JPH09167751A - Rotary substrate treatment device - Google Patents

Rotary substrate treatment device

Info

Publication number
JPH09167751A
JPH09167751A JP34758595A JP34758595A JPH09167751A JP H09167751 A JPH09167751 A JP H09167751A JP 34758595 A JP34758595 A JP 34758595A JP 34758595 A JP34758595 A JP 34758595A JP H09167751 A JPH09167751 A JP H09167751A
Authority
JP
Japan
Prior art keywords
substrate
rotary
moving member
rotary table
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34758595A
Other languages
Japanese (ja)
Other versions
JP3361223B2 (en
Inventor
Joichi Nishimura
譲一 西村
Masami Otani
正美 大谷
Akihiko Morita
彰彦 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP34758595A priority Critical patent/JP3361223B2/en
Publication of JPH09167751A publication Critical patent/JPH09167751A/en
Application granted granted Critical
Publication of JP3361223B2 publication Critical patent/JP3361223B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent generation of a substrate of inferior quality by a method wherein whether a vertically moving member is moved to the prescribed position is confirmed by detecting the vertical position of the detection shaft which integrally moves in vertical direction with the vertically moving member. SOLUTION: When a rotary stand 12 is rotated while a substrate W is being treated, a vertically moving member 20 is in the upper position adjacent to the backside of the substrate W as shown by a two dot chain line. The valve disc 30, on the lower end of a detection shaft 24 droopingly provided in the center part 20, is on the uppermost position as shown by a two dot chain line, and the plane surface on the upper surface side is positioned close to the upper valve seat 36 of a guide cylinder 32. As a result, the upper aperture 40 of the guide cylinder 32 is closed, and the vacuum pressure increases in the guide cylinder 32, the hollow part of a rotary shaft 14 and a vacuum suction path 44. The increase in vacuum pressure is detected by a pressure gauge 46, and the state that the vertically moving member 20 is on the upper position adjacent to the backside of the substrate W, can be confirmed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、半導体ウエハ、
液晶表示装置用ガラス基板、フォトマスク用ガラス基板
等の基板を水平姿勢に保持して鉛直軸回りに回転させな
がらフォトレジスト液、洗浄液、現像液、エッチング液
等の処理液を基板表面へ供給して処理を行なう回転式基
板処理装置、特に、回転台の上面から少し間隔を設けて
基板を支持する回転式基板処理装置に関する。
[0001] The present invention relates to a semiconductor wafer,
While holding substrates such as glass substrates for liquid crystal display devices and glass substrates for photomasks in a horizontal position and rotating them around the vertical axis, supply treatment liquids such as photoresist liquid, cleaning liquid, developing liquid, and etching liquid to the substrate surface. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary substrate processing apparatus that performs processing by supporting a substrate, and more particularly to a rotary substrate processing apparatus that supports a substrate at a small distance from the upper surface of a turntable.

【0002】[0002]

【従来の技術】半導体ウエハ等の基板を、水平姿勢に支
持され鉛直軸回りに回転させられる回転台の上面から所
定間隔を設けて水平姿勢に支持し、この状態で基板を回
転させながら処理液を基板表面へ供給して処理を行なう
回転式基板処理装置においては、例えば特開平5−90
238号公報や実開平4−65446号公報に開示され
たように、回転台の上面に複数個の支持ピンを立設し、
これらの支持ピンによって基板を位置決めし保持するよ
うにしている。このような処理装置では、基板は回転台
の上面から少し浮いた状態で保持されるので、基板が回
転台に当接して載置される場合に生じる基板裏面の損傷
や汚染を避けることができる一方、基板処理中に飛散し
た処理液のミストが基板の下側に回り込んで基板裏面に
付着し、ミストによって基板裏面が汚染される、といっ
た別の問題を生じる。このような問題を解消する方法の
1つとして、基板を回転させながら処理している際に基
板裏面へ純水等のリンス液を吹き付けて基板裏面へのミ
ストの回り込みを防止する、いわゆるバックリンスを行
なう方法があるが、特開平7−130695号公報に
は、基板処理中に少なくとも基板と同程度の大きさを有
する上下移動部材を基板裏面に近接させてミストが基板
裏面へ回り込むのを防止するようにした回転式基板処理
装置が開示されている。
2. Description of the Related Art A substrate such as a semiconductor wafer is supported in a horizontal position at a predetermined distance from the upper surface of a turntable which is supported in a horizontal position and can be rotated about a vertical axis. An example of a rotary substrate processing apparatus that supplies a substrate to a substrate surface for processing is disclosed in Japanese Patent Laid-Open No. 5-90
As disclosed in Japanese Patent No. 238 and Japanese Utility Model Laid-Open No. 4-65446, a plurality of support pins are erected on the upper surface of the rotary table.
The substrate is positioned and held by these support pins. In such a processing apparatus, since the substrate is held in a state of being slightly floated from the upper surface of the turntable, it is possible to avoid damage or contamination of the back surface of the substrate that occurs when the substrate is placed in contact with the turntable. On the other hand, another problem arises in that the mist of the processing liquid scattered during the processing of the substrate goes around to the lower side of the substrate and adheres to the back surface of the substrate, and the back surface of the substrate is contaminated by the mist. As one of methods for solving such a problem, a so-called back rinse in which a rinse liquid such as pure water is sprayed onto the back surface of the substrate to prevent the mist from wrapping around the back surface of the substrate while processing the substrate while rotating the substrate. In Japanese Patent Laid-Open No. 7-130695, a vertical moving member having at least the same size as the substrate is brought close to the back surface of the substrate to prevent mist from wrapping around the back surface of the substrate during substrate processing. A rotary substrate processing apparatus configured to do so is disclosed.

【0003】同号公報に開示された処理装置は、図4に
その概略構成を一部破断した状態の正面図で示し、図5
にその一部を拡大断面図で示すように、基板Wを水平姿
勢に保持して鉛直軸回りに回転する基板回転保持具70
を有している。基板回転保持具70は、下面の中心部に
回転軸74が垂設され、水平姿勢にかつ鉛直軸回りに回
転自在に支持されて、モーター76に回転軸74を介し
て連結された回転台72を備えている。回転台72の上
面には、基板Wの周縁に当接して基板Wを位置決めし水
平姿勢に支持する複数個の支持ピン78がねじ込み固定
されており、また、図5に示すように複数個の微小突起
80が突設されている。支持ピン78は、円柱状の胴部
78aと、この胴部78aの上部に一体形成され、外周
縁が胴部78aの外周面より外側に張り出し、上面が基
板Wの周縁と当接して基板Wを支持する鍔部78bと、
この鍔部78bの上部に一体形成され、基板Wの周縁と
当接して基板Wの水平方向の移動を規制する小突起78
cとから構成されている。
The processing apparatus disclosed in the above publication is shown in FIG. 4 in a partially cutaway front view, and FIG.
As shown in an enlarged sectional view of a part thereof, a substrate rotation holder 70 that holds the substrate W in a horizontal posture and rotates about a vertical axis.
have. In the substrate rotation holder 70, a rotation shaft 74 is vertically provided at the center of the lower surface, is supported in a horizontal posture and is rotatable about a vertical axis, and is connected to a motor 76 via the rotation shaft 74. Is equipped with. A plurality of support pins 78 for abutting the peripheral edge of the substrate W to position and support the substrate W in a horizontal posture are screwed and fixed on the upper surface of the turntable 72. Further, as shown in FIG. The minute protrusion 80 is provided in a protruding manner. The support pin 78 is formed integrally with a cylindrical body portion 78a and an upper portion of the body portion 78a, an outer peripheral edge of which extends outwardly from an outer peripheral surface of the body portion 78a, and an upper surface of the support pin 78 abuts on the peripheral edge of the substrate W. A brim portion 78b for supporting the
A small protrusion 78 that is integrally formed on the upper portion of the collar portion 78b and contacts the peripheral edge of the substrate W to restrict the horizontal movement of the substrate W.
c.

【0004】回転台72の上面側には、薄板材からなる
円形状の上下移動部材82が配設されている。この上下
移動部材82の周辺部には、回転台72上の各支持ピン
78に対応する位置に支持ピン78の胴部78aよりも
若干大径のガイド孔84がそれぞれ形成されている。こ
れらガイド孔84を貫通して支持ピン78が回転台72
に取着されていることにより、上下移動部材82が支持
ピン78の胴部78aに案内されて上下方向にのみ移動
可能になっている。この上下移動部材82は、基板Wの
裏面へのミストの付着を防止するために、少なくとも基
板Wと同程度の大きさにされており、図示例では基板W
よりも若干大径に形成されている。尚、上下移動部材8
2に円形のガイド孔84を形成するのに代えて、上下移
動部材の周縁に外方へ開放されたU字状の切欠きを形成
することもある。
On the upper surface side of the rotary table 72, a circular vertical moving member 82 made of a thin plate material is arranged. Guide holes 84 having a diameter slightly larger than that of the body portion 78a of the support pin 78 are formed at positions corresponding to the respective support pins 78 on the rotary table 72 in the peripheral portion of the vertical movement member 82. The support pins 78 penetrate the guide holes 84 and the support pins 78 are rotated.
The vertical movement member 82 is guided by the body portion 78a of the support pin 78 so that it can be moved only in the vertical direction. The vertical movement member 82 is at least as large as the substrate W in order to prevent the mist from adhering to the back surface of the substrate W.
It is formed to have a slightly larger diameter. The vertical moving member 8
Instead of forming the circular guide hole 84 in 2, the U-shaped notch opened to the outside may be formed in the peripheral edge of the vertical moving member.

【0005】回転台72の周辺部には、円周方向に等配
されて複数個、例えば3個の開口86が形成されてお
り、その各開口86の位置に、上下移動部材82を上下
に駆動するための押し上げ機構88がそれぞれ設けられ
ている。押し上げ機構88は、作動片90aと垂下片9
0bとを有する逆L字形の押し上げ部材90を備え、垂
下片90bの下端部には、錘り92が取着されている。
押し上げ部材90の中間屈曲部にはピン94が挿通さ
れ、このピン94は、その両端が軸受け96によってそ
れぞれ支持されて、そのピン軸が円形の回転台72の接
線方向と平行に配置されている。そして、押し上げ部材
90は、作動片90aがピン94よりも外側に位置する
ように回転台72に取着され、ピン94の軸回りに揺動
可能になっていて、作動片90aが開口86を通して回
転台72の上面より上方へ揺動変位できるように構成さ
れている。
Around the periphery of the rotary table 72, a plurality of, for example, three openings 86 are formed equidistantly in the circumferential direction, and the vertical moving member 82 is vertically moved at the position of each opening 86. A push-up mechanism 88 for driving is provided respectively. The push-up mechanism 88 includes an operating piece 90a and a hanging piece 9
And a weight 92 is attached to the lower end of the hanging piece 90b.
A pin 94 is inserted through an intermediate bent portion of the push-up member 90, and both ends of the pin 94 are supported by bearings 96, respectively, and the pin shaft is arranged parallel to the tangential direction of the circular rotary table 72. . The push-up member 90 is attached to the turntable 72 so that the operating piece 90a is located outside the pin 94, and is swingable around the axis of the pin 94. The operating piece 90a passes through the opening 86. It is configured so as to be capable of swinging displacement upward from the upper surface of the rotary table 72.

【0006】基板回転保持具70の周囲には、処理液の
飛散を防止するためのカップ本体98が昇降可能に配設
されている。また、基板回転保持具70の上方には、処
理の内容に応じてフォトレジスト液、純水等の洗浄液、
現像液、エッチング液などの処理液を供給するためのノ
ズル100が水平方向へ往復移動可能に配設されてい
る。
Around the substrate rotation holder 70, a cup body 98 for preventing the processing liquid from scattering is disposed so as to be able to move up and down. Further, above the substrate rotation holder 70, a photoresist liquid, a cleaning liquid such as pure water, or the like, depending on the content of the treatment,
A nozzle 100 for supplying a processing liquid such as a developing liquid and an etching liquid is arranged so as to be reciprocally movable in the horizontal direction.

【0007】また、以上のような構成を有する回転式基
板処理装置の側方には、基板Wを処理装置内へ搬入して
基板回転保持具70上に移載したり、処理済みの基板W
を基板回転保持具70上から受け取って処理装置外へ搬
出したりするための搬送アーム102が、昇降及び水平
方向への進退可能に配設されている。この搬送アーム1
02は、基板Wの搬入及び搬出時に回転台72上の支持
ピン78と干渉しないように、先端側が平面視でU字状
に形成された基板載置部102aを備えている。搬送ア
ーム102の基板載置部102aは、3個の突起(図示
せず)により基板Wを下面側から点接触で支持するよう
になっている。
On the side of the rotary substrate processing apparatus having the above-described structure, the substrate W is carried into the processing apparatus and transferred onto the substrate rotation holder 70, or the processed substrate W is processed.
A transfer arm 102 for receiving the substrate from the substrate rotation holder 70 and carrying it out of the processing apparatus is disposed so as to be able to move up and down and move back and forth in the horizontal direction. This transfer arm 1
The substrate 02 has a substrate platform 102a whose front end is formed in a U shape in plan view so as not to interfere with the support pins 78 on the rotary table 72 when the substrate W is loaded and unloaded. The substrate mounting portion 102a of the transfer arm 102 is configured to support the substrate W by point contact from the lower surface side by three protrusions (not shown).

【0008】上記した処理装置における動作を説明する
と、まず、搬送アーム102によって基板Wを処理装置
内へ搬入する際は、カップ本体98は下降しており、回
転台72は停止している。このとき、押し上げ機構88
の押し上げ部材90は、図5に実線で示したように、垂
下片90bの下端部に取着された錘り92の重量により
作動片90aが水平姿勢をとっており、作動片90aが
回転台72の上面より下方に位置している。このため、
上下移動部材82は、図5に実線で示したように、回転
台72の上面の複数個の微小突起80に当接し支持され
て下方位置にある。
The operation of the above-described processing apparatus will be described. First, when the substrate W is carried into the processing apparatus by the transfer arm 102, the cup body 98 is lowered and the rotary table 72 is stopped. At this time, the lifting mechanism 88
As shown by the solid line in FIG. 5, in the lifting member 90 of FIG. 5, the operating piece 90a is in a horizontal posture due to the weight of the weight 92 attached to the lower end of the hanging piece 90b, and the operating piece 90a is in the rotary table. It is located below the upper surface of 72. For this reason,
As shown by the solid line in FIG. 5, the up-and-down moving member 82 is in contact with and supported by the plurality of minute projections 80 on the upper surface of the turntable 72, and is in the lower position.

【0009】この状態において、搬送アーム102が、
その基板載置部102aに基板Wを載置して処理装置内
へ進入し、基板回転保持具70の上方位置まで移動した
後、下降することにより、基板Wを回転台3上の支持ピ
ン78に受け渡す。そして、搬送アーム102は、後退
して処理装置外へ退避する。この際の一連の基板受け渡
し動作が支障無く行なえるようにするために、支持ピン
78上に支持された基板Wの下面と下方位置にある上下
移動部材82の上面との間の距離が、搬送アーム102
の厚みよりも若干大きくなるように、支持ビン78の高
さ(鍔部78bの上面位置)が適宜に設定される。
In this state, the transfer arm 102
The substrate W is placed on the substrate platform 102a, enters the processing apparatus, moves to a position above the substrate rotation holder 70, and then descends to support the substrate W on the rotary table 3. Hand over to. Then, the transfer arm 102 retracts and retracts outside the processing apparatus. In order that the series of substrate transfer operations at this time can be carried out without any hindrance, the distance between the lower surface of the substrate W supported on the support pins 78 and the upper surface of the vertically moving member 82 at the lower position is set to the transport distance. Arm 102
The height of the support bin 78 (the position of the upper surface of the collar portion 78b) is appropriately set so as to be slightly larger than the thickness.

【0010】次に、処理に際しては、まず、カップ本体
98が、基板回転保持具70を囲う所定位置まで上昇
し、続いて、モーター76が駆動されることにより、回
転台72と基板Wとが一体になって回転する。そして、
ノズル100が基板回転保持具70の回転中心の上方位
置(図4に二点鎖線で示す位置)まで移動する。
Next, in the processing, first, the cup main body 98 is raised to a predetermined position surrounding the substrate rotation holder 70, and then the motor 76 is driven, so that the turntable 72 and the substrate W are separated from each other. Rotate together. And
The nozzle 100 moves to a position above the rotation center of the substrate rotation holder 70 (a position indicated by a chain double-dashed line in FIG. 4).

【0011】回転台72が回転を始めて次第に回転速度
が増すにつれて、押し上げ機構88の錘り92に作用す
る遠心力が大きくなり、押し上げ部材90が、図5にお
ける時計回りに揺動し変位し始める。そして、各押し上
げ部材90の作動片90aが回転台72の上面からそれ
ぞれ突出し、作動片90aにより、図5に二点鎖線で示
したように上下移動部材82が水平姿勢を保ったまま上
方へ持ち上げられ、上下移動部材82の上面周縁部が支
持ピン78の鍔部78bの下面に当接する。このように
して上下移動部材82が上方位置へ移動することによ
り、基板Wの下面と上下移動部材82の上面とが僅かな
隙間、例えば1〜1.5mmの隙間を介して近接するこ
とになり、処理中、この状態が維持される。
As the rotary table 72 starts to rotate and the rotational speed gradually increases, the centrifugal force acting on the weight 92 of the push-up mechanism 88 increases, and the push-up member 90 starts rocking clockwise in FIG. . Then, the operating pieces 90a of the push-up members 90 respectively project from the upper surface of the turntable 72, and the operating pieces 90a raise the vertical moving member 82 upward while keeping the horizontal posture, as shown by the chain double-dashed line in FIG. Then, the peripheral edge of the upper surface of the vertically moving member 82 contacts the lower surface of the flange 78b of the support pin 78. By moving the vertical movement member 82 to the upper position in this manner, the lower surface of the substrate W and the upper surface of the vertical movement member 82 come close to each other with a slight gap, for example, a gap of 1 to 1.5 mm. During processing, this state is maintained.

【0012】回転台72が所定の回転速度に達すると、
ノズル100から処理液が基板W上に供給され、基板W
に所要の処理が施される。この際、余剰の処理液は、基
板Wの周縁から周囲へ飛散し、飛散した処理液の一部が
ミストとなってカップ本体98内を漂うが、上下移動部
材82が上昇して基板Wと上下移動部材82との間隔が
極めて狭くなっているので、基板Wの裏面側へミストが
回り込むことが殆んど無く、基板W裏面へのミストの付
着が防止されることとなる。
When the turntable 72 reaches a predetermined rotation speed,
The processing liquid is supplied from the nozzle 100 onto the substrate W,
Required processing is performed on. At this time, the excess processing liquid is scattered from the peripheral edge of the substrate W to the surroundings, and a part of the scattered processing liquid becomes mist and drifts in the cup body 98, but the vertical movement member 82 rises to form the substrate W. Since the distance between the vertical movement member 82 and the vertical movement member 82 is extremely narrow, the mist hardly wraps around the back surface of the substrate W, and the adhesion of the mist to the back surface of the substrate W is prevented.

【0013】基板Wの処理が終わると、モーター76が
停止して、回転台72の回転速度が徐々に低下してい
く。これに伴い、押し上げ機構88の錘り92に作用す
る遠心力も小さくなり、押し上げ部材90が、図5に実
線で示した元の位置へ揺動し復帰する。そして、押し上
げ部材90の作動片90aによって支持され持ち上げら
れていた上下移動部材82が、図5に実線で示した元の
下方位置へ下降する。
When the processing of the substrate W is completed, the motor 76 stops and the rotation speed of the turntable 72 gradually decreases. Along with this, the centrifugal force acting on the weight 92 of the lifting mechanism 88 is also reduced, and the lifting member 90 swings back to the original position shown by the solid line in FIG. Then, the vertically moving member 82, which is supported and lifted by the operating piece 90a of the pushing-up member 90, descends to the original lower position shown by the solid line in FIG.

【0014】回転台72が完全に停止すると、カップ本
体98が下降し、ノズル100が退去した後、搬送アー
ム102が駆動されて、その基板載置部102aが、基
板Wと上下移動部材82との間に形成された比較的広い
空間へ進入する。そして、搬送アーム102が上昇する
ことにより、基板回転保持具70上から処理済みの基板
Wが基板載置部102a上へ移載され、続いて、搬送ア
ーム102が後退することにより、基板Wは処理装置か
ら搬出される。
When the rotary table 72 is completely stopped, the cup body 98 descends and the nozzle 100 retreats, and then the transfer arm 102 is driven so that the substrate mounting portion 102a moves to the substrate W and the vertical moving member 82. It enters the relatively large space formed between. Then, when the transfer arm 102 moves up, the processed substrate W is transferred from the substrate rotation holder 70 onto the substrate platform 102a, and then the transfer arm 102 retracts to move the substrate W. Unloaded from the processor.

【0015】[0015]

【発明が解決しようとする課題】図4及び図5に示した
上記構成の回転式基板処理装置を使用すると、基板回転
保持具70が回転して、それと一体に基板Wを回転させ
ながら処理している間は、回転台72上に配設された上
下移動部材82が上昇し、基板Wの裏面側へのミストの
回り込みを防止して、基板Wの裏面へのミストの付着が
防止され、バックリンスを行なわなくてもよくなる。ま
た、基板Wの搬入及び搬出に際しては、上下移動部材8
2が下降し、基板回転保持具70に対する搬送アーム1
02の進退動作が支障無く行なわれることとなる。
When the rotary substrate processing apparatus having the above-described configuration shown in FIGS. 4 and 5 is used, the substrate rotation holder 70 rotates and the substrate W is processed while being rotated integrally therewith. While moving, the vertical moving member 82 disposed on the rotary table 72 rises to prevent the mist from wrapping around to the back surface side of the substrate W and prevent the mist from adhering to the back surface of the substrate W. No need to do back rinse. Further, when carrying in and carrying out the substrate W, the vertical movement member 8
2 is lowered and the transfer arm 1 for the substrate rotation holder 70 is moved.
The forward / backward movement of 02 is performed without any trouble.

【0016】ところが、搬送アーム102により基板W
を処理装置内へ搬入して基板回転保持具70上へ受け渡
すとき、或いは、基板回転保持具70上の処理済みの基
板Wを受け取って処理装置内から搬出するために搬送ア
ーム102を処理装置内へ進入させるときに、何らかの
原因で上下移動部材82が下方位置まで下降していない
と、搬送アーム102の基板載置部102aの下面或い
は先端面が上下移動部材82の上面或いは周縁に接触し
て、基板の搬入及び搬出の動作に支障を生じ、また、機
器の一部を損傷する可能性もある。
However, the substrate W is transferred by the transfer arm 102.
When the wafer W is carried into the processing apparatus and transferred onto the substrate rotation holder 70, or the processed substrate W on the substrate rotation holder 70 is received and carried out from the processing apparatus, the transfer arm 102 is used. If the vertical movement member 82 is not lowered to the lower position for some reason when entering the inside, the lower surface or the tip end surface of the substrate platform 102a of the transfer arm 102 contacts the upper surface or the peripheral edge of the vertical movement member 82. As a result, the operation of loading and unloading the substrate may be hindered, and a part of the device may be damaged.

【0017】また、基板の処理中に、上下移動部材82
が上方位置まで上昇していないと、基板の裏面側への処
理液ミストの回り込みを防止することができず、基板裏
面側にミストが付着してしまう。この結果、基板の品質
不良を生じることとなる。
Also, during the processing of the substrate, the vertical moving member 82
Is not raised to the upper position, it is impossible to prevent the processing liquid mist from wrapping around to the back surface side of the substrate, and the mist adheres to the back surface side of the substrate. As a result, the quality of the substrate is deteriorated.

【0018】この発明は、以上のような事情に鑑みてな
されたものであり、回転台の上面から少し間隔を設けて
基板を支持し、回転台上に配設された上下移動部材を上
下方向に移動させて、処理中における基板裏面への処理
液ミストの付着を防止するとともに、基板の搬入及び搬
出を支障無く行なえるようにした回転式基板処理装置に
おいて、上下移動部材が下方位置又は上方位置にあるこ
とを確認して、上下移動部材の動作不良により基板の搬
入及び搬出の動作に支障が生じたり基板の搬入及び搬出
の動作によって機器の一部を損傷したりすることを防止
するとともに、上下移動部材の動作不良により基板の処
理中に基板裏面側へ処理液ミストが付着することを防止
して、基板の品質不良を生じないようにする回転式基板
処理装置を提供することを目的とする。
The present invention has been made in view of the above circumstances, and supports the substrate at a slight distance from the upper surface of the rotary table, and vertically moves the vertical moving member disposed on the rotary table. In the rotary substrate processing apparatus, the vertical movement member is set to the lower position or the upper position in order to prevent the processing liquid mist from adhering to the back surface of the substrate during processing and to perform the loading and unloading of the substrate without hindrance. Check that it is in the position, and prevent malfunction of the vertical moving member from interfering with board loading and unloading operations and damaging part of the equipment due to board loading and unloading operations. Provided is a rotary substrate processing apparatus, which prevents a processing liquid mist from adhering to the back surface side of a substrate during processing of a substrate due to a malfunction of a vertically moving member, and prevents defective quality of the substrate from occurring. And an object thereof.

【0019】[0019]

【課題を解決するための手段】請求項1に係る発明は、
下面の中心部に回転軸が垂設され、水平姿勢にかつ鉛直
軸回りに回転自在に支持された回転台と、この回転台の
上面に固設されて、基板を水平姿勢にかつ回転台上面か
ら所定間隔を設けて支持する基板支持手段と、前記回転
台の回転軸を回転させる回転手段と、少なくとも基板と
同程度の大きさを有し、前記回転台の上面側に配設さ
れ、水平姿勢を保って上下方向に移動自在に支持された
上下移動部材と、この上下移動部材を、前記回転台が停
止している間は回転台上面に接触もしくは近接する下方
位置に、回転台が回転して基板の処理が行なわれている
間は前記基板支持手段に支持された基板の裏面に近接す
る上方位置に移動させる上下移動手段とを備えた回転式
基板処理装置において、前記上下移動部材の下面の中心
部に、上下移動部材と一体に上下方向に移動する検知用
軸を垂設し、前記検知用軸の上下位置を検知して、前記
上下移動部材が所定位置に移動しているかどうかを確認
する検知手段を設けたことを特徴とする。
The invention according to claim 1 is
A rotating table is vertically installed at the center of the lower surface and is supported in a horizontal posture and rotatable about a vertical axis. The rotating table is fixedly mounted on the upper surface of the rotating platform to keep the substrate in the horizontal posture and the upper surface of the rotating table. A substrate supporting means for supporting at a predetermined distance from the rotating table, a rotating means for rotating the rotating shaft of the rotating table, and at least about the same size as the substrate, arranged on the upper surface side of the rotating table, and horizontal. An up / down moving member supported in a vertically movable manner while maintaining a posture, and the up / down moving member is rotated to a lower position in contact with or close to the upper surface of the rotating table while the rotating table is stopped. In the rotary substrate processing apparatus provided with a vertical moving means for moving the substrate to an upper position near the back surface of the substrate supported by the substrate supporting means while the substrate is being processed, Vertical movement member at the center of the bottom surface A detection shaft that vertically moves integrally is provided vertically, and a detection unit that detects the vertical position of the detection shaft and confirms whether the vertical movement member has moved to a predetermined position is provided. Characterize.

【0020】請求項2に係る発明は、請求項1記載の回
転式基板処理装置において、上記回転台の回転軸を中空
とするとともに、回転台の中心部に、回転軸の中空部に
連通し上下移動部材の検知用軸が貫通されてその上下移
動を許容する貫通孔を形成し、上記検知手段を次のよう
に構成したことを特徴とする。すなわち、前記検知用軸
の下端部に形設されて上下方向に移動する弁体と、前記
上下移動部材が前記回転台の上面に接触もしくは近接す
る下方位置に移動したときに前記弁体の下面側と密接す
る下部弁座、及び、上下移動部材が基板の下面に近接す
る上方位置に移動したときに弁体の上面側と密接する上
部弁座を有し、下部弁座及び上部弁座の各部位がそれぞ
れ開口した容器状をなし、前記回転軸の中空部に嵌着さ
れたガイド筒と、前記回転軸の中空部に流路接続された
真空吸引路と、この真空吸引路及び前記回転軸の中空部
を通して前記ガイド筒の内部を真空吸引する真空吸引手
段と、前記真空吸引路に介設されてその真空圧を検知す
る圧力検知手段とを備えて、上記検知手段を構成した。
According to a second aspect of the present invention, in the rotary substrate processing apparatus according to the first aspect, the rotary shaft of the rotary table is hollow, and the central part of the rotary table communicates with the hollow part of the rotary shaft. The detecting shaft of the vertically moving member is penetrated to form a through hole that allows the vertically moving member to move up and down, and the detecting means is configured as follows. That is, the valve body that is formed at the lower end of the detection shaft and moves in the vertical direction, and the lower surface of the valve body when the vertical movement member moves to a lower position where it contacts or approaches the upper surface of the rotary table. Of the lower valve seat and the upper valve seat, the lower valve seat being in close contact with the side and the upper valve seat being in close contact with the upper surface of the valve body when the vertically moving member moves to the upper position close to the lower surface of the base plate. Each part has a container shape with an opening, and a guide cylinder fitted in the hollow part of the rotary shaft, a vacuum suction path connected to the hollow part of the rotary shaft by a flow path, the vacuum suction path and the rotation. The above-mentioned detection means is provided with a vacuum suction means for vacuum-sucking the inside of the guide cylinder through the hollow portion of the shaft, and a pressure detection means interposed in the vacuum suction path for detecting the vacuum pressure thereof.

【0021】請求項3に係る発明は、請求項2記載の回
転式基板処理装置において、上記弁体の上面側がガイド
筒の上部弁座に密接したときに前記回転台の貫通孔を通
して外気にリークするリーク部を設けたことを特徴とす
る。
According to a third aspect of the present invention, in the rotary substrate processing apparatus according to the second aspect, when the upper surface side of the valve body comes into close contact with the upper valve seat of the guide cylinder, the air leaks to the outside through the through hole of the rotary table. It is characterized in that a leak portion is provided.

【0022】請求項4に係る発明は、請求項1ないし請
求項3のいずれかに記載の回転式基板処理装置におい
て、上記上下移動部材が所定位置に移動していないこと
が上記検知手段によって検知されたときに警報を発する
報知手段を設けたことを特徴とする。
According to a fourth aspect of the present invention, in the rotary substrate processing apparatus according to any one of the first to third aspects, the detection means detects that the vertical moving member has not moved to a predetermined position. It is characterized in that an informing means is provided for issuing an alarm when the warning is given.

【0023】請求項1に係る発明の回転式基板処理装置
では、上下移動部材が上下方向に移動すると、その下面
の中心部に垂設された検知用軸が一体に上下方向に移動
するので、検知手段によって検知用軸の上下位置を検知
することにより、上下移動部材が所定位置に移動してい
るかどうかを確認することが可能になる。
In the rotary substrate processing apparatus according to the first aspect of the present invention, when the vertical moving member moves in the vertical direction, the detection shaft vertically provided at the center of the lower surface of the vertical moving member integrally moves in the vertical direction. By detecting the vertical position of the detection shaft by the detection means, it becomes possible to confirm whether or not the vertical movement member has moved to a predetermined position.

【0024】請求項2に係る発明の回転式基板処理装置
では、上下移動部材の下面の中心部に垂設された検知用
軸は、回転台の中心部に形成された貫通孔を貫通して上
下移動し、検知用軸の下端部に形設された弁体が、回転
軸の中空部に嵌着されたガイド筒の内部において上下方
向に移動する。また、真空吸引手段により、回転軸の中
空部及びその中空部に流路接続された真空吸引路を通し
てガイド筒の内部が真空吸引される。そして、上下移動
部材が回転台の上面に接触もしくは近接する下方位置に
移動したときには、弁体の下面側がガイド筒の下部弁座
に密接することにより、下部弁座の部位に形成された開
口が塞がれるため、回転軸の中空部及び真空吸引路にお
ける空気圧が低下(真空圧が上昇)することになり、こ
の真空圧の上昇を圧力検知手段によって検知することに
より、上下移動部材が回転台の上面に接触もしくは近接
する下方位置に移動したことが確認される。また、上下
移動部材が基板の下面に近接する上方位置に移動したと
きには、弁体の上面側がガイド筒の上部弁座に密接する
ことにより、上部弁座の部位に形成された開口が塞がれ
るため、ガイド筒内、回転軸の中空部及び真空吸引路に
おける空気圧が低下(真空圧が上昇)することになり、
この真空圧の上昇を圧力検知手段によって検知すること
により、上下移動部材が基板の下面に近接する上方位置
に移動したことが確認される。
In the rotary substrate processing apparatus according to the second aspect of the present invention, the detection shaft vertically provided at the center of the lower surface of the vertically moving member passes through the through hole formed at the center of the rotary table. The valve body that moves up and down and is formed at the lower end of the detection shaft moves up and down inside the guide cylinder that is fitted in the hollow portion of the rotating shaft. Further, the inside of the guide cylinder is vacuum-sucked by the vacuum suction means through the hollow portion of the rotating shaft and the vacuum suction passage connected to the hollow portion by a flow path. When the vertical movement member moves to a lower position where it contacts or approaches the upper surface of the rotary table, the lower surface side of the valve element comes into close contact with the lower valve seat of the guide cylinder, so that the opening formed in the lower valve seat portion is opened. Since it is blocked, the air pressure in the hollow portion of the rotary shaft and the vacuum suction path decreases (vacuum pressure increases). By detecting this increase in vacuum pressure by the pressure detection means, the vertical movement member is rotated by the rotary table. It is confirmed that it has moved to a lower position in contact with or close to the upper surface of. Further, when the vertical movement member moves to the upper position close to the lower surface of the base plate, the upper surface side of the valve body comes into close contact with the upper valve seat of the guide cylinder, thereby closing the opening formed in the upper valve seat portion. Therefore, the air pressure in the guide cylinder, the hollow part of the rotary shaft, and the vacuum suction path decreases (vacuum pressure increases),
By detecting the increase in the vacuum pressure by the pressure detecting means, it is confirmed that the vertical moving member has moved to the upper position close to the lower surface of the substrate.

【0025】請求項3に係る発明の回転式基板処理装置
では、弁体の上面側がガイド筒の上部弁座に密接したと
きには、ガイド筒内がリーク部により回転台の貫通孔を
通して外気に一部リークするので、このときの真空吸引
路の真空圧は、弁体の下面側がガイド筒の下部弁座に密
接したときの真空圧に比べて低くなる。すなわち、上下
移動部材が基板の下面に近接する上方位置に移動したと
きの真空吸引路の真空圧が、上下移動部材が回転台の上
面に接触もしくは近接する下方位置に移動したときの真
空吸引路の真空圧に比べて低くなる。従って、この真空
圧の違いから、上下移動部材が上方位置にあるか下方位
置にあるかを確認することが可能となる。
In the rotary substrate processing apparatus according to the third aspect of the present invention, when the upper surface side of the valve body is in close contact with the upper valve seat of the guide cylinder, the inside of the guide cylinder is partially leaked to the outside air through the through hole of the rotary table due to the leak portion. Since there is a leak, the vacuum pressure in the vacuum suction passage at this time is lower than the vacuum pressure when the lower surface side of the valve body is in close contact with the lower valve seat of the guide cylinder. That is, the vacuum pressure in the vacuum suction path when the vertical moving member moves to the upper position close to the lower surface of the substrate, the vacuum suction path when the vertical moving member moves to the lower position contacting or close to the upper surface of the rotary table. It becomes lower than the vacuum pressure. Therefore, it is possible to confirm whether the vertically moving member is at the upper position or the lower position from the difference in the vacuum pressure.

【0026】請求項4に係る発明の回転式基板処理装置
では、検知手段により、上下移動部材が所定位置に移動
していないことが検知されたときに警報が発せられ、上
下移動部材の動作に何か異常があったことが作業者に知
らされる。
In the rotary substrate processing apparatus according to the fourth aspect of the present invention, when the detecting means detects that the vertically moving member has not moved to the predetermined position, an alarm is issued and the operation of the vertically moving member is notified. The operator is notified that something is wrong.

【0027】[0027]

【発明の実施の形態】以下、この発明の最良の実施形態
について図面を参照しながら説明する。
Preferred embodiments of the present invention will be described below with reference to the drawings.

【0028】図1及び図2は、この発明の実施形態の1
例を示し、図1は、回転式基板処理装置の要部の概略構
成を示す正面断面図、図2は、その一部を拡大した断面
図である。
FIGS. 1 and 2 show a first embodiment of the present invention.
As an example, FIG. 1 is a front sectional view showing a schematic configuration of a main part of a rotary substrate processing apparatus, and FIG. 2 is a partially enlarged sectional view thereof.

【0029】この回転式基板処理装置は、基板Wを水平
姿勢に保持して鉛直軸回りに回転する基板回転保持具1
0を有しており、基板回転保持具10は、下面の中心部
に回転軸14が垂設され、水平姿勢にかつ鉛直軸回りに
回転自在に支持されて、図示しないモーターに回転軸1
4を介して連結された回転台12を備えている。回転台
12の上面には、基板Wの周縁に当接して基板Wを位置
決めし水平姿勢に支持する複数個の支持ピン16がねじ
込み固定されており、複数個の微小突起18が突設され
ている。これらの構成は、図4及び図5に基づいて上述
した処理装置と同様であり、また、支持ピン16の構成
も、図5に示したものと特に異なる点が無いので、その
説明を省略する。また、図示を省略しているが、図4及
び図5に示した処理装置と同様に、基板回転保持具10
の周囲には、処理液の飛散を防止するためのカップ本体
が昇降可能に配設され、基板回転保持具10の上方に
は、処理液を供給するためのノズルが水平方向へ往復移
動可能に配設されている。さらに、この処理装置の側方
には、基板Wを処理装置内へ搬入して基板回転保持具1
0上に移載したり、処理済みの基板Wを基板回転保持具
10上から受け取って処理装置外へ搬出したりするため
の搬送アームが、昇降及び水平方向への進退可能に配設
されている。
This rotary substrate processing apparatus has a substrate rotation holder 1 for holding a substrate W in a horizontal posture and rotating it about a vertical axis.
In the substrate rotation holder 10, the rotation shaft 14 is vertically provided at the center of the lower surface of the substrate rotation holder 10 and is supported in a horizontal posture and rotatable about a vertical axis.
The rotary table 12 is connected to the rotary table 12 via the rotary table 4. A plurality of support pins 16 for abutting against the peripheral edge of the substrate W to position and support the substrate W in a horizontal posture are screwed and fixed on the upper surface of the turntable 12, and a plurality of minute protrusions 18 are provided in a protruding manner. There is. These configurations are similar to those of the processing apparatus described above with reference to FIGS. 4 and 5, and the configuration of the support pins 16 is not different from that shown in FIG. . Although not shown, the substrate rotation holder 10 is similar to the processing apparatus shown in FIGS. 4 and 5.
A cup main body for preventing the scattering of the processing liquid is vertically arranged around the substrate, and a nozzle for supplying the processing liquid is horizontally reciprocated above the substrate rotation holder 10. It is arranged. Further, on the side of this processing apparatus, the substrate W is loaded into the processing apparatus and the substrate rotation holder 1
0, a transfer arm for receiving the processed substrate W from the substrate rotation holder 10 and carrying it out of the processing apparatus is provided so as to be able to move up and down and move back and forth in the horizontal direction. There is.

【0030】回転台12の上面側には、薄板材からなる
円形状の上下移動部材20が配設されている。そして、
図4及び図5に示した処理装置と同様に、上下移動部材
20は、少なくとも基板Wと同程度の大きさにされてお
り、図示例では基板Wよりも若干大径に形成されてい
る。尚、上下移動部材20に円形のガイド孔22を形成
するのに代えて、上下移動部材の周縁に外方へ開放され
たU字状の切欠きを形成するようにしてもよい。また、
上下移動部材20の周辺部には、回転台12上の各支持
ピン16に対応する位置に支持ピン16の胴部よりも若
干大径のガイド孔22がそれぞれ形成されていて、これ
らガイド孔22を貫通して支持ピン16が回転台12に
取着されていることにより、上下移動部材20が支持ピ
ン16の胴部に案内されて上下方向にのみ移動可能にな
っている。
On the upper surface side of the rotary table 12, a circular vertical moving member 20 made of a thin plate material is arranged. And
Similar to the processing apparatus shown in FIGS. 4 and 5, the vertical movement member 20 is at least as large as the substrate W, and is formed to have a diameter slightly larger than the substrate W in the illustrated example. Instead of forming the circular guide hole 22 in the vertical moving member 20, a U-shaped notch opened to the outside may be formed in the peripheral edge of the vertical moving member. Also,
Guide holes 22 each having a diameter slightly larger than the body of the support pin 16 are formed in the peripheral portion of the vertical movement member 20 at positions corresponding to the support pins 16 on the rotary table 12, respectively. Since the support pin 16 is attached to the rotary table 12 by penetrating therethrough, the vertical movement member 20 is guided by the body of the support pin 16 and can move only in the vertical direction.

【0031】また、この処理装置にも、図4及び図5に
より説明したような上記構成の押し上げ機構が設けられ
ており、その押し上げ機構によって上下移動部材20が
上下に駆動されるようになっているが、押し上げ機構に
ついては、既に詳しく説明したので、図1及び図2にお
いては、押し上げ機構の図示を省略し、その説明もここ
では省略することにする。尚、上下移動部材20を上下
方向に移動させる上下移動手段としては、図4及び図5
に示したような押し上げ機構88に限らず、どのような
機構であっても上下移動部材を上下移動させることがで
きればよいが、上下移動手段そのものは、この発明の要
旨と直接関係しないので、これ以上の説明は省略する。
Further, this processing apparatus is also provided with the lifting mechanism having the above-described structure as described with reference to FIGS. 4 and 5, and the vertically moving member 20 is driven vertically by the lifting mechanism. However, since the push-up mechanism has already been described in detail, the illustration of the push-up mechanism is omitted in FIGS. 1 and 2, and the description thereof is also omitted here. The vertical moving means for moving the vertical moving member 20 in the vertical direction is as shown in FIGS.
Not only the push-up mechanism 88 as shown in FIG. 4 but also any mechanism may be used as long as the vertical moving member can be moved vertically. However, since the vertical moving means itself is not directly related to the gist of the present invention, The above description is omitted.

【0032】この処理装置では、上下移動部材20の下
面の中心部に検知用軸24が垂設されており、検知用軸
24は上下移動部材20と一体に上下方向に移動する。
また、回転軸14が中空に形成されているとともに、回
転台12の中心部に、回転軸12の中空部26に連通し
検知用軸24が貫通されてその上下移動を許容する貫通
孔28が形成されている。
In this processing apparatus, a detection shaft 24 is vertically provided at the center of the lower surface of the vertical movement member 20, and the detection shaft 24 moves vertically with the vertical movement member 20.
Further, the rotating shaft 14 is formed in a hollow shape, and a through hole 28 is formed in the center of the rotating table 12 so as to communicate with the hollow portion 26 of the rotating shaft 12 and to penetrate the detecting shaft 24 to allow its vertical movement. Has been formed.

【0033】検知用軸24の下端部には、円形板部の下
面側に逆円錐形部を一体形成した形状の弁体30が一体
に形設されている。また、回転軸14の中空部26の上
端部に、円筒容器状をなすガイド筒32が嵌着されてお
り、このガイド筒32内に検知用軸24の弁体30が挿
入されており、弁体30は、ガイド筒32内において上
下方向に移動可能になっている。ガイド筒32は、弁体
30の下面側円錐面と密接する下部弁座34と、弁体3
0の上面側平面と密接する上部弁座36を有し、下部弁
座34及び上部弁座36の各部位にそれぞれ開口38、
40が形成されている。そして、図2に実線で示したよ
うに、上下移動部材20が回転台12の上面に近接する
下方位置に移動したときに、弁体30の下面側円錐面が
下部弁座34に密接して、下部開口38を閉塞するよう
になっている。また、図1に示し図2に二点鎖線で示し
たように、上下移動部材20が基板Wの下面に近接する
上方位置に移動したときに、弁体30の上面側平面が上
部弁座36に密接して、上部開口40を閉塞するように
なっている。また、弁体30の円形板部には、リーク用
細孔42が貫通して形成されている。そして、弁体30
の上面側平面が上部弁座36に密接して上部開口40を
閉塞した際に、ガイド筒32の内部がリーク用細孔42
及び回転台12の貫通孔28を通して外気に一部リーク
するようになっている。尚、このリーク用細孔42は、
弁体30の円形板部に必ずしも形成しなくてもよい。
At the lower end of the detecting shaft 24, a valve body 30 having a shape in which an inverted conical portion is integrally formed on the lower surface side of a circular plate portion is integrally formed. Further, a guide cylinder 32 in the form of a cylindrical container is fitted to the upper end of the hollow portion 26 of the rotary shaft 14, and the valve body 30 of the detection shaft 24 is inserted into the guide cylinder 32. The body 30 is vertically movable within the guide tube 32. The guide cylinder 32 includes a lower valve seat 34 that is in close contact with the lower conical surface of the valve body 30, and the valve body 3
0 has an upper valve seat 36 that is in close contact with the upper surface side plane, and has openings 38 in the respective parts of the lower valve seat 34 and the upper valve seat 36,
40 are formed. Then, as shown by the solid line in FIG. 2, when the up-and-down moving member 20 moves to the lower position close to the upper surface of the turntable 12, the lower conical surface of the valve body 30 comes into close contact with the lower valve seat 34. The lower opening 38 is closed. Further, as shown by the two-dot chain line in FIG. 1 and in FIG. 2, when the vertical movement member 20 moves to the upper position close to the lower surface of the substrate W, the upper surface side plane of the valve body 30 has the upper valve seat 36. And closes the upper opening 40. Further, the circular plate portion of the valve body 30 is formed with a leak pore 42 penetrating therethrough. And the valve body 30
The inner surface of the guide cylinder 32 is closed when the upper surface side of the guide closes the upper valve seat 36 and closes the upper opening 40.
A part of the air leaks to the outside air through the through hole 28 of the rotary table 12. The leak pores 42 are
It does not necessarily have to be formed on the circular plate portion of the valve body 30.

【0034】回転軸14の中空部26には、図示しない
バキュームシール及びハウジングを介して真空吸引路4
4が流路接続されており、真空吸引路44は真空吸引源
に流路接続されている。そして、真空吸引路44及び回
転軸14の中空部26を通してガイド筒32の内部を真
空吸引することができるように構成されている。また、
真空吸引路44には、2接点付圧力計46が介設されて
おり、この圧力計46により真空吸引路44の空気圧
(真空圧)を検知されるようになっている。尚、図示し
ていないが、2接点付圧力計46によって上下移動部材
20が所定位置に移動していないことが検知されたとき
に警報を発する報知器を設けておくとよい。
In the hollow portion 26 of the rotary shaft 14, a vacuum suction passage 4 is provided through a vacuum seal and a housing (not shown).
4 is connected to the vacuum suction passage 44, and the vacuum suction passage 44 is connected to the vacuum suction source. The inside of the guide cylinder 32 can be vacuum-sucked through the vacuum suction passage 44 and the hollow portion 26 of the rotary shaft 14. Also,
A pressure gauge with two contacts 46 is provided in the vacuum suction passage 44, and the air pressure (vacuum pressure) in the vacuum suction passage 44 is detected by the pressure gauge 46. Although not shown, it is advisable to provide an alarm device that issues an alarm when the pressure gauge with two contacts 46 detects that the vertical movement member 20 has not moved to a predetermined position.

【0035】次に、上記した構成の回転式基板処理装置
において上下移動部材20が所定位置に移動しているか
どうかを確認する検知動作について説明する。
Next, a detecting operation for confirming whether or not the vertical moving member 20 is moved to a predetermined position in the rotary substrate processing apparatus having the above-mentioned structure will be described.

【0036】ガイド筒32の内部は、真空吸引源により
真空吸引路44及び回転軸14の中空部26を通して常
時或いは任意のタイミングで真空吸引されており、ま
た、2接点付圧力計46によって真空吸引路44の真空
圧が常時或いは任意のタイミングでモニターされてい
る。そして、基板Wを処理装置内へ搬入しまた処理済み
の基板Wを処理装置内から搬出する際には、回転台12
は停止しており、このとき、上下移動部材20は、図2
に実線で示したように回転台12の上面に近接した下方
位置にある。また、上下移動部材20の下面の中心部に
垂設された検知用軸24の下端部の弁体30は、図2に
実線で示した最下位置にあり、その下面側円錐面がガイ
ド筒32の下部弁座34に密接した状態となっている。
これにより、ガイド筒32の下部開口38が塞がれ、こ
の結果、回転軸14の中空部26及び真空吸引路44に
おける真空圧が上昇することになる。この真空圧の上昇
が2接点付圧力計46によって検知されることにより、
上下移動部材20が回転台12の上面に近接する下方位
置にあることが確認される。
The inside of the guide cylinder 32 is vacuumed by a vacuum suction source through the vacuum suction passage 44 and the hollow portion 26 of the rotary shaft 14 at all times or at an arbitrary timing, and is vacuum sucked by a two-contact pressure gauge 46. The vacuum pressure in the passage 44 is monitored constantly or at any timing. When the substrate W is loaded into the processing apparatus and the processed substrate W is loaded from the processing apparatus, the rotary table 12 is used.
2 has stopped, and the vertical movement member 20 is
As shown by the solid line, it is in the lower position close to the upper surface of the turntable 12. Further, the valve body 30 at the lower end of the detection shaft 24 vertically provided at the center of the lower surface of the vertically moving member 20 is at the lowermost position shown by the solid line in FIG. 2, and the conical surface on the lower surface side is the guide cylinder. It is in close contact with the lower valve seat 34 of 32.
As a result, the lower opening 38 of the guide cylinder 32 is closed, and as a result, the vacuum pressure in the hollow portion 26 of the rotary shaft 14 and the vacuum suction passage 44 increases. By detecting the increase in the vacuum pressure by the pressure gauge with two contacts 46,
It is confirmed that the up-and-down moving member 20 is in the lower position close to the upper surface of the turntable 12.

【0037】一方、回転台12が停止しているにも拘ら
ず、上下移動部材20が回転台12の上面に近接する下
方位置まで下降していないときは、弁体30の下面側円
錐面がガイド筒32の下部弁座34に密接しておらず、
下部開口38を通して回転軸14の中空部26とガイド
筒32の内部とが連通した状態となっている。この結
果、ガイド筒32の内部及び回転台12の貫通孔28を
通して回転軸14の中空部26が外気にリークし、真空
吸引路44における真空圧が上昇しない。このときは、
2接点付圧力計46によって異常が検知され、警報器か
ら警報が発せられる。そして、搬送アームも進入しな
い。
On the other hand, when the rotary table 12 is stopped but the vertical moving member 20 is not lowered to the lower position close to the upper surface of the rotary table 12, the conical surface on the lower surface side of the valve body 30 is Is not in close contact with the lower valve seat 34 of the guide cylinder 32,
The hollow portion 26 of the rotary shaft 14 and the inside of the guide cylinder 32 are in communication with each other through the lower opening 38. As a result, the hollow portion 26 of the rotary shaft 14 leaks to the outside through the inside of the guide cylinder 32 and the through hole 28 of the rotary table 12, and the vacuum pressure in the vacuum suction passage 44 does not rise. At this time,
An abnormality is detected by the pressure gauge with two contacts 46, and an alarm is issued from the alarm device. Also, the transfer arm does not enter.

【0038】基板Wの処理中において回転台12が回転
しているときは、上下移動部材20は、図1に示したよ
うにまた図2に二点鎖線で示したように基板Wの裏面に
近接した上方位置にある。そして、上下移動部材20の
下面の中心部に垂設された検知用軸24の下端部の弁体
30は、図2に二点鎖線で示した最上位置にあり、その
上面側平面がガイド筒32の上部弁座36に密接した状
態となっている。これにより、ガイド筒32の上部開口
40が塞がれ、この結果、ガイド筒32の内部、回転軸
14の中空部26及び真空吸引路44における真空圧が
上昇することになる。このとき、弁体30の円形板部に
はリーク用細孔42が形成されており、そのリーク用細
孔42及び回転台12の貫通孔28を通してガイド筒3
2の内部が外気に一部リークしているため、回転台12
が停止して上下移動部材20が回転台12の上面に近接
した下方位置にあるとき程には、真空吸引路44におけ
る真空圧は上昇しない。この真空圧の上昇が2接点付圧
力計46によって検知されることにより、上下移動部材
20が基板Wの裏面に近接した上方位置にあることが確
認される。
When the turntable 12 is rotating during the processing of the substrate W, the vertical moving member 20 is placed on the back surface of the substrate W as shown in FIG. 1 and by the chain double-dashed line in FIG. It is in a close up position. The valve element 30 at the lower end of the detection shaft 24 vertically provided at the center of the lower surface of the vertically moving member 20 is at the uppermost position shown by the chain double-dashed line in FIG. It is in close contact with the upper valve seat 36 of 32. As a result, the upper opening 40 of the guide cylinder 32 is closed, and as a result, the vacuum pressure in the inside of the guide cylinder 32, the hollow portion 26 of the rotary shaft 14 and the vacuum suction passage 44 increases. At this time, a leak pore 42 is formed in the circular plate portion of the valve body 30, and the guide cylinder 3 is passed through the leak pore 42 and the through hole 28 of the rotary base 12.
Since the inside of 2 partially leaks to the outside, the turntable 12
The vacuum pressure in the vacuum suction passage 44 does not rise as much as when the vertical movement member 20 is in the lower position close to the upper surface of the rotary table 12 after stopping. The rise of the vacuum pressure is detected by the pressure gauge with two contacts 46, whereby it is confirmed that the vertical movement member 20 is at the upper position close to the back surface of the substrate W.

【0039】一方、回転台12が回転しているにも拘ら
ず、上下移動部材20が基板Wの裏面に近接する上方位
置まで上昇していないときは、弁体30の上面側平面が
ガイド筒32の上部弁座36に密接しておらず、上部開
口40を通してガイド筒32の内部と回転台12の貫通
孔28とが連通した状態となっている。この結果、ガイ
ド筒32の内部、回転軸14の中空部26及び真空吸引
路44における真空圧が上昇しない。このときは、2接
点付圧力計46によって異常が検知され、警報器から警
報が発せられる。
On the other hand, when the rotary table 12 is rotating but the vertical moving member 20 is not raised to the upper position close to the rear surface of the substrate W, the upper surface side plane of the valve body 30 is a guide cylinder. It is not in close contact with the upper valve seat 36 of 32, and the inside of the guide cylinder 32 and the through hole 28 of the rotary base 12 are in communication with each other through the upper opening 40. As a result, the vacuum pressure in the inside of the guide tube 32, the hollow portion 26 of the rotary shaft 14 and the vacuum suction passage 44 does not rise. At this time, an abnormality is detected by the pressure gauge with two contacts 46, and an alarm is issued from the alarm device.

【0040】尚、弁体30の円形板部にリーク用細孔4
2を形成しないときは、真空圧の検知だけからは、上下
移動部材22が下方位置にあるのか上方位置にあるのか
が区別できないので、この場合には、基板回転保持具1
0が回転しているか停止しているかを示す信号と圧力計
からの信号とを組み合わせることにより、上下移動部材
22の位置を検知するようにすればよい。
It should be noted that leak holes 4 are formed in the circular plate portion of the valve body 30.
When 2 is not formed, it is not possible to distinguish whether the vertical moving member 22 is in the lower position or the upper position by only detecting the vacuum pressure. In this case, therefore, the substrate rotation holder 1
The position of the vertical moving member 22 may be detected by combining a signal indicating whether 0 is rotating or stopped and a signal from the pressure gauge.

【0041】上下移動部材の下面に垂設された検知用軸
の上下位置を検知して上下移動部材が所定の下方位置又
は上方位置にあるかどうかを確認する検知手段として
は、図1及び図2に示した構成のものに限定されない。
例えば、図3に示すように、モーター50によって回転
駆動される回転軸52を下方へ延長して配設し、回転軸
52の軸心部に形成された中空部54に、上下移動部材
56の下面の中心部に垂設された検知用軸58を挿通し
て、検知用軸58の下端部を回転軸52の下端よりさら
に延設し、その検知用軸58の延設部58aに遮光板6
0を取着して、遮光板60を挾むように上下2個所の位
置に2組の投光部62a、64a及び受光部62b、6
4bをそれぞれ配置したセンサーを設けた構成としても
よい。図中の符号66は、軸受である。
The detecting means for detecting the vertical position of the detection shaft vertically provided on the lower surface of the vertical moving member and confirming whether the vertical moving member is at a predetermined lower position or upper position is shown in FIGS. The configuration is not limited to that shown in FIG.
For example, as shown in FIG. 3, a rotary shaft 52, which is driven to rotate by a motor 50, is disposed so as to extend downward, and a vertical movement member 56 is provided in a hollow portion 54 formed at the axial center of the rotary shaft 52. A lower end of the detecting shaft 58 is further extended from the lower end of the rotating shaft 52 by inserting a detecting shaft 58 vertically provided at the center of the lower surface, and a light shielding plate is provided on an extending portion 58a of the detecting shaft 58. 6
0 is attached, and two sets of light projecting portions 62a and 64a and light receiving portions 62b and 6 are provided at two positions above and below so as to sandwich the light shielding plate 60.
4b may be arranged in each sensor. Reference numeral 66 in the drawing is a bearing.

【0042】図3に示した処理装置では、上下移動部材
56が二点鎖線で示したように回転台12の上面に近接
した下方位置にあるときは、投光部64aから照射され
た光線が遮光板60によって遮られ、受光部64bから
信号が出力されない。これにより、上下移動部材56が
回転台12の上面に近接した下方位置にあることが確認
される。また、上下移動部材56が実線で示したように
基板Wの裏面に近接した上方位置にあるときは、投光部
62aから照射された光線が遮光板60によって遮ら
れ、受光部62bから信号が出力されない。これによ
り、上下移動部材56が基板Wの裏面に近接した上方位
置にあることが確認される。尚、上下移動部材56の下
面に垂設された検知用軸58の上下位置を光学式センサ
ーで検知するのに代えて、機械接触式の検知器によって
検知するようにしてもよい。
In the processing apparatus shown in FIG. 3, when the up-and-down moving member 56 is in the lower position close to the upper surface of the turntable 12 as shown by the chain double-dashed line, the light beam emitted from the light projecting section 64a is emitted. The light is blocked by the light shielding plate 60, and no signal is output from the light receiving portion 64b. This confirms that the vertical movement member 56 is in the lower position close to the upper surface of the turntable 12. Further, when the vertical movement member 56 is in the upper position close to the back surface of the substrate W as shown by the solid line, the light beam emitted from the light projecting portion 62a is blocked by the light shielding plate 60, and a signal is received from the light receiving portion 62b. No output. Accordingly, it is confirmed that the vertical movement member 56 is in the upper position close to the back surface of the substrate W. The vertical position of the detection shaft 58 vertically provided on the lower surface of the vertical movement member 56 may be detected by a mechanical contact type detector instead of being detected by the optical sensor.

【0043】[0043]

【発明の効果】回転台の上面から少し間隔を設けて基板
を支持し、回転台上に配設された上下移動部材を上下方
向に移動させて、処理中における基板裏面への処理液ミ
ストの付着を防止するとともに、基板の搬入及び搬出を
支障無く行なえるようにする回転式基板処理装置を、請
求項1に係る発明のように構成することにより、上下移
動部材の動作不良により基板の搬入及び搬出の動作に支
障が生じたり基板の搬入及び搬出の動作によって機器の
一部を損傷したりすることを防止することができ、ま
た、上下移動部材の動作不良により基板の処理中に基板
裏面側へ処理液ミストが付着することを防止して、基板
の品質不良を生じないようにすることができる。
The substrate is supported at a slight distance from the upper surface of the rotary table, and the vertical moving member arranged on the rotary table is moved in the vertical direction, so that the processing liquid mist on the back surface of the substrate during processing can be prevented. By configuring the rotary substrate processing apparatus that prevents the adhesion and can carry in and carry out the substrate without any trouble as in the invention according to claim 1, the substrate can be carried in due to the malfunction of the vertical moving member. Also, it is possible to prevent the operation of loading and unloading from being hindered, and to prevent damage to a part of the equipment due to the operation of loading and unloading the substrate, and the backside of the substrate during processing of the substrate due to malfunction of the vertically moving member. It is possible to prevent the processing liquid mist from adhering to the side and prevent the quality of the substrate from being deteriorated.

【0044】請求項2に係る発明の回転式基板処理装置
では、上下移動部材の所定位置にあるかどうかが、回転
台の回転軸の中空部に流路接続された真空吸引路におけ
る真空圧を検知することにより確認されるので、請求項
1に係る発明の上記効果が確実に奏される。
In the rotary substrate processing apparatus according to the second aspect of the present invention, whether or not the vertical moving member is at a predetermined position indicates the vacuum pressure in the vacuum suction passage connected to the hollow portion of the rotary shaft of the rotary table. Since it is confirmed by the detection, the above effect of the invention according to claim 1 is surely exhibited.

【0045】請求項3に係る発明の回転式基板処理装置
では、回転台の回転軸の中空部に流路接続された真空吸
引路の真空圧の違いから、上下移動部材が上方位置又は
下方位置のどちらにあるかを確認することができる。
In the rotary substrate processing apparatus according to the third aspect of the present invention, the vertical moving member is located at the upper position or the lower position due to the difference in vacuum pressure of the vacuum suction path connected to the hollow portion of the rotary shaft of the rotary table. You can check which one is in.

【0046】請求項4に係る発明の回転式基板処理装置
では、作業者は、警報によって上下移動部材の動作に何
か異常があったことを正確に知ることができる。
In the rotary substrate processing apparatus according to the fourth aspect of the present invention, the operator can accurately know that there is something wrong with the operation of the vertical moving member by an alarm.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の実施形態の1例を示し、回転式基板
処理装置の要部の概略構成を示す正面断面図である。
FIG. 1 is a front sectional view showing an example of an embodiment of the present invention and showing a schematic configuration of a main part of a rotary substrate processing apparatus.

【図2】図1に示した処理装置の一部を拡大した断面図
である。
FIG. 2 is an enlarged cross-sectional view of a part of the processing apparatus shown in FIG.

【図3】この発明の実施形態の別の例を示し、回転式基
板処理装置の要部の概略構成を示す正面断面図である。
FIG. 3 is a front cross-sectional view showing another example of the embodiment of the present invention and showing a schematic configuration of a main part of a rotary substrate processing apparatus.

【図4】従来の回転式基板処理装置の概略構成の1例を
示す一部破断正面図である。
FIG. 4 is a partially cutaway front view showing an example of a schematic configuration of a conventional rotary substrate processing apparatus.

【図5】図4に示した処理装置の一部拡大断面図であ
る。
5 is a partially enlarged sectional view of the processing apparatus shown in FIG.

【符号の説明】[Explanation of symbols]

10 基板回転保持具 12 回転台 14、52 回転軸 16 支持ピン 20、56 上下移動部材 24、58 検知用軸 26、54 回転軸の中空部 28 回転台の貫通孔 30 弁体 32 ガイド筒 34、36 弁座 38、40 開口 42 リーク用細孔 44 真空吸引路 46 2接点付圧力計 50 モーター 60 遮光板 62a、64a 投光部 62b、64b 受光部 10 substrate rotation holder 12 rotary table 14, 52 rotary shaft 16 support pin 20, 56 vertical moving member 24, 58 detection shaft 26, 54 hollow portion of rotary shaft 28 rotary table through hole 30 valve body 32 guide cylinder 34, 36 Valve Seat 38, 40 Opening 42 Leakage Pore 44 Vacuum Suction Path 46 2 Contact Pressure Gauge 50 Motor 60 Light Shading Plate 62a, 64a Light Emitting Section 62b, 64b Light Receiving Section

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 G03F 7/30 502 G03F 7/30 502 H01L 21/027 H01L 21/30 564C 21/306 569C 21/306 J ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location G03F 7/30 502 G03F 7/30 502 H01L 21/027 H01L 21/30 564C 21/306 569C 21 / 306 J

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 下面の中心部に回転軸が垂設され、水平
姿勢にかつ鉛直軸回りに回転自在に支持された回転台
と、 この回転台の上面に固設されて、基板を水平姿勢にかつ
回転台上面から所定間隔を設けて支持する基板支持手段
と、 前記回転台の回転軸を回転させる回転手段と、 少なくとも基板と同程度の大きさを有し、前記回転台の
上面側に配設され、水平姿勢を保って上下方向に移動自
在に支持された上下移動部材と、 この上下移動部材を、前記回転台が停止している間は回
転台上面に接触もしくは近接する下方位置に、回転台が
回転して基板の処理が行なわれている間は前記基板支持
手段に支持された基板の裏面に近接する上方位置に移動
させる上下移動手段と、を備えた回転式基板処理装置に
おいて、 前記上下移動部材の下面の中心部に、上下移動部材と一
体に上下方向に移動する検知用軸を垂設し、 前記検知用軸の上下位置を検知して、前記上下移動部材
が所定位置に移動しているかどうかを確認する検知手段
を設けたことを特徴とする回転式基板処理装置。
1. A rotary table having a rotation shaft vertically provided at a central portion of a lower surface and rotatably supported in a horizontal posture and rotatable about a vertical axis; and a substrate fixed to an upper surface of the rotary platform to horizontally position the substrate. And a substrate supporting means for supporting the rotary table at a predetermined distance from the upper surface of the rotary table, a rotating means for rotating the rotary shaft of the rotary table, and at least about the same size as the substrate, on the upper surface side of the rotary table. An up-and-down moving member that is arranged and supported to be movable in the up-and-down direction while maintaining a horizontal posture, and the up-and-down moving member at a lower position that is in contact with or close to the upper surface of the rotating table while the rotating table is stopped. A rotary substrate processing apparatus comprising: a vertical moving unit that moves the rotary table to an upper position near the back surface of the substrate supported by the substrate supporting unit while the substrate is being processed by rotating the rotary table. , The center of the lower surface of the vertical moving member A detection shaft that vertically moves integrally with the vertical movement member is provided vertically, and the vertical position of the detection shaft is detected to detect whether the vertical movement member moves to a predetermined position. A rotary substrate processing apparatus comprising means.
【請求項2】 回転台の回転軸が中空とされるととも
に、回転台の中心部に、回転軸の中空部に連通し上下移
動部材の検知用軸が貫通されてその上下移動を許容する
貫通孔が形成され、 検知手段が、 前記検知用軸の下端部に形設されて上下方向に移動する
弁体と、 前記上下移動部材が前記回転台の上面に接触もしくは近
接する下方位置に移動したときに前記弁体の下面側と密
接する下部弁座、及び、上下移動部材が基板の下面に近
接する上方位置に移動したときに弁体の上面側と密接す
る上部弁座を有し、下部弁座及び上部弁座の各部位がそ
れぞれ開口した容器状をなし、前記回転軸の中空部に嵌
着されたガイド筒と、 前記回転軸の中空部に流路接続された真空吸引路と、 この真空吸引路及び前記回転軸の中空部を通して前記ガ
イド筒の内部を真空吸引する真空吸引手段と、 前記真空吸引路に介設されてその真空圧を検知する圧力
検知手段と、を備えて構成された請求項1記載の回転式
基板処理装置。
2. The rotary shaft of the rotary table is hollow, and the detection shaft of the vertical moving member is pierced through the central part of the rotary table so as to communicate with the hollow part of the rotary shaft and allow its vertical movement. A hole is formed, the detection means is formed at the lower end of the detection shaft and moves vertically, and the vertical movement member is moved to a lower position where the vertical movement member comes into contact with or comes close to the upper surface of the rotary table. A lower valve seat that is in close contact with the lower surface side of the valve element, and an upper valve seat that is in close contact with the upper surface side of the valve element when the vertical movement member moves to an upper position close to the lower surface of the substrate; Each part of the valve seat and the upper valve seat has a container shape with an opening, and a guide cylinder fitted in the hollow part of the rotary shaft, and a vacuum suction path connected to the hollow part of the rotary shaft in a flow path, Through the vacuum suction path and the hollow part of the rotary shaft, Rotary substrate processing apparatus of a vacuum suction unit, the vacuum suction path interposed which are configured with a pressure detecting means for detecting the vacuum pressure, the claims 1, wherein the vacuum suction of.
【請求項3】 弁体の上面側がガイド筒の上部弁座に密
接したときに回転台の貫通孔を通して外気にリークする
リーク部が設けられた請求項2記載の回転式基板処理装
置。
3. The rotary substrate processing apparatus according to claim 2, further comprising a leak portion that leaks to the outside air through the through hole of the rotary table when the upper surface side of the valve body comes into close contact with the upper valve seat of the guide cylinder.
【請求項4】 上下移動部材が所定位置に移動していな
いことが検知手段によって検知されたときに警報を発す
る報知手段が設けられた請求項1ないし請求項3のいず
れかに記載の回転式基板処理装置。
4. The rotary type according to claim 1, further comprising notification means for issuing an alarm when the detection means detects that the vertically moving member has not moved to a predetermined position. Substrate processing equipment.
JP34758595A 1995-12-14 1995-12-14 Rotary substrate processing equipment Expired - Fee Related JP3361223B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34758595A JP3361223B2 (en) 1995-12-14 1995-12-14 Rotary substrate processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34758595A JP3361223B2 (en) 1995-12-14 1995-12-14 Rotary substrate processing equipment

Publications (2)

Publication Number Publication Date
JPH09167751A true JPH09167751A (en) 1997-06-24
JP3361223B2 JP3361223B2 (en) 2003-01-07

Family

ID=18391216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34758595A Expired - Fee Related JP3361223B2 (en) 1995-12-14 1995-12-14 Rotary substrate processing equipment

Country Status (1)

Country Link
JP (1) JP3361223B2 (en)

Cited By (6)

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JP2004128295A (en) * 2002-10-04 2004-04-22 Dainippon Screen Mfg Co Ltd Substrate processor and substrate processing system
JP2009295668A (en) * 2008-06-03 2009-12-17 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, program, and recording medium
US8246759B2 (en) 2008-06-03 2012-08-21 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and program storage medium
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KR20170073284A (en) * 2015-12-18 2017-06-28 주식회사 케이씨텍 Apparatus of loading substrate in chemical mechanical polishing system and control method thereof
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128295A (en) * 2002-10-04 2004-04-22 Dainippon Screen Mfg Co Ltd Substrate processor and substrate processing system
JP2009295668A (en) * 2008-06-03 2009-12-17 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, program, and recording medium
US8246759B2 (en) 2008-06-03 2012-08-21 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and program storage medium
JP2013229552A (en) * 2011-12-19 2013-11-07 Dainippon Screen Mfg Co Ltd Substrate holding rotary device, substrate processing apparatus including the same, and substrate processing method
US9385020B2 (en) 2011-12-19 2016-07-05 SCREEN Holdings Co., Ltd. Substrate holding and rotating device, substrate treatment apparatus including the device, and substrate treatment method
KR20170073284A (en) * 2015-12-18 2017-06-28 주식회사 케이씨텍 Apparatus of loading substrate in chemical mechanical polishing system and control method thereof
JP2018046226A (en) * 2016-09-16 2018-03-22 株式会社Screenホールディングス Substrate processing method, substrate processing apparatus
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CN109791883B (en) * 2016-09-16 2023-02-28 株式会社斯库林集团 Substrate processing method and substrate processing apparatus

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