CN108059479A - 一种新型多孔陶瓷加热体的制备工艺 - Google Patents

一种新型多孔陶瓷加热体的制备工艺 Download PDF

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Publication number
CN108059479A
CN108059479A CN201711397395.3A CN201711397395A CN108059479A CN 108059479 A CN108059479 A CN 108059479A CN 201711397395 A CN201711397395 A CN 201711397395A CN 108059479 A CN108059479 A CN 108059479A
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porous ceramic
starch
preparation process
slurry
embedded
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CN201711397395.3A
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CN108059479B (zh
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丁毅
程宏生
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Shenzhen ALD Technology Co Ltd
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ALD Group Ltd
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Priority to CN201711397395.3A priority Critical patent/CN108059479B/zh
Priority to PCT/CN2018/074113 priority patent/WO2019119612A1/zh
Publication of CN108059479A publication Critical patent/CN108059479A/zh
Priority to US16/907,401 priority patent/US11845702B2/en
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Abstract

本发明公开了一种新型多孔陶瓷加热体的制备工艺，涉及加热体制备技术领域；该制备工艺依次包括混料、球磨、脱泡、成型与干燥、排淀粉、烧结、接电极；本发明的有益效果是：整个制造工艺简单,采用箱式炉在氧化气氛和常压下烧结坯体,生产效率高、烧结温度低、利于实现规模化生产；制得的多孔陶瓷加热体加热均匀、加热效率高。

Description

一种新型多孔陶瓷加热体的制备工艺
技术领域
本发明涉及加热体制备技术领域，更具体的说，本发明涉及一种新型多孔陶瓷加热体的制备工艺。
背景技术
多孔陶瓷体可用于各种应用，多孔陶瓷作为固液分离介质、液体的过滤净化、气体净化以及化学反应的催化剂载体等广泛应用在环保、化工、冶金医药及生物医学等领域。另外多孔陶瓷还可以作为加热源，形成多孔陶瓷加热体。但现有技术中的多孔陶瓷加热体，都是将发热丝烧结在多孔陶瓷体的表面上，或者将电阻浆料印刷在致密陶瓷的表面上，在加热过程中只是加热体的表面发热，导致多孔陶瓷加热体的加热不均匀。
发明内容
为了克服现有技术的不足，本发明提供一种新型多孔陶瓷加热体的制备工艺，通过该工艺制得的多孔陶瓷加热体既具有多孔的性质又具有加热体的性质，整体加热过程更为均匀。
本发明解决其技术问题所采用的技术方案是：一种新型多孔陶瓷加热体的制备工艺，其改进之处在于：该制备工艺包括以下的步骤：
A、混料：按质量百分比称取15-45%的硅藻土、5-19%的淀粉、0-2%的纳米二氧化硅溶液、20-40%的去离子水、20-35%的电阻浆料、10-25%的有机溶剂，混和搅拌均匀，制得多孔陶瓷基体浆料；
B、球磨：向步骤A中制得的多孔陶瓷基体浆料加入研磨球，并放入球磨罐中进行湿法球磨，湿法球磨的时间为4-24h；
C、脱泡：将步骤B中湿法球磨后的多孔陶瓷基体浆料在真空条件下进行脱泡；
D、成型与干燥：将步骤C中制得的陶瓷基体浆料用浇注机浇注制成所需形状的陶瓷基体，并将陶瓷基体进行干燥，以形成胚体；
E、排淀粉：将步骤D制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行排淀粉，炉内气氛为氧气；
F、烧结：将步骤E制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行烧结，烧结气氛为氧气，坯体烧结制得多孔陶瓷加热体半成品；
G、接电极：将步骤F制得的多孔陶瓷加热体半成品的两端进行表面镀镍处理，再于镀镍处理后的部位进行钎焊引出电极，制得多孔陶瓷加热体成品。
在上述的结构中，所述的步骤E具体为：将步骤D制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行排淀粉，炉内气氛为氧气，升温速率为1-20℃/min，排淀粉温度为300-600℃，保温时间为2-12h。
在上述的结构中，所述步骤F为：将步骤E制得的胚体置于石墨坩埚中，用隔离粉淹埋，接着放入烧结炉进行烧结，其中升温速率为1-20℃/min，烧结温度为900-1400℃，时间为10-20h，坯体烧结制得多孔陶瓷加热体半成品。
在上述的结构中，所述的步骤A中，多孔陶瓷基体浆料由以下质量百分比的原料组成：
硅藻土15%
淀粉5%
纳米二氧化硅溶液1%
去离子水20%
电阻浆料34%
有机溶剂25%。
在上述的结构中，所述的步骤A中，多孔陶瓷基体浆料由以下质量百分比的原料组成：
硅藻土35%
淀粉12%
纳米二氧化硅溶液2%
去离子水21%
电阻浆料20%
有机溶剂10%。
在上述的结构中，所述的步骤A中，多孔陶瓷基体浆料由以下质量百分比的原料组成：
硅藻土45%
淀粉5%
去离子水20%
电阻浆料20%
有机溶剂10%。
本发明的有益效果是：该工艺为陶瓷粉末和电阻浆料的混合物共烧，所制得的多孔陶瓷加热体为复合物，整体既具有多孔的性质又具有加热体的性质，整体加热使加热过程更均匀，克服了只有表面加热导致加热不均匀的缺点；制得的多孔陶瓷加热体加热均匀、加热效率高，并且该工艺简单，利用规模化的生产。
附图说明
图1为本发明的一种新型多孔陶瓷加热体的制备工艺的工艺流程图。
具体实施方式
下面结合附图和实施例对本发明进一步说明。
以下将结合实施例和附图对本发明的构思、具体结构及产生的技术效果进行清楚、完整地描述，以充分地理解本发明的目的、特征和效果。显然，所描述的实施例只是本发明的一部分实施例，而不是全部实施例，基于本发明的实施例，本领域的技术人员在不付出创造性劳动的前提下所获得的其他实施例，均属于本发明保护的范围。另外，专利中涉及到的所有联接/连接关系，并非单指构件直接相接，而是指可根据具体实施情况，通过添加或减少联接辅件，来组成更优的联接结构。本发明创造中的各个技术特征，在不互相矛盾冲突的前提下可以交互组合。
实施例1
参照图1所示，本发明揭示了一种新型多孔陶瓷加热体的制备工艺，具体的，该工艺包括以下的步骤：
A、混料：按质量百分比称取15%的硅藻土、5%的淀粉、1%的纳米二氧化硅溶液、20%的去离子水、34%的电阻浆料、25%的有机溶剂，混和搅拌均匀，制得多孔陶瓷基体浆料；
B、球磨：向步骤A中制得的多孔陶瓷基体浆料加入研磨球，并放入球磨罐中进行湿法球磨，湿法球磨的时间为4h；
C、脱泡：将步骤B中湿法球磨后的多孔陶瓷基体浆料在真空条件下进行脱泡；
D、成型与干燥：将步骤C中制得的陶瓷基体浆料用浇注机浇注制成所需形状的陶瓷基体，并将陶瓷基体进行干燥，以形成胚体；
E、排淀粉：将步骤D制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行排淀粉，炉内气氛为氧气，升温速率为1℃/min，排淀粉温度为300℃，保温时间为2h；
F、烧结：将步骤E制得的胚体置于石墨坩埚中，用隔离粉淹埋，接着放入烧结炉进行烧结，其中升温速率为1℃/min，烧结温度为900℃，时间为10h，坯体烧结制得多孔陶瓷加热体半成品；
G、接电极：将步骤F制得的多孔陶瓷加热体半成品的两端进行表面镀镍处理，再于镀镍处理后的部位进行钎焊引出电极，制得多孔陶瓷加热体成品。
实施例2
参照图1所示，本发明揭示了一种新型多孔陶瓷加热体的制备工艺，具体的，该工艺包括以下的步骤：
A、混料：按质量百分比称取35%的硅藻土、12%的淀粉、2%的纳米二氧化硅溶液、21%的去离子水、20%的电阻浆料、10%的有机溶剂，混和搅拌均匀，制得多孔陶瓷基体浆料；
B、球磨：向步骤A中制得的多孔陶瓷基体浆料加入研磨球，并放入球磨罐中进行湿法球磨，湿法球磨的时间为24h；
C、脱泡：将步骤B中湿法球磨后的多孔陶瓷基体浆料在真空条件下进行脱泡；
D、成型与干燥：将步骤C中制得的陶瓷基体浆料用浇注机浇注制成所需形状的陶瓷基体，并将陶瓷基体进行干燥，以形成胚体；
E、排淀粉：将步骤D制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行排淀粉，炉内气氛为氧气，升温速率为20℃/min，排淀粉温度为600℃，保温时间为12h；
F、烧结：将步骤E制得的胚体置于石墨坩埚中，用隔离粉淹埋，接着放入烧结炉进行烧结，其中升温速率为20℃/min，烧结温度为1400℃，时间为20h，坯体烧结制得多孔陶瓷加热体半成品；
G、接电极：将步骤F制得的多孔陶瓷加热体半成品的两端进行表面镀镍处理，再于镀镍处理后的部位进行钎焊引出电极，制得多孔陶瓷加热体成品。
实施例3
参照图1所示，本发明揭示了一种新型多孔陶瓷加热体的制备工艺，具体的，该工艺包括以下的步骤：
A、混料：按质量百分比称取45%的硅藻土、5%的淀粉、20%的去离子水、20%的电阻浆料、10%的有机溶剂，混和搅拌均匀，制得多孔陶瓷基体浆料；
B、球磨：向步骤A中制得的多孔陶瓷基体浆料加入研磨球，并放入球磨罐中进行湿法球磨，湿法球磨的时间为14h；
C、脱泡：将步骤B中湿法球磨后的多孔陶瓷基体浆料在真空条件下进行脱泡；
D、成型与干燥：将步骤C中制得的陶瓷基体浆料用浇注机浇注制成所需形状的陶瓷基体，并将陶瓷基体进行干燥，以形成胚体；
E、排淀粉：将步骤D制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行排淀粉，炉内气氛为氧气，升温速率为10℃/min，排淀粉温度为450℃，保温时间为7h；
F、烧结：将步骤E制得的胚体置于石墨坩埚中，用隔离粉淹埋，接着放入烧结炉进行烧结，其中升温速率为10℃/min，烧结温度为1200℃，时间为15h，坯体烧结制得多孔陶瓷加热体半成品；
G、接电极：将步骤F制得的多孔陶瓷加热体半成品的两端进行表面镀镍处理，再于镀镍处理后的部位进行钎焊引出电极，制得多孔陶瓷加热体成品。
综上所述，本发明提供了一种新型多孔陶瓷加热体的制备工艺，该工艺为陶瓷粉末和电阻浆料的混合物共烧，所制得的多孔陶瓷加热体为复合物，整体既具有多孔的性质又具有加热体的性质，整体加热使加热过程更均匀，克服了只有表面加热导致加热不均匀的缺点；整个制造工艺简单,采用箱式炉在氧化气氛和常压下烧结坯体,生产效率高、烧结温度低、利于实现规模化生产；制得的多孔陶瓷加热体加热均匀、加热效率高。
以上是对本发明的较佳实施进行了具体说明，但本发明创造并不限于所述实施例，熟悉本领域的技术人员在不违背本发明精神的前提下还可做出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (6)

1.一种新型多孔陶瓷加热体的制备工艺，其特征在于：该制备工艺包括以下的步骤：
A、混料：按质量百分比称取15-45%的硅藻土、5-19%的淀粉、0-2%的纳米二氧化硅溶液、20-40%的去离子水、20-35%的电阻浆料、10-25%的有机溶剂，混和搅拌均匀，制得多孔陶瓷基体浆料；
B、球磨：向步骤A中制得的多孔陶瓷基体浆料加入研磨球，并放入球磨罐中进行湿法球磨，湿法球磨的时间为4-24h；
C、脱泡：将步骤B中湿法球磨后的多孔陶瓷基体浆料在真空条件下进行脱泡；
D、成型与干燥：将步骤C中制得的陶瓷基体浆料用浇注机浇注制成所需形状的陶瓷基体，并将陶瓷基体进行干燥，以形成胚体；
E、排淀粉：将步骤D制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行排淀粉，炉内气氛为氧气；
F、烧结：将步骤E制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行烧结，烧结气氛为氧气，坯体烧结制得多孔陶瓷加热体半成品；
G、接电极：将步骤F制得的多孔陶瓷加热体半成品的两端进行表面镀镍处理，再于镀镍处理后的部位进行钎焊引出电极，制得多孔陶瓷加热体成品。
2.根据权利要求1所述的一种新型多孔陶瓷加热体的制备工艺，其特征在于：所述的步骤E具体为：将步骤D制得的坯体置于石墨坩埚中，并埋入隔离粉，此后用箱式炉将埋于隔离粉中的坯体在常压下进行排淀粉，炉内气氛为氧气，升温速率为1-20℃/min，排淀粉温度为300-600℃，保温时间为2-12h。
3.根据权利要求1所述的一种新型多孔陶瓷加热体的制备工艺，其特征在于：所述步骤F为：将步骤E制得的胚体置于石墨坩埚中，用隔离粉淹埋，接着放入烧结炉进行烧结，其中升温速率为1-20℃/min，烧结温度为900-1400℃，时间为10-20h，坯体烧结制得多孔陶瓷加热体半成品。
4.根据权利要求1所述的一种新型多孔陶瓷加热体的制备工艺，其特征在于：所述的步骤A中，多孔陶瓷基体浆料由以下质量百分比的原料组成：
硅藻土15%
淀粉5%
纳米二氧化硅溶液1%
去离子水20%
电阻浆料34%
有机溶剂25%。
5.根据权利要求1所述的一种新型多孔陶瓷加热体的制备工艺，其特征在于：所述的步骤A中，多孔陶瓷基体浆料由以下质量百分比的原料组成：
硅藻土35%
淀粉12%
纳米二氧化硅溶液2%
去离子水21%
电阻浆料20%
有机溶剂10%。
6.根据权利要求1所述的一种新型多孔陶瓷加热体的制备工艺，其特征在于：所述的步骤A中，多孔陶瓷基体浆料由以下质量百分比的原料组成：
硅藻土45%
淀粉5%
去离子水20%
电阻浆料20%
有机溶剂10%。
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