CN108054236A - 单晶硅片清洗制绒方法 - Google Patents

单晶硅片清洗制绒方法 Download PDF

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Publication number
CN108054236A
CN108054236A CN201711271931.5A CN201711271931A CN108054236A CN 108054236 A CN108054236 A CN 108054236A CN 201711271931 A CN201711271931 A CN 201711271931A CN 108054236 A CN108054236 A CN 108054236A
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cleaning
silicon chip
wool
concentration
rough polishing
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刘露露
衣玉林
穆林森
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SUZHOU RUNYANG PHOTOVOLTAIC TECHNOLOGY Co Ltd
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SUZHOU RUNYANG PHOTOVOLTAIC TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/08Etching
    • C30B33/10Etching in solutions or melts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • H01L31/02363Special surface textures of the semiconductor body itself, e.g. textured active layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
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Abstract

本发明公开一种单晶硅片清洗制绒方法,该方法依次包括粗抛、预清洗、制绒、后清洗、酸洗、慢提拉以及烘干,其中,粗抛是于预清洗之前使用浓度0.8%—1.2%的KOH溶液对硅片进行初步抛光;后清洗是使用浓度1.2%—2.2%的H2O2和浓度0.5%—0.8%的KOH混合溶液清洗制绒后该硅片表面残留物。本发明适用于单晶硅片清洗制绒工序,有效解决了硅片制绒后添加剂残留问题,并且改善了硅片表面脏污难以去除的情况,提高了制绒的合格率。

Description

单晶硅片清洗制绒方法
技术领域
本发明涉及太阳能电池清洗制绒领域,尤其涉及清洗制绒脏污和硅片表面残留物的单晶硅片清洗制绒方法。
背景技术
太阳能电池清洗制绒工艺是太阳能电池制造工艺中至关重要的一步,对成品电池片的电性能有着重大的影响。脏污片的产生是清洗制绒工序经常会出现的问题,其流传下去会造成外观不合格电池片以及EL不合格品增多。制绒后添加剂的残留会导致电池片效率偏低,EL发暗,严重影响效率及良率。
现有技术中,脏污片通常进行返工处理,但是,这种处理方法存在两个问题:第一,经二次制绒后电池片偏薄,易碎片,造成产线的碎片率增加;第二,二次制绒后绒面效果较一次制绒效果差,会造成成品电池片效率下降以及不良率增加。
发明内容
有鉴于此,本发明的目的是解决上述现有技术的不足,提供一种优化的单晶硅片清洗制绒方法。
本发明解决上述现有技术的不足所采用的技术方案是:一种单晶硅片清洗制绒方法,依次包括粗抛、预清洗、制绒、后清洗、酸洗、慢提拉以及烘干,其中,粗抛是于预清洗之前对该硅片进行粗抛光;后清洗是清洗制绒后该硅片表面残留物。
特别地,粗抛时使用浓度0.8%—1.2%的KOH溶液对该硅片进行初步抛光。
特别地,后清洗时使用浓度1.2%—2.2%的H2O2和浓度0.5%—0.8%的KOH混合溶液对该硅片进行清洗。
相较于现有技术,本发明的单晶硅片清洗制绒方法,改进硅片制绒的流程,加入粗抛和后清洗流程,分别对硅片进行粗抛光和清洗制绒后硅片表面残留物,粗抛改善了制绒前硅片脏污问题,后清洗解决了制绒后硅片添加剂表面残留问题,因而从源头上优化单晶硅片清洗制绒工序,有效解决了硅片制绒后添加剂残留问题,并且改善了硅片表面脏污难以去除的情况,提高了制绒的合格率。
附图说明
图1为本发明单晶硅片清洗制绒方法的流程图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
请参阅图1,为本发明单晶硅片清洗制绒方法的流程图,如图所示,该方法为:
1)粗抛;
2)预清洗;
3)水洗;
4)制绒;
5)水洗;
6)后清洗;
7)水洗;
8)酸洗
9)水洗;
10)慢提拉;
11)烘干。
其中,粗抛是于预清洗之前对该硅片进行粗抛光;后清洗是清洗经制绒后该硅片表面残留物,且于本实施例中,粗抛时使用浓度0.8%—1.2%的KOH溶液对该硅片进行初步抛光,后清洗时使用浓度1.2%—2.2%的H2O2和浓度0.5%—0.8%的KOH混合溶液对该硅片进行清洗。
本发明在以往制绒工艺的基础上,加入了粗抛和后清洗流程,制绒前的粗抛工序可初步去除硅片表面脏污和机械损伤层,制绒后的后清洗工序可有效去除硅片表面添加剂残留,故而能够达成本发明的目的。
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。

Claims (3)

1.一种单晶硅片清洗制绒方法,适用于一硅片,该方法依次包括预清洗、制绒、酸洗、慢提拉以及烘干,其特征在于,该方法还包括如下工序:
粗抛,于预清洗之前对该硅片进行粗抛光;
后清洗,清洗经制绒后该硅片表面残留物。
2.根据权利要求1所述的单晶硅片清洗制绒方法,其特征在于,粗抛时使用浓度0.8%—1.2%的KOH溶液对该硅片进行初步抛光。
3.根据权利要求1所述的单晶硅片清洗制绒方法,其特征在于,后清洗时使用浓度1.2%—2.2%的H2O2和浓度0.5%—0.8%的KOH混合溶液对该硅片进行清洗。
CN201711271931.5A 2017-12-06 2017-12-06 单晶硅片清洗制绒方法 Pending CN108054236A (zh)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108565316A (zh) * 2018-05-31 2018-09-21 韩华新能源(启东)有限公司 一种单晶硅片制绒方法
CN109326660A (zh) * 2018-09-16 2019-02-12 苏州润阳光伏科技有限公司 太阳电池单晶硅基绒面生成工艺
CN110165018A (zh) * 2019-04-18 2019-08-23 横店集团东磁股份有限公司 一种下降漏电提升效率的多晶清洗工艺
CN110459647A (zh) * 2019-08-09 2019-11-15 江苏日托光伏科技股份有限公司 一种改善大尺寸硅片制绒均匀性的方法和装置
CN114335247A (zh) * 2021-12-29 2022-04-12 湖州爱康光电科技有限公司 一种异质结电池双制绒清洗工艺及装置

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CN102842652A (zh) * 2012-09-19 2012-12-26 英利能源(中国)有限公司 硅片的制绒酸洗的方法
CN103394484A (zh) * 2013-08-02 2013-11-20 常州时创能源科技有限公司 多晶硅太阳能电池硅片酸制绒后的清洗工艺
CN104538500A (zh) * 2015-01-06 2015-04-22 横店集团东磁股份有限公司 用于晶体硅太阳能电池抗lid和pid的pecvd镀膜和烧结工艺

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US20110220201A1 (en) * 2008-11-07 2011-09-15 Sunpreme, Ltd. Low-cost multi-junction solar cells and methods for their production
CN102842652A (zh) * 2012-09-19 2012-12-26 英利能源(中国)有限公司 硅片的制绒酸洗的方法
CN103394484A (zh) * 2013-08-02 2013-11-20 常州时创能源科技有限公司 多晶硅太阳能电池硅片酸制绒后的清洗工艺
CN104538500A (zh) * 2015-01-06 2015-04-22 横店集团东磁股份有限公司 用于晶体硅太阳能电池抗lid和pid的pecvd镀膜和烧结工艺

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108565316A (zh) * 2018-05-31 2018-09-21 韩华新能源(启东)有限公司 一种单晶硅片制绒方法
CN109326660A (zh) * 2018-09-16 2019-02-12 苏州润阳光伏科技有限公司 太阳电池单晶硅基绒面生成工艺
CN110165018A (zh) * 2019-04-18 2019-08-23 横店集团东磁股份有限公司 一种下降漏电提升效率的多晶清洗工艺
CN110459647A (zh) * 2019-08-09 2019-11-15 江苏日托光伏科技股份有限公司 一种改善大尺寸硅片制绒均匀性的方法和装置
CN114335247A (zh) * 2021-12-29 2022-04-12 湖州爱康光电科技有限公司 一种异质结电池双制绒清洗工艺及装置

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