CN108054239B - Silicon wafer pretreatment device and treatment method using same - Google Patents
Silicon wafer pretreatment device and treatment method using same Download PDFInfo
- Publication number
- CN108054239B CN108054239B CN201711314071.9A CN201711314071A CN108054239B CN 108054239 B CN108054239 B CN 108054239B CN 201711314071 A CN201711314071 A CN 201711314071A CN 108054239 B CN108054239 B CN 108054239B
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- conveying
- cooling device
- silicon
- belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 109
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 109
- 239000010703 silicon Substances 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 54
- 239000000428 dust Substances 0.000 claims abstract description 39
- 238000007650 screen-printing Methods 0.000 claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 230000001276 controlling effect Effects 0.000 claims description 3
- 238000007781 pre-processing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000002203 pretreatment Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 abstract description 14
- 239000002002 slurry Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052709 silver Inorganic materials 0.000 abstract description 6
- 239000004332 silver Substances 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 73
- 239000012535 impurity Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a silicon wafer pretreatment device, which is arranged before a screen printing process in the preparation process of a silicon solar cell, is connected with an electrical control system, and comprises a conveying device, a cooling device and a dust removal device, wherein the conveying device is in transmission connection with the output end of the previous process, the cooling device and the dust removal device are respectively and fixedly arranged above and below the conveying device, a flexible correction belt for correcting the position of a silicon wafer is further arranged on the conveying device, the flexible correction belt corresponds to the cooling device when stopped, and a sensor assembly is further fixedly arranged on one side of the conveying device. After the silicon chip is cooled, the surface temperature is rapidly reduced, the volatilization rate of slurry organic matters is reduced, the phenomenon of wire breakage after printing is reduced, the printing quality is improved, the use amount of the silver slurry is saved, and the production cost is reduced; the cooling device and the dust removal device synchronously remove dust on the upper surface and the lower surface of the silicon wafer, the probability of damage of the screen printing plate is reduced, the cost is saved, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of solar cell preparation, in particular to a device for preprocessing a silicon wafer for a solar cell before printing and a method for preprocessing by applying the device.
Background
The preparation process of the crystalline silicon solar cell mainly comprises the following steps: cleaning and texturing, diffusing and forming a junction, etching the edge of the back, depositing an antireflection film, screen printing, sintering, testing and sorting, wherein the screen printing is an important process in the production process of the crystalline silicon battery. In the previous process of screen printing, the silicon wafer needs to be dried in an aluminum back surface field drying oven, and after drying, the silicon wafer is naturally cooled in the process of being conveyed to a front silver printing machine for screen printing, the cooling time is short, the temperature of the silicon wafer is high (the temperature is up to 43 degrees), the volatilization of an organic solvent in silver paste slurry in a screen printing plate in the printing process is fast, the phenomenon of line breaking after printing is serious, the utilization rate of the silver paste is low, the cost is increased, and the printing effect is poor.
In addition, foreign matters such as dust and impurities are inevitably adhered to the silicon wafer in each preparation process before screen printing, the impurities can puncture a screen printing plate or cause the silicon wafer to break during printing, and the dust can influence the printing effect.
Disclosure of Invention
Therefore, the invention provides a device for pretreating silicon wafers before screen printing and a method for pretreating by applying the device, so as to solve at least one problem.
According to one aspect of the invention, the silicon wafer pretreatment device is arranged before a screen printing process in a silicon solar cell preparation process, is connected with an electrical control system, and comprises a conveying device, a cooling device and a dust removal device, wherein the conveying device is in transmission connection with an output end of a previous process, the cooling device and the dust removal device are respectively and fixedly arranged above and below the conveying device, a flexible correction belt with the same size as a silicon wafer is further arranged on the conveying device, the position of the flexible correction belt corresponds to that of the cooling device when the flexible correction belt stops, and a sensor assembly is further fixedly arranged on one side of the conveying device.
Preferably, according to the silicon wafer pretreatment device provided by the invention, the conveying device is a belt transmission mechanism and comprises two parallel rolling shafts and a conveying belt sleeved on the rolling shafts.
Preferably, according to the silicon wafer pretreatment device, the flexible correction belt is fixedly glued on the conveying belt.
Preferably, according to the silicon wafer pretreatment device, the cooling device is a fixed air cooler and comprises a cooling fan and a fan control device.
Preferably, according to the silicon wafer pretreatment device provided by the invention, the wind direction of the wind discharged by the fan is consistent with the vertical direction and corresponds to the position of the flexible correction belt when the flexible correction belt is stopped.
Preferably, according to the silicon wafer pretreatment device provided by the invention, the dust removal device comprises a vacuum generation device and a vacuum absorber, and the vacuum absorber is fixedly arranged right below the stop position of the flexible correction belt.
Preferably, according to the silicon wafer pretreatment device of the present invention, the vacuum generation device is one of a vacuum generator and a vacuum pump.
Preferably, according to the silicon wafer pretreatment device provided by the invention, the sensor assembly comprises a temperature sensor for regulating and controlling the cooling device and a position sensor for detecting the position of the silicon wafer and sending an alarm signal.
According to another aspect of the present invention, there is provided a method for pretreating a silicon wafer using the above pretreatment apparatus, comprising the steps of:
s1 feeding and conveying: the silicon chip is output from the output end of the previous working procedure and is transmitted to the conveying device;
s2 locating: when the silicon chip is completely coincident with the position of the flexible correction belt on the conveying device, the silicon chip is positioned and prepared, otherwise, the sensor assembly sends out an alarm signal;
s3, cooling: the flexible correcting belt stops, the air outlet of the cooling device is over against the upper surface of the silicon wafer, the sensor assembly detects the surface temperature of the silicon wafer, and the air output of the cooling device is regulated and controlled;
s4 dust removal: synchronously removing dust on the upper surface of the silicon wafer by the cooling device, and simultaneously starting the dust removing device to remove dust on the lower surface of the silicon wafer under the action of vacuum negative pressure;
s5 blanking transmission: and the conveying device is started again, and the pretreated silicon wafer is conveyed to the next procedure for screen printing.
Compared with the prior art, the technical scheme of the invention has the following advantages:
after the silicon chip is cooled by the cooling device, the surface temperature is rapidly reduced to 30 degrees, the volatilization rate of organic matters in the screen printing plate slurry is reduced during screen printing, the phenomenon of wire breakage after printing is reduced, and the printing quality is improved; the volatilization rate of the organic solvent in the slurry is reduced, so that the use amount of the silver slurry is saved, and the production cost is reduced; the cooling device blows the upper surface of the silicon wafer while cooling, dust or particle impurities on the upper surface of the silicon wafer can be removed, in addition, the dust removal device positioned below the conveying device synchronously adsorbs and removes dust on the lower surface of the silicon wafer, the impurities on the upper surface and the lower surface of the silicon wafer are thoroughly removed while the conveying and cooling efficiency of the silicon wafer is not influenced, the damage of a screen printing plate and the cracking probability of the silicon wafer during screen printing are reduced, the cost is saved, and the production efficiency is improved.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the specific embodiments. The drawings are only for purposes of illustrating the particular embodiments and are not to be construed as limiting the invention. In the drawings:
FIG. 1 is a schematic perspective view of a silicon wafer pretreatment apparatus according to the present invention.
The components are described as follows:
10. a conveying device; 20. a cooling device; 30. a dust removal device; 40. a sensor assembly.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. Examples of the embodiments are illustrated in the accompanying drawings, and specific embodiments described in the following embodiments of the invention are provided as illustrative of the embodiments of the invention only and are not intended to be limiting of the invention.
The invention provides a device for pretreating a silicon wafer for a solar cell before printing, which is shown in figure 1, and a method for pretreating by using the device.
The invention provides a silicon wafer pretreatment device which is arranged before a silk-screen printing process in the preparation process of a silicon solar cell and is connected with an electrical control system, and the silicon wafer pretreatment device comprises a conveying device, a cooling device and a dust removal device, wherein the cooling device is fixedly arranged above the conveying device, and the dust removal device is fixedly arranged below the conveying device; the conveying device is in transmission connection with the output end (namely the aluminum back field drying oven) of the previous procedure, and in addition, a sensor assembly is fixedly arranged on one side of the conveying device.
The sensor assembly comprises a temperature sensor and a position sensor, the temperature sensor is used for detecting the surface temperature of the silicon wafer and regulating and controlling the cooling device, and the position sensor is used for detecting the position of the silicon wafer and sending an alarm signal.
Furthermore, the conveying device is a belt transmission mechanism and comprises two rolling shafts which are horizontally arranged in parallel and a conveying belt which is sleeved on the rolling shafts. A flexible correction belt (not shown) is fixedly glued to the conveyor belt and runs in a loop with the conveyor belt. The conveying belt and the flexible correction belt on the conveying belt rotate to the output end of the oven and transmit the silicon wafers to be picked, at the moment, the picked silicon wafers just fall in the area where the flexible correction belt is located, and the flexible correction belt can correct the positions of the silicon wafers after being conveyed due to the fact that the size of the flexible correction belt is the same as that of the silicon wafers. When the positions of the flexible correction belt and the silicon wafer are completely coincident, the silicon wafer after being conveyed is accurately positioned, the conveying belt continues to work, otherwise, the sensor assembly sends out an alarm signal, and an operator needs to adjust the position of the silicon wafer.
The conveying belt drives the silicon wafer to be continuously conveyed, the conveying device can pause for 1-2 seconds before the silicon wafer enters the silk-screen printing process, the flexible correction belt corresponds to the cooling device when being stopped, and meanwhile, the silicon wafer on the correction belt corresponds to the cooling device.
Further, the cooling device is a fixed air cooler and comprises a cooling fan and a fan control device. The cooling fan corresponds to the stop position of the flexible correction belt and the position of the silicon wafer. The silicon wafer is horizontally transported on the transmission belt, the air outlet direction of the cooling fan is consistent with the vertical direction when the silicon wafer is stopped, and the front side of the silicon wafer directly blows to the upper surface of the silicon wafer to carry out air cooling on the silicon wafer. The temperature sensor measures the surface temperature of the silicon wafer, and feeds a detection value back to the control system, so that the fan control device is started to regulate and control the wind speed of the cooling fan. The power of a cooling fan adopted in practice is 23W, the surface temperature of the silicon wafer measured by a temperature sensor can be rapidly reduced to about 30 degrees from 43 degrees just after the silicon wafer is taken out of an oven, and the temperature is obviously reduced. If the surface temperature of the silicon wafer is higher, the fan control device increases the rotating speed of the fan through regulation and control, and the air output of the cooling fan in unit time is increased, so that the cooling efficiency is improved.
And during cooling, the fan can also remove dust or particle impurities on the upper surface of the silicon wafer by blowing, so that the dust removal effect is achieved, and the cleanness of the upper surface of the silicon wafer is ensured.
Further, the dust removing device of the present invention comprises a vacuum generating device, which may be one of a vacuum generator or a vacuum pump, and a vacuum absorber (not shown in the figure), wherein the vacuum absorber is fixedly arranged right below the stop position of the flexible correction belt. When the cooling device cools the upper surface of the silicon wafer, the dust removal device performs vacuum adsorption dust removal on the lower surface of the silicon wafer, and the cleanliness of the lower surface of the silicon wafer is ensured.
According to another aspect of the present invention, there is provided a method for pretreating a silicon wafer using the above pretreatment apparatus, comprising the steps of:
s1 feeding and conveying: the silicon chip is output from the output end of the previous working procedure and is transmitted to the conveying device;
s2 locating: when the silicon chip is completely coincident with the position of the flexible correction belt on the conveying device, the silicon chip is accurately positioned, otherwise, the sensor assembly sends out an alarm signal;
s3, cooling: the flexible correcting belt stops, the air outlet of the cooling device is over against the upper surface of the silicon wafer, the sensor assembly detects the surface temperature of the silicon wafer, and the air output of the cooling device is regulated and controlled;
s4 dust removal: synchronously removing dust on the upper surface of the silicon wafer by the cooling device, and simultaneously starting the dust removing device to remove dust on the lower surface of the silicon wafer under the action of vacuum negative pressure;
s5 blanking transmission: and the conveying device is started again, and the pretreated silicon wafer is conveyed to the next procedure for screen printing.
After the silicon chip is cooled by the cooling device, the surface temperature is rapidly reduced to 30 degrees, the volatilization rate of organic matters in the screen printing plate slurry is reduced during screen printing, the phenomenon of wire breakage after printing is reduced, and the printing quality is improved; the volatilization rate of the organic solvent in the slurry is reduced, so that the use amount of the silver slurry is saved, and the production cost is reduced; the cooling device blows the upper surface of the silicon wafer while cooling, tiny dust or particles on the upper surface of the silicon wafer can be removed, in addition, the dust removal device positioned below the conveying device synchronously adsorbs and removes dust on the lower surface of the silicon wafer, impurities on the upper surface and the lower surface of the silicon wafer are thoroughly removed while the conveying and cooling efficiency of the silicon wafer is not hindered, the damage rate of a screen printing plate and the cracking rate of the silicon wafer during screen printing are reduced, the cost is saved, and the production efficiency is improved.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, the word "comprising" does not exclude the presence of data or steps not listed in a claim.
Claims (7)
1. The utility model provides a silicon chip preprocessing device, sets up before the screen printing process of silicon solar cell preparation process, includes conveyor, cooling device and dust collector, its characterized in that: the silicon wafer pretreatment device is connected with an electrical control system, and the cooling device and the dust removal device are respectively and fixedly arranged above and below the conveying device; the conveying device is a belt transmission mechanism, the belt transmission mechanism is in transmission connection with the output end of the previous process and comprises two parallel rolling shafts and a conveying belt sleeved on the rolling shafts, a flexible correction belt with the same size and shape as the silicon wafer is fixedly connected onto the conveying belt in an adhesive mode, the flexible correction belt corresponds to the cooling device and the dust removal device when the flexible correction belt stops, the dust removal device comprises a vacuum generation device and a vacuum absorber, and a sensor assembly is further fixedly arranged on one side of the conveying device.
2. The silicon wafer pretreatment apparatus according to claim 1, characterized in that: the cooling device is a fixed air cooler and comprises a cooling fan and a fan control device.
3. The silicon wafer pretreatment apparatus according to claim 2, characterized in that: the air outlet direction of the fan is consistent with the vertical direction and corresponds to the position of the flexible correction belt when the flexible correction belt is stopped.
4. The silicon wafer pretreatment apparatus according to claim 1, characterized in that: the vacuum absorber is fixedly arranged right below the stop position of the correction belt.
5. The silicon wafer pretreatment apparatus according to claim 4, characterized in that: the vacuum generating device is one of a vacuum generator and a vacuum pump.
6. The silicon wafer pretreatment apparatus according to claim 1, characterized in that: the sensor assembly comprises a temperature sensor for regulating and controlling the cooling device and a position sensor for detecting the position of the silicon chip and sending an alarm signal.
7. A silicon wafer pretreatment method for pretreating a silicon wafer by using the pretreatment device according to any one of claims 1 to 6, comprising the steps of:
s1 feeding and conveying: the silicon chip is output from the output end of the previous working procedure and is transmitted to the conveying device;
s2 locating: when the silicon chip is completely coincident with the position of the flexible correction belt on the conveying device, the silicon chip is accurately positioned, otherwise, the sensor assembly sends out an alarm signal;
s3, cooling: the flexible correcting belt stops, the air outlet of the cooling device is over against the upper surface of the silicon wafer, the sensor assembly detects the surface temperature of the silicon wafer, and the air output of the cooling device is regulated and controlled;
s4 dust removal: synchronously removing dust on the upper surface of the silicon wafer by the cooling device, and simultaneously starting the dust removing device to remove dust on the lower surface of the silicon wafer under the action of vacuum negative pressure;
s5 blanking transmission: and the conveying device is started again, and the pretreated silicon wafer is conveyed to the next procedure for screen printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711314071.9A CN108054239B (en) | 2017-12-12 | 2017-12-12 | Silicon wafer pretreatment device and treatment method using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711314071.9A CN108054239B (en) | 2017-12-12 | 2017-12-12 | Silicon wafer pretreatment device and treatment method using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108054239A CN108054239A (en) | 2018-05-18 |
| CN108054239B true CN108054239B (en) | 2019-12-31 |
Family
ID=62123425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711314071.9A Active CN108054239B (en) | 2017-12-12 | 2017-12-12 | Silicon wafer pretreatment device and treatment method using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108054239B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113203239B (en) * | 2021-04-09 | 2022-08-16 | 涌明科技(上海)有限公司 | Wafer toasts and uses cooling device with multi-angle regulatory function |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101211836B1 (en) * | 2005-10-24 | 2012-12-12 | 삼성코닝정밀소재 주식회사 | Porous Chalcogenide Thin Film, Manufacturing Method Thereof and electronic device using the same |
| CN202062787U (en) * | 2011-04-20 | 2011-12-07 | 江苏伯乐达光伏有限公司 | Silk screen printing equipment |
| US9545612B2 (en) * | 2012-01-13 | 2017-01-17 | California Institute Of Technology | Solar fuel generator |
| CN203937316U (en) * | 2014-04-30 | 2014-11-12 | 江苏爱多光伏科技有限公司 | A kind of chip transmission device of screen process press |
| CN204488215U (en) * | 2015-03-23 | 2015-07-22 | 中建材浚鑫科技股份有限公司 | Serigraphy dust arrester |
| CN106803492B (en) * | 2017-03-20 | 2023-06-20 | 常州亿晶光电科技有限公司 | Pretreatment device before silicon wafer printing in solar cell preparation process |
-
2017
- 2017-12-12 CN CN201711314071.9A patent/CN108054239B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108054239A (en) | 2018-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101842000A (en) | Attaching device and attaching method using same | |
| CN103832052A (en) | Fully automatic battery piece image positioning silk-screen printing equipment | |
| WO2019033814A1 (en) | Automatic positioning and printing system and method for electrode printing of solar cell sheet | |
| CN108054239B (en) | Silicon wafer pretreatment device and treatment method using same | |
| CN109702359B (en) | Multifunctional solar cell laser scribing equipment | |
| CN106611729A (en) | Automatic cell material overturning device and method and solar cell production line | |
| CN108155118A (en) | A kind of polysilicon chip cleaning system and its cleaning method | |
| CN106784168B (en) | Cleaning heat sink before silicon chip printing in solar battery sheet preparation technology | |
| CN112701059A (en) | Wafer defect detector for semiconductor production | |
| CN210309496U (en) | Feeding and discharging device of screen printing machine and screen printing machine | |
| CN206806298U (en) | Solar panel conveys blow device | |
| CN115892658B (en) | Automatic silicon wafer film tearing machine and silicon wafer blanking system | |
| CN113070239A (en) | Automatic oranges and tangerines nondestructive test sorting device of high spectrum | |
| CN206574687U (en) | Pretreatment unit before silicon chip printing in solar battery sheet preparation technology | |
| CN107009117A (en) | The outer confidential paper conveying assembly of rotating disc type | |
| CN217903091U (en) | Die bonder with double swing arms | |
| CN106803492B (en) | Pretreatment device before silicon wafer printing in solar cell preparation process | |
| CN207549690U (en) | Cell piece Screenprinting workbench | |
| CN202712132U (en) | Real-time adjustment thimble mechanism and system thereof | |
| CN215551786U (en) | Silicon wafer cleaning device of screen printing machine | |
| CN1260779C (en) | Method and device for removing useless materials from semiconductor wafers | |
| CN209222544U (en) | A kind of heating rotary platform device | |
| CN211254245U (en) | Automatic feeding device for processing silicon carbide single crystal wafer | |
| CN206574735U (en) | Cleaning heat sink before silicon chip printing in solar battery sheet preparation technology | |
| CN209617709U (en) | A kind of multistation labeling device based on XYZ platform |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200916 Address after: 231400 North 3rd road, Tongcheng Economic Development Zone, Anqing City, Anhui Province Patentee after: China building materials Junxin (Tongcheng) Technology Co., Ltd Address before: Shen Gang Town Cheng Road Jiangyin city Jiangsu Province, Wuxi City, No. 1011, 214443 Patentee before: JETION SOLAR (JIANGSU) Co.,Ltd. |