CN105044951A - Substrate assembly method - Google Patents
Substrate assembly method Download PDFInfo
- Publication number
- CN105044951A CN105044951A CN201510507371.3A CN201510507371A CN105044951A CN 105044951 A CN105044951 A CN 105044951A CN 201510507371 A CN201510507371 A CN 201510507371A CN 105044951 A CN105044951 A CN 105044951A
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- China
- Prior art keywords
- substrate
- carrying platform
- batch
- modified areas
- local modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 title claims abstract description 188
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 230000007423 decrease Effects 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 241000272165 Charadriidae Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133325—Assembling processes
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The invention provides a substrate assembly method which is suitable for assembly of a first substrate and a second substrate of a display panel. The substrate assembly method includes the steps that an assembly device with a heating structure is provided; the first substrate is assembled to the second substrate through the assembly device; the local deformation regions of the first substrate and the second substrate after assembly are detected; the local deformation regions are heated through the heating structure to correct alignment offset of the first substrate and the second substrate. By means of the substrate assembly method, deformation of the local regions of the substrates can be corrected in the substrate assembly process, the assembly accuracy of the display panel is improved effectively, and the yield of products is increased.
Description
Technical field
The present invention relates to display technique field, particularly relate to a kind of substrate in batch cube method.
Background technology
The display panel of display device has the upper and lower base plate be oppositely arranged, the thin-film transistor array base-plate of such as liquid crystal indicator and colored optical filtering substrates.In the preparation process of display device, on the top carrying platform that the mode fitted together by the upper and lower base plate of display panel is mainly placed on assembling apparatus respectively upper and lower base plate to be assembled and below carrying platform, upper and lower base plate to be assembled position up on carrying platform and below carrying platform is determined, top carrying platform and below carrying platform vacuum suction upper and lower base plate to be assembled by the steady arm on top carrying platform and below carrying platform.Utilize subsequently corrector to be placed on top carrying platform and below carrying platform on upper and lower base plate to be assembled carry out position correction after remove corrector again.Then, after top carrying platform being turned over turnback, make top carrying platform decline carry out pressing with below carrying platform, thus upper and lower base plate is assembled into together.Being spaced a distance for placing liquid crystal material between upper and lower base plate after group is vertical, relying on frame adhesive and chock insulator matter between upper and lower base plate as stilt to keep the spacing distance between upper and lower base plate.
At present, can be revised by adjustment tool parameters when the overall contraposition of upper and lower base plate is inaccurate, by detecting the relative displacement of upper substrate and infrabasal plate and compensating side-play amount and make upper and lower base plate contraposition accurate.Along with the slimming of display device, the upper and lower base plate of display panel also makes more and more thinner, due to the reason of upper and lower base plate own material or the factor etc. of assembling apparatus, by above-mentioned assemble method up carrying platform decline in the step of pressing after turning over turnback, the upper and lower base plate distortion caused because of rotation, pressing etc., upper and lower base plate group stand that rear regional area spacing distance is uneven etc. group stood after the regional area of upper and lower base plate produce deformation and occur group abnormal.Adjustment tool parameters can only carry out translation to the entirety of substrate, namely can only four direction integral translation all around in the plane at substrate place, but cannot adjust for the distortion of the regional area of substrate, therefore, upper and lower base plate regional area is still difficult to revise when there is distortion, the group that finally have impact on display panel founds precision, and then causes waste of material.
Summary of the invention
The invention provides a kind of substrate in batch cube method, can revise the distortion of the regional area of substrate in the vertical substrate process of group, the group that effectively improve display panel founds precision, improves the yield of product.
It is adopt following technical scheme to realize that the present invention solves its technical matters.
A kind of substrate in batch cube method, the group of the first substrate and second substrate that are suitable for display panel is stood, and substrate in batch cube method comprises: provide the assembling apparatus with heating arrangement; Utilize assembling apparatus that first substrate group is stood on second substrate; Test set stand after first substrate and the local modified areas of second substrate; Heating arrangement is utilized to offset with the contraposition revising first substrate and second substrate local modified areas heating.
In present pre-ferred embodiments, above-mentioned heating arrangement has multiple temperature control region, and each temperature control region independently can control heating-up temperature.
In present pre-ferred embodiments, above-mentioned assembling apparatus comprises the first carrying platform and the second carrying platform, and in the first carrying platform and the second carrying platform, at least one is provided with heating arrangement.
In present pre-ferred embodiments, the method that above-mentioned first substrate group stands on second substrate comprises: first substrate is placed in the first carrying platform, the first carrying platform is utilized to locate and fix first substrate, second substrate is placed in the second carrying platform, the second carrying platform is utilized to locate and fix second substrate, overturning the first carrying platform makes the first carrying platform relative with the second carrying platform, makes the first carrying platform decline carry out pressing with the second carrying platform and stands on second substrate to make first substrate group.
In present pre-ferred embodiments, above-mentioned local modified areas is the position skew of the regional area organizing the first substrate after standing and/or second substrate.
In present pre-ferred embodiments, the skew of the position of above-mentioned regional area refers to that first substrate is relative to the depression of second substrate or the relative first substrate of second substrate or projection.
In present pre-ferred embodiments, above-mentioned test set stand after first substrate and the local modified areas of second substrate also comprise utilize pick-up unit to detect to organize vertical after first substrate and the side-play amount of local modified areas of second substrate.
In present pre-ferred embodiments, the above-mentioned heating arrangement that utilizes comprises to the method that local modified areas heating offsets with the contraposition revising first substrate and second substrate the temperature calculated needed for local modified areas, utilizes heating arrangement to make it reach required temperature to local modified areas heating.
In present pre-ferred embodiments, the required temperature of above-mentioned local modified areas calculates according to first substrate or the thermal expansivity of second substrate and the side-play amount of local modified areas.
In present pre-ferred embodiments, above-mentioned display panel is display panels, and first substrate is colored optical filtering substrates, and second substrate is thin-film transistor array base-plate.
Substrate in batch cube method of the present invention utilize assembling apparatus that first substrate group is stood on second substrate and test set stand after first substrate and the local modified areas of second substrate, the heating arrangement of recycling assembling apparatus offsets with the contraposition revising first substrate and second substrate local modified areas heating.The object that the contraposition making local modified areas generation thermal expansion deformation reach correction first substrate and second substrate by the temperature adjusting heating arrangement offsets, the distortion of the regional area of first substrate and second substrate is revised, the group that effectively improve display panel founds precision, improves the yield of product.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to technological means of the present invention can be better understood, and can be implemented according to the content of instructions, and can become apparent to allow aforesaid substrate method for assembling of the present invention and other objects, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail.
Accompanying drawing explanation
Fig. 1 is the step schematic diagram of the substrate in batch cube method of present pre-ferred embodiments.
Fig. 2 is the structural representation of the first/the second carrying platform of the assembling apparatus of present pre-ferred embodiments.
Fig. 3 is the schematic diagram that the substrate in batch of present pre-ferred embodiments founds process.
Embodiment
For further setting forth the present invention for the technological means reaching predetermined goal of the invention and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to the embodiment of substrate in batch cube method proposed according to the present invention, structure, feature and effect thereof, be described in detail as follows:
Aforementioned and other technology contents, Characteristic for the present invention, can know and present in the detailed description of following cooperation with reference to graphic preferred embodiment.By the explanation of embodiment, when can to the present invention for the technological means reaching predetermined object and take and effect be able to more deeply and concrete understanding, however institute's accompanying drawings be only to provide with reference to and the use of explanation, be not used for being limited the present invention.
Fig. 1 is the step schematic diagram of the substrate in batch cube method of present pre-ferred embodiments, refers to Fig. 1, and the group of first substrate and second substrate that substrate in batch cube method is suitable for display panel is stood, and describes in detail below to substrate in batch cube method.
Step S11: the assembling apparatus 10 with heating arrangement 30 is provided.
Particularly, Fig. 2 is the structural representation of the first/the second carrying platform of the assembling apparatus of present pre-ferred embodiments, as shown in Figure 2, assembling apparatus 10 comprises the first carrying platform 11, second carrying platform 12, assembling apparatus 10 is mainly used in the assembling of the upper and lower base plate of liquid crystal panel, first carrying platform 11 is for placing first substrate 21, and the second carrying platform 12 is for placing second substrate 22.In first carrying platform 11 and the second carrying platform 12, at least one is provided with the heating arrangement 30 of separated regions control temperature.The first carrying platform 11 being provided with heating arrangement 30 has similar structure with the second carrying platform 12, is described below for the structure of the first carrying platform 11.Heating arrangement 30 is arranged on the first carrying platform 11 for placing the surface of first substrate 21, and when namely first substrate 21 is placed on the first carrying platform 11, the first carrying platform 11 to be contacted with first substrate 21 by heating arrangement 30 and fixed by first substrate 21.Heating arrangement 30 is such as constant temperature heating plate, and heating arrangement 30 is divided into multiple temperature control region 31, and each temperature control region 31 can independent control temperature.In the present embodiment, the arrangement in matrix of multiple temperature control region 31, and the size in each temperature control region 31 is identical, but not as limit.
Step S12: first substrate 21 groups is stood on second substrate 22.
Particularly, Fig. 3 is the schematic diagram that the substrate in batch of present pre-ferred embodiments founds process, as shown in Figure 3, first substrate 21 is placed in the first carrying platform 11, the first carrying platform 11 is utilized to locate and fix first substrate 21, second substrate 22 is placed in the second carrying platform 12, the second carrying platform 12 is utilized to locate and fix second substrate 22, overturning the first carrying platform 11 makes the first carrying platform 11 relative with the second carrying platform 12, the first carrying platform 11 decline is made to carry out pressing with the second carrying platform 12 and make first substrate 21 groups stand on second substrate 22, namely first substrate 21 and second substrate 22 press together.Display panel is such as display panels, and first substrate 21 is such as colored optical filtering substrates, and second substrate 22 is such as thin-film transistor array base-plate.
Step S13: test set stand after the local modified areas of first substrate 21 and second substrate 22.
First substrate 21 after group is vertical with likely there is the integral position of first substrate 21 relative to second substrate 22 (or second substrate 22 is relative to first substrate 21) between second substrate 22 and offset, the tool parameters by adjustment assembling apparatus 10 moves first substrate 21 or second substrate 22 pairs of integral positions and offsets and revise.Local modified areas refers to the position skew being present in the regional area on first substrate 21 and/or second substrate 22 after the integral position skew of the first substrate 21 after standing group and second substrate 22 is revised, such as first substrate 21 is relative to the depression of second substrate 22 (or second substrate 22 is relative to first substrate 21) or projection, and the regional area spacing distance between the first substrate 21 namely caused in the vertical process of group and second substrate 22 is uneven and contraposition that is that produce offsets.Utilize pick-up unit to detect the side-play amount of the local modified areas organizing the first substrate 21 after standing and second substrate 22, and the position at place, local modified areas is marked.
Step S14: utilize heating arrangement 30 pairs of local modified areas heating to offset with the contraposition revising first substrate 21 and second substrate 22.
Particularly, the temperature revised when first substrate 21 offsets with the contraposition of second substrate 22 needed for local modified areas is calculated according to first substrate 21 or the thermal expansivity of second substrate 22 and the side-play amount of local modified areas, heating arrangement 30 has multiple temperature control region 31, finds out the temperature control region 31 corresponding with local modified areas and be heated to required temperature to local modified areas by the mark of local modified areas.Make local modified areas thermal expansion deformation occur to compensate the side-play amount of local modified areas by the temperature in the temperature control region 31 adjusting the heating arrangement 30 corresponding with local modified areas, reach the object revised first substrate 21 and offset with the contraposition of second substrate 22.Such as, first substrate 21 and second substrate 22 are glass substrate, when heating local modified areas, often heat up 1 DEG C, thermal expansion 0.3 μm.
Substrate in batch cube method of the present invention utilizes assembling apparatus 10 that first substrate 21 groups is stood on second substrate 22, test set stand after the local modified areas of first substrate 21 and second substrate 22, heating arrangement 30 pairs of local modified areas heating of recycling assembling apparatus 10 offset with the contraposition revising first substrate 21 and second substrate 22.Make local modified areas that thermal expansion deformation occur by the temperature adjusting heating arrangement 30 and reach the object revised first substrate 21 and offset with the contraposition of second substrate 22, the distortion of the regional area of first substrate 21 and second substrate 22 is revised, the group that effectively improve display panel founds precision, improves the yield of product.
Above substrate in batch cube method provided by the present invention is described in detail, apply specific case herein to set forth principle of the present invention and embodiment, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. a substrate in batch cube method, the group of the first substrate and second substrate that are suitable for display panel is stood, and it is characterized in that, described substrate in batch cube method comprises:
The assembling apparatus with heating arrangement is provided;
Utilize described assembling apparatus that described first substrate group is stood on described second substrate;
Test set stand after described first substrate and the local modified areas of described second substrate; And
Described heating arrangement is utilized to offset with the contraposition revising described first substrate and described second substrate the heating of described local modified areas.
2. substrate in batch cube method as claimed in claim 1, it is characterized in that, described heating arrangement has multiple temperature control region, and each described temperature control region independently can control heating-up temperature.
3. substrate in batch cube method as claimed in claim 1, it is characterized in that, described assembling apparatus comprises the first carrying platform and the second carrying platform, and in described first carrying platform and described second carrying platform, at least one is provided with described heating arrangement.
4. substrate in batch cube method as claimed in claim 3, it is characterized in that, the method that described first substrate group stands on described second substrate comprises: described first substrate is placed in described first carrying platform, described first carrying platform is utilized to locate and fix described first substrate, described second substrate is placed in the second carrying platform, described second carrying platform is utilized to locate and fix described second substrate, overturning described first carrying platform makes described first carrying platform relative with described second carrying platform, make described first carrying platform decline carry out pressing with described second carrying platform and stand on described second substrate to make described first substrate group.
5. substrate in batch cube method as claimed in claim 1, is characterized in that, described local modified areas is the position skew of the regional area organizing the described first substrate after standing and/or described second substrate.
6. substrate in batch cube method as claimed in claim 5, is characterized in that, the position skew of described regional area refers to depression or the projection of the relatively described second substrate of described first substrate or the relatively described first substrate of described second substrate.
7. substrate in batch cube method as claimed in claim 5, it is characterized in that, test set stand after described first substrate and the local modified areas of described second substrate also comprise utilize pick-up unit to detect to organize vertical after described first substrate and the side-play amount of described local modified areas of described second substrate.
8. substrate in batch cube method as claimed in claim 7, it is characterized in that, utilize described heating arrangement to comprise the method that the heating of described local modified areas offset with the contraposition revising described first substrate and described second substrate: to calculate the temperature needed for described local modified areas according to described first substrate or the thermal expansivity of described second substrate and the described side-play amount of described local modified areas, utilize described heating arrangement to described local modified areas heat make its reach described needed for temperature.
9. substrate in batch cube method as claimed in claim 8, is characterized in that, heat described local modified areas, often heats up 1 DEG C, described local modified areas thermal expansion 0.3 μm.
10. substrate in batch cube method as claimed in claim 1, it is characterized in that, described display panel is display panels, and described first substrate is colored optical filtering substrates, and described second substrate is thin-film transistor array base-plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510507371.3A CN105044951B (en) | 2015-08-18 | 2015-08-18 | Substrate method for assembling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510507371.3A CN105044951B (en) | 2015-08-18 | 2015-08-18 | Substrate method for assembling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105044951A true CN105044951A (en) | 2015-11-11 |
| CN105044951B CN105044951B (en) | 2018-01-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510507371.3A Active CN105044951B (en) | 2015-08-18 | 2015-08-18 | Substrate method for assembling |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107272233A (en) * | 2017-07-24 | 2017-10-20 | 武汉华星光电技术有限公司 | Alignment device |
| CN110908152A (en) * | 2019-11-08 | 2020-03-24 | 深圳市华星光电半导体显示技术有限公司 | Base plate assembling machine table and method for assembling base plate into box |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54150149A (en) * | 1978-05-17 | 1979-11-26 | Hitachi Ltd | Production of liquid crystal display device |
| JPH0933905A (en) * | 1995-07-25 | 1997-02-07 | Hitachi Kasei Techno Plant Kk | Heat treatment device for glass substrate for liquid crystal |
| JPH11199258A (en) * | 1998-01-07 | 1999-07-27 | Canon Inc | Heat treatment device for glass substrate |
| JP2002318378A (en) * | 2001-04-22 | 2002-10-31 | Mikuni Denshi Kk | Method for assembling liquid crystal display device and its device |
| CN1763614A (en) * | 2004-10-18 | 2006-04-26 | 中华映管股份有限公司 | Exposure process |
| CN1971343A (en) * | 2006-12-05 | 2007-05-30 | 友达光电股份有限公司 | Checking platform and checking method using the same |
| CN1991445A (en) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | Inspection apparatus for liquid crystal display panels |
| KR20100012386A (en) * | 2008-07-28 | 2010-02-08 | 주식회사 테라세미콘 | Apparatus for heat treatment |
| CN201540421U (en) * | 2009-08-19 | 2010-08-04 | 郑春晓 | Semiautomatic heating rotary type vacuum laminating machine |
| CN102863147A (en) * | 2012-09-26 | 2013-01-09 | 深圳市华星光电技术有限公司 | Device and method for baking substrate |
-
2015
- 2015-08-18 CN CN201510507371.3A patent/CN105044951B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54150149A (en) * | 1978-05-17 | 1979-11-26 | Hitachi Ltd | Production of liquid crystal display device |
| JPH0933905A (en) * | 1995-07-25 | 1997-02-07 | Hitachi Kasei Techno Plant Kk | Heat treatment device for glass substrate for liquid crystal |
| JPH11199258A (en) * | 1998-01-07 | 1999-07-27 | Canon Inc | Heat treatment device for glass substrate |
| JP2002318378A (en) * | 2001-04-22 | 2002-10-31 | Mikuni Denshi Kk | Method for assembling liquid crystal display device and its device |
| CN1763614A (en) * | 2004-10-18 | 2006-04-26 | 中华映管股份有限公司 | Exposure process |
| CN1991445A (en) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | Inspection apparatus for liquid crystal display panels |
| CN1971343A (en) * | 2006-12-05 | 2007-05-30 | 友达光电股份有限公司 | Checking platform and checking method using the same |
| KR20100012386A (en) * | 2008-07-28 | 2010-02-08 | 주식회사 테라세미콘 | Apparatus for heat treatment |
| CN201540421U (en) * | 2009-08-19 | 2010-08-04 | 郑春晓 | Semiautomatic heating rotary type vacuum laminating machine |
| CN102863147A (en) * | 2012-09-26 | 2013-01-09 | 深圳市华星光电技术有限公司 | Device and method for baking substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107272233A (en) * | 2017-07-24 | 2017-10-20 | 武汉华星光电技术有限公司 | Alignment device |
| CN110908152A (en) * | 2019-11-08 | 2020-03-24 | 深圳市华星光电半导体显示技术有限公司 | Base plate assembling machine table and method for assembling base plate into box |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105044951B (en) | 2018-01-16 |
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Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee after: InfoVision Optoelectronics(Kunshan)Co.,Ltd. Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee before: INFOVISION OPTOELECTRONICS (KUNSHAN) Co.,Ltd. |