CN105080782A - Liquid coating device - Google Patents

Liquid coating device Download PDF

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Publication number
CN105080782A
CN105080782A CN201410223103.4A CN201410223103A CN105080782A CN 105080782 A CN105080782 A CN 105080782A CN 201410223103 A CN201410223103 A CN 201410223103A CN 105080782 A CN105080782 A CN 105080782A
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CN
China
Prior art keywords
described
wafer
supporting platform
square
main shaft
Prior art date
Application number
CN201410223103.4A
Other languages
Chinese (zh)
Inventor
尹宁
卢继奎
Original Assignee
沈阳芯源微电子设备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沈阳芯源微电子设备有限公司 filed Critical 沈阳芯源微电子设备有限公司
Priority to CN201410223103.4A priority Critical patent/CN105080782A/en
Publication of CN105080782A publication Critical patent/CN105080782A/en

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Abstract

The invention relates to wafer treatment equipment in the semiconductor industry, in particular to a liquid coating device. The liquid coating device comprises a workbench, a bottom plate, a square wafer bearing table, a spindle motor, a wafer bearing table lifting air cylinder, a spindle and a liquid cup. The spindle motor, the wafer bearing table lifting air cylinder and the liquid cup are arranged on the workbench, a spindle is driven by the spindle motor to rotate, and the spindle is connected with the wafer bearing table lifting air cylinder and driven by the wafer bearing table lifting air cylinder to ascend and descend. The top end of the spindle penetrates the workbench and the liquid cup in sequence, the bottom plate in the liquid cup is connected with the square wafer bearing table, the bottom plate and the square wafer bearing table are driven by the spindle to synchronously rotate, and the square wafer bearing table is driven by the spindle driven by the wafer bearing table lifting air cylinder and can ascend and descend relative to the bottom plate. Coated square wafers or round wafers are adsorbed to the square wafer bearing table and rotate or ascend and descend along with the square wafer bearing table. The liquid coating device can be used for treatment of the square wafers and the round wafers, the influence of air flowing on coating evenness is lowered, and the wafers are prevented from being polluted by the outside.

Description

A kind of liquid coating device

Technical field

The present invention relates to semicon industry wafer processing apparatus, specifically a kind of liquid coating device.

Background technology

Substrate for semiconductor integrated circuit manufacture mostly is 4 ~ 12 inch circular wafers.Traditional liquid coating device is typically employed in a circular cavity, and center arranges rotatable circular wafer-supporting platform, and Circular wafer adopts the mode of vacuum suction on wafer-supporting platform to process.This method can obtain uniform liquid spreading effect, in semicon industry extensive use; But this mode is applied in square wafer, due to the impact of own form and ambient windstream, the liquid coating of square wafer is extremely uneven, and the very large regions of wafer corner can not reach technological requirement, cannot use, cause waste.

Summary of the invention

The object of the present invention is to provide a kind of liquid coating device.This liquid coating device can be used for the process of square, circular two kinds of difformity wafers.

Another object of the present invention is to provide a kind of liquid coating device.This liquid coating device adjustable liquid cup internal gas flow, avoids being subject to external contamination.

The object of the invention is to be achieved through the following technical solutions:

The present invention includes workbench, base plate, square wafer-supporting platform, spindle motor, wafer-supporting platform lift cylinder, main shaft and liquid cup, wherein spindle motor, wafer-supporting platform lift cylinder and liquid cup are arranged on described workbench respectively, described spindle motor is connected with main shaft by transmission device, drive shaft rotates, and described main shaft is connected with described wafer-supporting platform lift cylinder, is driven be elevated by wafer-supporting platform lift cylinder; The top of described main shaft is successively through workbench and liquid cup, be connected with the described base plate and square wafer-supporting platform that are positioned at liquid cup, described base plate and square wafer-supporting platform drive synchronous rotary by main shaft, and the main shaft that described square wafer-supporting platform is driven by wafer-supporting platform lift cylinder drives, can be elevated relative to described base plate; Coated square wafer or Circular wafer are attracted on described square wafer-supporting platform, rotate or lifting with described square wafer-supporting platform.

Wherein: described workbench is provided with top cover lifting cylinder, the output of this top cover lifting cylinder is connected with upper cover, described upper cover be positioned at described liquid cup top, be elevated by top cover lifting air cylinder driven, the upper cover of decline covers described liquid cup;

Be provided with air distribution plate above described workbench, described air distribution plate have the hole passed for described liquid cup, the air distribution plate around the liquid cup passed is evenly equipped with multiple passage; Described air distribution plate is connected with workbench by many root posts, and described air distribution plate is parallel with workbench;

On described main shaft, key is connected with the first axle sleeve, and the output of described spindle motor is connected with this first axle sleeve by described transmission device, drives described main shaft to rotate; The output of described wafer-supporting platform lift cylinder is connected with described main shaft by lifter plate, and drive shaft is elevated; Described workbench is provided with guide pillar, and described lifter plate is connected with guide pillar by guide pin bushing;

The top key of described main shaft is connected with the second axle sleeve, and described base plate is connected with this second axle sleeve; Described second axle sleeve is provided with the adjustment screw adjusting described square wafer-supporting platform height, and described square wafer-supporting platform is by being connected with the top of described main shaft after the adjustment of this adjustment screw; Described base plate is circular, and centre has the square groove for described square wafer-supporting platform lifting; The edge of described base plate is downward-sloping;

The square wafer that described square wafer-supporting platform adsorbs or Circular wafer are when coated, and wafer surface is positioned at the top of described plate upper surface; Further, when applying Circular wafer the upper surface of described square wafer-supporting platform higher than the upper surface of described base plate.

Advantage of the present invention and good effect are:

1. square wafer-supporting platform of the present invention and base plate can rotate with spindle synchronous, and square wafer-supporting platform also can be elevated with main shaft opposed bottom, can be used for the process of square, circular two kinds of difformity wafers.

2. be provided with liftable upper cover above liquid cup of the present invention, upper cover covers liquid cup after declining, and covered by whole coating zone, air-flow enters liquid cup by upper cover, play adjustment liquid cup internal gas flow, avoid being subject to the effect of external contamination, reduce air flowing to the impact of coating uniformity.

3. the top of workbench of the present invention is provided with air distribution plate, and air-flow, by being discharged by the exhaust outlet on workbench after air distribution plate, is avoided refluxing due to the stop of workbench, ensures that air-flow is always downward.

4. the height of square wafer-supporting platform of the present invention regulates by adjustment screw thread, and the wafer being applicable to different-thickness carries out liquid coating.

Accompanying drawing explanation

Fig. 1 is perspective view of the present invention;

Fig. 2 is structural front view of the present invention;

Fig. 3 is A-A sectional view of Fig. 2;

Fig. 4 is the internal structure schematic diagram after upper cover of the present invention covers liquid cup;

Fig. 5 is the perspective view after upper cover of the present invention covers liquid cup;

Wherein: 1 is workbench, 2 is upper cover, and 3 is base plate, and 4 is square wafer-supporting platform, 5 is spindle motor, and 6 is square wafer, and 7 is air distribution plate, and 8 is lifter plate, 9 is wafer-supporting platform lift cylinder, and 10 is the first axle sleeve, and 11 is main shaft, 12 is top cover lifting cylinder, and 13 is guide pillar, and 14 is guide pin bushing, 15 is passage, and 16 is guide rail, and 17 is column, 18 is liquid cup, and 19 is the second axle sleeve, and 20 is adjustment screw.

Detailed description of the invention

Below in conjunction with accompanying drawing, the invention will be further described.

As shown in Fig. 1 ~ 5, the present invention includes workbench 1, upper cover 2, base plate 3, square wafer-supporting platform 4, spindle motor 5, air distribution plate 7, lifter plate 8, wafer-supporting platform lift cylinder 9, first axle sleeve 10, main shaft 11, top cover lifting cylinder 12, liquid cup 18, second axle sleeve 19 and adjustment screw 20, wherein the lower surface of workbench 1 is separately installed with spindle motor 5 and wafer-supporting platform lift cylinder 9, and upper surface is provided with liquid cup 18; Above workbench 1, be provided with air distribution plate 7, this air distribution plate 7 is connected with workbench 1 by many root posts 17, and air distribution plate 7 and workbench 1 be arranged in parallel; Air distribution plate 7 has the hole that feeding cup 18 passes, the air distribution plate 7 around the liquid cup 18 passed is evenly equipped with the passage 15 of multiple bar shaped.Air-flow can arrange by air distribution plate 7, prevents top from blowing down the gas come and touches the rear bounce-back of workbench 1, can take up the pollutant on workbench 1, can pollute like this to liquid coating processes during air rebound; When after placement air distribution plate 7, the gas come is blown down in top can blow to workbench 1 by the passage 15 on air distribution plate 7, but during bounce-back, air distribution plate 7 can play barrier effect, the pollutant taken up when effectively reducing bounce-back.And due to the stop of air distribution plate 7, air-flow, by being discharged by the exhaust outlet on workbench 1 after air distribution plate, is avoided due to the stop of workbench 1 and refluxes, ensure that air-flow is always downward, avoid sinuous flow to cause wafer contamination.

Workbench 1 is connected with guide rail 16, is provided with top cover lifting cylinder 12 on track 16, the output of this top cover lifting cylinder 12 is connected with circular upper cover 2, and upper cover 2 is positioned at the top of liquid cup 18, is elevated under the driving of top cover lifting cylinder 12.Upper cover 2 after decline can cover liquid cup 18, is covered by whole coating zone, reducing the impact of air-flow on liquid coating uniformity, and stopping that waste liquid splashes, can play the effect avoiding external particle to pollute simultaneously when carrying out liquid coating.

Main shaft 11 is provided with the first axle sleeve 10, and main shaft 11 has keyway, and the first axle sleeve 10 is connected with main shaft 11 key, and such first axle sleeve 10 both can drive main shaft 11 to rotate, and main shaft 11 can also be elevated by relative first axle sleeve 10.The output of spindle motor 5 is connected with this first axle sleeve 10 by transmission device, drive shaft 11 rotates, and transmission device can be belt, pulley transmission structure, sprocket wheel, chain drive structure or meshed transmission gear structure; The transmission device of the present embodiment is belt, pulley transmission structure, and namely the output of spindle motor 5 is connected with the first belt pulley, and the first axle sleeve 10 is provided with the second belt pulley, is connected between first and second belt pulley by belt.The output of wafer-supporting platform lift cylinder 9 is connected with main shaft 11 by lifter plate 8, and drive shaft 11 is elevated; Workbench 1 is provided with guide pillar 13, lifter plate 8 is connected with guide pillar 13 by guide pin bushing 14, in main shaft 11 lifting process, play guide effect.

The top of main shaft 11, successively through workbench 1 and liquid cup 18, is connected with the base plate 3 and square wafer-supporting platform 4 being positioned at liquid cup 18.The top key of main shaft 11 is connected with the second axle sleeve 19, and base plate 3 is circle, is connected with the second axle sleeve 19, and the centre of this base plate 3 has the square groove be elevated for square wafer-supporting platform 4, and the edge of base plate 3 is downward-sloping, and the liquid be convenient on base plate 3 is drained; Square wafer-supporting platform 4 is connected with the top of main shaft 11, when main shaft 11 rotates, by square wafer-supporting platform 4 synchronous rotary that the second axle sleeve 19 be connected with main shaft 11 key can drive base plate 3 and be connected with main shaft 11, and the main shaft 11 that square wafer-supporting platform 4 is driven by wafer-supporting platform lift cylinder 9 drives, can be elevated relative to base plate 3.Coated square wafer 6 or Circular wafer are attracted on square wafer-supporting platform 4, the square wafer 6 of absorption on square wafer-supporting platform 4 or Circular wafer are when coated, and wafer surface is positioned at the top (can higher than base plate 3 upper surface 0.1 ~ 5mm) of base plate 3 upper surface; Further, when applying Circular wafer, the upper surface of square wafer-supporting platform 4 is higher than the upper surface of base plate 3.

In order to apply the wafer of different-thickness, second axle sleeve 19 is provided with the adjustment screw 20 of square wafer-supporting platform 4 height of adjustment, square wafer-supporting platform 4 is by being connected with the top of main shaft 11 after the adjustment of this adjustment screw 20, ensure when liquid applies like this, the surface of square wafer 6 or Circular wafer remains consistent to the distance of base plate 3 upper surface, when no matter the square wafer 6 of what thickness or Circular wafer being applied, can ensure that chip back surface is not contaminated, and waste liquid all can not enter square wafer-supporting platform 4 inside.

Operation principle of the present invention is:

Before work, circular upper cover 2 is in the state of rise.

During coating square wafer 6, wafer-supporting platform lift cylinder 9 works, and drives square wafer-supporting platform 4 to rise by main shaft 11, and square wafer 6 is placed on square wafer-supporting platform 4, by square wafer-supporting platform 4 and adsorbs; Then, wafer-supporting platform lift cylinder 9 drives square wafer-supporting platform 4 to decline, after declining, square wafer 6 can embed in the groove of base plate 3, and the upper surface of square wafer 6 is higher than the upper surface of base plate 3, such liquid is when square wafer 6 applies, unnecessary liquid can be drained through base plate 3 upper surface when rotated, and waste liquid would not enter the inside of square wafer-supporting platform 4.

Upper cover 2 declines under the driving of top cover lifting cylinder 12, covers liquid cup 18, is covered by whole coating zone.Spindle motor 5 works, and drive main shaft 11 to rotate by belt, pulley transmission structure, base plate 3 and square wafer-supporting platform 4 synchronously rotate with main shaft 11.While rotating, the surface of liquid square shaped wafer 6 applies.Because the upper surface of square wafer 6 is higher than the upper surface of base plate 3, such liquid is when square wafer 6 is coated with, and unnecessary liquid can be drained through base plate 3 upper surface when rotated, and such liquid would not enter the inside of square wafer-supporting platform 4.

During coating Circular wafer, the upper surface of square wafer-supporting platform 4 is higher than the upper surface of base plate 3, and it is inner that such liquid would not enter square wafer-supporting platform 4; Other operations are identical with coating square wafer.

Claims (10)

1. a liquid coating device, it is characterized in that: comprise workbench (1), base plate (3), square wafer-supporting platform (4), spindle motor (5), wafer-supporting platform lift cylinder (9), main shaft (11) and liquid cup (18), wherein spindle motor (5), wafer-supporting platform lift cylinder (9) and liquid cup (18) are arranged on described workbench (1) respectively, described spindle motor (5) is connected with main shaft (11) by transmission device, drive shaft (11) rotates, and described main shaft (11) is connected with described wafer-supporting platform lift cylinder (9), lifting is driven by wafer-supporting platform lift cylinder (9), the top of described main shaft (11) is successively through workbench (1) and liquid cup (18), be connected with the described base plate (3) and square wafer-supporting platform (4) that are positioned at liquid cup (18), described base plate (3) and square wafer-supporting platform (4) drive synchronous rotary by main shaft (11), and the main shaft (11) that described square wafer-supporting platform (4) is driven by wafer-supporting platform lift cylinder (9) drives, can be elevated relative to described base plate (3), coated square wafer (6) or Circular wafer are attracted on described square wafer-supporting platform (4), rotate or lifting with described square wafer-supporting platform (4).
2. by liquid coating device according to claim 1, it is characterized in that: described workbench (1) is provided with top cover lifting cylinder (12), the output of this top cover lifting cylinder (12) is connected with upper cover (2), described upper cover (2) be positioned at described liquid cup (18) top, by top cover lifting cylinder (12) drive lifting, the upper cover (2) of decline covers described liquid cup (18).
3. by liquid coating device according to claim 1, it is characterized in that: described workbench (1) top is provided with air distribution plate (7), described air distribution plate (7) has the hole passed for described liquid cup (18), the air distribution plate (7) around the liquid cup (18) passed is evenly equipped with multiple passage (15).
4. by liquid coating device according to claim 3, it is characterized in that: described air distribution plate (7) is connected with workbench (1) by many root posts (17), described air distribution plate (7) is parallel with workbench (1).
5. by the liquid coating device described in claim 1,2 or 3, it is characterized in that: the upper key of described main shaft (11) is connected with the first axle sleeve (10), and the output of described spindle motor (5) is connected with this first axle sleeve (10) by described transmission device, is driven described main shaft (11) to rotate; The output of described wafer-supporting platform lift cylinder (9) is connected with described main shaft (11) by lifter plate (8), and drive shaft (11) is elevated.
6. by liquid coating device according to claim 5, it is characterized in that: described workbench (1) is provided with guide pillar (13), described lifter plate (8) is connected with guide pillar (13) by guide pin bushing (14).
7., by the liquid coating device described in claim 1,2 or 3, it is characterized in that: the top key of described main shaft (11) is connected with the second axle sleeve (19), described base plate (3) is connected with this second axle sleeve (19).
8. by liquid coating device according to claim 7, it is characterized in that: described second axle sleeve (19) is provided with the adjustment screw (20) of described square wafer-supporting platform (4) height of adjustment, described square wafer-supporting platform (4) is by being connected with the top of described main shaft (11) after the adjustment of this adjustment screw (20).
9. by liquid coating device according to claim 7, it is characterized in that: described base plate (3) is for circular, and centre has the square groove be elevated for described square wafer-supporting platform (4); The edge of described base plate (3) is downward-sloping.
10. by the liquid coating device described in claim 1,2 or 3, it is characterized in that: the square wafer (6) of the upper absorption of described square wafer-supporting platform (4) or Circular wafer are when coated, and wafer surface is positioned at the top of described base plate (3) upper surface; Further, when applying Circular wafer the upper surface of described square wafer-supporting platform (4) higher than the upper surface of described base plate (3).
CN201410223103.4A 2014-05-23 2014-05-23 Liquid coating device CN105080782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410223103.4A CN105080782A (en) 2014-05-23 2014-05-23 Liquid coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410223103.4A CN105080782A (en) 2014-05-23 2014-05-23 Liquid coating device

Publications (1)

Publication Number Publication Date
CN105080782A true CN105080782A (en) 2015-11-25

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Family Applications (1)

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CN201410223103.4A CN105080782A (en) 2014-05-23 2014-05-23 Liquid coating device

Country Status (1)

Country Link
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060233952A1 (en) * 2005-04-15 2006-10-19 Tokyo Electron Limited Liquid processing method and liquid processing apparatus
US7927657B2 (en) * 2003-03-10 2011-04-19 Tokyo Electron Limited Liquid processing apparatus and liquid processing method
CN102020234A (en) * 2009-09-18 2011-04-20 沈阳芯源微电子设备有限公司 Glue spraying processing device used in semiconductor manufacturing
CN103811290A (en) * 2012-11-13 2014-05-21 沈阳芯源微电子设备有限公司 Spray liquid recovery device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7927657B2 (en) * 2003-03-10 2011-04-19 Tokyo Electron Limited Liquid processing apparatus and liquid processing method
US20060233952A1 (en) * 2005-04-15 2006-10-19 Tokyo Electron Limited Liquid processing method and liquid processing apparatus
JP2006302934A (en) * 2005-04-15 2006-11-02 Tokyo Electron Ltd Liquid treatment method and liquid treating apparatus
CN102020234A (en) * 2009-09-18 2011-04-20 沈阳芯源微电子设备有限公司 Glue spraying processing device used in semiconductor manufacturing
CN103811290A (en) * 2012-11-13 2014-05-21 沈阳芯源微电子设备有限公司 Spray liquid recovery device

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Application publication date: 20151125