CN108054239A - The processing method of silicon chip pretreatment unit and the application device - Google Patents
The processing method of silicon chip pretreatment unit and the application device Download PDFInfo
- Publication number
- CN108054239A CN108054239A CN201711314071.9A CN201711314071A CN108054239A CN 108054239 A CN108054239 A CN 108054239A CN 201711314071 A CN201711314071 A CN 201711314071A CN 108054239 A CN108054239 A CN 108054239A
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- silicon chip
- conveying device
- cooling device
- pretreatment unit
- dust
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 100
- 239000010703 silicon Substances 0.000 title claims abstract description 100
- 238000003672 processing method Methods 0.000 title description 2
- 238000001816 cooling Methods 0.000 claims abstract description 52
- 238000012937 correction Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000000605 extraction Methods 0.000 claims abstract description 19
- 238000002360 preparation method Methods 0.000 claims abstract description 6
- 238000007650 screen-printing Methods 0.000 claims description 13
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 230000035611 feeding Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 abstract description 14
- 239000002002 slurry Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052709 silver Inorganic materials 0.000 abstract description 6
- 239000004332 silver Substances 0.000 abstract description 6
- 239000005416 organic matter Substances 0.000 abstract description 3
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 239000000428 dust Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Present invention is disclosed a kind of silicon chip pretreatment units, before being arranged on the silkscreen process of silicon solar cell preparation process, it is connected with electric control system, including conveying device, cooling device and dust-extraction unit, the output terminal of the conveying device and preceding working procedure is sequentially connected, the cooling device, dust-extraction unit is respectively fixedly disposed at the upper of the conveying device, lower section, the flexible correction belt of calibration position of silicon wafer is additionally provided on the transporter, the flexibility correction belt is corresponding with the position of the cooling device when pausing, the conveying device one side is further fixedly arranged on sensor module.After cooling, surface temperature declines rapidly silicon chip, and slurry organic matter rate of volatilization reduces, and the phenomenon that breaks after printing is reduced, and printing quality improves and saves the usage amount of silver paste slurry, reduces production cost；Cooling device, dust-extraction unit are synchronous to carry out dedusting to silicon chip upper and lower surface, reduces halftone breakage probability, cost-effective, improves production efficiency.
Description
Technical field
The present invention relates to solar cell preparing technical fields, and in particular to a kind of solar energy battery adopted silicon chip is before printing
The device pre-processed and the method pre-processed using the device.
Background technology
The preparation process of crystal silicon solar energy battery mainly includes：Cleaning and texturing, diffusion, dorsal edge etch, are heavy
Product antireflective coating, silk-screen printing, sintering, test sorting, wherein, silk-screen printing is a weight in crystal silicon cell production process
Want process.In the previous procedure of silk-screen printing, silicon chip need to be dried in Al-BSF baking oven, and positive silver is being delivered to after drying
Printing machine carries out natural cooling during silk-screen printing, and cooling time is short and silicon chip own temperature is high（Temperature is up to 43 °）, print
Organic solvent volatilization in swiped through journey halftone in silver paste slurry is very fast, and breaking after printing, phenomenon is serious, and silver paste utilization rate is low, cost
Increase, and printing effect is bad.
In addition, foreign matter, such as dust, impurity etc. are unavoidably adhered in each preparation section of the silicon chip before silk-screen printing,
Impurity can puncture halftone or silicon chip is caused to rupture during printing, and dust can influence printing effect.
The content of the invention
For this purpose, the present invention provide the device that a kind of silicon chip pre-processed before silk-screen printing and the application device into
The method of row pretreatment, it is above-mentioned at least one to solve the problems, such as.
According to an aspect of the invention, there is provided a kind of silicon chip pretreatment unit, is arranged on silicon solar cell preparation
Before the silkscreen process of process, it is connected with electric control system, including conveying device, cooling device and dust-extraction unit, institute
The output terminal for stating conveying device and preceding working procedure is sequentially connected, and the cooling device, dust-extraction unit are respectively fixedly disposed at described
The upper and lower of conveying device, be additionally provided on the transporter with die size just as flexible correction belt, it is described flexible to rectify
Corresponding with the position of the cooling device when just with pause, the conveying device one side is further fixedly arranged on sensor module.
Preferably, silicon chip pretreatment unit according to the present invention, the conveying device is belt gear, including two
The axis of rolling being arranged in parallel and the conveyer belt being socketed on the axis of rolling.
Preferably, silicon chip pretreatment unit according to the present invention, fixing glue is connected to the flexible correction on the conveyer belt
Band.
Preferably, silicon chip pretreatment unit according to the present invention, the cooling device is fixed forced air cooler, including cold
But fan and fan control device.
Preferably, silicon chip pretreatment unit according to the present invention, the air-out wind direction of the fan is consistent with vertical direction, and
Position when pausing with the flexible correction belt is corresponding.
Preferably, silicon chip pretreatment unit according to the present invention, the dust-extraction unit include vacuum generating device and vacuum
Absorber, the vacuum absorber are fixed at the underface of the flexible correction belt stall position.
Preferably, silicon chip pretreatment unit according to the present invention, the vacuum generating device is vacuum generator, vacuum pump
Middle one kind.
Preferably, silicon chip pretreatment unit according to the present invention, the sensor module include regulating and controlling the cooling device
Temperature sensor and detection position of silicon wafer, send the position sensor of alarm signal.
According to another aspect of the present invention, provide and a kind of using above-mentioned pretreatment unit silicon chip is pre-processed
Method includes the following steps：
S1 feedings transmit：Silicon chip is exported from the output terminal of preceding working procedure, in transmission transport to the conveying device；
S2 is positioned：When the flexible correction belt position on silicon chip and conveying device is completely superposed, then silicon chip positioning prepares, and otherwise passes
Sensor component sends alarm signal；
S3 is cooled down：Flexible correction belt pauses, cooling device air outlet face silicon chip upper surface, sensor module detection silicon chip surface
Temperature, and air output regulation and control are carried out to cooling device；
S4 dedustings：Cooling device synchronously carries out silicon chip upper surface dedusting, meanwhile, dust-extraction unit starts, and is acted in negative pressure of vacuum
Under to silicon chip lower surface carry out dedusting；
S5 blankings are transmitted：Conveying device is again started up, and pretreated silicon chip is transported to next procedure carries out silk-screen printing.
Compared with prior art, technical scheme has the following advantages that：
After being cooled by cooling device, surface temperature is dropped rapidly to 30 ° to silicon chip, and organic matter during silk-screen printing in halftone slurry is waved
Rate reduction is sent out, the phenomenon that breaks after printing is reduced, and printing quality improves；Since organic solvent volatility reduces in slurry, save
The usage amount of silver paste slurry, reduces production cost；Cooling device simultaneously brushes silicon chip upper surface in cooling, can be with
The dust or granule foreign of silicon chip upper surface are removed, in addition, the dust-extraction unit below conveying device is synchronous under silicon chip
Surface carries out absorption dedusting, while silicon chip conveying, cooling efficiency is not interfered, thoroughly removes the miscellaneous of upper and lower two surface of silicon chip
Matter, halftone breakage, die crack probability, improve production efficiency when reducing silk-screen printing while cost-effective.
Description of the drawings
By reading the detailed description of following detailed description, it is various other the advantages of and benefit it is common for this field
Technical staff will be apparent understanding.Attached drawing is only used for showing the purpose of specific embodiment, and is not considered as to invention
Limitation.In the accompanying drawings：
Fig. 1 is the dimensional structure diagram of silicon chip pretreatment unit of the present invention.
Wherein part description is as follows：
10th, conveying device；20th, cooling device；30th, dust-extraction unit；40th, sensor module.
Specific embodiment
The present invention is described in further detail with specific embodiment below in conjunction with the accompanying drawings.The embodiment is shown
Example is shown in the drawings, specific reality of the specific embodiment described in following embodiments of the present invention only as the present invention
Apply the exemplary illustration of mode, it is intended to for explaining the present invention, and be not configured to limitation of the present invention.
The present invention provides the device that a kind of solar energy battery adopted silicon chip is pre-processed before printing, as shown in Figure 1, with
And the method pre-processed using the device.
One aspect of the present invention provides a kind of silicon chip pretreatment unit, is arranged on the silk screen of silicon solar cell preparation process
Before printing process, which is connected with electric control system, including conveying device, cooling device and dust-extraction unit, cooling dress
The top for being fixed at conveying device is put, dust-extraction unit is fixed at the lower section of conveying device；Conveying device and preceding road work
The output terminal of sequence（That is Al-BSF baking oven）It is sequentially connected, in addition, the one side of conveying device is further fixedly arranged on sensor module.
The sensor module includes temperature sensor and position sensor, and temperature sensor is used to detect silicon chip surface temperature
It spends and cooling device is regulated and controled, position sensor is used to detect position of silicon wafer, send alarm signal.
Further, transporter is belt gear, the axis of rolling that is set including two horizontal parallels and is socketed in
Conveyer belt on the axis of rolling.Flexible correction belt（It is not shown in figure）Fixation is glued on conveyer belt, and as conveyer belt follows
Ring operates.Conveyer belt and flexible correction belt thereon operate to baking oven output terminal and are driven and pick up silicon chip, at this point, the silicon after picking up
Piece just falls in flexible correction belt region, and since flexible correction belt size is identical with die size, flexible correction belt can be with
Position after chip transmission is calibrated.When flexible correction belt and position of silicon wafer are completely superposed, show the silicon chip after transmission
Accurate positioning, conveyer belt then work on, and otherwise, sensor module sends alarm signal, need operating personnel to position of silicon wafer into
Row adjustment.
Conveyer belt drives silicon chip to continue to transport, before silkscreen process is entered, conveying device meeting minibreak 1-2 seconds
Clock, flexible correction belt is corresponding with the position of cooling device when pausing, while silicon chip on correction belt and cooling device
Position is also corresponding.
Further, cooling device is fixed forced air cooler, including cooling fan and fan control device.Cooling fan
The position where position and silicon chip when pausing with flexible correction belt is corresponding.Silicon chip horizontal transport on the belt pauses
When cooling fan air-out wind direction it is consistent with vertical direction, Buddhist silicon chip upper surface is blown in direct front, and air-cooled cooling is carried out to silicon chip.
Temperature sensor measures silicon chip surface temperature, by detected value feedback signal to control system, so as to start fan control device pair
Cooling fan carries out wind speed regulation and control.For the cooling fan power used in practice for 23W, temperature sensor measures silicon chip surface temperature
30 ° or so can be dropped rapidly to by just go out baking oven 43 °, temperature declines apparent.If silicon chip surface temperature is higher, fan control dress
It puts by regulating and controlling to increase rotation speed of the fan, the air output of cooling fan unit interval is improved, so as to improve cooling efficiency.
While cooling, fan can also remove the dust or granule foreign of silicon chip upper surface by brushing, and play and remove
The effect of dirt ensures the cleaning of silicon chip upper surface.
Further, dust-extraction unit of the invention includes vacuum generating device and vacuum absorber（It is not shown in figure）, institute
It can be one kind in vacuum generator or vacuum pump to state vacuum generating device, and the vacuum absorber is fixed at flexible rectify
The just underface with stall position.While cooling device cools down silicon chip upper surface, dust-extraction unit is under silicon chip
Surface ensures the cleannes of silicon chip lower surface into vacuum adsorbed dedusting.
According to another aspect of the present invention, provide and a kind of using above-mentioned pretreatment unit silicon chip is pre-processed
Method includes the following steps：
S1 feedings transmit：Silicon chip is exported from the output terminal of preceding working procedure, in transmission transport to the conveying device；
S2 is positioned：When the flexible correction belt position on silicon chip and conveying device is completely superposed, then otherwise silicon chip accurate positioning passes
Sensor component sends alarm signal；
S3 is cooled down：Flexible correction belt pauses, cooling device air outlet face silicon chip upper surface, sensor module detection silicon chip surface
Temperature, and air output regulation and control are carried out to cooling device；
S4 dedustings：Cooling device synchronously carries out silicon chip upper surface dedusting, meanwhile, dust-extraction unit starts, and is acted in negative pressure of vacuum
Under to silicon chip lower surface carry out dedusting；
S5 blankings are transmitted：Conveying device is again started up, and pretreated silicon chip is transported to next procedure carries out silk-screen printing.
After being cooled by cooling device, surface temperature is dropped rapidly to 30 ° to silicon chip in the present invention, halftone slurry during silk-screen printing
In organic matter rate of volatilization reduce, after printing break phenomenon reduce, printing quality improve；Since organic solvent volatilizees in slurry
Rate reduces, and saves the usage amount of silver paste slurry, reduces production cost；Cooling device cooling simultaneously to silicon chip upper surface into
Row brushes, and can remove silicon chip upper surface small dust or particle, in addition, the dust-extraction unit below conveying device is synchronous
Absorption dedusting is carried out to the lower surface of silicon chip, while silicon chip conveying, cooling efficiency is not interfered, it is upper and lower thoroughly to remove silicon chip
The impurity on two surfaces, halftone breakage, die crack probability when reducing silk-screen printing, improves production effect while cost-effective
Rate.
It should be noted that above-described embodiment is that the present invention will be described rather than limits the invention, and
Those skilled in the art can design alternative embodiment without departing from the scope of the appended claims.In claim
In, word "comprising" does not exclude the presence of data or step not listed in the claims.
Claims (9)
1. a kind of silicon chip pretreatment unit, before being arranged on the silkscreen process of silicon solar cell preparation process, with electric-controlled
System processed is connected, it is characterised in that：Including conveying device, cooling device and dust-extraction unit, the conveying device and preceding road work
The output terminal of sequence is sequentially connected, and the cooling device, dust-extraction unit are respectively fixedly disposed at the upper and lower of the conveying device,
Be additionally provided on the transporter with die size just as flexible correction belt, it is described flexibility correction belt pause when with it is described cold
But the position of device is corresponding, and the conveying device one side is further fixedly arranged on sensor module.
2. silicon chip pretreatment unit according to claim 1, it is characterised in that：The conveying device is belt drive
Structure, the axis of rolling being arranged in parallel including two and the transmission belt being socketed on the axis of rolling.
3. silicon chip pretreatment unit according to claim 2, it is characterised in that：Fixing glue is connected to described on the conveyer belt
Flexible correction belt.
4. silicon chip pretreatment unit according to claim 1, it is characterised in that：The cooling device is fixed air cooling
Device, including cooling fan and fan control device.
5. silicon chip pretreatment unit according to claim 4, it is characterised in that：The air-out wind direction of the fan and vertical side
To consistent, and position when pausing with the flexible correction belt is corresponding.
6. silicon chip pretreatment unit according to claim 1, it is characterised in that：The dust-extraction unit is filled including vacuum
It puts and vacuum absorber, the vacuum absorber is fixed at the underface of the correction belt stall position.
7. silicon chip pretreatment unit according to claim 6, it is characterised in that：The vacuum generating device is vacuum
One kind in device, vacuum pump.
8. silicon chip pretreatment unit according to claim 1, it is characterised in that：The sensor module is included described in regulation and control
The temperature sensor and detection position of silicon wafer of cooling device, the position sensor for sending alarm signal.
9. a kind of silicon chip preprocess method carries out silicon chip using the pretreatment unit as any one of claim 1-8
Pretreatment, which is characterized in that include the following steps：
S1 feedings transmit：Silicon chip is exported from the output terminal of preceding working procedure, in transmission transport to the conveying device；
S2 is positioned：When the flexible correction belt position on silicon chip and conveying device is completely superposed, then otherwise silicon chip accurate positioning passes
Sensor component sends alarm signal；
S3 is cooled down：Flexible correction belt pauses, cooling device air outlet face silicon chip upper surface, sensor module detection silicon chip surface
Temperature, and air output regulation and control are carried out to cooling device；
S4 dedustings：Cooling device synchronously carries out silicon chip upper surface dedusting, meanwhile, dust-extraction unit starts, and is acted in negative pressure of vacuum
Under to silicon chip lower surface carry out dedusting；
S5 blankings are transmitted：Conveying device is again started up, and pretreated silicon chip is transported to next procedure carries out silk-screen printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711314071.9A CN108054239B (en) | 2017-12-12 | 2017-12-12 | Silicon wafer pretreatment device and treatment method using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711314071.9A CN108054239B (en) | 2017-12-12 | 2017-12-12 | Silicon wafer pretreatment device and treatment method using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108054239A true CN108054239A (en) | 2018-05-18 |
| CN108054239B CN108054239B (en) | 2019-12-31 |
Family
ID=62123425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711314071.9A Active CN108054239B (en) | 2017-12-12 | 2017-12-12 | Silicon wafer pretreatment device and treatment method using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108054239B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113203239A (en) * | 2021-04-09 | 2021-08-03 | 涌明科技(上海)有限公司 | Wafer toasts and uses cooling device with multi-angle regulatory function |
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| CN202062787U (en) * | 2011-04-20 | 2011-12-07 | 江苏伯乐达光伏有限公司 | Silk screen printing equipment |
| CN203937316U (en) * | 2014-04-30 | 2014-11-12 | 江苏爱多光伏科技有限公司 | A kind of chip transmission device of screen process press |
| US20150056109A1 (en) * | 2012-01-13 | 2015-02-26 | California Institute Of Technology | Solar fuel generator |
| CN204488215U (en) * | 2015-03-23 | 2015-07-22 | 中建材浚鑫科技股份有限公司 | Serigraphy dust arrester |
| CN106803492A (en) * | 2017-03-20 | 2017-06-06 | 常州亿晶光电科技有限公司 | Pretreatment unit before silicon chip printing in solar battery sheet preparation technology |
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2017
- 2017-12-12 CN CN201711314071.9A patent/CN108054239B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070090346A1 (en) * | 2005-10-24 | 2007-04-26 | Jeong Hyun D | Porous chalcogenide thin film, method for preparing the same and electronic device using the same |
| CN202062787U (en) * | 2011-04-20 | 2011-12-07 | 江苏伯乐达光伏有限公司 | Silk screen printing equipment |
| US20150056109A1 (en) * | 2012-01-13 | 2015-02-26 | California Institute Of Technology | Solar fuel generator |
| CN203937316U (en) * | 2014-04-30 | 2014-11-12 | 江苏爱多光伏科技有限公司 | A kind of chip transmission device of screen process press |
| CN204488215U (en) * | 2015-03-23 | 2015-07-22 | 中建材浚鑫科技股份有限公司 | Serigraphy dust arrester |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113203239A (en) * | 2021-04-09 | 2021-08-03 | 涌明科技(上海)有限公司 | Wafer toasts and uses cooling device with multi-angle regulatory function |
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| Publication number | Publication date |
|---|---|
| CN108054239B (en) | 2019-12-31 |
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Effective date of registration: 20200916 Address after: 231400 North 3rd road, Tongcheng Economic Development Zone, Anqing City, Anhui Province Patentee after: China building materials Junxin (Tongcheng) Technology Co., Ltd Address before: Shen Gang Town Cheng Road Jiangyin city Jiangsu Province, Wuxi City, No. 1011, 214443 Patentee before: JETION SOLAR (JIANGSU) Co.,Ltd. |