TWI795811B - Wafer box device, semiconductor processing machine and wafer inspection method - Google Patents

Abstract

The present invention provides a wafer box device, comprising: a wafer box body, which has a closed hollow structure; a plurality of carrying bars are arranged at intervals from top to bottom on the inner wall of the wafer box body, and a plurality of carrying bars of the same height are used for on the carrying wafer; the sensor is arranged on the carrying bar to obtain the characteristic value of the wafer; the judging unit is arranged on the wafer cassette body and is used to judge the characteristic according to the characteristic value obtained by the sensor Whether the value is within the threshold range. The invention also provides a semiconductor processing machine and a wafer detection method. Through the present invention, the abnormal state of wafers in the wafer box can be automatically identified in real time according to the thickness and weight of wafers, the downtime rate of machines can be reduced, and the yield of wafers can be greatly improved.

Description

Wafer box device, semiconductor processing machine and wafer inspection method

The invention relates to the technical field of semiconductor manufacturing processes, in particular to a wafer box device, a semiconductor processing machine and a wafer detection method.

The manufacturing process of semiconductor products needs to go through many process steps, and each process step is completed by the corresponding process machine. When a batch of wafers is completed on a process machine, the robotic arm (Arm) of the process machine will put the batch of wafers into the wafer box (Foup), and then the operator will remove the wafer box from the process The machine is moved to the storage system, and then the wafer box is transferred to the next process machine through the storage system and the transportation system, and the robot arm of the next process machine takes the wafer out of the wafer box and transfers it to the process reaction The process reaction is carried out in the room, and the wafer is returned after the process reaction is completed, and then placed back into the wafer box for subsequent process steps.

Wafer box is a common media device used to carry and transport wafers. The function of wafer box is to keep wafers in a closed space during the process of transferring wafers from one process machine to another. In order to prevent the dust in the atmosphere from contaminating the wafer. Although in the existing field of semiconductor manufacturing, the wafer box has many advantages such as high hardness, wear resistance, high temperature resistance, good air circulation and easy transportation, etc., it does not have the function of automatically identifying wafers, let alone based on the identification Carry out corresponding protection actions for wafer abnormalities (such as wafers put into wrong wafer cassettes, scrapped wafers into wafer cassettes), so as to avoid some emergencies and ensure the good condition of wafers, machines, etc. run.

An input/output device is also provided on the process machine of each process, which is used to load the wafer or substrate into the process machine in a state of being isolated from the external environment. The input/output device must also be equipped with a wafer loader (load port), which is used as an intermediary device for transferring wafers between the wafer cassette and the process tool. The wafer loader can open the wafer cassette, and load the wafer or substrate in the wafer cassette into the input/output device of the process tool. In fact, in actual production, or in laboratory experiments, there are always some emergencies. For example, in actual production, if a machine breaks down, two or three wafer loading and unloading machines of the machine have wafer cassettes opened at the same time, and there are wafers in the machine, then the equipment will take out the wafers in the machine. During the round, the wafer will be placed in a wafer box that does not belong to itself due to a fault, which will cause errors in the subsequent process and eventually cause the wafer to be scrapped. For another example, when doing experiments in the laboratory, it is often necessary to carry out a large number of burn-in tests due to the introduction of a certain process flow or the clarification of the quality of a certain component. A normal silicon wafer cannot be identified in time due to the reduction in thickness or weight caused by long-term cleaning and etching. When the thickness of the wafer is below a certain threshold, it is easy to cause the wafer to break during the mechanical transfer process. Damaged wafers will pollute subsequent manufacturing processes, greatly reducing the yield of semiconductor products. And once the process is abnormal or fails, the process machine must be shut down for maintenance, and it will take a lot of time to detect which wafer is scrapped, and the entire production time will also be delayed.

In view of this, overcoming the defects in the prior art is an urgent problem to be solved in this technical field.

The purpose of the present invention is to provide a wafer box device, a semiconductor processing machine and a method, which can perform corresponding protection actions according to the identified abnormal situation of the wafer, so as to ensure the good operation of the wafer and the machine.

In order to achieve the above object, the present invention provides a wafer box device, comprising: The wafer box body has a closed hollow structure; the inner wall of the wafer box body is arranged with a plurality of carrying bars at intervals from top to bottom, and multiple carrying bars of the same height are used to carry wafers; a sensor, arranged on the carrying bar, for acquiring the characteristic value of the wafer; and The judging unit is arranged on the wafer cassette body, and is used for judging whether the characteristic value obtained by the sensor is within a threshold range or not.

Preferably, the characteristic value includes the weight of the wafer and/or the thickness of the wafer.

Preferably, the wafer cassette device further includes a wafer loading and unloading machine; when the judging unit judges that the characteristic value is not within the threshold range, the wafer loading and unloading machine stops loading and unloading wafers.

Preferably, the wafer box device further includes a placing platform for placing the wafer box body, and the placing platform is provided with a power supply unit for supplying power to the wafer box device.

Preferably, the sensor is a quality sensor for measuring wafer quality.

Preferably, the sensor is a displacement sensor, and the wafer is supported by the displacement sensor, and a corresponding deformation value is generated according to the elastic deformation generated by the weight of the wafer; the judging unit obtains according to the degree of the elastic deformation wafer weight.

Preferably, the bottom of the displacement sensor can be adjusted up and down, so that the top ends of the displacement sensors arranged on the same carrying bar are located on the same horizontal plane.

Preferably, the sensor is a light-sensitive sensor, which is arranged between two adjacent carrying bars up and down; the light-sensitive sensor includes an emitting part and a carrying part; the carrying part is used to place a crystal A circle, which is set on the top surface of the lower carrying bar among the two vertically adjacent carrying bars; the emitting part is set on the bottom surface of the upper carrying bar among the two vertically adjacent carrying bars; The emitting part emits a light beam to the wafer below it, and generates a distance value according to the received light beam reflected by the wafer; the judging unit obtains the thickness of the wafer according to the distance value.

Preferably, the wafer cassette device further includes an input unit provided on the wafer cassette body for inputting the threshold value of the characteristic value of the wafer.

Preferably, the threshold includes any one or more of a maximum weight threshold, a minimum weight threshold, a maximum thickness threshold and a minimum thickness threshold.

Preferably, the wafer cassette device further includes a prompting device provided on the wafer cassette body, and when the characteristic value is not within the threshold range, the prompting device will give a prompting message.

Preferably, the prompting device includes a display unit arranged outside the wafer cassette body for displaying the characteristic value collected by the sensor; when the characteristic value obtained by a certain sensor is not within the threshold range, the display unit passes the high Lights up and flashes to give an alarm.

Preferably, the prompting device further includes a buzzer arranged on the wafer cassette body, and when the characteristic value acquired by a certain sensor is not within the threshold range, the buzzer will give an alarm.

The present invention also provides a semiconductor processing machine, including the wafer box device described in the present invention, a processing chamber, a transfer chamber, a front-end module of equipment, an air lock chamber and a wafer loading and unloading machine.

The present invention also provides a wafer detection method for detecting wafers in the wafer cassette device, which is realized by using the wafer cassette device described in the present invention, including the following steps: Transfer the wafer into the wafer box body; Obtaining the characteristic value of the corresponding wafer through a plurality of sensors arranged in the wafer cassette body carrying the strip; and The judging unit judges whether the characteristic value of the wafer acquired by the sensor is within a threshold range.

The wafer detection method also includes the following steps: When the judging unit judges that the characteristic value is not within the threshold range, the wafer loader stops loading and unloading wafers, and the prompting device gives prompt information at the same time.

Preferably, the prompting device gives prompting information, which specifically includes the following steps: Alarm through the buzzer of the prompting device; The feature values that are not within the threshold range are displayed by highlighting and flickering through the display unit of the prompting device.

Preferably, the wafer detection method also includes: The threshold value of the characteristic value of the wafer is input through the input unit of the wafer cassette body.

Compared with prior art, the beneficial effect of the present invention is: (1) The present invention has high integration degree, simple structure and easy realization. Through the present invention, it is possible to automatically and instantly identify the abnormal condition of wafers, and issue an alarm reminder through the prompting device; (2) The present invention can perform corresponding protection actions according to the identified abnormal state of the wafer. Avoid adverse effects of defective wafers on the subsequent manufacturing process, and ensure the good operation of the machine; through the present invention, the downtime rate of the machine can be effectively reduced, and the yield of wafers can be greatly improved; (3) Through the present invention, it is not necessary to check the wafers of the machine one by one to know which is the abnormal wafer, which greatly saves the time of machine downtime and maintenance, and effectively improves the production efficiency of wafers; (4) The present invention can set the threshold value range of the wafer feature value correspondingly according to the process performed by the machine, and is applicable to all process flows of semiconductor manufacturing.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making progressive changes fall within the protection scope of the present invention.

The present invention provides a wafer box device, as shown in Figure 1, Figure 2A, Figure 2B, Figure 3, and Figure 10, comprising: a wafer box body 1, a plurality of sensors 3, a judging unit 4, an input unit 5, Prompt device 6 , wafer loading and unloading machine 63 , placing table 631 .

The wafer box body 1 has a closed hollow structure, as shown in Figure 2A and Figure 2B, it includes a first side wall 11, a third side wall 13 opposite to the first side wall 11, and is arranged on the first side wall 11 and the second side wall 12 between the third side wall 13 . As shown in FIG. 1 , FIG. 2A , and FIG. 2B , a plurality of carrying bars 2 are arranged at intervals from top to bottom on the inner wall of the wafer cassette body 1 , and multiple carrying bars 2 of the same height are used to carry wafers 7 . The front of the wafer box body 1 is provided with an opening door (not shown in the figure), which is used to put the wafer 7 into the wafer box body 1 or take out the wafer 7 from the wafer box body 1, and the opening door and the second side wall 12 relative. Usually, a handle 15 is provided on the top of the wafer box body 1 for easy handling of the wafer box body 1 .

The sensor 3 is arranged on the carrier bar 2 and is used to obtain the characteristic value of the wafer 7 . As shown in FIG. 2A , in one embodiment of the present invention, the carrying strips 2 are distributed on the first side wall 11 to the third side wall 13 , but not on the door opening. The carrying bar 2 is divided into three sections according to its distribution on the first to third side walls, namely the first carrying bar section 21 to the carrying bar third section 23 . In this embodiment, at least one sensor 3 is provided at the first section 21 of the carrying bar to the third section 23 of the carrying bar. Since three points determine a plane, the wafer 7 is placed on the sensor 3 more stably through the arrangement of the sensor 3 .

As shown in FIG. 2B , in another embodiment of the present invention, the carrying bars 2 are only distributed on the first side wall 11 and the third side wall 13 , and each carrying bar 2 is provided with a sensor 3 . Each carrier bar 2 on the first side wall 11 has a corresponding carrier bar 2 arranged on the third side wall 13, and the wafer 7 is placed horizontally through the sensors 3 provided on the two corresponding carrier bars 2 .

The characteristic values include the weight of the wafer 7 and/or the thickness of the wafer 7 . Since the wafer 7 is processed under different processes, weight and/or thickness changes may occur. Under normal circumstances, the weight and thickness of the wafer 7 processed by the same process of the machine are basically the same, and the thickness change and weight change of the wafer 7 match the process performed by it. However, when the parameters of the manufacturing process are set incorrectly, or in some misoperations, the wafer 7 will be processed incorrectly, so that the wafer 7 is too heavy, too light, or too thick, too thin. For example, in the aging test, the process processing time is wrongly set; or during the etching process of the wafer 7, the concentration of the reaction gas input into the processing chamber 64 is not well controlled; the RF power is not applied to the processing chamber 64 according to the preset frequency and intensity. etc., may cause the wafer 7 not to be processed correctly to form defects or even be scrapped. It is obviously a very simple, direct and effective method to find wafer defects through the physical properties (weight, thickness) of the wafer 7 .

The judging unit 4 is arranged on the pod body 1, and is used for judging whether the characteristic value obtained by the sensor 3 is within a threshold range or not. When the judgment unit 4 judges that the characteristic value is not within the threshold range, the wafer loader 63 stops loading and unloading the wafer 7 (without opening the door of the cassette body 1 ).

The input unit 5 is arranged on the wafer cassette body 1 for inputting the threshold value of the characteristic value of the wafer 7 . The thresholds include any one or more of a maximum weight threshold, a minimum weight threshold, a maximum thickness threshold, and a minimum thickness threshold.

The placing table 631 is used for placing the wafer cassette body 1 , and usually the placing table 631 is set on the wafer loading and unloading machine 63 . The placing table 631 is provided with a power supply unit 632 for supplying power to the wafer cassette device. As shown in Figure 3, the power supply part 632 protrudes upwards and is arranged on the placement table 631. The bottom of the wafer cassette body 1 is provided with a slot 14 matching the power supply part 632, and the power supply part 632 is connected with the slot 14. The electrical connection is realized to supply power to the sensor 3 in the wafer box device. In the present invention, the power supply part 632 also has the function of limiting the wafer cassette body 1, which can help the wafer cassette body 1 to be placed in a correct position, reduces human misoperation, and improves work efficiency.

The prompting device 6 is arranged on the cassette body 1, and when the characteristic value is not within the threshold range, the prompting device 6 will give prompting information. The prompting device 6 includes a display unit 61 disposed outside the pod body 1 and a buzzer 62 disposed on the pod body 1 .

The display unit 61 is used to display the characteristic values collected by the sensors 3; when the characteristic values obtained by a certain (or one of) the sensors 3 are not within the threshold range, the display unit 61 will give an alarm by highlighting or blinking. When the characteristic value obtained by a certain sensor 3 is not within the threshold range, the buzzer 62 will give an alarm.

As shown in FIG. 9 , in the embodiment of the present invention, the display unit 61 , the buzzer 62 , the input unit 5 and the judgment unit 4 are all arranged on the outer surface of the second side wall 12 .

In the embodiment of the present invention, the weight or thickness of the wafer 7 can be acquired by the mass sensor 31 , the displacement sensor 32 , and the photosensitive sensor 33 . The working methods and setting methods of the three sensors are respectively described in Embodiment 1 to Embodiment 3.

Embodiment one

As shown in FIG. 4 , in this embodiment, the sensor 3 is a quality sensor 31 for measuring the quality of the wafer 7 . First, a maximum weight threshold and a minimum weight threshold matching the process performed by the machine are input through the input unit 5 . The threshold range = [minimum weight threshold, maximum weight threshold]. When a wafer 7 is processed, the wafer handling machine 63 opens the door of the wafer cassette body 1, and the wafer 7 is transferred to the carrier bar 2 in the wafer cassette body 1, and the wafer loading and unloading machine 63 closes the wafer The opening of the box body 1 is weighed by at least three mass sensors 31 provided on the carrying bar 2 . The weighing result of each mass sensor 31 will be displayed on the outer surface of the pod body 1 through the display unit 61 . Normally, the weighing result of each mass sensor 31 is one-third of the mass of the wafer 7 . When the weighing result of a certain quality sensor 31 is not within the threshold range, the judging unit 4 judges that the wafer 7 is unqualified, the buzzer 62 gives an alarm, and the display unit 61 is no longer within the threshold range by highlighting and flashing. The weighing results in the alarm will be issued. The wafer loading and unloading machine 63 no longer opens the door of the wafer cassette body 1, and stops loading and unloading the wafer 7.

Apparently, as shown in FIG. 4A , in the present invention, not only defective wafers 7 can be found through the quality sensor 31 , but also whether there are repeated placements of wafers 7 on the same carrier bar 2 can be found. Alternatively, as shown in FIG. 4B , it can be found by the present invention whether the wafer 7 is placed across the carrier bar 2 .

Embodiment two

In this embodiment, the weight of the wafer 7 is still used to determine whether the wafer 7 has defects. As shown in FIG. 5, the sensor 3 used in this embodiment is a displacement sensor 32, which supports the wafer 7 through the displacement sensor 32, and generates a corresponding deformation value according to the elastic deformation of the wafer 7 according to the weight of the wafer 7. ; The judging unit 4 acquires the weight of the wafer 7 according to the degree of elastic deformation (or deformation value).

As shown in FIG. 6, the bottom of the displacement sensor 32 can be adjusted up and down, so that the top of the displacement sensor 32 arranged on the same carrier bar 2 is located on the same horizontal plane, and the weighing of the wafer 7 can be obtained more accurately. value.

Embodiment three

In this embodiment, whether there is a defect is judged by detecting the thickness of the wafer 7 . The sensor 3 used in this embodiment is a photosensitive sensor 33 . As shown in FIG. 7 and FIG. 8 , the photosensitive sensor 33 is arranged between two vertically adjacent carrying bars 2 . The photosensitive sensor 33 includes an emitting portion 331 and a carrying portion 332 . The carrier part 332 is used to place the wafer 7, which is arranged on the top surface of the lower carrier bar 2 among the two adjacent carrier bars 2 up and down; the carrier part 332 can be adjusted up and down so that it is arranged on the same carrier The top ends of the carrying parts 332 of the bar 2 are located on the same horizontal plane; the emitting part 331 is arranged on the bottom surface of the upper carrying bar 2 among the two adjacent carrying bars 2 up and down; The light beam is emitted, and a distance value is generated according to the light beam reflected by the received wafer 7; the judging unit 4 obtains the thickness of the wafer 7 according to the distance value.

Specifically, first input a maximum thickness threshold and a minimum thickness threshold matching the process performed by the machine through the input unit 5 . The threshold range=[minimum thickness threshold, maximum thickness threshold]. When the wafer 7 is not placed on the carrier bar 2, the adjacent emitter 331 above the carrier bar 2 emits a light beam, and the emitter 331 receives the reflected beam from the carrier portion 332 below it and generates a first distance value; When the wafer 7 is placed, the emitting portion 331 adjacent above the carrying bar 2 emits a beam, and the emitting portion 331 receives the reflected beam of the wafer 7 and generates a second distance value; the judging unit 4 is based on the first distance value and The difference of the second distance value obtains the thickness of the wafer 7 . When the obtained wafer thickness is not within the threshold range, the judging unit 4 judges that the wafer 7 is unqualified, the buzzer 62 gives an alarm, and the display unit 61 gives an alarm by highlighting and blinking the thickness value not within the threshold range. The wafer loading and unloading machine 63 no longer opens the door of the wafer cassette body 1, and stops loading and unloading wafers.

As shown in Figure 10, the present invention also provides a semiconductor processing machine, including the wafer box device described in the present invention, a processing chamber 64, a transfer chamber 65, a front-end module 66, an air lock chamber 67, and a wafer loading and unloading machine 63 (the wafer loading and unloading machine 63 in FIG. 10 is blocked by the placed wafer cassette body 1). One end of the equipment front-end module 66 (EFEM) is connected to the wafer loader 63, and the other end is connected to the air lock chamber 67 (load lock), and the air lock chamber 67 is connected to the transmission chamber 65 (TMTransmission Machine). The transfer chamber 65 is connected to the processing chamber 64 .

The wafer 7 is placed on the placement table 631 of the wafer handling machine 63 , and the wafer 7 is transferred between the wafer handling machine 63 and the airlock chamber 67 through the mechanical arm of the EFEM. The transfer chamber 65 is arranged between the airlock chamber 67 and the processing chamber 64 , and the transfer of the wafer 7 between the airlock chamber 67 and the processing chamber 64 is realized by a robot arm arranged in the transfer chamber 65 . (Wafer 7 often needs to be processed in a vacuum state due to the relationship of the manufacturing process, so the semiconductor machine must constantly perform pressure conversion between vacuum and atmospheric pressure. In order to make the processing chamber 64 in the machine remain at a In a stable state, the pressure conversion between vacuum and atmospheric pressure is performed by the air lock chamber 67 to prevent the wafer 7 from suddenly entering the atmospheric pressure environment in the vacuum environment and causing damage).

The processing chamber 64 is usually provided with a base for placing the wafer 7, and the reaction gas is delivered to the processing chamber 64 through the gas pipeline, and by applying radio frequency power to the processing chamber 64, the reaction gas in the processing chamber 64 is ionized to generate plasma, The wafer 7 in the processing chamber 64 is deposited or etched under the action of plasma. An opening is provided on the side wall of the processing chamber 64 for accommodating the entry and exit of the wafer 7 . At the same time, a shield plate (not shown) that can move up and down is also provided between the processing chamber 64 and the transfer chamber 65. Only when the wafer is transferred between the process chamber 64 and the transfer chamber 65, the shield plate avoids the processing chamber. The opening of the side wall; otherwise, the opening of the side wall of the processing chamber is blocked by the shielding plate, so as to block the pollution particles in the gas flowing from the transfer chamber to the processing chamber 64 or from the processing chamber 64 to the transfer chamber. A vacuum device (not shown in the figure) is provided at the bottom of the processing chamber to discharge the reaction by-products out of the processing chamber 64 .

The present invention also provides a wafer detection method for detecting the wafer 7 in the wafer cassette device, which is realized by using the wafer cassette device described in the present invention, including the following steps: According to the process of the machine, the threshold value of the wafer characteristic value is input through the input unit 5 of the wafer cassette device; the characteristic value can be a characteristic value representing the quality of the wafer, or a characteristic value representing the thickness of the wafer; The threshold includes any one or more of a maximum weight threshold, a minimum weight threshold, a maximum thickness threshold, and a minimum thickness threshold. The wafer 7 is transferred into the wafer cassette body 1 . Obtain the characteristic value of corresponding wafer 7 by a plurality of sensors 3 that are arranged on carrying bar 2 in wafer cassette body 1; Described sensor 3 can be the quality sensor 31 that is used to detect wafer quality, displacement A sensor 32, or a photosensitive sensor 33 for detecting wafer thickness; and The judging unit 4 judges whether the feature value of the wafer 7 acquired by the sensor 3 is within the threshold range; when detecting the quality of the wafer, the threshold range=[minimum weight threshold, maximum weight threshold]; when When detecting the thickness of the wafer 7, the threshold range=[minimum thickness threshold, maximum thickness threshold].

When the judging unit 4 judges that the characteristic value is not within the threshold range, the wafer loader 63 stops loading and unloading the wafer 7, and the buzzer 62 alarms, and the display unit 61 highlights and flashes the characteristic value not within the threshold range.

The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person familiar with the technical field can easily think of various equivalents within the technical scope disclosed in the present invention. Modifications or replacements shall all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the patent application scope.

1: Wafer box body 11: First side wall 12: Second side wall 13: Third side wall 14: slot 15: Handle 2: Carrying bar 21～23: The first section of the load-carrying strip to the third section of the load-bearing strip 3: Sensor 31: Quality sensor 32: Displacement sensor 33: Photosensitive detector 331: launch department 332: bearing part 4: Judgment unit 5: Input unit 6: Prompt device 61: Display unit 62: Buzzer 63:Wafer loader and unloader 631: place table 632: Power supply department 64: Processing room 65: Transmission room 66:Equipment front-end module 67: Airlock 7: Wafer

In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings that need to be used in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are an embodiment of the present invention. For those of ordinary skill in the art In other words, without making progressive changes, further drawings can also be derived from these drawings: Fig. 1 is a schematic diagram inside the wafer box body of the present invention; Fig. 2A is an internal top view of the wafer box device in one embodiment of the present invention; Fig. 2B is an internal top view of the wafer box device in another embodiment of the present invention; Fig. 3 is a schematic diagram of a placement platform of the present invention; Fig. 4 is a schematic diagram of the inside of the wafer box device in Embodiment 1 of the present invention; FIG. 4A is a schematic diagram of detecting that wafers are repeatedly placed on the carrier bar in Embodiment 1 of the present invention; FIG. 4B is a schematic diagram of detecting a wafer placed across a carrier bar in Embodiment 1 of the present invention; Fig. 5 is a schematic diagram of the inside of the wafer box device in Embodiment 2 of the present invention; Fig. 6 is a partially enlarged schematic diagram of Fig. 5; 7 is a schematic diagram of the inside of the wafer box device in Embodiment 3 of the present invention; Fig. 8 is a partially enlarged schematic diagram of Fig. 7; Fig. 9 is a schematic diagram of a judging unit, a prompting device, and an input unit of the present invention; and FIG. 10 is a schematic diagram of the structure of the semiconductor processing machine of the present invention.

11: First side wall

12: Second side wall

13: Third side wall

2: Carrying bar

21~23: The first section of the bearing strip ~ the third section of the bearing strip

3: Sensor

7: Wafer

Claims (18)

A wafer box device, comprising: A wafer box body, which has a closed hollow structure; the inner wall of the wafer box body is arranged with a plurality of carrying bars at intervals from top to bottom, and the plurality of carrying bars of the same height are used to carry a wafer; a sensor, arranged on the carrier bar, for acquiring a characteristic value of the wafer; and A judging unit is arranged on the wafer cassette body, and is used for judging whether the characteristic value is within a threshold range according to the characteristic value acquired by the sensor. The wafer cassette device as claimed in claim 1, wherein the characteristic value includes the weight of the wafer and/or the thickness of the wafer. The wafer cassette device according to claim 1, further comprising a wafer handling machine; when the judging unit judges that the characteristic value is not within the threshold range, the wafer handling machine stops loading and unloading the wafer. The wafer cassette device as claimed in claim 1, further comprising a placing table for placing the wafer cassette body, and the placing table is provided with a power supply part for supplying power to the wafer cassette device. The wafer cassette device as claimed in claim 1, wherein the sensor is a quality sensor for measuring the quality of the wafer. The wafer cassette device as claimed in claim 1, wherein the sensor is a displacement sensor, the wafer is supported by the displacement sensor, and a corresponding displacement is generated according to the elastic deformation of the wafer weight Deformation value: the judging unit acquires the weight of the wafer according to the degree of elastic deformation. The wafer cassette device as claimed in claim 6, wherein the bottom of the displacement sensor can be adjusted up and down, so that the top ends of the displacement sensors disposed on the same carrier bar are located at the same horizontal plane. The wafer cassette device as claimed in item 1, wherein the sensor is a photosensitive sensor, which is arranged between two adjacent carrying bars up and down; the photosensitive sensor includes an emitting part and A carrying part; the carrying part is used to place the wafer, and it is arranged on the top surface of the carrying bar located below among the two adjacent carrying bars up and down; the emitting part is arranged on the two carrying bars adjacent up and down The bottom surface of the carrying bar located above in the bar; the emitting part emits a beam to the wafer below it, and generates a distance value according to the received reflected beam of the wafer; the judging unit obtains the distance value of the wafer according to the distance value thickness. The wafer cassette device as claimed in claim 1, further comprising an input unit provided on the wafer cassette body for inputting the threshold value of the characteristic value of the wafer. The wafer cassette device according to claim 9, wherein the threshold includes any one or more of a maximum weight threshold, a minimum weight threshold, a maximum thickness threshold, and a minimum thickness threshold. The wafer cassette device as claimed in claim 1, further comprising a prompting device disposed on the wafer cassette body, and when the characteristic value is not within the threshold range, the prompting device will give a prompting message. The wafer cassette device as claimed in claim 11, wherein the prompting device includes a display unit arranged outside the wafer cassette body for displaying the characteristic value collected by the sensor; when one of the sensing If the characteristic value acquired by the sensor is not within the threshold range, the display unit will give an alarm by highlighting or flashing. The wafer cassette device as claimed in claim 11, wherein the prompting device further includes a buzzer arranged on the wafer cassette body, when the characteristic value acquired by one of the sensors is not within the threshold range, The buzzer alarm. A semiconductor processing machine, comprising a wafer box device as described in any one of claims 1 to 13, a processing chamber, a transfer chamber, a front-end module of equipment, an air lock chamber and a wafer loading and unloading machine. A wafer detection method for detecting a wafer in a wafer cassette device, which is realized by using the wafer cassette device as described in any one of claims 1 to 13, including the following steps: transferring the wafer into a cassette body; Obtaining the characteristic value corresponding to the wafer through a plurality of sensors arranged in the wafer cassette body carrying the strip; A judging unit judges whether the characteristic value is within a threshold range according to the characteristic value of the wafer acquired by the sensor. The wafer detection method as described in claim 15, further comprising the following steps: When the judging unit judges that the feature value is not within the threshold range, a wafer loader stops loading and unloading the wafer, and a prompting device gives a prompting information. The wafer detection method as described in claim 16, wherein the prompting device gives the prompting information, which specifically includes the following steps: Alarm through a buzzer of the prompting device; A display unit of the prompting device highlights and flashes the feature value that is not within the threshold range. The wafer detection method as described in claim 15, further comprising the following steps: The threshold value of the characteristic value of the wafer is input through an input unit of the wafer box body.

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