CN108006491B - LED tunnel lamp - Google Patents
LED tunnel lamp Download PDFInfo
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- CN108006491B CN108006491B CN201711216523.XA CN201711216523A CN108006491B CN 108006491 B CN108006491 B CN 108006491B CN 201711216523 A CN201711216523 A CN 201711216523A CN 108006491 B CN108006491 B CN 108006491B
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- Prior art keywords
- silica gel
- lamp
- led
- lamp body
- tunnel lamp
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
- F21V23/0464—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the level of ambient illumination, e.g. dawn or dusk sensors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/101—Outdoor lighting of tunnels or the like, e.g. under bridges
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to an LED tunnel lamp, which comprises: a lamp body (1); a light emitting source (2) disposed in the lamp body (1); the light-transmitting panel (3) is arranged on the surface of the lamp body (1); the photosensitive sensor (4) is arranged on the surface of the lamp body (1); wherein, the luminous source (2) comprises more than one LED lamp (21). The LED tunnel lamp provided by the invention has the advantages of light weight, high light transmittance, good heat dissipation effect, simple structure and low cost.
Description
Technical Field
The invention belongs to the technical field of LED luminescence, and particularly relates to an LED tunnel lamp.
Background
The Light-Emitting Diode (LED) has the characteristics of long service life, high luminous efficiency, good color rendering, safety, reliability, rich color and easy maintenance. Under the background of today's increasingly serious environmental pollution, climate warming and energy shortage, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21 st century. This is a major leap in the history of human lighting since gas lighting, incandescent lamps and fluorescent lamps, and has rapidly improved the lighting quality of human life. The LED tunnel lamp generally needs to be dustproof, waterproof, corrosion-resistant and rust-proof, so that the LED tunnel lamp has strong anti-strong collision and impact capabilities. The LED tunnel lamp can be suitable for large-area flood lighting in places such as tunnels, workshops, large warehouses, venues, metallurgy, various factories, engineering construction and the like. Of course, the most used scenario is also tunneling.
Along with the rapid development of road traffic construction in China, the construction scale and the number of highway tunnels are also larger and larger, the application of tunnel lamps is also wider and wider, the LED tunnel lamp is one of the tunnel lamps, is applied to large-area illumination in places such as tunnels and the like, selects the LED as a light source of a luminous body, and can realize multipurpose illumination by matching with different reflectors; and the softening treatment can not cause dazzling or other uncomfortable reactions.
At present, the heat dissipation problem of the LED tunnel lamp is still outstanding, and the heat dissipation effect of the lamp directly influences the service life of the LED luminous body, so that the working reliability and the maintenance cost of the lamp are influenced. In the prior art, the problems of heating and heat dissipation of the LED tunnel lamp are mostly solved by researching the structure of the LED tunnel lamp or controlling the working time of the LED tunnel lamp, wherein the structure of the LED tunnel lamp is modified in a complex way to achieve a better heat dissipation effect, so that the problems of more complex manufacturing process, larger volume and weight, higher cost and the like of the LED tunnel lamp are caused; due to the vibration effect of vehicles passing through the tunnel, the heavier the LED tunnel lamp is, the greater the potential safety hazard is brought; the working time of the LED tunnel lamp is controlled to achieve a better control heating effect, the manufacturing cost and the labor cost of control can be increased, and the brightness is reduced due to the fact that the LED tunnel lamp is controlled to partially emit light.
Therefore, it is important to manufacture a high-quality LED tunnel lamp which is lighter, has better heat dissipation effect and higher light extraction rate.
Disclosure of Invention
In order to improve the working performance of the LED tunnel lamp, the invention provides the LED tunnel lamp; the technical problem to be solved by the invention is realized by the following technical scheme:
an embodiment of the present invention provides an LED tunnel lamp, including:
a lamp body 1;
a light source 2 disposed in the lamp body 1;
a light-transmitting panel 3 disposed on the surface of the lamp body 1;
the photosensitive sensor 4 is arranged on the surface of the lamp body 1;
wherein, the luminous source 2 comprises more than one LED lamp 21.
In one embodiment of the present invention, the LED lamps 21 are arranged in a circular array on the light emitting surface of the lamp body 1.
In an embodiment of the present invention, the LED lamp 21 sequentially includes, from bottom to top: the LED module comprises a heat dissipation substrate 211, an LED chip 212, a first silica gel layer 213, a lens area 214 and a second silica gel layer 215.
In one embodiment of the present invention, the first silicone gel layer 213 contains no phosphor, and the second silicone gel layer 215 contains phosphor.
In one embodiment of the present invention, the refractive index of the first silicone gel layer 213 is smaller than the refractive index of the second silicone gel layer 215, and the refractive index of the lens region 214 is larger than the refractive indices of the first silicone gel layer 213 and the second silicone gel layer 215.
In an embodiment of the present invention, the heat-dissipating substrate 211 has a plurality of circular grooves; the central axis of the circular groove is parallel to the plane of the heat dissipation substrate 211.
In one embodiment of the invention, the LED tunnel lamp further comprises a bracket 5; the bracket 5 is a U-shaped bracket with an open end rotatably connected to the lamp body 1.
In one embodiment of the present invention, the LED tunnel lamp further comprises a controller; wherein, the controller is arranged in the lamp body 1.
In one embodiment of the present invention, a heat dissipation plate is disposed on the back surface of the lamp body 1; wherein, be provided with a plurality of circular slots on the heating panel.
In one embodiment of the present invention, the material of the lamp body 1 and the bracket 5 is an aluminum alloy.
Compared with the prior art, the invention has the following beneficial effects:
the LED tunnel lamp provided by the invention has the advantages of light weight, high light transmittance, good heat dissipation effect, simple structure and low cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Other aspects and features of the present invention will become apparent from the following detailed description, which proceeds with reference to the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.
Fig. 1 is a schematic structural diagram of an LED tunnel lamp according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention;
fig. 3 is a schematic view of a heat dissipation substrate according to an embodiment of the invention;
fig. 4 a-4 b are schematic diagrams illustrating a silica gel hemisphere distribution according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing an LED lamp according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.
Example one
Referring to fig. 1, fig. 1 is a schematic structural diagram of an LED tunnel lamp according to an embodiment of the present invention, including:
a lamp body 1;
a light source 2 disposed in the lamp body 1;
a light-transmitting panel 3 disposed on the surface of the lamp body 1;
the photosensitive sensor 4 is arranged on the surface of the lamp body 1;
wherein, the luminous source 2 comprises more than one LED lamp 21.
Specifically, the LED lamps 21 are arranged in a circular shape on the light emitting surface of the lamp body 1.
Further, the LED tunnel lamp also comprises a bracket 5; the bracket 5 is a U-shaped bracket with an open end rotatably connected to the lamp body 1.
Preferably, the LED tunnel lamp further comprises a controller; wherein, the controller is arranged in the lamp body 1.
Specifically, the controller is connected with the photosensitive sensor, the photosensitive sensor 4 receives external light intensity information and feeds the light intensity information back to the controller, and the controller generates a control instruction according to the received information to control the LED light source to emit light or partially emit light.
Specifically, an aluminum alloy heat dissipation plate is arranged on the back of the lamp body 1; wherein, be provided with a plurality of circular slots on the heating panel. Wherein, set up the passageway that the circulation of air can be increased through setting up the circular slot in the aluminum alloy heating panel, increased the radiating effect.
Preferably, the material of the lamp body 1 and the bracket 5 is an aluminum alloy.
The LED tunnel lamp provided by the embodiment is simple in structure, and solves the problems that the traditional LED tunnel lamp is heavy in weight and inconvenient to install and has potential safety hazards caused by vibration generated by vehicles due to the adoption of the aluminum alloy lamp body and the bracket which are light in weight; has the characteristics of convenient installation, safe use and wide application; meanwhile, the photosensitive sensor and the controller are used for controlling the opening and closing of the LED lamp, so that intelligent illumination of the LED tunnel lamp is realized, energy is saved, and the service life of the LED tunnel lamp is prolonged.
Example two
In this embodiment, another LED tunnel lamp is described in detail based on the above embodiment, the LED lamp 21 of the LED tunnel lamp adopts the following structure, please refer to fig. 2, and fig. 2 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention.
Specifically, the LED lamp 21 sequentially includes, from bottom to top: the heat dissipation substrate 211, the LED chip 212, the first silicone rubber layer 213, the lens region 214, and the second silicone rubber layer 215; wherein, the thickness of the first silica gel layer 213 is 10 μm to 110 μm, and the thickness of the second silica gel layer 215 is 50 μm to 500 μm.
Preferably, the LED chip is an ultraviolet LED chip.
Preferably, the heat dissipation substrate 211 is a copper material or aluminum material heat dissipation substrate.
Further, referring to fig. 3, fig. 3 is a schematic view of a heat dissipation substrate according to an embodiment of the present invention, wherein the heat dissipation substrate 211 is provided with a plurality of circular grooves; the central axis of the circular groove is parallel to the plane of the heat dissipation substrate 211.
The radiating substrate with the circular grooves is adopted, the strength is almost unchanged, meanwhile, the cost of the radiating substrate is reduced, the air circulation channel is increased, and the radiating effect is improved by utilizing the heat convection of air.
Specifically, the first silica gel layer 213 does not contain phosphor, and the second silica gel layer 215 contains phosphor. The fluorescent powder is red, green and blue.
The color of the light can be continuously adjusted by changing the content of the red, green and blue fluorescent powders, and the light can be changed into any color besides white light, and simultaneously the color temperature of the light source can be adjusted.
Preferably, the lens region 214 includes a plurality of silicone hemispheres distributed in a rectangular or rhombic shape, wherein the silicone of the silicone hemispheres does not contain phosphor.
Preferably, the radius of the silica gel hemisphere is greater than 10 μm, the distance from the silica gel hemisphere to the LED chip 212 is greater than 3 μm, and the distance between the silica gel hemispheres is 5 to 10 μm.
Specifically, referring to fig. 4a to 4b, fig. 4a to 4b are schematic diagrams illustrating distribution of silica gel hemispheres according to an embodiment of the present invention, in fig. 4a, the silica gel hemispheres are uniformly distributed between the first silica gel layer and the second silica gel layer in a rectangular shape; in fig. 4b, the silica gel hemispheres are uniformly distributed between the first silica gel layer and the second silica gel layer in a diamond shape.
Further, the refractive index of the first silicone rubber layer 213 is smaller than that of the second silicone rubber layer 215, and the refractive index of the lens region 214 is larger than that of the first silicone rubber layer 213 and the second silicone rubber layer 215.
The LED lamp of the LED tunnel lamp provided by the embodiment adopts a structure that the fluorescent powder is separated from the LED chip, so that the problem of the reduction of the quantum efficiency of the fluorescent powder caused by high temperature is avoided; the silica gel in contact with the LED chip in the LED lamp is high-temperature-resistant silica gel, so that the problem of light transmittance reduction caused by aging and yellowing of the silica gel is solved; meanwhile, the refractive index design of the LED lamp can ensure that more light rays of the LED chip can be irradiated out through the packaging material, and the problem of insufficient brightness caused by low light transmittance is avoided. Therefore, the LED tunnel lamp of the embodiment has stable quantum efficiency and light transmittance, strong reliability, high light transmittance and high brightness.
EXAMPLE III
In this embodiment, a method for manufacturing an LED lamp according to the present invention is described in detail below on the basis of the above-described embodiments. Specifically, referring to fig. 5, fig. 5 is a flowchart of a method for manufacturing an LED lamp according to an embodiment of the present invention, including the following steps:
s21, selecting a heat dissipation substrate;
s22, selecting an LED chip;
s23, welding the LED chip on the heat dissipation substrate;
s24, coating first silica gel above the LED chip to form a first silica gel layer;
s25, preparing a hemispherical lens area above the first silica gel layer;
s26, preparing fluorescent powder glue;
s27, coating fluorescent powder glue above the first silica gel layer and the hemispherical lens area to form a second silica gel layer; to complete the LED package.
Specifically, step S21 may include:
s211, selecting a heat dissipation substrate and a support;
s212, cleaning the heat dissipation substrate and the bracket;
s213, drying the heat dissipation substrate and the support.
Preferably, the heat dissipation substrate is made of a copper material, the thickness of the heat dissipation substrate is greater than 0.5 mm and less than 10 mm, a circular groove is formed in the heat dissipation substrate along the width direction, and the circular groove is parallel to the plane of the heat dissipation substrate in the width direction of the heat dissipation substrate; the diameter of the circular groove in the heat dissipation substrate is 0.3-2 mm, and the distance between the circular holes is 0.5-10 mm.
Preferably, the LED chip is an ultraviolet LED chip.
Specifically, step S23 may include:
s231, printing solder and checking the die bonding of the solder:
s232, welding the LED chip on the radiating substrate by adopting a reflow soldering process, and installing the radiating substrate on the bracket.
Specifically, step S24 may include:
s241, coating first silica gel above the LED chip;
s242, baking the blank with a mold for 15-60 minutes at the temperature of 90-125 ℃;
and S243, removing the mould after baking to form a first silica gel layer.
Preferably, step S25 may include:
s251, coating second silica gel on the first silica gel layer to form a third silica gel layer;
s252, forming a plurality of silica gel hemispheres on the third silica gel layer by adopting a plurality of hemispherical molds;
and S253, removing the mold after baking the belt mold to form a hemispherical lens area.
Specifically, step S26 may include:
s261, selecting fluorescent powder and silica gel;
s262, mixing the fluorescent powder and the silica gel to form fluorescent powder gel;
s263, carrying out color test on the fluorescent powder glue;
s264, baking the fluorescent powder glue.
Further, the fluorescent powder is red, green and blue; namely, the fluorescent powder glue contains three kinds of fluorescent powder of red, green and blue;
the fluorescent powder glue can continuously adjust the color of light by changing the content of red, green and blue fluorescent powder, can also be changed into any color except white light, and can also adjust the color temperature of a light source.
Preferably, step S27 may include:
s271, coating the fluorescent powder glue above the first silica gel layer and the hemispherical lens area;
s272, forming a second silica gel layer on the fluorescent powder glue by adopting a hemispherical mold;
s273, removing the die after baking;
s274, baking for 4-12 hours at the temperature of 100-150 ℃ to finish the LED packaging.
Specifically, step S27 is followed by: and detecting and packaging the LED packaging structure.
In summary, the principle and embodiments of the present invention are explained herein by using specific examples, and the above descriptions of the examples are only used to help understanding the present invention and its core ideas; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention, and the scope of the present invention should be subject to the appended claims.
Claims (6)
1. An LED tunnel lamp, comprising:
a lamp body (1);
a light emitting source (2) disposed in the lamp body (1);
the light-transmitting panel (3) is arranged on one side of the light-emitting surface of the light-emitting source (2) and is positioned right above the light-emitting source (2);
the photosensitive sensor (4) is arranged on the surface of the lamp body (1);
wherein the light emitting source (2) comprises more than one LED lamp (21); the LED lamps (21) are arranged on the light emitting surface of the lamp body (1) in a circular shape;
the LED lamp (21) sequentially comprises from bottom to top: the LED chip comprises a heat dissipation substrate (211), an LED chip (212), a first silica gel layer (213), a lens area (214) and a second silica gel layer (215); wherein the first silica gel layer (213) does not contain fluorescent powder, and the second silica gel layer (215) contains fluorescent powder; the refractive index of the first silicone rubber layer (213) is smaller than that of the second silicone rubber layer (215), and the refractive index of the lens region (214) is larger than that of the first silicone rubber layer (213) and the second silicone rubber layer (215);
the lens area (214) comprises a plurality of rectangular or rhombic silica gel hemispheres, the radius of each silica gel hemisphere is larger than 10 micrometers, the distance from each silica gel hemisphere to the LED chip (212) is larger than 3 micrometers, and the distance between the silica gel hemispheres is 5-10 micrometers;
the silica gel of the first silica gel layer (213) is high-temperature-resistant silica gel.
2. The tunnel lamp of claim 1, wherein the heat-dissipating substrate (211) is provided with a plurality of first circular grooves therein; the central axis of the first circular groove is parallel to the plane of the heat dissipation substrate (211).
3. The tunnel lamp of claim 1, wherein the LED tunnel lamp further comprises a bracket (5); the support (5) is a U-shaped support with an opening end rotatably connected to the lamp body (1).
4. The tunnel lamp of claim 1 wherein the LED tunnel lamp further comprises a controller; wherein, the controller is arranged in the lamp body (1).
5. The tunnel lamp according to claim 1, wherein a heat dissipation plate is provided on the rear surface of the lamp body (1); wherein, be provided with a plurality of second circular slots on the heating panel.
6. A tunnel lamp according to claim 1, characterized in that the material of the lamp body (1) is an aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711216523.XA CN108006491B (en) | 2017-11-28 | 2017-11-28 | LED tunnel lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711216523.XA CN108006491B (en) | 2017-11-28 | 2017-11-28 | LED tunnel lamp |
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| Publication Number | Publication Date |
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| CN108006491A CN108006491A (en) | 2018-05-08 |
| CN108006491B true CN108006491B (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711216523.XA Expired - Fee Related CN108006491B (en) | 2017-11-28 | 2017-11-28 | LED tunnel lamp |
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