CN203364806U - Carrying disc detection device - Google Patents
Carrying disc detection device Download PDFInfo
- Publication number
- CN203364806U CN203364806U CN 201320298459 CN201320298459U CN203364806U CN 203364806 U CN203364806 U CN 203364806U CN 201320298459 CN201320298459 CN 201320298459 CN 201320298459 U CN201320298459 U CN 201320298459U CN 203364806 U CN203364806 U CN 203364806U
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- plate
- load plate
- unit
- probe
- pick
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000001514 detection method Methods 0.000 title claims abstract description 37
- 239000000523 sample Substances 0.000 claims abstract description 34
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000005259 measurement Methods 0.000 abstract description 4
- 230000007774 longterm Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 24
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A carrier tray detection device for detecting the flatness of a carrier tray having a detection surface and for mounting a thickness measurement unit to detect the thickness of a wafer carried on the carrier tray, the detection device comprising: the device comprises a lifting mechanism, a balance mechanism arranged below a lifting plate of the lifting mechanism, and a leveling detection unit erected on the balance mechanism, wherein the balance mechanism comprises a balance plate which can be obliquely hung below the lifting plate, the leveling detection unit comprises a reference probe and a detection probe, and the reference probe and the detection probe are arranged on the balance plate and can abut against a detection surface of the carrying disc. The flatness detection unit can measure the flatness of the carrier plate so as to avoid influencing the accuracy of the thickness measurement unit for measuring the wafer when the carrier plate is warped due to long-term use.
Description
Technical field
The utility model relates to a kind of pick-up unit, particularly relates to a kind of load plate pick-up unit that is used for detecting the planarization of load plate.
Background technology
General industry is when producing integrated circuit, usually several wafers (wafer) are placed on a load plate, by carrying of this load plate, aforementioned wafer is transported to a machining machine and tool and carries out every processing, because the thickness accuracy of wafer can affect the yield of successive process, therefore, this case applicant once proposed TaiWan, China M427665 utility model, but this utility model mainly will be used for measuring the measurement probe carriage of wafer thickness accuracy and be located on the balance plate of a beat, a detection faces that recycles this load plate is adjusted the deflection angle of this balance plate, thus, thickness that just can the described wafer of accurately measuring.Take the detection faces of load plate due to aforementioned utility model is benchmark, therefore, if can further detect the planarization of this load plate when measuring wafer thickness, can improve the accuracy that measures wafer thickness.
Summary of the invention
The purpose of this utility model is to provide a kind of planarization that can detect load plate, measures the load plate pick-up unit of accuracy to improve wafer thickness.
The utility model load plate pick-up unit is for detecting the planarization of a load plate, and can set up for a thickness measuring unit, be carried on the thickness of the wafer on this load plate with detection, described load plate has a detection faces, and this pick-up unit comprises: an elevating mechanism with a lifter plate, one is arranged on the lifter plate below of this elevating mechanism and is subject to this elevating mechanism driving and the balanced controls of reciprocal lifting, an and smooth detecting unit be erected on these balanced controls, these balanced controls comprise that can be hung from above the balance plate below this lifter plate on the bias, described smooth detecting unit comprises a reference probe that is installed on this balance plate, and one be installed on described balance plate the detector probe spaced with this reference probe, this reference probe and this detector probe also can be resisted against on the detection faces of this load plate.
Load plate pick-up unit described in the utility model, this reference probe is positioned at the central authorities of this load plate, and this detector probe and this reference probe are spaced, and the edge of contiguous this load plate.
Load plate pick-up unit described in the utility model, these balanced controls also comprise that several are installed on this balance plate and can shore the reference column on the detection faces of this load plate.
Load plate pick-up unit described in the utility model, these balanced controls also comprise that several can be hung this balance plate from above hanger bar below the lifter plate of this elevating mechanism on the bias, and this elevating mechanism also comprises a support, and a lifting assembly that is installed on this support, this lifting assembly has at least one telescoping cylinder that is used for driving this lifter plate lifting.
The beneficial effects of the utility model are: aforementioned smooth detecting unit can measure the planarization of this load plate, to avoid when this load plate, because use for a long time while producing prying, has influence on the accuracy that this thickness measuring unit measures for this wafer thickness.
The accompanying drawing explanation
Fig. 1 is the stereographic map of a preferred embodiment of the utility model load plate pick-up unit;
Fig. 2 is a schematic side view of this preferred embodiment, and in figure, this load plate pick-up unit position is a ready position;
Fig. 3 is a local elevational schematic view of this preferred embodiment;
Fig. 4 is the schematic side view of a similar Fig. 2, and in figure, this load plate pick-up unit position is a detection position.
Embodiment
Below in conjunction with drawings and Examples, the utility model is elaborated.
Consult Fig. 1, 2, 3, a preferred embodiment of the utility model pick-up unit is used for detecting the planarization of a load plate 11, and can set up for a thickness measuring unit 13, this load plate 11 can carry several wafers 12 to carry out every processing simultaneously, this load plate 11 has a detection faces 111 upward again, and several wafer positioning parts 112 recessed around these detection faces 111 Yi Ge centers and with respect to this detection faces 111, described wafer 12 is placed in respectively in the wafer positioning part 112 of this load plate 11, and this thickness measuring unit 13 can be because of one of them of the corresponding described wafer 12 of the rotation of this load plate 11, and there are several down one of them thickness measuring probes 131 of outstanding and corresponding described wafer 12.
This pick-up unit of the present embodiment comprises: elevating mechanism that is positioned at these load plate 11 tops 2, one hang the balanced controls 3 below this elevating mechanism 2 from above, and a smooth detecting unit 4 that detects the planarization of this load plate 11.This elevating mechanism 2 comprises a support 21, a lifting assembly 22 that is arranged on these support 21 the place aheads, and one is subject to this lifting assembly 22 and drives and liftable lifter plate 23.This lifting assembly 22 has two down telescoping cylinders 221 of projection, and this lifter plate 23 is subject to the reciprocally lifting of driving of described telescoping cylinder 221.
But the balanced controls 3 of the present embodiment comprise that a slice is in the balance plate 31 between this lifter plate 23 and this load plate 11, several the hanger bar 32 that this balance plate 31 are suspended in the deflection mode below this lifter plate 23, and several be installed on this balance plate 31 outstanding reference column 33 down.Described reference column 33 is located at this 13 outside, thickness measuring unit around ground, and can be to detection faces 111 that should load plate 11, and every reference column 33 all has a location that is positioned at below and can shores on the detection faces 111 of this load plate 11 and supports end 331.
The smooth detecting unit 4 of the present embodiment comprises a benchmark probe 41 and a detector probe 42 that is installed on this balance plate 31 spacedly and down vertically gives prominence to.This reference probe 41 is positioned at the central authorities of this load plate 11, and the edge of these detector probe 42 contiguous these load plates 11, this reference probe 41 and this detector probe 42 can be resisted against on the detection faces 111 of this load plate 11.
The load plate pick-up unit position of the present embodiment is when a ready position shown in Fig. 2,13 of this thickness measuring unit are directly over one of them of described wafer 12, and the reference probe 41 of this smooth detecting unit 4 and detector probe 42 all position above this load plate 11, and respectively to central authorities and edge that should load plate 11.
Consult Fig. 1,3,4, when this lifting assembly 22 drives this lifter plate 23 to descend, to drive these balanced controls 3 descends together, when the location of the described reference column 33 of these balanced controls 3 is supported end 331 and is resisted against on the detection faces 111 of this load plate 11, the described thickness measuring probe 131 of this thickness measuring unit 13 also can be resisted against one of them end face of described wafer 12, the thickness of the wafer 12 be pressed against with measurement.At the same time, the reference probe 41 of the smooth detecting unit 4 descended along with this balanced controls 3 and the detection faces 111 that detector probe 42 also can be resisted against this load plate 11, with the planarization of the detection faces 111 that detects this load plate 11.That is to say, when this load plate pick-up unit is transformed into the detection position of Fig. 4 by the ready position of Fig. 2, except this thickness measuring unit 13 can detect the thickness of corresponding wafer 12, aforementioned load plate pick-up unit also can detect the planarization of this load plate 11.
When this load plate 11 produces prying, distortion in long-term use and along with described wafer 12 turnover high temperature process environment, reference probe 41 and detector probe 42 on the former detection faces 111 that should simultaneously be resisted against this load plate 11, can sense difference because of the out-of-flatness of the detection faces 111 of this load plate 11, now, this smooth detecting unit 4 just can the output detections result, with notice work people, changes this load plate 11.Specifically, this load plate pick-up unit of the utility model is structure innovation not only, also can detect the planarization of the detection faces 111 of this load plate 11, because the thickness measuring unit 13 of the thickness accuracy that is used for detecting described wafer 12 is to be erected on this balance plate 31, and this balance plate 31 to take the detection faces 111 of this load plate 11 be benchmark, therefore when the planarization of the detection faces 111 of this load plate 11 can be detected, can avoid when this load plate 11 because long-term the use while producing prying has influence on the accuracy of this thickness measuring unit 13 for described wafer 12 thickness measurings.
Additional disclosure, because load plate 11 deflection at edge when being heated was higher in the past, therefore the present embodiment allows this reference probe 41 and this detector probe 42 respectively to central authorities and edge that should load plate 11, can improve the accuracy of the deflection of measuring this load plate 11.
Claims (4)
1. a load plate pick-up unit, be used for detecting the planarization of a load plate, and can set up for a thickness measuring unit, is carried on the thickness of the wafer on this load plate with detection, and described load plate has a detection faces, it is characterized in that: this pick-up unit comprises:
An elevating mechanism, comprise a reciprocally lifter plate of lifting;
Balanced controls, be subject to this elevating mechanism and drive, and comprise that one can be hung from above below this lifter plate and the balance plate set up for this thickness measuring unit on the bias; And
A smooth detecting unit, comprise a benchmark probe and a detector probe on the detection faces that is installed on this balance plate and can be resisted against this load plate.
2. load plate pick-up unit according to claim 1, it is characterized in that: this reference probe is positioned at the central authorities of this load plate, and this detector probe and this reference probe are spaced, and the edge of contiguous this load plate.
3. load plate pick-up unit according to claim 2 is characterized in that: these balanced controls also comprise that several are installed on this balance plate and can shore the reference column on the detection faces of this load plate.
4. load plate pick-up unit according to claim 3, it is characterized in that: but these balanced controls also comprise that several are hung this balance plate from above hanger bar below the lifter plate of this elevating mechanism in the deflection mode, and this elevating mechanism also comprises a support, and a lifting assembly that is installed on this support, this lifting assembly has at least one telescoping cylinder that is used for driving this lifter plate lifting.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101216861 | 2012-08-31 | ||
| TW101216861U TWM447589U (en) | 2012-08-31 | 2012-08-31 | Inspection device for carrying plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203364806U true CN203364806U (en) | 2013-12-25 |
Family
ID=48194976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320298459 Expired - Fee Related CN203364806U (en) | 2012-08-31 | 2013-05-28 | Carrying disc detection device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203364806U (en) |
| TW (1) | TWM447589U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105588538A (en) * | 2016-03-22 | 2016-05-18 | 嘉兴市兴嘉汽车零部件制造有限公司 | Sucking disc location line flatness detection device and detection method |
| CN109211182A (en) * | 2018-10-18 | 2019-01-15 | 广州小鹏汽车科技有限公司 | A kind of circuit board deformability measuring device and method |
| CN110514123A (en) * | 2019-09-20 | 2019-11-29 | 成都博奥晶芯生物科技有限公司 | A kind of microstructured bodies two-dimensional detecting method and device based on laser displacement sensor |
| CN111806764A (en) * | 2020-07-13 | 2020-10-23 | 博众精工科技股份有限公司 | Film covering device |
| CN117047636A (en) * | 2022-11-28 | 2023-11-14 | 东莞市雕润数控科技有限公司 | Semiconductor wafer thinning polisher |
-
2012
- 2012-08-31 TW TW101216861U patent/TWM447589U/en not_active IP Right Cessation
-
2013
- 2013-05-28 CN CN 201320298459 patent/CN203364806U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105588538A (en) * | 2016-03-22 | 2016-05-18 | 嘉兴市兴嘉汽车零部件制造有限公司 | Sucking disc location line flatness detection device and detection method |
| CN105588538B (en) * | 2016-03-22 | 2018-04-03 | 嘉兴市兴嘉汽车零部件制造有限公司 | Sucker position line flatness checking device and detection method |
| CN109211182A (en) * | 2018-10-18 | 2019-01-15 | 广州小鹏汽车科技有限公司 | A kind of circuit board deformability measuring device and method |
| CN110514123A (en) * | 2019-09-20 | 2019-11-29 | 成都博奥晶芯生物科技有限公司 | A kind of microstructured bodies two-dimensional detecting method and device based on laser displacement sensor |
| CN110514123B (en) * | 2019-09-20 | 2021-04-02 | 成都博奥晶芯生物科技有限公司 | Microstructure two-dimensional detection method and device based on laser displacement sensor |
| CN111806764A (en) * | 2020-07-13 | 2020-10-23 | 博众精工科技股份有限公司 | Film covering device |
| CN117047636A (en) * | 2022-11-28 | 2023-11-14 | 东莞市雕润数控科技有限公司 | Semiconductor wafer thinning polisher |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM447589U (en) | 2013-02-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20160528 |