CN112151431A - Pre-loading chamber and semiconductor process platform - Google Patents
Pre-loading chamber and semiconductor process platform Download PDFInfo
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- CN112151431A CN112151431A CN202011023326.8A CN202011023326A CN112151431A CN 112151431 A CN112151431 A CN 112151431A CN 202011023326 A CN202011023326 A CN 202011023326A CN 112151431 A CN112151431 A CN 112151431A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses a pre-loading cavity and a semiconductor process platform, wherein the pre-loading cavity comprises a cavity body and a wafer support frame; the cavity body has been seted up and has been held the chamber, the wafer support frame is located hold the intracavity, the wafer support frame includes first plummer and second plummer, first plummer with the second plummer all is used for bearing the weight of the wafer, first plummer set up in the top of second plummer, the portion of dodging has been seted up to first plummer, connecting portion have been seted up to the second plummer, dodge the portion with connecting portion set up relatively, the mounting can pass and dodge the portion and assemble in connecting portion, the second plummer with the cavity body passes through the mounting is connected. The scheme can solve the problem that the transmission efficiency of the wafer is low.
Description
Technical Field
The invention relates to the technical field of semiconductor chip manufacturing, in particular to a pre-loading chamber and a semiconductor process platform.
Background
The LOAD LOCK chamber (LOAD LOCK chamber) is used as a transition chamber for transferring a transferred wafer between a vacuum environment and an atmospheric environment, for example, when the wafer needs to be transferred from the atmospheric environment to the vacuum environment, the LOAD LOCK chamber needs to be in the atmospheric environment first, the atmospheric robot can transfer the wafer into the LOAD LOCK chamber, and then the LOAD LOCK chamber is vacuumized, so that the LOAD LOCK chamber is in a vacuum state and then transferred into the vacuum transfer chamber by the vacuum robot, thereby realizing the transfer of the wafer from the atmospheric environment to the vacuum environment.
Among the correlation technique, the chamber of preloading includes cavity body and wafer support frame, the wafer support frame passes through the bolt fastening on the diapire of cavity body, the lower part of wafer support frame is provided with the mounting, for the convenience of assembly, need reserve out mounting height between wafer support frame and the mounting, thereby make things convenient for operating personnel to install, but this part mounting height causes the height of wafer support frame great, and then occupy the inner space of great cavity body, make the volume of cavity body great, and then lead to the aerifing and the air exhaust time of the chamber of preloading longer, thereby influence the transmission efficiency of wafer.
Disclosure of Invention
The invention discloses a pre-loading chamber and a semiconductor process platform, which aim to solve the problem of low wafer transmission efficiency.
In order to solve the problems, the invention adopts the following technical scheme:
a pre-load chamber comprises a chamber body and a wafer support frame;
the cavity body has been seted up and has been held the chamber, the wafer support frame is located hold the intracavity, the wafer support frame includes first plummer and second plummer, first plummer with the second plummer all is used for bearing the weight of the wafer, first plummer set up in the top of second plummer, the portion of dodging has been seted up to first plummer, connecting portion have been seted up to the second plummer, dodge the portion with connecting portion set up relatively, the mounting can pass and dodge the portion and assemble in connecting portion, the second plummer with the cavity body passes through the mounting is connected.
A semiconductor process platform comprises a vacuum transmission chamber, an atmospheric transmission chamber and at least one pre-loading chamber, wherein a transmission port of the vacuum transmission chamber is communicated with a vacuum film transmission port of the pre-loading chamber, and a transmission port of the atmospheric transmission chamber is communicated with the atmospheric film transmission port;
the central axis of the transmission port of the vacuum transmission chamber is coincided with the central axis of the vacuum transmission sheet port which is correspondingly communicated;
the central axis of the transmission port of the atmosphere transmission chamber is coincided with the central axis of the atmosphere transmission sheet port which is correspondingly communicated.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the pre-loading cavity disclosed by the invention, the wafer support frame comprises a first bearing table and a second bearing table, the first bearing table and the second bearing table are both used for bearing wafers, the first bearing table and the second bearing table are superposed, the first bearing table is provided with an avoiding part, the second bearing table is provided with a connecting part, the avoiding part and the connecting part are arranged oppositely, and the fixing piece can be assembled in the connecting part through the avoiding part. In this scheme, the mounting can be followed and dodged the portion and passed, and then enter into connecting portion, operating personnel can stretch into the instrument simultaneously and dodge in the portion, in order to realize fastening the operation to the mounting, second plummer on the wafer support frame passes through mounting and this body coupling of cavity, at this moment, need not to reserve the operating space who installs the mounting between the diapire of wafer support frame and cavity body, thereby the whole height of wafer support frame has been reduced, and then the volume that makes the chamber of holding is less, thereby can shorten the aerifing and the air exhaust time of pre-loading chamber, and then improve the transmission efficiency of wafer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a semiconductor processing platform according to an embodiment of the present invention;
fig. 2-4 are isometric views of a pre-load chamber as disclosed in an embodiment of the present invention;
FIG. 5 is a top view of a pre-load chamber as disclosed in an embodiment of the present invention;
FIG. 6 is a bottom view of the pre-load chamber disclosed in an embodiment of the present invention;
fig. 7 to 9 are sectional views showing a partial structure of the pre-loading chamber according to the embodiment of the present invention.
Description of reference numerals:
100-pre-loading chamber, 110-chamber body, 111-containing cavity, 112-cover body, 1121-first observation window, 1122-second observation window, 113-main body part, 1131-first positioning projection, 114-bottom plate, 1141-first interface, 1142-first positioning projection, 120-wafer support frame, 121-first bearing table, 1211-avoiding part, 122-second bearing table, 1221-connecting part, 130-fixing part, 140-support driving device, 150-positioning part, 160-second sealing part,
200-vacuum transmission cavity, 210-gate valve,
300-wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1-9, an embodiment of the present invention discloses a pre-load chamber 100, the disclosed pre-load chamber 100 including a chamber body 110 and a wafer support shelf 120.
The chamber body 110 is a body component of the pre-loaded chamber 100 that provides a mounting basis for other components of the pre-loaded chamber 100. The chamber body 110 has a receiving cavity 111, and the wafer support frame 120 is located in the receiving cavity 111. The wafer support frame 120 includes a first loading platform 121 and a second loading platform 122, the first loading platform 121 is disposed above the second loading platform 122, and both the first loading platform 121 and the second loading platform 122 are used for loading the wafer 300. A gap for moving the wafer 300 needs to be reserved between the first susceptor table 121 and the second susceptor table 122, and a gap for moving the wafer 300 needs to be reserved between the first susceptor table 121 and the top wall of the chamber body 110, so as to prevent the wafer 300 from colliding during the movement.
Alternatively, the depth of the receiving cavity 111 may be 40mm, and the distance between the bearing surface of the first carrier 121 and the bearing surface of the second carrier 122 may be 10 mm. The distance between the carrying surface of the first carrying table 121 and the top wall of the chamber body 110 may be 12 mm. The distance between the bearing surface of the second susceptor 122 and the bottom wall of the chamber body 110 may be 18 mm. Of course, other values are possible, and are not limited herein.
The first susceptor 121 is provided with an avoiding portion 1211, the second susceptor 122 is provided with a connecting portion 1221, the avoiding portion 1211 is opposite to the connecting portion 1221, the fixing member 130 can pass through the avoiding portion 1211 to be assembled in the connecting portion 1221, and the second susceptor 122 is connected to the chamber body 110 through the fixing member 130.
In a specific operation process, a side of the second susceptor 122 facing away from the wafer 300 contacts with the bottom of the chamber body 110, the fixing member 130 can pass through the avoiding portion 1211 and enter the connecting portion 1221, and a fastening tool of an operator can extend into the avoiding portion 1211 to fasten the fixing member 130.
Alternatively, the avoidance portion 1211 may be an avoidance hole or an avoidance notch. The connection portion 1221 may be a through hole or a threaded hole. The fixing member 130 may be a rivet or a bolt. Specific configurations of the avoidance portion 1211, the connection portion 1221, and the fixing member 130 are not limited herein. It is to be noted that the area of the minimum end surface of the avoiding portion 1211 needs to be larger than the area of the maximum end surface of the fixing member 130, so that the fixing member 130 can pass through the avoiding portion 1211.
In the embodiment of the disclosure, the fixing member 130 may pass through the avoiding portion 1211 and further enter the connecting portion 1221, and an operator may extend a tool into the avoiding portion 1211 to fasten the fixing member 130, and the second carrying stage 122 on the wafer supporting frame 120 is connected to the chamber body 110 through the fixing member 130. At this time, an operation space for installing the fixing member 130 is not required to be reserved between the wafer support frame 120 and the bottom wall of the chamber body 110, so that the overall height of the wafer 300 support frame 120 is reduced, and further, the volume of the accommodating cavity 111 is small, so that the inflation and air-extraction time of the pre-loading chamber 100 can be shortened, and the transmission efficiency of the wafer 300 is improved.
While a particular configuration of the chamber body 110 is provided herein, other configurations may be employed, and are not intended to be limiting. Specifically, the chamber body 110 may include a main body 113, a bottom plate 114, and a cover 112, and a through cavity may be disposed in the main body 113, where the through cavity is formed from an upper end surface to a lower end surface of the main body 113. The cover 112 and the bottom plate 114 are detachably disposed on the upper end surface and the lower end surface of the main body 113, respectively, and the bottom surface of the cover 112, the inner wall of the through cavity of the main body 113, and the top surface of the bottom plate 114 together enclose to form the accommodating cavity 111. The second bearing platform 122 is fixed to the base plate 114 by a fixing member 130. At this time, the chamber body 110 is separately arranged, and when the local part of the chamber body 110 is damaged, the corresponding part on the chamber body 110 can be replaced, so that the chamber body 110 does not need to be replaced integrally, the maintainability of the chamber body 110 is improved, and the service life of the chamber body 110 is prolonged. In addition, when the pre-loading chamber 100 needs to be added with other functions, the pre-loading chamber 100 can be integrated by replacing the bottom plate 114 or the cover 112 of the chamber body 110, so that more functions can be integrated into the pre-loading chamber 100, and the service performance of the pre-loading chamber 100 is improved.
In the above embodiments, the bottom plate 114 may be a part of the bottom wall of the main body 113, which is described above, that is, the bottom plate 114 may be a part of the bottom wall of the chamber body 110. The cover 112 may be a top wall of the main body 113 described above, that is, the cover 112 may be a top wall of the chamber body 110.
Specifically, the cover 112 and the main body 113 may be connected by a screw thread, a snap connection, or the like, and other connection methods may be adopted without limitation. The main body 113 and the bottom plate 114 may be connected by a screw thread or a snap connection, but may also be connected by other methods without limitation.
Further, the chamber body 110 is separately disposed, and before the chamber body 110 is assembled, the wafer support 120 may be fixed on the bottom plate 114, and then the bottom plate 114 may be installed in the through cavity. At this time, the installation process of fixing the wafer support frame 120 on the bottom plate 114 can be performed outside the through cavity, so that a larger operation space is provided, the collision of an operator is not easy to occur, and the personal safety of the operator is improved. It should be noted that, when the wafer support frame 120 is fixed on the bottom plate 114 and the bottom plate 114 is inserted into the through cavity, an avoiding space needs to be formed on the main body portion 113 or the outer contour of the wafer support frame 120 needs to be designed to avoid the through cavity, so as to prevent the main body portion 113 and the wafer support frame 120 from interfering with each other.
In an alternative embodiment, a cooling device may be disposed within the base plate 114 for cooling the wafer 300 on the wafer support 120. In this case, the bottom plate 114 has a cooling function, so that a processing process in which the wafer 300 needs to be cooled during processing of the wafer 300 can be satisfied, and thus the functionality of the pre-loading chamber 100 is enhanced.
Optionally, the cooling device may be a water-cooling type cooling device, a water-cooling copper pipe is disposed in the bottom plate 114, the copper pipe is communicated with the cooling water circulation system, and cooling water with a lower temperature may be introduced into the copper pipe, so that the bottom plate 114 maintains a lower temperature, and a temperature difference is formed between the bottom plate 114 and the wafer 300 with a higher temperature, thereby cooling the wafer 300. Of course, the cooling device may be other types of cooling devices, and the specific type of cooling device is not limited herein.
Alternatively, in another alternative embodiment, a heating device is disposed in the bottom plate 114 for heating the wafer 300 on the wafer support 120. At this time, the base plate 114 has a heating function, so that the wafer 300 inside the pre-loading chamber 100 can be heated, thereby making the pre-loading chamber 100 more functional.
Alternatively, the heating device may be a heating wire, and the heating wire is powered on and the temperature of the heating wire is raised, so that the bottom plate 114 maintains a higher temperature, and a temperature difference is formed between the bottom plate 114 and the wafer 300 with a lower temperature, thereby heating the wafer 300. Of course, the heating device may have other structures, and is not limited herein.
In the above embodiments, the pre-loading chamber 100 is provided with functional components that can perform multiple functions of the pre-loading chamber 100, and the functional components may include a vacuum gauge, a suction assembly, an inflation assembly, and the like. The main body 113 is provided with a wafer transfer port for the wafer 300 to enter and exit, and the functional components are all arranged on the main body 113 and occupy the space of the wafer transfer port. For this purpose, in another alternative embodiment, the bottom plate 114 may be provided with a first interface 1141, the first interface 1141 is communicated with the accommodating cavity 111, and the first interface 1141 is used for installing the functional component. In this embodiment, the first interface 1141 is formed on the bottom plate 114, so that a part of the functional components can be mounted on the bottom plate 114, and thus the space occupied by the functional components in the sheet conveying port is small, and the pre-loading chamber 100 has a large sheet conveying port.
For example, the first interface 1141 may be used to mount an inflation assembly, and of course, the first interface 1141 may also be used to mount other functional assemblies, which is not limited herein.
Optionally, the specific size of the first interface 1141 can be flexibly selected according to the external size of the installed functional component, and is not limited herein.
In another alternative embodiment, the sidewall of the main body 113 may be formed with an atmospheric sheet transfer port and a vacuum sheet transfer port, which are oppositely disposed, and the atmospheric sheet transfer port is communicated with the atmospheric transmission chamber, and the vacuum sheet transfer port is communicated with the vacuum transmission chamber 200. The top surface of the atmospheric wafer transfer port and the top surface of the vacuum wafer transfer port are flush with the bottom surface of the cover 112, and the bottom surfaces of the atmospheric wafer transfer port and the vacuum wafer transfer port are flush with the top surface of the bottom plate 114. In this scheme, the distance that piece mouth bottom surface was passed to atmosphere passes the height of piece mouth for atmosphere, the distance that piece mouth top surface was passed to vacuum passes the height that piece mouth bottom surface was passed to the vacuum, the height that piece mouth was passed to atmosphere and the height that piece mouth was passed to vacuum are the same with the height that holds chamber 111, at this moment, whole chamber 111 that holds all is used for wafer 300 to pass the piece, thereby make wafer 300 have great biography piece space, simultaneously, the height that holds chamber 111 is equivalent with passing piece mouth position, can further reduce the volume of pre-loading chamber 100, can further shorten the aerifing and the bleed time of pre-loading chamber 100.
Further, the intersection point of the central axis of the atmospheric wafer transfer port and the central axis of the vacuum wafer transfer port is perpendicular to the wafer 300, and the connecting line of the center of the wafer 300 carried on the wafer support is perpendicular to the wafer 300. That is, the wafer 300 is transported along the central axis of the vacuum transfer port on the transportation path between the pre-loading chamber 100 and the vacuum transfer chamber 200, so that the wafer 300 can be directly moved in and out between the pre-loading chamber 100 and the vacuum transfer chamber 200, and the wafer 300 does not need to be adjusted in position when entering or exiting the pre-loading chamber 100, thereby improving the transportation efficiency of the wafer 300.
In another alternative embodiment, the cover 112 may be formed with a first observation window 1121, the side wall of the body 113 may be formed with a second observation window 1122, and both the first observation window 1121 and the second observation window 1122 may be used for observing the position of the wafer 300 in the accommodating cavity 111. In this embodiment, the first observation window 1121 may observe the central region of the wafer 300, the second observation window 1122 may observe the edge of the wafer 300, and the first observation window 1121 and the second observation window 1122 may accurately observe the position of the wafer 300 in the accommodating cavity 111, thereby facilitating the adjustment and maintenance of the position of the wafer 300.
In the above embodiment, the wafer support frame 120 is mounted on the bottom plate 114, so the mounting position accuracy of the bottom plate 114 and the main body 113 is low, which may affect the mounting accuracy of the wafer support frame 120 in the accommodating cavity 111. Based on this, in another optional embodiment, the lower end of the bottom plate 114 may be provided with a first positioning boss 1142, one side of the inner wall of the through cavity facing the bottom plate 114 may be provided with a second positioning boss 1131, the bottom plate 114 may be inserted into the through cavity, the first positioning boss 1142 abuts against the second positioning boss 1131, and the first positioning boss 1142 is detachably connected with the second positioning boss 1131. At this time, the first positioning bosses 1142 and the second positioning bosses 1131 can position the mounting positions of the base plate 114 and the body 113, so as to improve the mounting accuracy of the base plate 114 and the body 113, and further improve the mounting accuracy of the support frame 120 of the wafer 300 in the accommodating cavity 111. Meanwhile, the bottom plate 114 is inserted into the main body part 113 through the through cavity, so that the depth of the accommodating cavity 111 is flush with the upper and lower positions of the atmospheric sheet conveying port and the vacuum sheet conveying port respectively, and the volume of the accommodating cavity is further reduced.
Further, the main body 113 and the cover 112 may also be positioned by using a boss structure, which is not described herein again.
In order to improve the sealing performance of the assembly of the chamber body 110, in another alternative embodiment, a first sealing member may be disposed between the cover body 112 and the main body 113, and at this time, the first sealing member may be capable of blocking a gap between the cover body 112 and the main body 113, so as to improve the sealing performance between the cover body 112 and the main body 113, and further improve the sealing performance of the chamber body 110.
Of course, the second seal 160 may be provided between the bottom plate 114 and the main body 113. Specifically, a second seal 160 is disposed between first locating boss 1142 and second locating boss 1131. At this time, the second sealing member 160 can seal the gap between the first positioning boss 1142 and the second positioning boss 1131, thereby improving the sealing performance between the bottom plate 114 and the main body 113, and further improving the sealing performance of the chamber body 110.
In the above embodiment, the number of the wafer supporting frames 120 may be a complete frame, and the first loading platform 121 and the second loading platform 122 are formed at two ends of the frame, at this time, in order to make the wafer placement more stable, the wafer supporting frame 120 needs to have a larger volume, however, the volume of the wafer supporting frame 120 is larger, so that the wafer supporting frame 120 occupies a larger accommodating cavity 111, and thus is not beneficial to the transportation of the wafer in the pre-loading chamber 100.
Based on this, in another alternative embodiment, the wafer support 120 may include at least two sub-supports, the at least two sub-supports may be disposed at intervals, the sub-supports may include an upper support and a lower support, the upper support is fixed on the lower support, the avoiding portion 1211 may be disposed on the upper support, the connecting portion 1221 may be disposed on the lower support, and all the upper supports may form the first susceptor 121, that is, all the upper supports jointly support the wafer 300 on the same support surface. All of the sub-frames may form the second susceptor 122, i.e., all of the sub-frames support the wafer 300 on the same support surface. In this embodiment, at least two sub-supporting frames may be supported on at least two sides of the wafer 300, so that the wafer 300 is supported more stably, and at the same time, the volume of the wafer supporting frame 120 may be reduced, so that the wafer supporting frame 120 occupies a smaller space of the accommodating cavity 111, which is more beneficial for the wafer 300 to be transported by the pre-loading chamber 100.
Optionally, as shown in fig. 4, the number of the sub-supports may be three, and the three sub-supports may be arranged at intervals, and at this time, the three sub-supports respectively support different three points on the wafer 300, so that the wafer 300 is supported more stably. Of course, the number of the sub-supporting frames may be other numbers, and is not limited herein.
In another alternative embodiment, the lower bracket and the chamber body 110 can be positioned and matched by the positioning member 150. The scheme can improve the installation precision of the wafer support frame 120 and the chamber body 110, and further improve the assembly precision of the pre-loading chamber 100. Alternatively, the positioning member 150 may be a positioning pin, but other positioning structures may also be adopted, and the disclosure is not limited thereto.
Based on the pre-load chamber 100 according to any of the above embodiments of the present invention, a semiconductor processing platform is also disclosed in the embodiments of the present invention, and the disclosed semiconductor processing platform comprises at least one pre-load chamber 100 according to any of the above embodiments.
The semiconductor processing platform disclosed by the invention further comprises a vacuum transmission chamber 200, and a transmission port of the vacuum transmission chamber 200 is communicated with a vacuum sheet transmission port of the pre-loading chamber 100.
The central axis of the transfer port of the vacuum transfer chamber 200 coincides with the central axis of the vacuum transfer port that is correspondingly communicated. In this embodiment, the wafer 300 is transported along the central axis of the vacuum transfer port on the transportation path between the pre-loading chamber 100 and the vacuum transfer chamber 200, so as to achieve the straight-in and straight-out of the wafer 300 between the pre-loading chamber 100 and the vacuum transfer chamber 200, and further, the wafer 300 does not need to be adjusted in position when entering and exiting the pre-loading chamber 100, thereby improving the transportation efficiency of the wafer 300.
Alternatively, the vacuum transfer chamber 200 is provided with a gate valve 210, and the pre-loading chamber 100 may be fixedly coupled to the gate valve 210 by bolts, at which time the vacuum transfer chamber 200 is detachably coupled to the pre-loading chamber 100.
In another optional embodiment, the semiconductor processing platform further includes an atmospheric transfer chamber, a transfer port of the atmospheric transfer chamber is communicated with the atmospheric wafer transfer port of the pre-loading chamber 100, and a central axis of the transfer port of the atmospheric transfer chamber coincides with a central axis of the atmospheric wafer transfer port correspondingly communicated, so that the wafer 300 can be straightly moved between the pre-loading chamber 100 and the atmospheric transfer chamber, and the transfer efficiency of the wafer 300 is further improved.
In another alternative embodiment, the number of pre-load chambers 100 may be two, with the central axes of the atmospheric transfer ports of the two pre-load chambers 100 being parallel. At this time, the two pre-loading chambers 100 of the semiconductor processing platform can be used alternatively, thereby improving the processing efficiency of the semiconductor processing platform.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (12)
1. A pre-load chamber comprising a chamber body (110) and a wafer support pedestal (120);
the chamber body (110) is provided with an accommodating cavity (111), the wafer support frame (120) is located in the accommodating cavity (111), the wafer support frame (120) comprises a first bearing table (121) and a second bearing table (122), the first bearing table (121) and the second bearing table (122) are both used for bearing a wafer (300), the first bearing table (121) is arranged above the second bearing table (122), an avoiding part (1211) is arranged on the first bearing table (121), a connecting part (1221) is arranged on the second bearing table (122), the avoiding part (1211) is arranged opposite to the connecting part (1221), the fixing part (130) can penetrate through the avoiding part (1211) to be assembled in the connecting part (1221), and the second bearing table (122) is connected with the chamber body (110) through the fixing part (130).
2. The pre-loading chamber according to claim 1, wherein the chamber body (110) comprises a main body portion (113), a bottom plate (114) and a cover body (112), a through cavity is formed in the main body portion (113), the cover body (112) and the bottom plate (114) are detachably disposed on an upper end surface and a lower end surface of the main body portion (113), a bottom surface of the cover body (112), an inner wall of the through cavity of the main body portion (113) and a top surface of the bottom plate (114) together enclose the accommodating cavity (111), and the second bearing table (122) is fixed on the bottom plate (114) through the fixing member (130).
3. The pre-load chamber of claim 2, wherein a cooling device is provided in the base plate (114) for cooling wafers on the wafer support rack (120); and/or
A heating device is arranged in the bottom plate (114) and used for heating the wafer (300) on the wafer supporting frame (120).
4. The pre-loading chamber according to claim 2, wherein the side wall of the main body (113) is provided with an atmosphere wafer transferring port and a vacuum wafer transferring port which are oppositely arranged, the atmosphere wafer transferring port and the vacuum wafer transferring port are both communicated with the accommodating cavity (111), the top surface of the atmosphere wafer transferring port and the top surface of the vacuum wafer transferring port are both flush with the bottom surface of the cover body (112), and the bottom surface of the atmosphere wafer transferring port and the bottom surface of the vacuum wafer transferring port are both flush with the top surface of the bottom plate (114).
5. The pre-load chamber of claim 4, wherein a line connecting an intersection of a central axis of the atmospheric wafer transfer port and a central axis of the vacuum wafer transfer port with a center of the wafer (300) carried on the wafer support pedestal (120) is perpendicular to the wafer (300).
6. The pre-load chamber of claim 2, wherein the cover (112) defines a first viewing window (1121), the side wall of the main body (113) defines a second viewing window (1122), and the first viewing window (1121) and the second viewing window (1122) are used for viewing the position of the wafer (300) in the accommodating chamber (111).
7. The pre-loading chamber according to claim 2, characterized in that a first positioning boss (1142) is provided at the lower end of the bottom plate (114), a second positioning boss (1131) is provided at one side of the inner wall of the through cavity facing the bottom plate, the bottom plate (114) is inserted into the through cavity, the first positioning boss (1142) abuts against the second positioning boss (1131), and the first positioning boss (1142) is detachably connected with the second positioning boss (1131).
8. The pre-load chamber according to claim 7, wherein a first seal is provided between the cover (112) and the body (113); and/or the presence of a gas in the gas,
a second sealing element (160) is arranged between the first positioning boss (1142) and the second positioning boss (1131).
9. The pre-load chamber of claim 1, wherein the wafer support rack (120) comprises at least two sub-support racks, the at least two sub-support racks are spaced apart, the sub-support racks comprise an upper rack and a lower rack, the upper rack is fixed to the lower rack, the avoiding portion (1211) is disposed on the upper rack, the connecting portion (1221) is disposed on the lower rack, all of the upper racks form the first susceptor (121), and all of the lower racks form the second susceptor (122).
10. The pre-load chamber of claim 9, wherein the lower bracket is in locating engagement with the chamber body (110) by a locating member (150).
11. A semiconductor processing platform comprising a vacuum transfer chamber (200), an atmospheric transfer chamber, and at least one pre-load chamber of any of claims 1 to 10, the transfer port on the vacuum transfer chamber (200) being in communication with a vacuum wafer transfer port, the transfer port of the atmospheric transfer chamber being in communication with the atmospheric wafer transfer port;
the central axis of the transmission port of the vacuum transmission chamber (200) is coincided with the central axis of the vacuum transmission sheet port which is correspondingly communicated;
the central axis of the transmission port of the atmosphere transmission chamber is coincided with the central axis of the atmosphere transmission sheet port which is correspondingly communicated.
12. The semiconductor processing platform of claim 11, wherein the number of the pre-loading chambers (100) is two, and central axes of the atmospheric wafer transfer ports of the two pre-loading chambers (100) are parallel.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011023326.8A CN112151431B (en) | 2020-09-25 | 2020-09-25 | Preloading chamber and semiconductor process platform |
| PCT/CN2021/119014 WO2022063052A1 (en) | 2020-09-25 | 2021-09-17 | Pre-loading chamber and semiconductor processing platform |
| TW110134905A TWI798838B (en) | 2020-09-25 | 2021-09-17 | Load lock chamber and semiconductor process platform |
| JP2023516756A JP7402380B2 (en) | 2020-09-25 | 2021-09-17 | Preload chamber and semiconductor process platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011023326.8A CN112151431B (en) | 2020-09-25 | 2020-09-25 | Preloading chamber and semiconductor process platform |
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| Publication Number | Publication Date |
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| CN112151431A true CN112151431A (en) | 2020-12-29 |
| CN112151431B CN112151431B (en) | 2023-07-11 |
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| CN202011023326.8A Active CN112151431B (en) | 2020-09-25 | 2020-09-25 | Preloading chamber and semiconductor process platform |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7402380B2 (en) |
| CN (1) | CN112151431B (en) |
| TW (1) | TWI798838B (en) |
| WO (1) | WO2022063052A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112941624A (en) * | 2021-02-20 | 2021-06-11 | 北京北方华创微电子装备有限公司 | Chamber and semiconductor manufacturing equipment |
| WO2022063052A1 (en) * | 2020-09-25 | 2022-03-31 | 北京北方华创微电子装备有限公司 | Pre-loading chamber and semiconductor processing platform |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114941124B (en) * | 2022-06-01 | 2024-04-30 | 江苏邑文微电子科技有限公司 | Vacuum wafer coating device |
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Also Published As
| Publication number | Publication date |
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| WO2022063052A1 (en) | 2022-03-31 |
| JP2023536549A (en) | 2023-08-25 |
| TW202213589A (en) | 2022-04-01 |
| JP7402380B2 (en) | 2023-12-20 |
| CN112151431B (en) | 2023-07-11 |
| TWI798838B (en) | 2023-04-11 |
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