CN101491797A - Glue spreading device - Google Patents
Glue spreading device Download PDFInfo
- Publication number
- CN101491797A CN101491797A CNA2008100102175A CN200810010217A CN101491797A CN 101491797 A CN101491797 A CN 101491797A CN A2008100102175 A CNA2008100102175 A CN A2008100102175A CN 200810010217 A CN200810010217 A CN 200810010217A CN 101491797 A CN101491797 A CN 101491797A
- Authority
- CN
- China
- Prior art keywords
- wafer
- liquid
- rotation
- exhaust
- collection cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Coating Apparatus (AREA)
Abstract
The invention relates to a glue coating device for semiconductor backend encapsulation, namely a device for coating high-consistency photoresist on the surface of a wafer. A rotating cavity is formed in a gas-discharging and liquid-gathering outer gathering cup of the glue coating device; an upper opening of the gas-discharging and liquid-gathering outer gathering cup is provided with a sealing ring; the gas-discharging and liquid-gathering outer gathering cup is provided with a colloid discharge outlet; a upper cover of the glue coating device has a matched structure corresponding to the gas-discharging and liquid-gathering outer gathering cup through rotation; a wafer loading bracket driven to lift by a wafer bracket driving cylinder is provided with a wafer sucker; the wafer sucker is arranged in the rotating cavity of the gas-discharging and liquid-gathering outer gathering cup; and a rotating machine driving the wafer loading bracket to rotate is provided with a vacuum line communicated with the wafer sucker inside. The glue coating device can solve the problem of easy falling off of the coated high-consistency photoresist and the like, and is not only suitable for the common photoresist for backend encapsulation but also suitable for higher-consistency photoresist.
Description
Technical field:
The present invention relates to be a kind of behind semiconductor the glue spreading apparatus in the road encapsulation, promptly carry out the applying device of the photic corrosion inhibitor of high viscosity at crystal column surface.
Background technology:
At present, the equipment that uses in the back road packaging technology of semiconductor equipment is a lot, but a lot of defectives are but arranged for some common glue spreading apparatus than the photic corrosion inhibitor of high viscosity, because being mixed to stir by several organic solvents, some photic corrosion inhibitors than high viscosity form, viscosity height not only, and inner organic solvent highly volatile, often cause the gluing thickness of product surface undesirable, or the uniformity behind the gluing is bad.These photic corrosion inhibitors than high viscosity are all very sensitive to temperature, humidity, if do not control proper, its viscosity will change, do not reach requirement, thereby will make the goods behind the gluing various defectives occur, as: the particle crystallizations of differing in size etc. cause subsequent technique to be processed in the process, coated photic corrosion inhibitor comes off easily, produces adverse consequences.
Summary of the invention:
In order to overcome the problems referred to above, the invention provides the glue spreading apparatus in a kind of novel encapsulated, solve problems such as the photic corrosion inhibitor than high viscosity that applies comes off easily.This device not only is suitable for the photic corrosion inhibitor that those common back road encapsulation are used, also be suitable for those photic corrosion inhibitors simultaneously than high viscosity, control volatilization in the operation than the photic corrosion inhibitor internal solvent of high viscosity by filling a prescription, and the air motion of rotation cavity when applying, guarantee the processing quality of processed wafer, the basis of laying for later process.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of glue spreading apparatus, this glue spreading apparatus is provided with loam cake, exhaust and liquid are received outside collection cup, wafer suction disc, electric rotating machine, load the wafer carriage, wafer carriage drive cylinder, exhaust and liquid are received in the outside collection cup and are formed the rotation cavity, exhaust and liquid are received the outside collection cup sealing ring that is equipped with suitable for reading, it is corresponding fit structure that the loam cake of glue spreading apparatus is received outside collection cup by rotation and exhaust and liquid, on the loading wafer carriage by the lifting of wafer carriage drive air cylinder driven wafer suction disc is housed, wafer suction disc is arranged at exhaust and liquid is received in the rotation cavity of outside collection cup, drives the electric rotating machine inside of loading the rotation of wafer carriage and is provided with the vacuum line that communicates with wafer suction disc.
Described glue spreading apparatus, external cap and inner sealing rotation lid connect and compose the loam cake of glue spreading apparatus by coupling spindle, external cap is positioned at the outside, inner sealing rotation lid is positioned at the inboard, coupling spindle cooperates by swivel bearing with inner sealing rotation lid, and external cap is connected with the lid drive rod that lid switch drives the air cylinder driven rotation.
Described glue spreading apparatus, external cap is received on the outside collection cup in exhaust and liquid by swivelling cover, and it is closed mutually to make external cap and exhaust and liquid receive outside collection cup, forms the space that is isolated from the outside; Inner sealing rotation lid end opening is received the sealing ring of outside collection cup installation suitable for reading corresponding to exhaust and liquid, and inner sealing rotation lid is pressed on the sealing ring by rotation, closely contacts with sealing ring, forms airtight space.
The invention has the beneficial effects as follows:
1, the present invention is in the wafer coating procedure, revolution space sealing with wafer, promptly spatially portion adds lid, will effectively control the organic solvent volatilization of photic corrosion inhibitor inside like this, thereby guaranteed the viscosity of photic corrosion inhibitor in rotary course, cause wafer gluing under certain rotary speed, the gluing thickness on surface reaches requirement.
Rotate synchronously when 2, added lid of the present invention and wafer rotate, thereby make wafer in the gluing process, inner air-flow obtains control corresponding, make the air-flow of crystal column surface and photic corrosion inhibitor at the stand of crystal column surface glue, echo mutually in the processes such as even glue, so just guaranteed the uniformity behind the gluing.
3, simple and ingenious structure of the present invention is applicable to making of all back road packaging technologies.Be applicable to also that simultaneously the technology of some illumination masks makes, added lid rotates when requiring with the wafer rotation synchronously, such purpose is to make wafer in the gluing process, inner air-flow obtains control corresponding, can also effectively control the organic solvent volatilization of photic corrosion inhibitor inside, thereby guarantee the viscosity of photic corrosion inhibitor in rotary course.
4, because the present invention is the device of sealing, inside and outside environment can be isolated, well protect environment.
Description of drawings:
Fig. 1 is a front view of the present invention.
Fig. 2 is a side view of the present invention.
Among the figure: 1 lid drive rod; 2 external cap; 3 inner sealings rotation lid; 4 swivel bearings; 5 coupling spindles; 6 sealing rings; 7 rotation cavitys; 8 exhausts and liquid are received outside collection cup; 9 lid switches drive cylinder; 10 wafer suction discs; 11 electric rotating machines; 12 colloid floss holes; 13 load the wafer carriage; 14 wafer carriage drive cylinders.
The specific embodiment:
The present invention is further described below in conjunction with drawings and Examples.
As Fig. 1-shown in Figure 2, glue spreading apparatus of the present invention is provided with that lid drive rod 1, external cap 2, inner sealing rotation lid 3, swivel bearing 4, coupling spindle 5, sealing ring 6, rotation cavity 7, exhaust and liquid are received outside collection cup 8, lid switch drives cylinder 9, wafer suction disc 10, electric rotating machine 11, colloid floss hole 12, loads wafer carriage 13, wafer carriage drive cylinder 14.External cap 2 and inner sealing rotation lid 3 connect and compose the loam cake of glue spreading apparatus by coupling spindle 5, external cap 2 is positioned at the outside, inner sealing rotation lid 3 is positioned at the inboard, coupling spindle 5 cooperates by swivel bearing 4 with inner sealing rotation lid 3, and external cap 2 is connected with the lid drive rod 1 that lid switch drives cylinder 9 driving rotations; Exhaust and liquid are received in the outside collection cup 8 and are formed rotation cavity 7, and exhaust and liquid are received outside collection cup 8 sealing rings 6 that are equipped with suitable for reading, and exhaust and liquid are received on the outside collection cup 8 and had colloid floss hole 12; It is corresponding fit structure that the loam cake of glue spreading apparatus is received outside collection cup 8 by rotation and exhaust and liquid, external cap 2 is received on the outside collection cup 8 in exhaust and liquid by swivelling cover, it is closed mutually to make external cap 2 and exhaust and liquid receive outside collection cup 8, inner sealing rotation lid 3 end openings are received the sealing ring 6 of outside collection cup 8 installations suitable for reading corresponding to exhaust and liquid, inner sealing rotation lid 3 is pressed on the sealing ring 6 by rotation, closely contacts with sealing ring 6; On the loading wafer carriage 13 by the 14 driving liftings of wafer carriage drive cylinder wafer suction disc 10 is housed, wafer suction disc 10 is arranged at exhaust and liquid is received in the rotation cavity 7 of outside collection cup 8, drives electric rotating machine 11 inside of loading 13 rotations of wafer carriage and is provided with the vacuum line that communicates with wafer suction disc 10.
When wafer is delivered to this device, wafer carriage drive cylinder 14 drives and loads 13 risings of wafer carriage, after wafer is placed, wafer carriage drive cylinder 14 drives and loads 13 declines of wafer carriage, wafer is fallen on the wafer suction disc 10, tightly adsorbed by the electric rotating machine 11 inner vacuum lines that communicate with wafer suction disc 10.At this moment begin gluing, after gluing finishes, lid switch drives cylinder 9 and drives lid drive rods 1 and drive that overall lid is covered exhaust and liquid is received on the outside collection cup 8, inner sealing rotation lid 3 closely contacts with sealing ring 6, make inner sealing rotation lid 3 and rotation cavity 7 form an airtight space, external cap 2 is received outside collection cup 8 closure mutually with exhaust and liquid, also forms a space that is isolated from the outside.
When electric rotating machine 11 rotations, drive sealing ring 6, rotation cavity 7, wafer suction disc 10 and wafer rotate simultaneously, the fixed form of inner sealing rotation lid 3 is connected with swivel bearing 4 tight fits by coupling spindle 5, because inner sealing rotation lid 3 contacts with the tight of sealing ring 6, driving inner sealing rotation lid 3 by drag seal 6 rotates together, so just reached inner sealing rotation lid 3 and the wafer effect of rotation synchronously, rotation by inner sealing rotation lid 3, will effectively control the air motion of crystal column surface well, reach desirable gluing effect.The glue that throws away; be to be discharged into exhaust and the outside collection cup 8 of liquid receipts by colloid floss hole 12; because external cap 2 is closed mutually with exhaust and the outside collection cup 8 of liquid receipts; also form a space that is isolated from the outside; all waste liquids, volatilization gas etc. all can be received outside exhaust, the discharge opeing outlet that collects cup 8 bottoms by exhaust and liquid and get rid of, thereby protected environment.
When the wafer gluing finishes, lid switch drives cylinder 9 driving lid drive rods 1 drive overall lid lid and opens, the vacuum of wafer suction disc 10 is closed, the absorption affinity of wafer is disappeared, wafer carriage drive cylinder 14 drives and loads 13 risings of wafer carriage, lift wafer, the wafer goods that process can be removed.
Claims (3)
1, a kind of glue spreading apparatus, it is characterized in that: this glue spreading apparatus is provided with loam cake, exhaust and liquid are received outside collection cup (8), wafer suction disc (10), electric rotating machine (11), load wafer carriage (13), wafer carriage drive cylinder (14), exhaust and liquid are received and are formed rotation cavity (7) in the outside collection cup (8), exhaust and liquid are received outside collection cup (8) sealing ring (6) that is equipped with suitable for reading, it is corresponding fit structure that the loam cake of glue spreading apparatus is received outside collection cup (8) by rotation and exhaust and liquid, on the loading wafer carriage (13) by wafer carriage drive cylinder (14) driving lifting wafer suction disc (10) is housed, wafer suction disc (10) is arranged at exhaust and liquid is received in the rotation cavity (7) of outside collection cup (8), drives electric rotating machine (11) inside of loading wafer carriage (13) rotation and is provided with the vacuum line that communicates with wafer suction disc (10).
2, according to the described glue spreading apparatus of claim 1, it is characterized in that: external cap (2) and inner sealing rotation lid (3) connect and compose the loam cake of glue spreading apparatus by coupling spindle (5), external cap (2) is positioned at the outside, inner sealing rotation lid (3) is positioned at the inboard, coupling spindle (5) cooperates by swivel bearing (4) with inner sealing rotation lid (3), and external cap (2) is connected with the lid drive rod (1) that lid switch drives cylinder (9) driving rotation.
3, according to the described glue spreading apparatus of claim 2, it is characterized in that: external cap (2) is received on the outside collection cup (8) in exhaust and liquid by swivelling cover, and it is closed mutually to make external cap (2) and exhaust and liquid receive outside collection cup (8), forms the space that is isolated from the outside; Inner sealing rotation lid (3) end opening is received the sealing ring (6) of outside collection cup (8) installation suitable for reading corresponding to exhaust and liquid, and inner sealing rotation lid (3) is pressed on the sealing ring (6) by rotation, closely contacts with sealing ring (6), forms airtight space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100102175A CN101491797A (en) | 2008-01-25 | 2008-01-25 | Glue spreading device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100102175A CN101491797A (en) | 2008-01-25 | 2008-01-25 | Glue spreading device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101491797A true CN101491797A (en) | 2009-07-29 |
Family
ID=40922687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100102175A Pending CN101491797A (en) | 2008-01-25 | 2008-01-25 | Glue spreading device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101491797A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368469A (en) * | 2011-09-20 | 2012-03-07 | 嘉兴科民电子设备技术有限公司 | Cover for forevacuum cavity of novel ICP (Inductively Coupled Plasma) etcher |
| CN103094171A (en) * | 2011-10-27 | 2013-05-08 | 沈阳芯源微电子设备有限公司 | Magnetic levitation wafer rotary system |
| CN103280421A (en) * | 2013-05-30 | 2013-09-04 | 沈阳拓荆科技有限公司 | Non-isometric position wafer bracket and use method |
| CN103811290A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Spray liquid recovery device |
| CN104525435A (en) * | 2014-12-06 | 2015-04-22 | 苏州欣航微电子有限公司 | Bicycle seat post surface coating device |
| CN107527833A (en) * | 2016-06-21 | 2017-12-29 | 株洲中车时代电气股份有限公司 | Semiconductor chip glue spreading method, device and equipment |
| CN110560327A (en) * | 2018-06-05 | 2019-12-13 | 深圳市旭控科技有限公司 | Silicon wafer coating source device |
| CN113634457A (en) * | 2021-08-10 | 2021-11-12 | 湖南大学 | MicroLED panel film laminating device and using method |
-
2008
- 2008-01-25 CN CNA2008100102175A patent/CN101491797A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368469A (en) * | 2011-09-20 | 2012-03-07 | 嘉兴科民电子设备技术有限公司 | Cover for forevacuum cavity of novel ICP (Inductively Coupled Plasma) etcher |
| CN102368469B (en) * | 2011-09-20 | 2014-01-01 | 天通吉成机器技术有限公司 | Cover for forevacuum cavity of novel ICP (Inductively Coupled Plasma) etcher |
| CN103094171A (en) * | 2011-10-27 | 2013-05-08 | 沈阳芯源微电子设备有限公司 | Magnetic levitation wafer rotary system |
| CN103094171B (en) * | 2011-10-27 | 2015-06-17 | 沈阳芯源微电子设备有限公司 | Magnetic levitation wafer rotary system |
| CN103811290A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Spray liquid recovery device |
| WO2014075524A1 (en) * | 2012-11-13 | 2014-05-22 | 沈阳芯源微电子设备有限公司 | Liquid spray recovery device with wafer location detector |
| CN103280421A (en) * | 2013-05-30 | 2013-09-04 | 沈阳拓荆科技有限公司 | Non-isometric position wafer bracket and use method |
| CN103280421B (en) * | 2013-05-30 | 2015-11-04 | 沈阳拓荆科技有限公司 | One is isometry position wafer bracket and using method not |
| CN104525435A (en) * | 2014-12-06 | 2015-04-22 | 苏州欣航微电子有限公司 | Bicycle seat post surface coating device |
| CN107527833A (en) * | 2016-06-21 | 2017-12-29 | 株洲中车时代电气股份有限公司 | Semiconductor chip glue spreading method, device and equipment |
| CN110560327A (en) * | 2018-06-05 | 2019-12-13 | 深圳市旭控科技有限公司 | Silicon wafer coating source device |
| CN113634457A (en) * | 2021-08-10 | 2021-11-12 | 湖南大学 | MicroLED panel film laminating device and using method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101491797A (en) | Glue spreading device | |
| CN103180056B (en) | For the confined chamber of wafer wet process | |
| US8974631B2 (en) | Device for fluid treating plate-like articles | |
| CN107827054A (en) | One kind automation bottled lid machine of sample | |
| CN104160496A (en) | Apparatus for treating surfaces of wafer-shaped articles | |
| CN201157813Y (en) | Glue spreading apparatus | |
| CN106005994A (en) | Plastic bottle lid loading device | |
| CN100470105C (en) | Valve device with washing means | |
| CN207635779U (en) | medicine bottle dryer | |
| US20150090365A1 (en) | Filling machine | |
| CN207537100U (en) | A kind of automation sample bottle capping machine | |
| CN206652675U (en) | A kind of square wafer vacuum glue spreader | |
| CN113210335A (en) | Cleaning device for brake valve of rail transit vehicle | |
| US20020170571A1 (en) | Rotary substrate processing apparatus and method | |
| US20130136858A1 (en) | Adhesive recycling during spin coating | |
| CN108372040A (en) | A kind of nozzle moisturizing switching mechanism | |
| KR20110014545A (en) | Apparatus for treating substrate | |
| CN201024073Y (en) | Vacuum spiral cover device | |
| CN211538427U (en) | Novel automatic spin-coating heating equipment | |
| CN207482273U (en) | Light guide plate packing machine | |
| JPS61178031A (en) | Vacuum drying granulation apparatus | |
| JPH0736910Y2 (en) | Rotary seal device for container rotary transport device | |
| CN106881660A (en) | Axis mechanism on a kind of rotating regulation type for large-sized wafer single-sided polishing | |
| CN2612645Y (en) | Totally-enclosed automatic control discharging apparatus for bipyramid desiccator | |
| JP2001010722A (en) | Star wheel device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090729 |