CN103280421A

CN103280421A - Non-isometric position wafer bracket and use method

Info

Publication number: CN103280421A
Application number: CN2013102113974A
Authority: CN
Inventors: 凌复华; 吴凤丽; 姜崴; 朱超群; 祁广杰
Original assignee: Piotech Shenyang Co Ltd
Current assignee: Piotech Inc
Priority date: 2013-05-30
Filing date: 2013-05-30
Publication date: 2013-09-04
Anticipated expiration: 2033-05-30
Also published as: CN103280421B

Abstract

The invention relates to a non-isometric position wafer bracket and a use method. The non-isometric position wafer bracket and the use method mainly solve the technical problem that according to a currently-designed isometric wafer bracket, positions of single wafers can be not be accurately adjusted individually when wafers are transmitted in multiple cavities at the same time. The non-isometric position wafer bracket comprises a high wafer supporting frame and a low wafer supporting frame. By means of the high wafer supporting frame, a supporting plate of the non-isometric position wafer bracket is connected to a wafer supporting frame bottom plate through fastening bolts and then connected into wafer transmitting cavities and fixed through fastening screws. By means of the low wafer supporting frame, a supporting plate of the isometric position wafer bracket is connected to the wafer supporting frame bottom plate through a standard part and connected into the water transmitting cavities and fixed through fastening screws. When the high wafer supporting frame and the low water supporting frame are installed and fixed, one mechanical arm can carry out calibration and accurate position on the wafers of multiple cavities respectively through two steps so as to ensure accuracy of positions in transmitting the wafers and homogeneity of deposited membranes.

Description

A kind of not isometry position wafer carriage and using method

Technical field

The present invention relates to a kind of not isometry position wafer carrier structure and using method, specifically a kind of in passing the sheet chamber carrying wafer not contour supporting structure and wafer is put into the method for wafer support from manipulator when in passing the sheet chamber, transmitting wafer, belong to semiconductor film film deposition apparatus field.

Background technology

The principle of film deposition techniques is that wafer is placed vacuum environment, feeds an amount of reacting gas, utilizes physical change and the chemical reaction of gas, forms solid film at crystal column surface.In the whole process of carrying out the gas membrane deposition, atmospheric pressure and the changing of vacuum state of wafer from EFEM is to transmit by passing the sheet chamber.

At present, the wafer support that passes sheet in the prior art all is the contour wafer support of same design, when in passing the sheet chamber, transmitting wafer wafer is put into wafer support from manipulator and takes the mode that falls, by the wafer transducer one of them wafer position is accurately adjusted before falling, because the connection of mechanical arm, but another wafer position also changes thereupon but can not adjust, latter two wafer of whereabouts touches wafer support simultaneously, the wafer position that this mode can only guarantee to pass in the sheet chamber is calibrated, another wafer is just fallen on the wafer support that passes the sheet chamber along with the whereabouts of mechanical arm, do not carry out the calibration of position, so pass simultaneously in the sheet process and can not accurately adjust the position of single wafer respectively at multi-cavity.

Summary of the invention

The present invention is that to address the above problem be purpose, and the contour wafer support that mainly solves existing design passes the technical problem that can not accurately adjust the position of single wafer respectively in the sheet process simultaneously at multi-cavity.Pass simultaneously in the process of sheet at multi-cavity, for guaranteeing accuracy, need carry out position correction separately to each wafer, cooperate the elevating mechanism in each cavity that wafer is taken off from mechanical arm respectively.The present invention can cancel the elevating mechanism that passes the sheet cavity, and by setting the differing heights position of wafer in each cavity, the Z axle elevating function of cooperative mechanical hand itself is realized each wafer is carried out position correction separately.Thereby make the location of wafer in passing the sheet chamber accurate.

The objective of the invention is to be achieved through the following technical solutions: a kind of not isometry position wafer carriage comprises two parts of high wafer support and low wafer support.High and low two wafer supports are respectively equipped with not support plate, set bolt and the high and low wafer support base plate of contour wafer support.High and low two wafer supports have only the base plate height difference of wafer support, and other structures are all identical with mounting means.Above-mentioned high wafer support by set bolt will be not the support plate of contour wafer support be connected to the wafer support base plate above, then by trip bolt be connected to pass in the sheet chamber fixing.Above-mentioned low wafer support by standard component with the support plate of contour wafer support be connected to the wafer support base plate above, and then by trip bolt be connected to pass in the sheet chamber fixing. when two wafer supports of height all install and fix finish after, begin to pass sheet by following step:

The first step, two wafer are delivered to the top of high wafer support by manipulator, adjust the wafer of high wafer support top by the wafer transducer, make the wafer on the left side accurately be positioned at the center of high wafer support.

Second step, the wafer on the left side accurately is positioned at after the center of high wafer support, manipulator begins to fall, about two wafer fall thereupon, because the height of high wafer support and low wafer support is unequal, therefore, the high wafer support in the left side touches wafer earlier and the wafer support on the right does not also touch wafer.The wafer on the right after the wafer on the high wafer support in the left side has been finished the process of transmitting the whereabouts, location is because the relatively low wafer support that also do not touch of wafer support.At this moment, the wafer transducer by the right begins to adjust the wafer of low wafer support top, makes the wafer on the right accurately be positioned at the center of wafer support, and the wafer that falls the right of manipulator machinery is placed on the low wafer support then.

By above two steps, realized that fully the multi-cavity wafer calibrates respectively and accurate location at manipulator, thereby guaranteed to pass the sheet position accurately, guaranteed uniformity of thin film deposition more.

Good effect of the present invention and advantage:

1. the present invention can accurately be implemented in the multi-cavity wafer and pass the course of work of calibrating each wafer in the sheet process separately, has guaranteed the accurate location of wafer in passing the sheet chamber.

2. the present invention is simple in structure, and it is little to take up room, convenient for installation and maintenance, with low cost, improves the accurate location of wafer in passing the sheet chamber when not influencing production efficiency

3. install after the not contour wafer carriage, the wafer on the mechanical arm can be put into wafer on the not contour wafer support in two steps by the descending motion of Z axle itself.

Description of drawings

Fig. 1 is the not front view of contour wafer support of the present invention;

Fig. 2 is the not vertical view of contour wafer support of the present invention;

Fig. 3, the procedure chart that Fig. 4 and Fig. 5 transmit for wafer;

The invention will be further described below in conjunction with accompanying drawing.

Embodiment

As shown in Figure 1 and Figure 2, a kind of not isometry position wafer carriage comprises 2 two parts of high wafer support 1 and low wafer support.High and low two wafer supports 1,2 are respectively equipped with the not support plate 3 of contour wafer support, set bolt 4 and high and low wafer support base plate 5,6.As can be seen from Figure 1 high and low two wafer supports 1,2 have only the base plate height difference of wafer support, and other structures are all identical with mounting means.

Above-mentioned high wafer support 1 by set bolt will be not the support plate 3 of contour wafer support be connected to wafer support base plate 5 above, then by trip bolt 4 be connected to pass in the sheet chamber fixing.Above-mentioned low wafer support 2 by standard component with the support plate 3 of contour wafer support be connected to wafer support base plate 6 above, and then by trip bolt 4 be connected to pass in the sheet chamber fixing. when two wafer supports of height all install and fix finish after, begin to pass sheet by following step:

The first step as shown in Figure 3, two wafer 7 are delivered to the top of high wafer support 1 by manipulator, adjust the wafer of high wafer support 1 top by the wafer transducer, make the wafer on the left side accurately be positioned at the center of high wafer support 1.

Second step as shown in Figure 4, the wafer on the left side accurately is positioned at after the center of high wafer support, manipulator begins to fall, about two wafer fall thereupon, because the height of high wafer support 1 and low wafer support 2 is unequal, therefore, the high wafer support in the left side touches wafer earlier and the wafer support on the right does not also touch wafer.The wafer on the right after the wafer on the high wafer support 1 in the left side has been finished the process of transmitting the whereabouts, location is because the relatively low wafer support that also do not touch of wafer support.At this moment, the wafer transducer by the right begins to adjust the wafer of low wafer support top, makes the wafer on the right among Fig. 4 accurately be positioned at the center of wafer support, and the wafer that falls the right of manipulator machinery is placed on the low wafer support 2 then.

Shown in Figure 5 is the transmittance process of lower floor's wafer, the biography sheet principle of its principle upper layer wafer.

Claims

1. isometry position wafer carriage not, it is characterized in that: it comprises high wafer support and two parts of low wafer support, high, low two wafer supports are respectively equipped with the not support plate of contour wafer support, set bolt and height, low wafer support base plate, above-mentioned height, low two wafer supports have only the base plate height difference of wafer support, other structures are all identical with mounting means, above-mentioned high wafer support by set bolt will be not the support plate of contour wafer support be connected to the wafer support base plate above, be connected to pass in the sheet chamber by trip bolt then and fix, above-mentioned low wafer support by standard component with the support plate of contour wafer support be connected to the wafer support base plate above, and then by trip bolt be connected to pass in the sheet chamber fixing.

2. the using method of not isometry position wafer carriage as claimed in claim 1, this method be when two wafer supports of height all install and fix finish after, begin to pass sheet by following step:

The first step, two wafer are delivered to the top of high wafer support by manipulator, adjust the wafer of high wafer support top by the wafer transducer, make the wafer on the left side accurately be positioned at the center of high wafer support;

Second step, the wafer on the left side accurately is positioned at after the center of high wafer support, manipulator begins to fall, about two wafer fall thereupon, because the height of high wafer support and low wafer support is unequal, therefore, the high wafer support in the left side touches wafer earlier and the wafer support on the right does not also touch wafer, the wafer on the right after the wafer on the high wafer support in the left side has been finished the process of transmitting the whereabouts, location is because the relatively low wafer support that also do not touch of wafer support, at this moment, begin to adjust the wafer of low wafer support top by the wafer transducer on the right, wafer on the right of making accurately is positioned at the center of wafer support, and manipulator machinery whereabouts is placed on the wafer on the right on the low wafer support then;