 4, the brace table 4 of placing wafer 2 is driven rotation and is driven lifting with spindle motor 12 by telescopic cylinder 9 by spindle motor 12.
Internal layer protective cover 1A and outer protective cover 1B are located at the periphery of brace table 4 from inside to outside successively, the top of internal layer protective cover 1A and outer protective cover 1B is taper type, inner hollow, internal layer protective cover 1A, outer protective cover 1B, brace table 4 and spindle motor 12 arrange with one heart.The top of internal layer protective cover 1A and outer protective cover 1B all has the hole for brace table 4 liftings, and on outer protective cover 1B, the edge in hole is provided with the wafer prober 3 that detects wafer 2 positions; The present embodiment is that the edge in hole on outer protective cover 1B is provided with connection between 3, two wafer probers 3 of a pair of symmetrically arranged wafer prober center of circle through described hole and wafer 2; On each wafer prober 3, be equipped with the tracheae 10 that blows out dry cleansing gas to wafer prober 3 tops; one end of this tracheae 10 is connected with source of the gas; the other end is to the top bending of wafer prober 3, and the gas that tracheae 10 blows out can play to wafer prober 3 effect of protection.
Outer protective cover 1B is arranged on base plate 11, and internal layer protective cover 1A is connected with the output that is arranged on the lift cylinder 8 in supporting bracket 7 by guide pillar 6, drives lifting by lift cylinder 8.Air exhaust loop 5 is installed on the output of spindle motor 12; on this air exhaust loop 5, be provided with vertically to the pore of internal layer protective cover 1A internal cavity blow gas; described pore is at least two; each pore is all connected with source of the gas; the clean dry gas being blown out by described pore enters internal layer protective cover 1A internal cavity by the gap between spindle motor 12 and base plate 11, and these gases can play a protective role to the device of cavity.
Operation principle of the present invention is:
As shown in Figure 1, when telescopic cylinder 9, in the time stretching out state, brace table 4 is in extreme higher position, and manipulator is placed on wafer on brace table 4, and telescopic cylinder 9 shrinks and drives brace table 4 to decline, when decline, a pair of wafer position detector 3 emits beam, one of them position detector 3 emits beam, another wafer position detector 3 receives light, when declining, wafer 2 can block the middle light of a pair of position detector 3, the light size of blocking when the light size that wafer position detector 3 can block wafer 2 is placed with wafer 2 is normal contrasts, if there is deviation, illustrate that there is deviation the position of wafer 2 on brace table 4, can report to the police to signal of control system (control system of the present invention is prior art), if two light contrast zero deflections, the position of wafer 2 on brace table 4 is accurate, can carry out next processing step.
After wafer 2 is accurately placed on brace table 4, telescopic cylinder 9 shrinks and drives brace table 4 to drop to least significant end, and now spindle motor 12 drives brace table 4 and wafer 2 to rotate, and external structure is to wafer 2 surface sprinkling liquid; Lift cylinder 8 is connected with guide pillar 6 by supporting bracket 7, and the other end of guide pillar 6 is connected with internal layer protective cover 1a, the rise and fall state of what lift cylinder 8 can be level and smooth control internal layer protective cover 1a.In the time that internal layer protective cover 1a is in decline state, as shown in Figure 3, the liquid of sprinkling can flow out from internal layer protective cover 1a outside, and the liquid spraying in the time that internal layer protective cover 1a is in propradation can flow out from internal layer protective cover 1a inner side, as shown in Figure 4.
In external structure, during to wafer 2 spraying liquid, air exhaust loop 5 can be to the gas that sprays clean dried in cavity, and the mist that the liquid that prevents from spraying produces is near spindle motor 12, thereby spindle motor 12 is played to the effect of protection.There is in addition a tracheae 10 on the side of wafer position detector 3, in the time giving wafer 2 spraying liquid, liquid can splash down on wafer position detector 3, can affect intensity and the transmit direction of the light that wafer position detector 3 produces, thereby can cause wafer position detector 3 false alarms.
Claims (8)
1. a spray liquid retracting device, it is characterized in that: comprise internal layer protective cover (1A), outer protective cover (1B), wafer prober (3), brace table (4), supporting bracket (7), lift cylinder (8), telescopic cylinder (9), base plate (11) and spindle motor (12), wherein supporting bracket (7) and telescopic cylinder (9) lay respectively at the below of base plate (11), and be connected on base plate (11), described spindle motor (12) is connected in the output of telescopic cylinder (9), the output of spindle motor (12) is passed by described base plate (11), be connected with the brace table (4) of placing wafer (2), the brace table (4) of this placement wafer (2) drives rotation by spindle motor (12), and drive lifting with spindle motor (12) by telescopic cylinder (9), described internal layer protective cover (1A) and outer protective cover (1B) are located at the periphery of brace table (4) from inside to outside successively, outer protective cover (1B) is arranged on described base plate (11), internal layer protective cover (1A) is connected with the output that is arranged on the lift cylinder (8) in supporting bracket (7), drives lifting by lift cylinder (8), the top of described internal layer protective cover (1A) and outer protective cover (1B) all has the hole for brace table (4) lifting, is provided with at the edge in the upper hole of outer protective cover (1B) wafer prober (3) that detects wafer (2) position.
2. by spray liquid retracting device described in claim 1, it is characterized in that: air exhaust loop (5) is installed on the output of described spindle motor (12), on this air exhaust loop (5), be provided with vertically to the pore of internal layer protective cover (1A) internal cavity blow gas, described pore is connected with source of the gas.
3. by spray liquid retracting device described in claim 2, it is characterized in that: described pore is at least two, each pore is all connected with source of the gas; The clean dry gas being blown out by described pore enters internal layer protective cover (1A) internal cavity by the gap between spindle motor (12) and base plate (11).
4. by spray liquid retracting device described in claim 1 or 2, it is characterized in that: described wafer prober (3) is provided with to the tracheae (10) of wafer prober (3) top blow gas, one end of this tracheae (10) is connected with source of the gas, and the other end is to the top bending of wafer prober (3).
5. by spray liquid retracting device described in claim 1 or 2, it is characterized in that: the edge in the upper hole of described outer protective cover (1B) is provided with a pair of symmetrically arranged wafer prober (3), and the connection between two wafer probers (3) is through the center of circle of described hole and wafer (2).
6. by spray liquid retracting device described in claim 1 or 2, it is characterized in that: the top of described internal layer protective cover (1A) and outer protective cover (1B) is taper type, inner hollow, internal layer protective cover (1A), outer protective cover (1B), brace table (4) and spindle motor (12) arrange with one heart.
7. by spray liquid retracting device described in claim 1 or 2, it is characterized in that: the edge of described brace table (4) is along the bumping post that is circumferentially evenly equipped with multiple positions wafer (2).
8. by spray liquid retracting device described in claim 1 or 2, it is characterized in that: described internal layer protective cover (1A) is connected with the output of lift cylinder (8) by guide pillar (6).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210455236.5A CN103811290A (en) | 2012-11-13 | 2012-11-13 | Spray liquid recovery device |
| PCT/CN2013/084950 WO2014075524A1 (en) | 2012-11-13 | 2013-10-10 | Liquid spray recovery device with wafer location detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210455236.5A CN103811290A (en) | 2012-11-13 | 2012-11-13 | Spray liquid recovery device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103811290A true CN103811290A (en) | 2014-05-21 |
Family
ID=50707909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210455236.5A Pending CN103811290A (en) | 2012-11-13 | 2012-11-13 | Spray liquid recovery device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103811290A (en) |
| WO (1) | WO2014075524A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105080782A (en) * | 2014-05-23 | 2015-11-25 | 沈阳芯源微电子设备有限公司 | Liquid coating device |
| CN108074830A (en) * | 2016-11-18 | 2018-05-25 | 沈阳芯源微电子设备有限公司 | A kind of wafer position detection device and its detection method |
| CN109701943A (en) * | 2019-01-22 | 2019-05-03 | 上海提牛机电设备有限公司 | A kind of wafer cleaning basin |
| CN110420803A (en) * | 2019-06-25 | 2019-11-08 | 泉州丰泽如通机械设计有限公司 | One kind is movable to urge dry sensors water-tight equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101452209A (en) * | 2007-11-30 | 2009-06-10 | 沈阳芯源微电子设备有限公司 | Automatic cap-covering mechanism in photoresist coating unit of square substrate |
| CN101491797A (en) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | Glue spreading device |
| CN201332089Y (en) * | 2008-12-24 | 2009-10-21 | 沈阳芯源微电子设备有限公司 | Multi-chemical co-cavity processing device |
| CN102059197A (en) * | 2009-11-13 | 2011-05-18 | 采钰科技股份有限公司 | Spray coating system and method |
| CN102244023A (en) * | 2010-05-12 | 2011-11-16 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate processing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005079219A (en) * | 2003-08-29 | 2005-03-24 | Tokyo Electron Ltd | Substrate processing apparatus |
| KR20080082846A (en) * | 2007-03-09 | 2008-09-12 | (주)이노루트 | Method of thinning substrate, apparatus for thinning substrate and system having the same |
-
2012
- 2012-11-13 CN CN201210455236.5A patent/CN103811290A/en active Pending
-
2013
- 2013-10-10 WO PCT/CN2013/084950 patent/WO2014075524A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101452209A (en) * | 2007-11-30 | 2009-06-10 | 沈阳芯源微电子设备有限公司 | Automatic cap-covering mechanism in photoresist coating unit of square substrate |
| CN101491797A (en) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | Glue spreading device |
| CN201332089Y (en) * | 2008-12-24 | 2009-10-21 | 沈阳芯源微电子设备有限公司 | Multi-chemical co-cavity processing device |
| CN102059197A (en) * | 2009-11-13 | 2011-05-18 | 采钰科技股份有限公司 | Spray coating system and method |
| CN102244023A (en) * | 2010-05-12 | 2011-11-16 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate processing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105080782A (en) * | 2014-05-23 | 2015-11-25 | 沈阳芯源微电子设备有限公司 | Liquid coating device |
| CN108074830A (en) * | 2016-11-18 | 2018-05-25 | 沈阳芯源微电子设备有限公司 | A kind of wafer position detection device and its detection method |
| CN109701943A (en) * | 2019-01-22 | 2019-05-03 | 上海提牛机电设备有限公司 | A kind of wafer cleaning basin |
| CN110420803A (en) * | 2019-06-25 | 2019-11-08 | 泉州丰泽如通机械设计有限公司 | One kind is movable to urge dry sensors water-tight equipment |
| CN110420803B (en) * | 2019-06-25 | 2020-12-11 | 德清县诚达金属材料有限公司 | Movable type drying accelerating type sensor sealing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014075524A1 (en) | 2014-05-22 |
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Application publication date: 20140521 |