CN108022860B - 用于处理基板的装置和方法 - Google Patents

用于处理基板的装置和方法 Download PDF

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CN108022860B
CN108022860B CN201711044543.3A CN201711044543A CN108022860B CN 108022860 B CN108022860 B CN 108022860B CN 201711044543 A CN201711044543 A CN 201711044543A CN 108022860 B CN108022860 B CN 108022860B
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substrate
heating
support plate
interval
liquid
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CN108022860A (zh
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郑煐宪
朴昶昱
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Semes Co Ltd
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Semes Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/002—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour incorporating means for heating or cooling, e.g. the material to be sprayed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201711044543.3A 2016-10-31 2017-10-31 用于处理基板的装置和方法 Active CN108022860B (zh)

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Application Number Priority Date Filing Date Title
KR1020160143129A KR101927699B1 (ko) 2016-10-31 2016-10-31 기판 처리 장치 및 방법
KR10-2016-0143129 2016-10-31

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CN108022860B true CN108022860B (zh) 2022-05-03

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Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10203604B2 (en) * 2015-11-30 2019-02-12 Applied Materials, Inc. Method and apparatus for post exposure processing of photoresist wafers
KR102030068B1 (ko) * 2017-10-12 2019-10-08 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN108333885A (zh) * 2018-02-08 2018-07-27 武汉华星光电技术有限公司 涂布装置
KR102099105B1 (ko) * 2018-07-18 2020-05-15 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR102204884B1 (ko) * 2018-09-27 2021-01-19 세메스 주식회사 기판 반송 로봇 및 기판 처리 설비
JP7213648B2 (ja) * 2018-09-27 2023-01-27 東京エレクトロン株式会社 基板処理装置
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CN109860024B (zh) * 2019-01-04 2022-07-08 山东天岳先进科技股份有限公司 一种降低晶片表面颗粒度的清洁方法
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