WO2022063052A1

WO2022063052A1 - Pre-loading chamber and semiconductor processing platform

Info

Publication number: WO2022063052A1
Application number: PCT/CN2021/119014
Authority: WO
Inventors: 马良
Original assignee: 北京北方华创微电子装备有限公司
Priority date: 2020-09-25
Filing date: 2021-09-17
Publication date: 2022-03-31
Also published as: JP7402380B2; JP2023536549A; CN112151431A; TWI798838B; CN112151431B; TW202213589A

Abstract

Disclosed are a pre-loading chamber and a semiconductor processing platform. The pre-loading chamber comprises a chamber body and a wafer support, wherein the chamber body is provided with an accommodating cavity, and the wafer support is located in the accommodating cavity. The wafer support comprises a plurality of bearing tables that are used for bearing wafers and are arranged at intervals in a vertical direction, a support body connected to the plurality of bearing tables, and a fixing member, wherein at least one of the plurality of bearing tables is located above the support body, and is provided with a yielding portion that allows the fixing member to pass therethrough, and the fixing member is used for fixedly connecting the support body to the chamber body. The solution can solve the problem of low wafer transmission efficiency.

Description

Preloading chambers and semiconductor process platforms

technical field

The invention relates to the technical field of semiconductor chip manufacturing, in particular to a preloading chamber and a semiconductor process platform.

Background technique

The preload chamber (LOAD LOCK chamber) is a transition chamber that transfers wafers in transit between a vacuum environment and an atmospheric environment, for example, when a wafer needs to be converted from an atmospheric environment to a vacuum environment , first make the preloading chamber in the atmospheric environment, then transfer the wafer into the preloading chamber by the atmospheric manipulator, and then perform vacuum processing on the preloading chamber to make the preloading chamber change from the atmospheric environment Then, the wafer is transferred from the preloading chamber to the vacuum transfer chamber by the vacuum manipulator, thereby realizing the transfer of the wafer from the atmospheric environment to the vacuum environment.

In the related art, the preloading chamber includes a chamber body and a wafer support frame, a support member is disposed at the bottom of the wafer support frame, and the support member is fixed on the bottom wall of the chamber body by bolts. In order to facilitate the assembly, the mounting height needs to be reserved between the wafer support frame and the support to meet the space required by the operator when using the mounting tool to install the above-mentioned screws, but the mounting height will occupy the larger chamber body. The internal space leads to a larger volume of the chamber body, which in turn leads to a longer time for inflation and pumping of the preloading chamber, thereby affecting the wafer transfer efficiency.

SUMMARY OF THE INVENTION

The invention discloses a preloading chamber and a semiconductor process platform to solve the problem of low wafer transfer efficiency.

In order to solve the above problems, the present invention adopts the following technical solutions:

A preloading chamber includes a chamber body and a wafer support;

The chamber body is provided with an accommodating cavity, and the wafer supporting frame is located in the accommodating cavity, and the wafer supporting frame includes a plurality of supporting platforms for carrying wafers and a plurality of supporting platforms arranged at intervals along the vertical direction. A supporting frame body connected with the plurality of bearing platforms, and a fixing piece, wherein at least one of the plurality of bearing platforms is located above the supporting frame body, and is provided with an escape portion that can allow the fixing piece to pass through ; The fixing piece is used for fixedly connecting the support frame body and the chamber body.

A semiconductor process platform, comprising a vacuum transfer chamber, an atmosphere transfer chamber and at least one of the above-mentioned preloading chambers, a transfer port on the vacuum transfer chamber is communicated with the vacuum sheet transfer port, and the atmosphere transfer chamber The transfer port of the chamber is communicated with the atmospheric film transfer port.

The technical scheme adopted in the present invention can achieve the following beneficial effects:

In the pre-loading chamber disclosed in the present invention, the wafer support frame includes a plurality of support tables for carrying wafers and a support frame body connected with the plurality of support tables, which are arranged at intervals along the vertical direction, and a fixing member, wherein At least one of the plurality of bearing platforms is located above the support frame body, and is provided with an avoidance part that can allow the fixing piece to pass through; the fixing piece is used for fixedly connecting the support frame body and the chamber body. In this solution, when installing the fixing member, the operator can pass the fixing member from above through the avoidance part of the bearing platform located above the support frame body, and then install it on the support frame body and the chamber body, so as to realize the connection between the two. Fixed connection, thus, there is no need to reserve an operation space for installing the fixture between the wafer support frame and the bottom wall of the chamber body, so that the overall height of the wafer support frame can be reduced, and the volume of the accommodating cavity can be reduced, As a result, the filling and pumping time of the preloading chamber can be shortened, thereby improving the transfer efficiency of the wafers.

The semiconductor process platform disclosed in the present invention, by using the preloading chamber disclosed in the present invention, can shorten the inflation and pumping time of the preloading chamber, thereby improving the transfer efficiency of wafers.

Description of drawings

The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the attached image:

1 is a schematic structural diagram of a semiconductor process platform disclosed in an embodiment of the present invention;

2 to 4 are axonometric views of a preloading chamber disclosed in an embodiment of the present invention;

5 is a top view of a preloading chamber disclosed in an embodiment of the present invention;

6 is a bottom view of a preloading chamber disclosed in an embodiment of the present invention;

7 to 9 are cross-sectional views of partial structures of a preloading chamber disclosed in an embodiment of the present invention.

Description of reference numbers:

100-preloading chamber, 110-chamber body, 111-accommodating chamber, 112-cover body, 1121-first observation window, 1122-second observation window, 113-main body, 114-bottom plate, 1141-first observation window An interface, 1142-positioning protrusion, 120-wafer support frame, 121-carrying table, 121a-first carrying table, 121b-second carrying table, 1211-avoidance part, 122-support frame body, 1221-installation hole , 130-fixing piece, 140-support drive device, 150-positioning piece, 160-second sealing piece;

200-vacuum transmission chamber, 210-gate valve;

300-wafer.

detailed description

In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The technical solutions disclosed by the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in FIGS. 1 to 9 , an embodiment of the present invention discloses a preloading chamber 100 . The disclosed preloading chamber 100 includes a chamber body 110 and a wafer support frame 120 .

The chamber body 110 is the main body part of the preload chamber 100 , which provides a mounting base for the other components of the preload chamber 100 . As shown in FIG. 7 , the chamber body 110 is provided with an accommodating cavity 111 , and the wafer support frame 120 is located in the accommodating cavity 111 . As shown in FIG. 8 , the wafer support frame 120 includes a plurality of supporting tables 121 for carrying the wafers 300 , a plurality of supporting frames 122 connected to the plurality of supporting tables 121 , and a fixing member 130 , which are arranged at intervals in the vertical direction. At least one of the plurality of bearing platforms 121 is located above the support frame body 122 . For example, FIG. 8 shows two bearing platforms, one of which is the first bearing platform 121 a , which is located above the support frame body 122 , the other carrier is the second carrier 121b, which is integrally formed with the support frame body 122, in other words, the second carrier table 121b is processed on the support frame body 122, which can further simplify the wafer support frame 120. The structure reduces the occupied space of the wafer support frame 120 . Of course, in practical applications, the number of the bearing platforms 121 may be more than three according to specific needs, and all the bearing platforms 121 and the support frame body 122 may be independent of each other.

It should be noted that, a gap required for the movement of the wafer 300 needs to be reserved between any two adjacent bearing platforms 121, for example, between the first bearing platform 121a and the second bearing platform 121b, and the first bearing platform 121a and the The top wall of the chamber body 110 also needs to reserve a gap required for the wafer 300 to move, so as to prevent the wafer 300 from colliding during the movement.

Optionally, the depth of the accommodating cavity 111 may be 40 mm, and the distance between the bearing surface of the first bearing platform 121 a and the bearing surface of the second bearing platform 121 b may be 10 mm. The distance between the bearing surface of the first bearing platform 121a and the top wall of the chamber body 110 may be 12 mm. The distance between the bearing surface of the second bearing platform 121b and the bottom wall of the chamber body 110 may be 18 mm. Of course, other values may also be used, which are not limited in this article.

As shown in FIG. 8 , the first bearing platform 121a located above the support frame body 122 is provided with a recess portion 1211 through which the fixing member 130 can pass through. holes, or alternatively, avoidance gaps. The fixing member 130 is used for fixing the connection between the support frame body 122 and the chamber body 110 . The fixing member 130 can be assembled on the support frame body 122 and the chamber body 110 through the avoidance portion 1211, so as to realize the fixed connection between the support frame body 122 and the chamber body 110.

During the specific operation, the side of the support frame body 122 away from the first bearing platform 121 a is in contact with the bottom of the chamber body 110 . When installing the fixing member 130 , the operator can pass the fixing member 130 through the avoidance portion 1211 from above. Then, it is installed on the support frame body 122 and the chamber body 110 to realize the fixed connection of the two. Therefore, there is no need to reserve the operation of installing a fixing piece between the support frame body 122 and the bottom wall of the chamber body 110. Therefore, the overall height of the wafer support frame 120 can be reduced, and the volume of the accommodating cavity 111 can be reduced, thereby shortening the filling and pumping time of the preloading chamber, thereby improving the wafer transfer efficiency.

It should be noted that the area of the smallest end face of the escape portion 1211 needs to be larger than the area of the largest end face of the fixing member 130 , so that the fixing member 130 can pass through the escape portion 1211 .

Optionally, an installation hole 1221 is formed on the support frame body 122 and located below the avoidance portion 1211 , and the installation hole 1221 may be a through hole or a threaded hole. The fixing member 130 is, for example, a fastening screw. One end of the fastening screw passes through the installation hole 1221 and is threadedly connected to the chamber body 110 . The fixing member 130 may be a rivet or a bolt.

It should be noted that the above-mentioned fixing member 130 can also adopt any other structure to fixedly connect the support frame body 122 and the chamber body 110, for example, a snap-on structure, a plug-in structure, etc. According to the fixing member 130 of different structures, it can be adapted to Corresponding connection structures are designed on the support frame body 122 and the chamber body 110 .

A specific structure of the chamber body 110 is provided herein. Of course, other structures may also be used, which are not limited herein. Specifically, as shown in FIG. 7 , the chamber body 110 may include a main body portion 113 , a bottom plate 114 and a cover body 112 . The main body portion 113 may be provided with a through cavity penetrating the main body portion 113 in the vertical direction. The through cavity refers to It penetrates from the upper end surface of the main-body part 113 to the lower end surface. The cover body 112 and the bottom plate 114 are detachably disposed on the upper end surface and the lower end surface of the main body portion 113 respectively, and the bottom surface of the cover body 112 and the main body portion 113 form the inner wall of the through cavity and the top surface of the bottom plate 114 together to form a receiving cavity. 111. The fixing member 130 is used for fixing the connection between the support frame body 122 and the bottom plate 114 .

The above-mentioned chamber body 110 is a split structure composed of the main body 113 , the bottom plate 114 and the cover body 112 . In this way, when the chamber body 110 is partially damaged, the corresponding parts on the chamber body 110 can be replaced, so that there is no need for the chamber body 110 The chamber body 110 is replaced as a whole, thereby improving the maintainability of the chamber body 110 and extending the service life of the chamber body 110 . In addition, when the preloading chamber 100 needs to add other functions, it can be done by replacing the bottom plate 114 or the cover 112 of the chamber body 110 , so that the preloading chamber 100 can integrate more functions, thereby improving the The performance of the preloading chamber 100 is improved.

In the above embodiment, the bottom plate 114 may be a part of the bottom wall of the main body part 113 described above, that is, the bottom plate 114 may be a part of the bottom wall of the chamber body 110 . The cover body 112 may be the top wall of the main body portion 113 described above, that is, the cover body 112 may be the top wall of the chamber body 110 .

Specifically, the cover body 112 and the main body portion 113 may be connected by a screw thread or a snap connection, and of course other connection methods may also be used. The text is not limited. The main body portion 113 and the bottom plate 114 may also be connected in a manner such as screw thread or snap connection, and of course, other manners may also be employed, which are not limited herein.

Further, the above-mentioned chamber body 110 is a split structure composed of a main body 113 , a bottom plate 114 and a cover body 112 . Before assembling the chamber body 110 , the wafer support frame 120 can be fixed on the bottom plate 114 , and then Then, the bottom plate 114 is installed into the through cavity in the main body portion 113 . At this time, the mounting process of the wafer support frame 120 fixed to the bottom plate 114 can be performed outside the through-cavity, so that there is a larger operating space, and the operator is not easily bumped, thereby improving the personal safety of the operator. It should be noted that, when the wafer support frame 120 is first fixed on the bottom plate 114, and then the bottom plate 114 is inserted into the through cavity, an avoidance space needs to be provided on the main body 113 or the outer contour of the wafer support frame 120 needs to be designed to avoid the through cavity. , so as to prevent the main body portion 113 from interfering with the wafer support frame 120 .

In an optional embodiment, a cooling device may be provided in the bottom plate 114, and the cooling device is used for cooling the wafer 300 placed on the wafer support frame 120 (ie, the carrier 121). At this time, the bottom plate 114 has a cooling function, so that the processing technology of cooling the wafer 300 during the processing of the wafer 300 can be satisfied, thereby making the function of the preloading chamber 100 stronger.

Optionally, the cooling device may be a water-cooled cooling device, and a copper tube for water cooling is arranged in the bottom plate 114, the copper tube is communicated with the cooling water circulation system, and cooling water with a lower temperature can be passed into the copper tube, so that the bottom plate 114 Keeping the temperature lower, a temperature difference is formed between the bottom plate 114 and the higher temperature wafer 300 , thereby cooling the wafer 300 . Of course, the cooling device may also be other types of cooling devices, and the specific type of the cooling device is not limited herein.

Or, in another optional embodiment, a heating device is provided in the bottom plate 114, and the heating device is used for heating the wafer 300 placed on the wafer support frame 120 (ie, the carrier 121). At this time, the bottom plate 114 has a heating function, so the wafers 300 in the preloading chamber 100 can be heated, thereby making the preloading chamber 100 more functional.

Optionally, the heating device may be an electric heating wire. When the electric heating wire is energized, the temperature of the electric heating wire increases, so that the bottom plate 114 maintains a relatively high temperature, and a temperature difference is formed between the bottom plate 114 and the lower temperature wafer 300, and further Wafer 300 is heated. Of course, the heating device may also have other structures, which are not limited herein.

In the above-mentioned embodiment, the preloading chamber 100 is provided with functional components, which can realize various functions of the preloading chamber 100. The functional components may include vacuum gauges, air extraction components, and inflation components. The main body portion 113 is provided with a wafer transfer port for entering and exiting the wafer 300 . The above-mentioned functional components are all disposed in the main body portion 113 and occupy the space of the wafer transfer port. To this end, in another optional embodiment, as shown in FIG. 4 , a first interface 1141 may be opened on the bottom plate 114 , the first interface 1141 communicates with the accommodating cavity 111 , and the first interface 1141 is used for installation functional components. In this solution, a first interface 1141 is provided on the bottom plate 114, and at least a part of the above-mentioned functional components can be installed on the bottom plate 114, so as to avoid occupation of the film transfer port due to too many functional components disposed on the main body portion 113. Due to the problem of space, there is enough space on the main body portion 113 to design a larger film transfer opening.

For example, the first interface 1141 can be used to install an inflatable component. Of course, the first interface 1141 can also be used to install other functional components, which is not limited herein.

Optionally, the specific size of the first interface 1141 can be flexibly selected according to the external size of the installed functional component, which is not limited herein.

In another optional embodiment, the side wall of the main body portion 113 may be provided with an air transfer port and a vacuum transfer port opposite to each other, the air transfer port is communicated with the air transfer chamber, and the vacuum transfer port is connected with the vacuum transfer chamber. 200 connected. The top surface of the atmospheric film transfer port and the top surface of the vacuum film transfer port are both flush with the bottom surface of the cover body 112 , and the bottom surface of the atmospheric film transfer port and the bottom surface of the vacuum film transfer port are both flush with the top surface of the bottom plate 114 . In this scheme, the distance from the top surface of the atmospheric film transfer port to the bottom surface of the atmospheric film transfer port is the height of the atmospheric film transfer port, and the distance from the top surface of the vacuum film transfer port to the bottom surface of the vacuum film transfer port is the height of the vacuum film transfer port. The height of the wafer opening is the same as the height of the accommodating cavity 111. At this time, the entire accommodating cavity 111 is used for the wafer 300 to be transferred, so that the wafer 300 has a larger space for wafer transfer. The positions of the die openings are equivalent, so that the volume of the preloading chamber 100 can be further reduced, and the inflation and pumping time of the preloading chamber 100 can be further shortened.

Further, the connection line between the intersection of the central axis of the air transfer port and the central axis of the vacuum transfer port and the center of the carrier surface of the wafer support frame 120 (ie, the carrier table 121 ) for carrying the wafer 300 is perpendicular to the carrier. noodle. That is to say, the transfer path of the wafer 300 between the preloading chamber 100 and the vacuum transfer chamber 200 is along the central axis of the vacuum transfer port, thereby realizing the transfer of the wafer 300 between the preloading chamber 100 and the vacuum transfer chamber. The straight in and straight out of the chambers 200 makes it unnecessary to adjust the position of the wafers 300 when entering and leaving the preloading chamber 100 , thereby improving the transfer efficiency of the wafers 300 .

In order to facilitate the observation of the wafer 300 in the accommodating cavity 111 , in another optional embodiment, the cover body 112 may be provided with a first observation window 1121 , and the side wall of the main body portion 113 may be provided with a second observation window 1122 , the first observation window 1121 and the second observation window 1122 can both be used to observe the position of the wafer 300 in the receiving chamber 111 . In this solution, the first observation window 1121 can observe the central area of the wafer 300, and the second observation window 1122 can observe the edge of the wafer 300. The first observation window 1121 and the second observation window 1122 can accurately observe the The position of the wafer 300 in the accommodating chamber 111 is observed, so as to facilitate adjustment and maintenance of the position of the wafer 300 .

In the above embodiment, the wafer support frame 120 is mounted on the bottom plate 114 , so the mounting position accuracy of the bottom plate 114 and the main body 113 is low, which may affect the mounting accuracy of the wafer support frame 120 in the accommodating cavity 111 . Based on this, in another optional embodiment, as shown in FIG. 8 , the bottom plate 114 is located in the through cavity in the main body portion 113 , and the outer peripheral wall of the bottom plate 114 is provided with positioning protrusions 1142 , which are correspondingly located in The bottom wall of the main body part 113 is provided with a positioning concave part, the positioning concave part and the positioning convex part 1142 are abutted on the surfaces facing each other, and the positioning convex part 1142 is detachably connected with the main body part 113 . By matching the positioning concave portion with the positioning convex portion 1142 , the installation positions of the bottom plate 114 and the main body portion 113 can be positioned, thereby improving the installation accuracy of the bottom plate 114 and the main body portion 113 , and further improving the mounting position of the wafer 300 support frame 120 in the accommodating cavity 111 . installation accuracy. At the same time, the bottom plate 114 is inserted into the main body 113 through the through cavity, so that the depth of the accommodating cavity 111 can be flush with the upper and lower positions of the atmospheric film transfer port and the vacuum chip transfer port, which further reduces the volume of the accommodating cavity.

Further, a positioning structure similar to the positioning concave portion and the positioning convex portion 1142 described above can also be used for positioning between the main body portion 113 and the cover body 112 , and details are not described herein again.

In order to improve the sealing performance of the assembly of the chamber body 110, in another optional embodiment, a first sealing member may be provided between the surfaces of the cover body 112 and the main body portion 113 facing each other. In this case, the first sealing member The component can block the gap between the cover body 112 and the main body part 113 , thereby improving the sealing performance between the cover body 112 and the main body part 113 , and further improving the sealing performance of the chamber body 110 .

Of course, a second sealing member may also be provided between the surfaces of the bottom plate 114 and the main body portion 113 facing each other. Specifically, as shown in FIG. 8 , a second sealing member 160 is provided between the positioning concave portion and the positioning convex portion 1142 . At this time, the second sealing member 160 can block the gap between the positioning concave portion and the positioning convex portion 1142 , thereby improving the sealing performance between the bottom plate 114 and the main body portion 113 and further improving the sealing performance of the chamber body 110 .

In an optional embodiment, there are at least two wafer support frames 120 , and they are arranged at intervals along the circumferential direction, and each carrier 121 on each wafer support frame 120 is connected to other wafer support frames 120 . Each of the supporting platforms 121 above is provided on the same layer in a one-to-one correspondence, and the supporting platforms 121 on the same layer are used to jointly support the wafer 300 . For example, as shown in FIG. 9 , there are three wafer support frames 120 , which are arranged at intervals in the circumferential direction, and each of the supporting platforms 121 on one wafer support frame 120 and the other two wafer support frames 120 are arranged at intervals. Each bearing platform 121 is arranged on the same layer in a one-to-one correspondence. By adopting a split-type bracket composed of a plurality of wafer supports 120, the overall volume of the bracket can be reduced on the basis of ensuring stable support for the wafers 300, so that the wafer support 120 occupies less space in the accommodating cavity 111 , which is more favorable for the preloading chamber 100 to transfer the wafer 300 .

Of course, in practical applications, the wafer support frame 120 can also be a complete support frame. For example, the support frame body adopts an integral structure, and each bearing platform includes a plurality of sub-bearing platforms connected to the support frame body. The plurality of sub-carriers are spaced apart along the circumferential direction and are arranged on the same layer to jointly support the wafer 300 . Alternatively, each carrying table may also adopt an integral structure, and each carrying table is provided with an escape opening for allowing the wafer 300 and the robot to enter and exit.

In another optional embodiment, as shown in FIG. 8 , the wafer support frame 120 further includes a positioning member 150 , and corresponding positioning members 150 are respectively provided on the opposite surfaces of the support frame body 122 and the chamber body 110 . The two ends of the positioning member 150 are respectively located in the positioning holes on the support frame body 122 and the chamber body 110 . This solution can improve the installation accuracy of the wafer support frame 120 and the chamber body 110 , thereby improving the assembly accuracy of the preloading chamber 100 . Optionally, the positioning member 150 may be a positioning pin, of course, other positioning structures may also be used, which are not limited herein.

Based on the preloading chamber 100 of any of the above embodiments of the present invention, an embodiment of the present invention further discloses a semiconductor process platform, and the disclosed semiconductor process platform includes at least one preloading chamber 100 of any of the above-mentioned embodiments.

The semiconductor process platform disclosed in the present invention further includes a vacuum transfer chamber 200 , and the transfer port of the vacuum transfer chamber 200 communicates with the vacuum transfer port of the preloading chamber 100 .

In an optional embodiment, the central axis of the transfer port of the vacuum transfer chamber 200 is coincident with the central axis of the corresponding vacuum transfer port. In this solution, the transfer path of the wafer 300 between the preloading chamber 100 and the vacuum transfer chamber 200 is along the central axis of the vacuum transfer port, thereby realizing the transfer of the wafer 300 between the preloading chamber 100 and the vacuum transfer chamber. The straight in and straight out of the chambers 200 makes it unnecessary to adjust the position of the wafers 300 when entering and leaving the preloading chamber 100 , thereby improving the transfer efficiency of the wafers 300 .

Optionally, the vacuum transfer chamber 200 is provided with a gate valve 210 , and the preloading chamber 100 can be fixedly connected with the gate valve 210 by bolts. At this time, the vacuum transfer chamber 200 is detachably connected with the preloading chamber 100 .

In another optional embodiment, the semiconductor process platform further includes an atmosphere transport chamber, the transport port of the atmosphere transport chamber is communicated with the atmosphere sheet transport port of the preloading chamber 100, and the transport port of the atmosphere transport chamber The central axis of the wafer 300 coincides with the central axis of the corresponding communicating air transfer port. This solution can realize the straight in and straight out of the wafer 300 between the preloading chamber 100 and the air transfer chamber, thereby improving the transfer of the wafer 300 effectiveness.

In another optional embodiment, the number of the preloading chambers 100 may be two, and the central axes of the air transfer openings of the two preloading chambers 100 are parallel. At this time, the two preloading chambers 100 of the semiconductor processing platform can be used alternately, thereby improving the processing efficiency of the semiconductor processing platform.

The above embodiments of the present invention mainly describe the differences between the various embodiments. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form better embodiments. No longer.

The above descriptions are merely embodiments of the present invention, and are not intended to limit the present invention. Various modifications and variations of the present invention are possible for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the scope of the claims of the present invention.

Claims

A preloading chamber is characterized by comprising a chamber body and a wafer support frame;

The chamber body is provided with an accommodating cavity, and the wafer supporting frame is located in the accommodating cavity, and the wafer supporting frame includes a plurality of supporting platforms for carrying wafers and a plurality of supporting platforms arranged at intervals along the vertical direction. A supporting frame body connected with the plurality of bearing platforms, and a fixing piece, wherein at least one of the plurality of bearing platforms is located above the supporting frame body, and is provided with an escape portion that can allow the fixing piece to pass through ; The fixing piece is used for fixedly connecting the support frame body and the chamber body.
The preloading chamber according to claim 1, wherein there are at least two wafer support frames, and they are arranged at intervals along the circumferential direction, and each of the wafer support frames The supporting table and each of the supporting tables on the other wafer support frames are arranged on the same layer in a one-to-one correspondence, and the supporting tables on the same layer are used to jointly support the wafers.
The preloading chamber according to claim 1 or 2, wherein a mounting hole is formed on the support frame body and below the avoidance portion; the fixing member is a tightening screw, and the One end of the fastening screw passes through the mounting hole and is threadedly connected with the chamber body.
The preloading chamber according to claim 1 or 2, wherein the wafer support frame further comprises a positioning member, and correspondingly located on the opposite surfaces of the support frame body and the chamber body respectively. A positioning hole is arranged on the upper part, and both ends of the positioning member are respectively located in the positioning holes on the support frame body and the chamber body.
The preloading chamber according to claim 1 or 2, wherein the chamber body comprises a main body part, a bottom plate and a cover body, wherein the main body part is provided with a vertical direction through the main body The cover body and the bottom plate are respectively detachably arranged on the upper end surface and the lower end surface of the main body part, and the bottom surface of the cover body and the main body part constitute the inner wall and the lower end surface of the through cavity. The top surface of the bottom plate together forms the accommodating cavity, and the fixing member is used for fixedly connecting the support frame body and the bottom plate.
The preloading chamber according to claim 5, wherein a cooling device is provided in the bottom plate, and the cooling device is used to cool the wafer placed on the carrier; and/or

A heating device is arranged in the bottom plate, and the heating device is used for heating the wafer placed on the carrying table.
The preloading chamber according to claim 5, wherein the side wall of the main body is provided with an oppositely arranged atmospheric film transfer port and a vacuum film transfer port, and the atmospheric film transfer port and the vacuum film transfer port are both connected with The accommodating cavity is communicated, the top surface of the atmospheric film transfer port and the top surface of the vacuum film transfer port are both flush with the bottom surface of the cover body, and the bottom surface of the atmospheric film transfer port and the vacuum film transfer port are flush with each other. The bottom surfaces are flush with the top surface of the bottom plate.
The preloading chamber according to claim 7, wherein the intersection point of the central axis of the atmospheric wafer transfer port and the central axis of the vacuum wafer transfer port and the carrier used for carrying the wafer on the carrier table The lines connecting the centers of the surfaces are perpendicular to the bearing surfaces.
The preloading chamber according to claim 5, wherein the cover body is provided with a first observation window, the side wall of the main body is provided with a second observation window, the first observation window and the The second observation windows are all used to observe the position of the wafer in the accommodating cavity.
The preloading chamber according to claim 5, wherein the bottom plate is located in the through cavity, and a positioning protrusion is provided on the outer peripheral wall of the bottom plate, and is correspondingly located on the main body portion. The bottom wall is provided with a positioning concave portion, the positioning convex portion and the opposite surfaces of the positioning concave portion abut against each other, and the positioning convex portion and the main body portion are detachably connected.
The preloading chamber according to claim 10, wherein a first sealing member is provided between the surfaces of the cover body and the main body portion facing each other; and/or,

A second sealing member is provided between the surfaces of the positioning convex portion and the positioning concave portion facing each other.
A semiconductor process platform, comprising a vacuum transfer chamber, an atmosphere transfer chamber, and at least one preloading chamber according to any one of claims 7 to 11, wherein a transfer port on the vacuum transfer chamber is connected to the The vacuum film transfer port is communicated with, and the transfer port of the atmospheric transfer chamber is communicated with the atmospheric film transfer port.
The semiconductor process platform according to claim 12, wherein the central axis of the transfer port of the vacuum transfer chamber coincides with the central axis of the corresponding vacuum transfer port;

The central axis of the transmission port of the air transmission chamber is coincident with the central axis of the corresponding communication air transmission port.
The semiconductor process platform according to claim 12 or 13, wherein the number of the preloading chambers is two, and the central axes of the air transfer openings of the two preloading chambers are parallel to each other .