CN110560327A - Silicon wafer coating source device - Google Patents
Silicon wafer coating source device Download PDFInfo
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- CN110560327A CN110560327A CN201810570807.7A CN201810570807A CN110560327A CN 110560327 A CN110560327 A CN 110560327A CN 201810570807 A CN201810570807 A CN 201810570807A CN 110560327 A CN110560327 A CN 110560327A
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- silicon wafer
- fixed
- coating device
- source coating
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 92
- 239000010703 silicon Substances 0.000 title claims abstract description 92
- 239000011248 coating agent Substances 0.000 title claims abstract description 49
- 238000000576 coating method Methods 0.000 title claims abstract description 49
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 239000003292 glue Substances 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims description 20
- 239000002699 waste material Substances 0.000 claims description 12
- 230000000903 blocking effect Effects 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 60
- 239000003973 paint Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
Abstract
本发明提出一种硅片涂源装置，硅片涂源装置所述包括机械手机构、点胶装置、驱动装置、定位工装台，所述驱动装置和所述定位工装台固定连接并带动所述定位工装台一起旋转运动，所述机械手机构夹取待加工的硅片放置在所述定位工装台上，所述点胶装置对所述定位工装台上的待加工的硅片进行点胶，胶水随着所述驱动装置高速旋转下在硅片的端面甩均匀，利用驱动装置产生离心力从而对硅片涂源均匀、全自动化、效率高、品质好、涂料不污染设备。
The present invention proposes a silicon wafer source coating device. The silicon wafer source coating device includes a manipulator mechanism, a glue dispensing device, a driving device, and a positioning tooling table. The driving device is fixedly connected to the positioning tooling table and drives the positioning device. The tooling table rotates together, the manipulator mechanism clamps the silicon wafer to be processed and places it on the positioning tooling table, and the dispensing device dispenses glue on the silicon wafer to be processed on the positioning tooling table, and the glue follows With the driving device rotating at high speed, the end face of the silicon wafer is thrown evenly, and the centrifugal force generated by the driving device is used to coat the silicon wafer evenly, fully automatic, high in efficiency, good in quality, and the coating does not pollute the equipment.
Description
技术领域technical field
本发明涉及机械生产设备领域，尤其是一种硅片涂源装置。The invention relates to the field of mechanical production equipment, in particular to a source coating device for silicon wafers.
背景技术Background technique
随着半导体行业的迅速发展，半导体硅片产能日趋扩大。半导体硅片制作过程中需要对硅片点胶涂源，而现有技术中，多使用手动涂覆的方法完成，自动化程度低且涂源不均匀，导致产品效率与质量都有待提高，目前手动涂敷的操作方法存在：人工作业失误率高；需配备专人进行操作；手动涂敷效率低的问题，且涂料在涂源时外洒造成设备污染，因此急需一种新的技术方案解释上述问题。With the rapid development of the semiconductor industry, the production capacity of semiconductor silicon wafers is expanding day by day. During the production process of semiconductor silicon wafers, it is necessary to apply glue to silicon wafers. In the existing technology, manual coating is mostly used. The degree of automation is low and the coating source is uneven, which leads to the improvement of product efficiency and quality. At present, manual The operation method of coating has the following problems: high error rate of manual operation; special personnel are required to operate; manual coating efficiency is low, and the coating is spilled outside the source to cause equipment pollution, so a new technical solution is urgently needed to explain the above question.
发明内容Contents of the invention
为了解决上述问题，本发明提出一种利用马达产生离心力从而对硅片涂源均匀、全自动化、效率高、品质好、涂料不污染设备的硅片涂源装置。In order to solve the above problems, the present invention proposes a silicon wafer coating device that utilizes a motor to generate centrifugal force to coat silicon wafers evenly, is fully automated, has high efficiency, good quality, and does not pollute the equipment.
本发明通过以下技术方案实现的：The present invention is realized through the following technical solutions:
本发明提出一种硅片涂源装置，所述硅片涂源装置包括机械手机构、点胶装置、驱动装置、定位工装台，所述驱动装置和所述定位工装台固定连接并带动所述定位工装台一起旋转运动，所述机械手机构夹取待加工的硅片放置在所述定位工装台上，所述点胶装置对所述定位工装台上的待加工的硅片进行点胶，胶水随着所述驱动装置高速旋转下在硅片的端面甩均匀。The present invention proposes a silicon wafer source coating device. The silicon wafer source coating device includes a manipulator mechanism, a glue dispensing device, a driving device, and a positioning tooling table. The driving device is fixedly connected to the positioning tooling table and drives the positioning device. The tooling table rotates together, the manipulator mechanism clamps the silicon wafer to be processed and places it on the positioning tooling table, and the dispensing device dispenses glue on the silicon wafer to be processed on the positioning tooling table, and the glue follows With the high-speed rotation of the driving device, the end face of the silicon wafer is thrown evenly.
进一步的，所述硅片涂源装置包括固定底板及盖板，所述驱动装置固定安装在所述固定底板上，所述定位工装台位于所述固定底板和所述盖板之间。Further, the silicon wafer coating source device includes a fixed base plate and a cover plate, the driving device is fixedly mounted on the fixed base plate, and the positioning tooling table is located between the fixed base plate and the cover plate.
进一步的，所述硅片涂源装置包括挡边圈，所述挡边圈套设于所述定位工装台并收容所述定位工装台。Further, the silicon wafer coating source device includes a rib ring, and the rib ring is sleeved on the positioning tool table and accommodates the positioning tool table.
进一步的，所述硅片涂源装置包括设有支撑所述挡边圈的支撑板、与所述固定底板固定在一起的第一安装板、与所述第一安装板固定连接的滑块。Further, the silicon wafer coating source device includes a support plate for supporting the rib ring, a first mounting plate fixed with the fixed bottom plate, and a slider fixedly connected with the first mounting plate.
进一步的，所述支撑板上设有滑轨，所述滑轨和所述滑块之间产生相对位移从而使得所述挡边圈上升或者下降。Further, a slide rail is provided on the support plate, and a relative displacement occurs between the slide rail and the slider so that the rib ring rises or falls.
进一步的，所述盖板还设有定位孔，当所述挡边圈上升时，所述挡边圈抵靠在所述定位孔中，所述点胶装置透过所述定位孔对所述定位工装台上的待加工的硅片进行点胶；当所述挡边圈下降时，所述挡边圈远离所述定位孔。Further, the cover plate is also provided with a positioning hole. When the rib ring is raised, the rib ring is against the positioning hole, and the glue dispensing device passes through the positioning hole to the positioning hole. Positioning the silicon wafer to be processed on the tooling table for dispensing; when the rib ring descends, the rib ring is far away from the positioning hole.
进一步的，所述挡边圈上设有废液接口，所述盖板设有接液座，所述废液接口和所述接液座均用于回收废液。Further, the flange ring is provided with a waste liquid interface, and the cover plate is provided with a liquid receiving seat, and both the waste liquid interface and the liquid receiving seat are used to recover waste liquid.
进一步的，所述点胶装置包括点胶头、与所述点胶头固定并相通的固定座、与所述固定座固定连接的固定架、驱动所述固定架旋转运动的旋转机构、驱动所述固定架上下运动的升降机构、安装所述旋转机构和所述升降机构的第二安装板、两端分别与所述第二安装板、所述固定底板固定连接的固定杆。Further, the glue dispensing device includes a glue dispensing head, a fixing seat fixed and communicated with the glue dispensing head, a fixing frame fixedly connected with the fixing seat, a rotating mechanism driving the rotating movement of the fixing frame, and a driving unit The elevating mechanism for the vertical movement of the fixed frame, the second mounting plate for installing the rotating mechanism and the elevating mechanism, and the fixed rods with both ends fixedly connected with the second mounting plate and the fixed bottom plate respectively.
进一步的，所述机械手机构设有多个用于吸附硅片的吸头，所述定位工装台上设有用于吸附硅片的吸孔，所述硅片涂源装置还包括抽风管组件，所述抽风管组件和所述吸孔相通。Further, the manipulator mechanism is provided with a plurality of suction heads for absorbing silicon wafers, the positioning tooling platform is provided with suction holes for absorbing silicon wafers, and the silicon wafer coating source device also includes an exhaust pipe assembly, The exhaust pipe assembly communicates with the suction hole.
进一步的，所述硅片涂源装置还包括与所述固定底板固定的罩底座，所述罩底座上设有与罩底座铰接的罩板，所述罩板固定设有提手，所述提手用于打开或者关闭所述罩板。Further, the silicon wafer source coating device also includes a cover base fixed to the fixed bottom plate, a cover plate hinged with the cover base is provided on the cover base, a handle is fixed on the cover plate, and the handle Hands are used to open or close the panel.
本发明的有益效果：Beneficial effects of the present invention:
本发明提出的硅片涂源装置包括机械手机构、点胶装置、驱动装置、定位工装台，所述驱动装置和所述定位工装台固定连接并带动所述定位工装台一起旋转运动，所述机械手机构夹取待加工的硅片放置在所述定位工装台上，所述点胶装置对所述定位工装台上的待加工的硅片进行点胶，胶水随着所述驱动装置高速旋转下在硅片的端面甩均匀，利用驱动装置产生离心力从而对硅片涂源均匀、全自动化、效率高、品质好、涂料不污染设备。The silicon chip coating source device proposed by the present invention includes a manipulator mechanism, a glue dispensing device, a driving device, and a positioning tooling table. The driving device is fixedly connected to the positioning tooling table and drives the positioning tooling table to rotate together. The manipulator The mechanism clamps the silicon wafer to be processed and places it on the positioning tooling table. The glue dispensing device dispenses glue on the silicon wafer to be processed on the positioning tooling table. The end face of the silicon wafer is thrown evenly, and the driving device is used to generate centrifugal force to coat the silicon wafer evenly, fully automatic, high in efficiency, good in quality, and the paint does not pollute the equipment.
附图说明Description of drawings
图1为本发明的硅片涂源装置的部分结构示意图；Fig. 1 is the partial structural representation of silicon chip coating source device of the present invention;
图2为本发明的硅片涂源装置的点胶装置的结构示意图；Fig. 2 is the structural representation of the dispensing device of the silicon chip coating source device of the present invention;
图3为本发明的硅片涂源装置的定位工装台的结构示意图；Fig. 3 is a schematic structural view of the positioning tooling platform of the silicon wafer coating source device of the present invention;
图4为本发明的硅片涂源装置的部分结构示意图；Fig. 4 is a partial structural schematic diagram of the silicon chip coating source device of the present invention;
图5为本发明的硅片涂源装置的装配后结构示意图。Fig. 5 is a schematic diagram of the assembled structure of the silicon wafer source coating device of the present invention.
具体实施方式Detailed ways
为了更加清楚、完整的说明本发明的技术方案，下面结合附图对本发明作进一步说明。In order to describe the technical solution of the present invention more clearly and completely, the present invention will be further described below in conjunction with the accompanying drawings.
请参考图1-图5，本发明提出一种硅片涂源装置，所述硅片涂源装置包括机械手机构1、点胶装置2、驱动装置3、定位工装台4，所述驱动装置3和所述定位工装台4固定连接并带动所述定位工装台4一起旋转运动，所述机械手机构1夹取待加工的硅片放置在所述定位工装台4上，所述点胶装置2对所述定位工装台4上的待加工的硅片进行点胶，胶水随着所述驱动装置3高速旋转下在硅片的端面甩均匀。Please refer to Fig. 1-Fig. 5, the present invention proposes a silicon wafer source coating device, the silicon wafer source coating device includes a manipulator mechanism 1, a glue dispensing device 2, a driving device 3, a positioning tooling table 4, and the driving device 3 It is fixedly connected with the positioning tooling table 4 and drives the positioning tooling table 4 to rotate together, the manipulator mechanism 1 clamps the silicon wafer to be processed and places it on the positioning tooling table 4, and the dispensing device 2 pairs Glue is dispensed on the silicon wafer to be processed on the positioning tool table 4, and the glue is evenly sprayed on the end face of the silicon wafer as the driving device 3 rotates at a high speed.
在本发明的一个实施方式中，所述驱动装置3可以为dd马达，转速可达2000～4000转，所述点胶装置2对所述定位工装台4上的待加工的硅片进行点胶，胶水滴落在硅片的中心，当驱动装置3通电转动时，所述定位工装台4也跟随着进行高速转动，固定在所述定位工装台4上的待加工的硅片也跟随着进行高速转动带来巨大的离心力，点胶后的胶水在离心力作用下在硅片的表面甩均匀，相比与人工涂源更加均匀，无需人工操作涂源，实现全自动化、效率高、品质好的优点。In one embodiment of the present invention, the driving device 3 may be a dd motor with a rotating speed of 2000-4000 revolutions, and the dispensing device 2 dispenses the silicon wafers to be processed on the positioning tooling table 4 , the glue drops on the center of the silicon wafer, and when the driving device 3 is energized and rotated, the positioning tool table 4 also rotates at a high speed, and the silicon wafer to be processed fixed on the positioning tool table 4 also follows. High-speed rotation brings huge centrifugal force, and the glue after dispensing is thrown evenly on the surface of the silicon wafer under the action of centrifugal force, which is more uniform than manual coating source, without manual operation of coating source, realizing full automation, high efficiency and good quality advantage.
在本发明的一个实施方式中，所述定位工装台4具有3个，对应地，机械手机构1、点胶装置2、驱动装置3均具有3个，3个工位一起工作，进一步地加快产品的生产效率。In one embodiment of the present invention, there are three positioning tooling tables 4, and correspondingly, there are three manipulator mechanisms 1, glue dispensing devices 2, and driving devices 3, and the three stations work together to further speed up the production process. production efficiency.
进一步的，所述硅片涂源装置包括固定底板5及盖板6，所述驱动装置3固定安装在所述固定底板5上，所述定位工装台4位于所述固定底板5和所述盖板6之间。Further, the silicon wafer coating source device includes a fixed base plate 5 and a cover plate 6, the driving device 3 is fixedly installed on the fixed base plate 5, and the positioning tooling table 4 is located between the fixed base plate 5 and the cover plate. between plates 6.
在本发明的一个实施方式中，所述固定底板5用于支撑所述驱动装置3，所述盖板6位于所述固定底板5之上。In one embodiment of the present invention, the fixed bottom plate 5 is used to support the driving device 3 , and the cover plate 6 is located on the fixed bottom plate 5 .
进一步的，所述硅片涂源装置包括挡边圈7，所述挡边圈7套设于所述定位工装台4并收容所述定位工装台4，所述挡边圈7上设有废液接口70，所述盖板6设有接液座61，所述废液接口70和所述接液座61均用于回收废液。Further, the silicon wafer source coating device includes a rib ring 7, the rib ring 7 is sleeved on the positioning tooling table 4 and accommodates the positioning tooling table 4, and the rib ring 7 is provided with waste Liquid interface 70, the cover plate 6 is provided with a liquid receiving seat 61, and both the waste liquid interface 70 and the liquid receiving seat 61 are used to recover waste liquid.
在本发明的一个实施方式中，所述挡边圈7具有容纳空间，容纳所述定位工装台4及固定在所述定位工装台4的硅片，所述挡边圈7套于所述定位工装台4的侧面且和所述定位工装台4存在一定的缝隙，方便所述挡边圈7相对于所述定位工装台4进行活动，由于驱动装置3带动所述定位工装台4上的待加工的硅片高速旋转，涂料在离心力的作用下甩向四周，因此设置挡边圈7来收集甩出的多余是废弃涂料，然后再通过废液接口70排出废弃涂料，防止涂料在涂源时污染设备，达到整洁、干净的目的，进一步提升产品的品质。In one embodiment of the present invention, the rib ring 7 has an accommodating space for accommodating the positioning tool table 4 and the silicon wafer fixed on the positioning tool table 4, and the rib ring 7 is sleeved on the positioning tool table 4. There is a certain gap between the side of the tooling table 4 and the positioning tooling table 4 to facilitate the movement of the rib ring 7 relative to the positioning tooling table 4. The processed silicon wafer rotates at high speed, and the paint is thrown to the surroundings under the action of centrifugal force. Therefore, the rib ring 7 is set to collect the excess paint that is thrown out, and then the waste paint is discharged through the waste liquid interface 70 to prevent the paint from being sprayed at the source. Contaminate the equipment to achieve the purpose of neatness and cleanliness, and further improve the quality of the product.
在本发明的一个实施方式中，所述盖板6设有接液座61，当所述点胶装置2需要更换涂料或者所述点胶装置2点胶后有残余涂料在表面时，将所述点胶装置2插入接液座61中进行操作，实现所述点胶装置2清洗或者处理残余涂料，防止涂料在不涂源时污染设备，进一步地达到整洁、干净的目的。In one embodiment of the present invention, the cover plate 6 is provided with a liquid receiving seat 61. When the dispensing device 2 needs to replace the paint or the dispensing device 2 has residual paint on the surface after dispensing, the liquid The glue dispensing device 2 is inserted into the liquid receiving seat 61 for operation, so as to realize the cleaning of the glue dispensing device 2 or dispose of residual paint, prevent the paint from polluting the equipment when it is not applied, and further achieve the purpose of cleanliness and cleanliness.
进一步的，所述硅片涂源装置包括设有支撑所述挡边圈7的支撑板71、与所述固定底板5固定在一起的第一安装板9、与所述第一安装板9固定连接的滑块10。Further, the silicon wafer coating source device includes a support plate 71 for supporting the rib ring 7, a first mounting plate 9 fixed with the fixed bottom plate 5, and a first mounting plate 9 fixed with the first mounting plate 9. Connected sliders 10.
进一步的，所述支撑板71上设有滑轨80，所述滑轨80和所述滑块10之间产生相对位移从而使得所述挡边圈7上升或者下降。Further, the support plate 71 is provided with a slide rail 80 , and a relative displacement occurs between the slide rail 80 and the slider 10 so that the rib ring 7 rises or falls.
在本发明的一个实施方式中，所述滑块10不动，所述驱动机构驱动所述滑轨80相对于所述滑块10产生相对位移，从而使得与所述支撑板71固定连接的挡边圈7实现上升或者下降。In one embodiment of the present invention, the slider 10 does not move, and the driving mechanism drives the slide rail 80 to generate a relative displacement relative to the slider 10, so that the stopper fixedly connected to the support plate 71 Side ring 7 realizes rising or falling.
进一步的，所述盖板6还设有定位孔60，当所述挡边圈7上升时，所述挡边圈7抵靠在所述定位孔60中，所述点胶装置2透过所述定位孔60对所述定位工装台4上的待加工的硅片进行点胶；当所述挡边圈7下降时，所述挡边圈7远离所述定位孔60。Further, the cover plate 6 is also provided with a positioning hole 60. When the rib ring 7 rises, the rib ring 7 abuts against the positioning hole 60, and the dispensing device 2 passes through the positioning hole 60. The positioning hole 60 is used for dispensing the silicon wafer to be processed on the positioning tooling table 4; when the rib ring 7 descends, the rib ring 7 is far away from the positioning hole 60.
在本发明的一个实施方式中，当驱动装置3开始准备旋转时，所述挡边圈7上升从而所述挡边圈7抵靠安装在所述定位孔60中并收容所述定位工装台4及所述定位工装台4上的待加工的硅片；当硅片涂源完成后，当所述挡边圈7下降从而所述挡边圈7远离所述定位孔60，所述挡边圈7露出所述定位工装台4及所述定位工装台4上的加工完成的硅片；设置所述挡边圈7伸缩上升或下降，是为了方便机械手机构1夹取待加工的硅片放入到所述定位工装台4以及加工完成后，机械手机构1夹取走加工完成的硅片，因为所述挡边圈7工作时，需要高于所述定位工装台4才可以收集废弃涂源，防止污染设备。In one embodiment of the present invention, when the driving device 3 starts to rotate, the rib ring 7 rises so that the rib ring 7 is mounted against the positioning hole 60 and accommodates the positioning tooling platform 4 and the silicon wafer to be processed on the positioning tooling table 4; after the silicon wafer coating source is completed, when the rib ring 7 descends so that the rib ring 7 is away from the positioning hole 60, the rib ring 7. Expose the positioning tooling platform 4 and the processed silicon wafers on the positioning tooling platform 4; the rib ring 7 is set to stretch up or down to facilitate the manipulator mechanism 1 to pick up the silicon wafers to be processed and put them into After the positioning tool table 4 and the processing are completed, the manipulator mechanism 1 clamps and removes the processed silicon wafer, because when the rib ring 7 is working, it needs to be higher than the positioning tool table 4 to collect waste coating sources. Prevent contamination of equipment.
进一步的，所述点胶装置2包括点胶头20、与所述点胶头20固定并相通的固定座21、与所述固定座21固定连接的固定架22、驱动所述固定架22旋转运动的旋转机构23、驱动所述固定架22上下运动的升降机构24、安装所述旋转机构23和所述升降机构24的第二安装板25、两端分别与所述第二安装板25、所述固定底板5固定连接的固定杆26。Further, the dispensing device 2 includes a dispensing head 20, a fixing seat 21 fixed and communicated with the dispensing head 20, a fixing frame 22 fixedly connected with the fixing seat 21, and driving the fixing frame 22 to rotate The rotating mechanism 23 of motion, the elevating mechanism 24 that drives described fixed mount 22 to move up and down, the second installation plate 25 that installs described revolving mechanism 23 and described elevating mechanism 24, two ends are respectively connected with described second installation plate 25, The fixed bottom plate 5 is fixedly connected with a fixed rod 26 .
在本发明的一个实施方式中，所述点胶头20为点胶阀，由气动控制开关，所述固定座21一端为半圆形，半包裹所述点胶头20，所述固定座21设有进液口，通过进液口，涂料进入点胶头20中，通过所述固定架22的联动，精准控制所述点胶头20的旋转运动和升降运动，所述第二安装板25用于安装固定所述旋转机构23和所述升降机构24，所述固定架22穿过所述固定底板5，所述固定杆26具有多个，通过固定杆26连接，所述第二安装板25平行地固定在所述固定底板5下方。In one embodiment of the present invention, the dispensing head 20 is a dispensing valve, which is switched by pneumatic control, and one end of the fixing seat 21 is semicircular, half-wrapping the dispensing head 20, and the fixing seat 21 There is a liquid inlet, through which the paint enters the dispensing head 20, through the linkage of the fixed frame 22, the rotation and lifting movement of the dispensing head 20 is precisely controlled, and the second mounting plate 25 For installing and fixing the rotating mechanism 23 and the lifting mechanism 24, the fixing frame 22 passes through the fixing bottom plate 5, and the fixing rod 26 has a plurality of connections through the fixing rod 26. The second mounting plate 25 are fixed below the fixed bottom plate 5 in parallel.
进一步的，所述机械手机构1设有多个用于吸附硅片的吸头100，所述定位工装台4上设有用于吸附硅片的吸孔40，所述硅片涂源装置还包括抽风管组件41，所述抽风管组件41和所述吸孔40相通。Further, the manipulator mechanism 1 is provided with a plurality of suction heads 100 for absorbing silicon wafers, the positioning tool table 4 is provided with suction holes 40 for absorbing silicon wafers, and the silicon wafer coating source device also includes suction An air duct assembly 41 , the exhaust duct assembly 41 communicates with the suction hole 40 .
在本发明的一个实施方式中，所述吸头100为无痕吸头100，所述吸头100具有多个，夹取时不会损坏硅片的表面，且所述吸头100由气动控制，在吸取硅片时，所述吸头100内部产生真空从而使得硅片稳稳地吸附在所述吸头100上，当吸头100带着硅片放置在所述定位工装台4后，进气使得所述吸头100回复压力，此时吸头100对硅片没有吸附作用；所述吸孔40通过抽风管组件41抽取气压产生真空，当所述定位工装台4带动所述硅片跟随所述驱动装置3高速旋转时，所述吸孔40吸附住硅片，避免硅片甩出来，无需额外的工装定位夹具，即可实现对硅片的固定，自动化程度高，且精准控制，效率高。In one embodiment of the present invention, the suction head 100 is a non-marking suction head 100. There are multiple suction heads 100, which will not damage the surface of the silicon wafer when clamping, and the suction head 100 is pneumatically controlled. , when sucking silicon wafers, a vacuum is generated inside the suction head 100 so that the silicon wafers are stably adsorbed on the suction head 100, and when the suction head 100 is placed on the positioning tool table 4 with the silicon wafers, The air makes the suction head 100 return to pressure. At this time, the suction head 100 has no adsorption effect on the silicon wafer; the suction hole 40 draws air pressure through the exhaust pipe assembly 41 to generate a vacuum. When the positioning tooling table 4 drives the silicon wafer When following the high-speed rotation of the driving device 3, the suction hole 40 absorbs the silicon wafer to prevent the silicon wafer from being thrown out, and the silicon wafer can be fixed without additional tooling and positioning fixtures, with a high degree of automation and precise control. efficient.
进一步的，所述硅片涂源装置还包括与所述固定底板5固定的罩底座11，所述罩底座11上设有与罩底座11铰接的罩板110，所述罩板110固定设有提手111，所述提手111用于打开或者关闭所述罩板110。Further, the silicon wafer source coating device also includes a cover base 11 fixed to the fixed bottom plate 5, the cover base 11 is provided with a cover plate 110 hinged with the cover base 11, and the cover plate 110 is fixedly provided with The handle 111 is used for opening or closing the cover plate 110 .
在本发明的一个实施方式中，所述罩底座11用于防尘，避免微尘进入定位工装台4对硅片污染，所述罩底座11上设有与罩底座11铰接的罩板110，所述罩板110固定设有提手111，所述提手111用于打开或者关闭所述罩板110，方便操作，所述罩底座11侧面还设有多个观察玻璃窗口，方便从外面观察硅片涂源装置工作时内部零件的工作情况。In one embodiment of the present invention, the cover base 11 is used for dust-proofing, preventing dust from entering the positioning tooling platform 4 to contaminate the silicon wafer. The cover base 11 is provided with a cover plate 110 hinged to the cover base 11, The cover plate 110 is fixedly provided with a handle 111, and the handle 111 is used to open or close the cover plate 110, which is convenient for operation. The side of the cover base 11 is also provided with a plurality of observation glass windows, which is convenient for observing from the outside. The working condition of the internal parts when the silicon wafer source coating device is working.
当然，本发明还可有其它多种实施方式，基于本实施方式，本领域的普通技术人员在没有做出任何创造性劳动的前提下所获得其他实施方式，都属于本发明所保护的范围。Certainly, the present invention may also have other various implementation modes. Based on this implementation mode, other implementation modes obtained by those skilled in the art without any creative work shall fall within the protection scope of the present invention.
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