CN108028227A - 表面安装器件及附接这种器件的方法 - Google Patents

表面安装器件及附接这种器件的方法 Download PDF

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Publication number
CN108028227A
CN108028227A CN201680039253.7A CN201680039253A CN108028227A CN 108028227 A CN108028227 A CN 108028227A CN 201680039253 A CN201680039253 A CN 201680039253A CN 108028227 A CN108028227 A CN 108028227A
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China
Prior art keywords
component
substrate
surface mount
mechanical couplings
binder course
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CN201680039253.7A
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CN108028227B (zh
Inventor
S.诺伊延
R.尤巴赫斯
O.范德斯吕斯
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Lumileds Holding BV
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Lumileds Holding BV
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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Abstract

一种器件包括基底上的表面安装组件，其中表面安装组件通过一组分立的机械耦合部件并通过结合层来附接。这使得能够单独地优化机械耦合性能和电/热性能。

Description

表面安装器件及附接这种器件的方法
技术领域
本发明涉及表面安装器件。
背景技术
表面安装器件通过焊料互连或粘合剂材料连接到印刷电路板。这些材料用于电、热（thermal）和机械目的。在管芯附接（die-attach）方法和组件附接（component-attach）方法二者中，使用的材料被选择以满足严格的电和热要求。一旦特定材料满足这些要求，就会优化互连的机械可靠性。
对于粘合剂材料和焊料材料二者来说，这种优化是一项具有挑战性的任务。大多数粘合剂材料具有低硬度并且机械柔顺，但是由于其低导热性，仅能承受有限的热负荷。大多数焊料材料具有较高的模量，但在典型的使用温度下工作时，其受害于低周疲劳（lowcycle fatigue）。
这表明在互连的电、热和机械设计之间存在权衡。该权衡妨碍了电、热和机械功能的单独优化。
发明内容
本发明由权利要求限定。
根据依照本发明的一方面的实例，提供了一种器件，包括：表面安装组件和基底，其中表面安装组件通过一组分立的机械耦合部件并通过结合层附接到基底。
机械耦合部件可以将机械连接功能与电连接功能和热连接功能分开，这使单独地优化这些功能成为可能。结合层可以被设计为提供电互连和热互连二者，或它可以特定地针对其热特性而设计。然后可以提供单独的电连接。
本发明使单独地优化热/电性能和机械寿命成为可能，利用单独材料的特定益处，并且不再需要在功能和可靠性之间权衡。
机械耦合部件可以例如包括平面的互连件，诸如棒（或支柱或者斜杠（sprit））、或者棒的布置、或者位于平面内的片状结构。
结合层可以包括单个连接区域，或者它可以具有单独隔离的部分。结合层例如可以是导电且导热的粘合剂层。那么它可以执行电功能和热功能二者。结合层可以替代地包括一个或多个焊料连接。可以有附加层，例如焊料连接形成设计为主要用于电连接性能的第一结合层，并且粘合剂层形成设计为主要用于热耦合性能的第二结合层。
机械部件例如通过创建静定的固定来优化。这意味着表面安装器件的每个自由度都受到独特的限制。这避免了由于例如热负荷产生的结构上的自应力。
机械耦合可以在室温制成。因此，消除了高温处理的缺点（例如超过材料的熔点或高的热应力）。这使其工艺与任何基底、管芯或组件兼容，每个基底、管芯或组件通常有最高处理温度。
表面安装组件例如包括在组件基部表面处的至少一个电接触焊盘，所述电接触焊盘通过导电粘合剂层连接到基底上。该基部接触意味着表面安装组件和基底之间的连接需要是导电的（不同于其中所有连接都是由远离器件主体横向延伸的引线形成的表面安装组件的情况）。电接触焊盘例如可以是接地触点。
表面安装组件可以替代地包括具有延伸到基部表面的一组至少两个接触端子的分立的组件。例如可以有向下连接到基底的在器件相对端处的接触端子。可替换地，可以在表面安装组件的基部处有接触焊盘阵列。
在另一种布置中，表面安装组件包括半导体组件，其中半导体管芯通过导电粘合剂层连接到基底。这用于管芯附接工艺。在这种情况下，表面安装组件的基部可以不是像这样的接触焊盘，但是它可以是半导体层。
在一个实例中，结合层可以包括具有嵌入的导电颗粒的粘合剂。然后通过消除对热和/或电连接的强机械耦合的要求，可以避免使用焊料。这相应地意味着可以使用较低温度的工艺。
结合层可以替代地包括焊料连接或焊料连接阵列，但是具有宽松的机械要求。
因此，本发明的机械耦合部件可以用于（部分地）替代额外地使用焊料连接的系统或具有导电粘合剂的系统的机械功能。因此，本发明的布置可以与焊料或与导电粘合剂结合。然而，这些连接不再需要被设计为承受机械负荷。
一个或多个机械耦合部件可以嵌入结合层中。例如在机械耦合部件已经形成后再施加结合层。
每个机械耦合部件可以包括以下之一：
连接棒，诸如支柱或斜杠；
一对交叉的连接棒；
限定片簧的焊盘；
限定受限片簧的图案化焊盘。
机械耦合部件的设计、其数量、取向和位置例如被选择以在基底和表面安装组件之间提供静定耦合。
基底可以包括：
半导体基底；或
印刷电路板；或
引线框架；或
柔性箔片。
因此，本发明通常对表面安装技术具有广泛的适用性。
机械耦合部件可以形成为与基底一体的组件或直接形成在基底之上。这可以例如通过基底的3D加工来实现，以在顶面中限定机械耦合部件。可替换地，可以将机械耦合部件3D打印在基底的顶面上，或者通过3D打印整个基底或基底的一部分将机械耦合部件3D打印在基底的顶面上。
机械耦合部件不一定在组件和基底之间的电互连和热互连中起作用。
3D打印部件可以替代地使用机械耦合附接到基底，这些机械耦合例如是作为现有（或未来）基底制造技术的一部分的本身与基底集成的机械耦合。耦合部件可以替代地例如通过模制、压铸、机械加工或增材制造（additive manufacturing）方法来单独地制造。它们可以通过焊接、胶合、（3D）打印诸如焊接的连接层、或者通过例如使用卡扣配合（snap-fit）连接的通孔连接来附接到基底。
表面安装组件也可以具有与机械耦合部件的卡扣配合连接。
根据本发明的另一方面的实例提供了一种制作器件的方法，包括：
使用一组分立的机械耦合部件将表面安装组件安装到基底；以及
使用结合层将表面安装组件附接到基底。
结合层可以再次包括导电粘合剂。
该方法可以包括将机械耦合部件形成为与基底一体的组件或直接形成在基底之上。表面安装组件可以使用卡扣配合耦合装配到机械耦合部件。该方法可以替代地包括将机械耦合部件形成为表面安装组件的一体组件。
附图说明
现在将参考附图详细描述本发明的实例，其中：
图1示出了附接到基底的已知的表面安装器件；
图2示出了附接到基底的表面安装器件的第一实例；
图3示出了附接到基底的表面安装器件的第二实例；
图4示出了机械耦合部件的三种可能的设计；
图5示出了四种不同的耦合布置；
图6示出了卡扣配合耦合布置；以及
图7示出了一种制作方法。
具体实施方式
本发明提供了一种器件，包括基底上的表面安装组件，其中表面安装组件通过一组分立的机械耦合部件且通过结合层附接，结合层诸如是导电粘合剂层、或焊料层、或焊料部分。这使机械耦合性能和电/热性能能够分别地优化。
图1 示出了使用执行互连功能的焊料或粘合剂层14连接到基底12的常规表面安装器件10。它必须满足电、热和机械要求。
图2示出了本发明的布置的一个实例。互连功能在两个部件之间分担。第一机械耦合部件20提供机械耦合。第二部件22是软的结合材料层，其满足热和电要求，但不需要提供牢固的机械耦合。
可替换地，可以有三个部件：机械耦合部件20、诸如焊料连接或电线连接的电连接（其不需要被设计为提供完整的机械或热支持）、以及主要提供热功能的粘合剂层。
本发明对在表面安装器件的主体和下面的基底之间需要导电耦合（即当表面安装器件的基部包括需要电接触到的区域时）的表面安装技术特别感兴趣。
这适用于半导体管芯上的半导体器件，其中管芯需要被电连接到受控的电位，以便避免浮动电位。因此，电连接可以不连接到像这样的接触焊盘，但是可以（在管芯附接表面安装工艺中）连接到半导体管芯。
这也适用于在其基部具有接触端子的电组件（其可以是有源的或无源的）。例如，表面安装电容器在端部可以具有向下延伸到底面层的端子。
这也适用于除例如可以由接触引线提供的其他端子之外、在其基部具有接地端子的电子组件。
这也适用于在其基部具有一组接触端子的电子组件，并且这些端子可能是该组件仅有的接触端子。
在一些其他实施例中，组件可以具有所需的电连接，该电连接通过连接电线或引线、或通过诸如球栅阵列的焊料球连接来实现。在这种情况下，其余的热功能和机械功能可以通过使用机械耦合部件和因此无需导电的结合层来解耦。然而，本发明对没有引线的表面安装器件特别感兴趣。
以上实例示出，导电粘合剂层可以是如图2中所示的单个层，但是其可以具有如图3所示的不同的部分22a、22b，用于电连接到表面安装组件的基部的不同区域。
分开的部分22a、22b可以是导电粘合剂层的分开的区域。可替换地，部分22a、22b可以是焊料部分，所述焊料部分因此限定结合层。因此它们提供热以及电耦合。它们也提供机械耦合，但是由于使用机械耦合部件20，可以使机械性能宽松。
除焊料连接和机械耦合部件之外，也可以可选地提供分开的附加粘合剂层。附加的粘合剂层例如可以在比焊料部分的面积更大的面积上延伸。
组件和基底之间的连接可以被认为是管芯附接部件（其用于组件到基底的热耦合和机械耦合）和组件附接部件（其用于组件到基底的电耦合）。机械耦合部件仅用作管芯附接部件，并且它们被设计为提供所需的机械耦合性能。
机械耦合部件20利用可以有些弹性的机械连接将表面安装器件10固定到基底。该连接优选地是静定的或近似静定的。
静定结构（也称为“均衡”）是完全受约束的，并且用作精确约束运动耦合。其结构减少或消除了可能由机械作用或热作用引起的自应力（即没有外部负荷的应力）的可能性。因此，机械耦合能够使部件10和基底12之间的内部负荷相互作用最小化，并且消除了自应力的可能性。
另外，机械耦合可以被设计成仅在弹性范围内受到应力。这种方式的耦合部件仅具有可逆的弹性变形，使得在释放当前的负荷之后，机械耦合回复到其原始形状。这样减少或消除了耦合部件中的疲劳，这增加了部件和系统的寿命。
机械耦合中以及部件本身中的应力可以被最小化，这使得寿命最大化。
结合层既可以用作组件的热耦合又可以用作电附接。这两个功能可以通过诸如导热粘合剂的结合层的单个设计来执行，或者可以作为分开的部件来执行，诸如与热耦合结合层结合的电焊料连接。
电功能性和热功能性可以利用标准材料（例如标准高导电性低硬度材料）实现。一个实例是填充有导电颗粒的粘合剂。这些材料的机械性能是次要的，因为机械功能性由机械耦合部件20来实现。
因此，本发明特别涉及机械耦合部件20，其使得能够将组件10弹性（近似）静定地固定到基底12。
增材制造技术（例如3D打印）的发展使得能够制作诸如片簧、受限的片簧、以及斜杠或支柱（在本文和下面的权利要求书中通常被称为连接棒）的小的、精细的弹性组件。
图4（a）示出了斜向连接支柱30（被称为斜杠）。这样的支柱也可以用作竖直或水平连接器。图4（b）示出了片簧32，并且图4（c）示出了一个受限片簧34。受限片簧在其表面中形成有图案以限定通道。这些改变了弹簧的特性。通道允许片簧的顶部边缘和底部边缘相对旋转。请注意，一对交叉支柱以与受限片簧相同的方式起作用。
这些结构每个都是平面的（尽管交叉的支柱可能具有较厚的中心部分），并且它们允许垂直于平面的一些弹性变形。
图5示出了提供静定结构的各种可能的连接方案。
图5（a）示出了两个部件之间的一组三个竖直耦合以及一组三个横向耦合。机械耦合部件都是连接棒耦合。
图5（b）示出了两个组件之间的一组两个竖直耦合，其中一个包括受限片簧34，并且另一个包括完整的片簧。它们是竖直的，但彼此正交。完整的片簧横跨部件的一侧的整个宽度延伸，使得仅需要两个机械耦合部件来形成期望的静定结构。
图5（c）示出了在两个组件之间的一组三个竖直耦合，每个耦合呈一对交叉棒30的形式。
图5（d）示出了两个组件之间的一组三个竖直耦合，每个耦合都是受限片簧34的形式。
机械耦合部件的数量与组件和基底之间的电连接的数量无关。例如可以恰好有两个或三个机械耦合部件，如上面的实例所示，其中一个机械耦合部件被视为包括附接到组件的特定位置的所有部件。例如，图5（a）示出了三个机械耦合部件；在组件的三个角处各一个。图5（b）示出了两个机械耦合部件，一个机械耦合部件沿着组件的一个边缘，并且另一个机械耦合部件在另一个角处。
机械耦合部件可以是导电的或绝缘的。它们连接到远离（即不包括）电接触端子的组件区域，例如组件的绝缘区域。
机械耦合部件的高度被设计成使得组件仅在弹性范围内承受负荷。如上所述，可以例如通过在基底上3D打印或基底本身的3D加工、单独制作随后附接到基底或者组件、或者通过其他方法，来创建机械耦合部件。
表面安装组件10和机械耦合部件20之间的连接可以通过夹具或插锁（clicking）系统来制作。图6示出了一个可能的解决方案。
表面安装组件10卡扣配合在形成为机械耦合部件20的一部分的保持通道40中。
本发明可以应用于任何需要附接到基底的表面安装器件或管芯，其中该基底例如可以是印刷电路板、柔性箔片或引线框架。
机械耦合部件可以例如使用诸如铝或铜的金属形成，但是如果例如使用注塑或3D打印，也可能使用塑料部件。
机械耦合部件可具有10-300μm的高度和在相同范围内的宽度的尺寸，例如相同的高度和宽度。部件的厚度可以大约是1-10μm。因此，机械耦合部件是平面结构，这意味着厚度至多是最大面内尺寸的1/10，并且该形状通常是平坦的，但不一定是完全平面的。在如图4（a）中所示的支柱的情况下，它们也是平面的，因为厚度至多是长度（这是最大的面内尺寸）的1/10。支柱可以被认为是一维连接，并且片簧或交叉支柱布置可以被认为是二维连接。
图7示出了一种制作方法。
图7（a）示出了基底12，其可以是半导体基底、印刷电路板、引线框或柔性箔片。
机械耦合部件20例如通过在基底之上的层沉积（例如通过3D打印工艺）形成，以提供图7（b）中所示的结构。
如图7（c）所示，表面安装组件例如通过卡扣配合耦合附接到机械耦合部件20。
如图7（d）所示，然后注入粘合剂层。可替换地，可以在附接表面安装组件10之前施加粘合剂层，然后在附接表面安装组件10之后固化粘合剂层。
通过研究附图、公开内容和所附权利要求，本领域技术人员在实践所要求保护的本发明时可以理解和实现所公开实施例的其他变型。在权利要求中，词语“包括”不排除其他元件或步骤，并且不定冠词“一”或“一个”不排除多个。在相互不同的从属权利要求中列举某些措施这一纯粹事实并不表示这些措施的组合不能有利地使用。权利要求中的任何附图标记不应被解释为限制范围。

Claims (14)

1.一种器件，包括：
表面安装组件（10）；以及
基底（12），
其中表面安装组件（10）通过一组分立的机械耦合部件（20；30；32；34）并通过结合层（22）附接到基底；并且
其中机械耦合部件（20；30；32；34）在基底和表面安装组件之间提供静定耦合，并且结合层在表面安装组件和基底之间提供电互连和/或热互连。
2.如权利要求1所述的器件，其中所述结合层（22）是导电粘合剂层。
3.如权利要求2所述的器件，其中所述结合层（22）包括具有嵌入的导电颗粒的粘合剂。
4.如权利要求2或3所述的器件，其中所述表面安装组件（10）包括在组件的基部表面处的至少一个电接触焊盘，所述至少一个电接触焊盘通过导电粘合剂层（22）连接到基底上。
5.如权利要求4所述的器件，其中所述表面安装组件（10）包括在其基部的接地触点。
6.如权利要求4所述的器件，其中所述表面安装组件（10）包括具有延伸到基部表面的一组至少两个接触端子的分立的组件。
7.如权利要求1、2或3所述的器件，其中所述表面安装组件（10）包括半导体组件，其中半导体管芯通过结合层（22）连接到基底。
8.如前述任一项权利要求所述的器件，其中一个或多个所述机械耦合部件（20；30；32；34）嵌入在结合层中。
9.如前述任一项权利要求所述的器件，其中每个所述机械耦合部件包括以下之一：
连接棒（30）；
一对（32）交叉的连接棒；
限定片簧的焊盘；
限定受限片簧的图案化焊盘（34）。
10.如前述任一项权利要求所述的器件，其中所述基底（12）包括：
半导体基底；或
印刷电路板；或
引线框架；或
柔性箔片。
11.如前述任一项权利要求所述的器件，其中所述机械耦合部件（20；30；32；34）形成为与基底一体的组件或直接形成在基底之上，并且可选地，其中所述表面安装组件卡扣配合到机械耦合部件。
12.一种制作器件的方法，包括：
使用在基底和表面安装组件之间提供静定耦合的一组分立的机械耦合部件（20；30；32；34）将表面安装组件（10）安装到基底；以及
在将表面安装组件安装到基底之后，提供结合层（22），所述结合层（22）在表面安装组件和基底之间提供电互连和/或热互连。
13.如权利要求12所述的方法，其中提供结合层包括提供导电粘合剂层（22）。
14.如权利要求12所述的方法，包括将所述机械耦合部件（20；30；32；34）形成为与基底一体的组件或与所述组件一体的组件、或将所述机械耦合部件（20；30；32；34）直接形成在基底之上。
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