CN107993963A - Mechanical arm for wafer detection - Google Patents
Mechanical arm for wafer detection Download PDFInfo
- Publication number
- CN107993963A CN107993963A CN201711165464.8A CN201711165464A CN107993963A CN 107993963 A CN107993963 A CN 107993963A CN 201711165464 A CN201711165464 A CN 201711165464A CN 107993963 A CN107993963 A CN 107993963A
- Authority
- CN
- China
- Prior art keywords
- wafer
- mechanical arm
- fixed seat
- detection
- external part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
Abstract
The invention belongs to technical field of semiconductors, and in particular to a kind of mechanical arm for wafer detection.Mechanical arm of the present invention for wafer detection, including wafer fixed seat, the wafer fixed seat is arranged on the both sides of the mechanical arm, the wafer fixed seat of the both sides of the mechanical arm is provided commonly for fixed support wafer, and the wafer fixed seat of wherein side is equipped with the detection unit for being used for detecting damaged wafer in the both sides of the mechanical arm.By using the mechanical arm of the present invention for wafer detection, by setting detection unit in wafer fixed seat, it can timely and effectively detect the breakage of wafer, prevent the extruding caused by damaged wafer residual is in acid tank to next batch wafer from destroying, rejection rate is reduced, improves production efficiency.
Description
Technical field
The invention belongs to technical field of semiconductors, and in particular to a kind of mechanical arm for wafer detection.
Background technology
In wafer etching process, the immersion by multiple tracks acid tank solution by wafer is generally required, to reach crystal column surface
The demand of quality.In the prior art, not for detecting the associated assay devices of wafer breakage in acid tank solution.Mechanical arm
The gripping and transport of wafer are only used for, when breakage occurs in acid tank solution for wafer, and there have broken wafer to be retained in acid tank to be molten
When in liquid, it can not be remained and be detected, and notify opposite operating personnel to stop the subsequent operations of wafer.When again by other
When the wafer of batch is put into the acid tank solution containing residual wafer fragmentation, remaining wafer fragmentation can be to putting into again
Wafer causes extruding to destroy, and causes the unnecessary wasting of resources, improves rejection rate, reduces production efficiency.
The content of the invention
The purpose of the present invention is to solve above-mentioned at least one problem, which is by the following technical programs
Realize.
Mechanical arm of the present invention for wafer detection, including wafer fixed seat, the wafer fixed seat
Arranged on the both sides of the mechanical arm, the wafer fixed seat of the both sides of the mechanical arm is provided commonly for fixed support crystalline substance
Round, wherein the wafer fixed seat of side is equipped with the detection list for being used for detecting damaged wafer in the both sides of the mechanical arm
Member.
Further, the wafer fixed seat further includes base and external part, and the base is equipped with multiple interval settings
External part, the wafer can be arranged in multiple external parts between external part described in any two, the detection unit
Arranged on the inside of multiple external parts.
Further, the horizontal plane of the external part is triangle.
Further, the detection unit is arranged on the intermediate symmetry face of the external part in the horizontal direction, the inspection
Survey the position that unit in the vertical direction is provided close to the bottom of the external part.
Further, multiple gas holes are additionally provided with the wafer fixed seat, multiple gas holes are respectively arranged on multiple
On base in the external part between external part described in any two.
Further, outlet passageway is equipped with the base, the outlet that is communicated in jointly of multiple ventholes leads to
On road, the purification gas in the outlet passageway can be discharged by the venthole.
Further, the purification gas is nitrogen.
Further, the wafer fixed seat is symmetricly set on the two bottom sides of the mechanical arm.
Further, the detection unit is light sensor.
Further, the light sensor is equipped with a kind of coating in PVC or PTFE.
By using the mechanical arm of the present invention for wafer detection, detected by being set in wafer fixed seat
Unit, can timely and effectively detect the breakage of wafer, prevent caused by damaged wafer residual is in acid tank to next batch
The extruding of wafer destroys, and reduces rejection rate, improves production efficiency.
Brief description of the drawings
By reading the detailed description of hereafter preferred embodiment, it is various other the advantages of and benefit it is common for this area
Technical staff will be clear understanding.Attached drawing is only used for showing the purpose of preferred embodiment, and is not considered as to the present invention
Limitation.And in whole attached drawing, identical component is denoted by the same reference numerals.In the accompanying drawings：
Fig. 1 is the overall structure diagram during mechanical arm shipping wafers of the embodiment of the present invention；
Fig. 2 is the cross-sectional view of wafer fixed seat in Fig. 1 embodiments；
Fig. 3 is the location diagram of wafer fixed seat and wafer in Fig. 2.
Each mark represents as follows in attached drawing：
100：Mechanical arm, 10：Wafer fixed seat, 11：Base, 12：External part, 13：Light sensor, 14：Gas hole；
200：Wafer.
Embodiment
The illustrative embodiments of the disclosure are more fully described below with reference to accompanying drawings.Although this public affairs is shown in attached drawing
The illustrative embodiments opened, it being understood, however, that may be realized in various forms the disclosure without the reality that should be illustrated here
The mode of applying is limited.Conversely, there is provided these embodiments are to be able to be best understood from the disclosure, and can be by this public affairs
The scope opened completely is communicated to those skilled in the art.
Fig. 1 is the overall structure diagram during mechanical arm shipping wafers of the embodiment of the present invention.Fig. 2 is implemented for Fig. 1
The cross-sectional view of wafer fixed seat in example.Fig. 3 is the location diagram of wafer fixed seat and wafer in Fig. 2.As schemed
Show, the mechanical arm 100 for being used for wafer detection in the present embodiment, including wafer fixed seat 10, wafer fixed seat 10 are arranged on machine
The both sides of tool arm 100, the wafer fixed seat 10 of the both sides of mechanical arm 100 are provided commonly for fixed support wafer 200, manipulator
Wherein the wafer fixed seat 10 of side is equipped with the detection unit for being used for detecting damaged wafer in the both sides of arm 100.
As shown in Figure 1, the two bottom sides of mechanical arm 100 are arranged with a pair of of wafer fixed seat 10.Wafer 200 is arranged on two
Between side wafer fixed seat 10, and fixation is supported by the upper surface of wafer fixed seat 10.
As shown in Fig. 2, the wafer fixed seat 10 in the present embodiment includes base 11, external part 12, detection unit and air blowing
Hole 14.Wherein, detection unit is light sensor 13.Base 11 is equipped with multiple external parts 12, and multiple intervals of external part 12 are set
Put.Gas hole 14 is arranged on the base 11 in multiple external parts 12 between any two external part 12.Outlet is equipped with base 11
Passage, multiple ventholes 14 are commonly connected on outlet passageway.Purification gas in outlet passageway can pass through venthole 14
Discharged.Light sensor 13 is arranged on the inside of external part 12.
Wherein, light sensor 13 is equipped with a kind of coating in PVC or PTFE.External part 12 uses transparent material system
Into, can facilitate light sensor 13 carry out signal acquisition.When there is wafer 200 that breakage occurs, the light in external part 12 passes
Sensor 13 can gather corresponding signal, and alarm, and remind operating personnel to have the generation of wafer fragmentation.At this time, reply residual
Damaged chip 200 in acid tank is handled, and prevents from causing the wafer 200 of other batches extruding to destroy.Venthole 14
Position is arranged between two adjacent external parts 12, and when mechanical arm 100 does not work, the purification gas in outlet passageway can
Discharged by gas hole 14, so as to be cleaned to the residuals on the two sides of external part 12, avoid residue shadow
Ring light sensor 13 and carry out signal acquisition.When mechanical arm 100 is gripped or shifted to wafer 200, it is net to stop discharge
Change gas.Wherein, the purification gas in outlet passageway is inert gas, such as nitrogen.Gas flow is additionally provided with outlet passageway
Control valve.According to the usage amount needs of nitrogen, different gas flows is adjusted.
Further, for convenience of the installation and dismounting of wafer 200, the horizontal plane of the external part 12 of wafer fixed seat 10
For triangle.Adjacent external part 12 is smaller close to the position gap of base 11, and the position gap away from base 11 is larger, is conducive to
Placement and taking-up to wafer 200.
Further, light sensor 13 is arranged on the intermediate symmetry face of external part 12 in the horizontal direction, light level
13 in the vertical direction of device is provided close to the position of the bottom of external part 12.Under light sensor 13 is placed in external part 12
Side, is conducive to the detection to damaged wafer, improves accuracy of detection.
As shown in figure 3, wafer 200 can be arranged in multiple external parts 12 between any two external part 12.Mechanical arm
100 both sides are equipped with wafer fixed seat 10.Between wafer 200 is placed in both sides wafer fixed seat 10,200 position of wafer is just
Fall between two adjacent external parts 12, wafer 200 is supported and shifted by the wafer fixed seat 10 of both sides.Together
When, light sensor 13 can check damaged wafer in external part 12.
By using the mechanical arm of the present invention for wafer detection, detected by being set in wafer fixed seat
Unit, can timely and effectively detect the breakage of wafer, prevent caused by damaged wafer residual is in acid tank to next batch
The extruding of wafer destroys, and reduces rejection rate, improves production efficiency.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, the change or replacement that can readily occur in,
It should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of the claim
Subject to enclosing.
Claims (10)
1. a kind of mechanical arm for wafer detection, it is characterised in that including wafer fixed seat, the wafer fixed seat is arranged on
The both sides of the mechanical arm, the wafer fixed seat of the both sides of the mechanical arm are provided commonly for fixed support wafer, institute
State in the both sides of mechanical arm the wherein wafer fixed seat of side and be equipped with the detection unit for being used for detecting damaged wafer.
2. the mechanical arm according to claim 1 for wafer detection, it is characterised in that the wafer fixed seat is also wrapped
Include base and external part, the base is equipped with multiple spaced external parts, and the wafer can be arranged on multiple described stretch
In outlet between external part described in any two, the detection unit is arranged on the inside of multiple external parts.
3. the mechanical arm according to claim 2 for wafer detection, it is characterised in that the level of the external part is cutd open
Section is triangle.
4. the mechanical arm according to claim 3 for wafer detection, it is characterised in that the detection unit is in level
On direction on the intermediate symmetry face of the external part, the detection unit in the vertical direction is provided close to the external part
Bottom position.
5. the mechanical arm for being used for wafer detection according to any one of claim 2-4, it is characterised in that the wafer
Multiple gas holes are additionally provided with fixed seat, multiple gas holes are respectively arranged in multiple external parts to be stretched described in any two
On base between outlet.
6. the mechanical arm according to claim 5 for wafer detection, it is characterised in that be equipped with outlet in the base
Passage, multiple ventholes are communicated on the outlet passageway jointly, and the purification gas in the outlet passageway can lead to
The venthole is crossed to be discharged.
7. the mechanical arm according to claim 6 for wafer detection, it is characterised in that the purification gas is nitrogen
Gas.
8. the mechanical arm for being used for wafer detection according to any one of claim 1-4, it is characterised in that the wafer
Fixed seat is symmetricly set on the two bottom sides of the mechanical arm.
9. the mechanical arm for being used for wafer detection according to any one of claim 1-4, it is characterised in that the detection
Unit is light sensor.
10. the mechanical arm for being used for wafer detection according to any one of claim 1-4, it is characterised in that the light
Line covers disposed on sensor has a kind of coating in PVC or PTFE.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165464.8A CN107993963B (en) | 2017-11-21 | 2017-11-21 | Mechanical arm for wafer detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165464.8A CN107993963B (en) | 2017-11-21 | 2017-11-21 | Mechanical arm for wafer detection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107993963A true CN107993963A (en) | 2018-05-04 |
| CN107993963B CN107993963B (en) | 2020-07-10 |
Family
ID=62031899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711165464.8A Active CN107993963B (en) | 2017-11-21 | 2017-11-21 | Mechanical arm for wafer detection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107993963B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670128A (en) * | 2019-08-20 | 2020-01-10 | 金瑞泓微电子(衢州)有限公司 | Automatic equipment for epitaxial treatment of wafer and operation method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4983093A (en) * | 1982-05-24 | 1991-01-08 | Proconics International, Inc. | Wafer transfer apparatus |
| US5183378A (en) * | 1990-03-20 | 1993-02-02 | Tokyo Electron Sagami Limited | Wafer counter having device for aligning wafers |
| JPH05152423A (en) * | 1991-08-30 | 1993-06-18 | Dainippon Screen Mfg Co Ltd | Surface treatment apparatus |
| JPH0786373A (en) * | 1993-09-14 | 1995-03-31 | Sugai:Kk | Substrate attitude change equipment |
| JPH0846009A (en) * | 1994-07-29 | 1996-02-16 | Tokyo Electron Ltd | Measuring method of discrepancy between gripper and holder, allignment method of gripper and holder, discrepancy measuring jig, diagnosis method of discrepancy between gripper and holder and washer and washing method |
| CN1219757A (en) * | 1997-12-08 | 1999-06-16 | 三菱电机株式会社 | Semiconductor wafer processing apparatus and method of controlling the same |
| US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
| JP2002261152A (en) * | 2001-02-27 | 2002-09-13 | Micronics Japan Co Ltd | Method and device for detecting position of cassette |
| JP2008130752A (en) * | 2006-11-20 | 2008-06-05 | Toshiba Corp | Semiconductor manufacturing device and its control method |
| CN202180473U (en) * | 2011-08-16 | 2012-04-04 | 北京京东方光电科技有限公司 | Mechanical arm |
| CN206505905U (en) * | 2017-02-24 | 2017-09-19 | 中芯国际集成电路制造（天津）有限公司 | Protection suite, mechanical arm and board |
-
2017
- 2017-11-21 CN CN201711165464.8A patent/CN107993963B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4983093A (en) * | 1982-05-24 | 1991-01-08 | Proconics International, Inc. | Wafer transfer apparatus |
| US5183378A (en) * | 1990-03-20 | 1993-02-02 | Tokyo Electron Sagami Limited | Wafer counter having device for aligning wafers |
| JPH05152423A (en) * | 1991-08-30 | 1993-06-18 | Dainippon Screen Mfg Co Ltd | Surface treatment apparatus |
| JPH0786373A (en) * | 1993-09-14 | 1995-03-31 | Sugai:Kk | Substrate attitude change equipment |
| JPH0846009A (en) * | 1994-07-29 | 1996-02-16 | Tokyo Electron Ltd | Measuring method of discrepancy between gripper and holder, allignment method of gripper and holder, discrepancy measuring jig, diagnosis method of discrepancy between gripper and holder and washer and washing method |
| US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
| CN1219757A (en) * | 1997-12-08 | 1999-06-16 | 三菱电机株式会社 | Semiconductor wafer processing apparatus and method of controlling the same |
| JP2002261152A (en) * | 2001-02-27 | 2002-09-13 | Micronics Japan Co Ltd | Method and device for detecting position of cassette |
| JP2008130752A (en) * | 2006-11-20 | 2008-06-05 | Toshiba Corp | Semiconductor manufacturing device and its control method |
| CN202180473U (en) * | 2011-08-16 | 2012-04-04 | 北京京东方光电科技有限公司 | Mechanical arm |
| CN206505905U (en) * | 2017-02-24 | 2017-09-19 | 中芯国际集成电路制造（天津）有限公司 | Protection suite, mechanical arm and board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670128A (en) * | 2019-08-20 | 2020-01-10 | 金瑞泓微电子(衢州)有限公司 | Automatic equipment for epitaxial treatment of wafer and operation method thereof |
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| Publication number | Publication date |
|---|---|
| CN107993963B (en) | 2020-07-10 |
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