CN107969075B - FPC hot pressing positioner - Google Patents
FPC hot pressing positioner Download PDFInfo
- Publication number
- CN107969075B CN107969075B CN201711454298.3A CN201711454298A CN107969075B CN 107969075 B CN107969075 B CN 107969075B CN 201711454298 A CN201711454298 A CN 201711454298A CN 107969075 B CN107969075 B CN 107969075B
- Authority
- CN
- China
- Prior art keywords
- platform
- base
- shaft
- adjusting screw
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007731 hot pressing Methods 0.000 title claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 25
- 238000007906 compression Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 238000002788 crimping Methods 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711454298.3A CN107969075B (en) | 2017-12-28 | 2017-12-28 | FPC hot pressing positioner |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711454298.3A CN107969075B (en) | 2017-12-28 | 2017-12-28 | FPC hot pressing positioner |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107969075A CN107969075A (en) | 2018-04-27 |
CN107969075B true CN107969075B (en) | 2024-01-19 |
Family
ID=61995964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711454298.3A Active CN107969075B (en) | 2017-12-28 | 2017-12-28 | FPC hot pressing positioner |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107969075B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109068503B (en) * | 2018-09-14 | 2021-03-12 | 深圳市宇顺电子股份有限公司 | Tin pressing jig and using method thereof |
CN109524509B (en) * | 2018-12-26 | 2023-10-20 | 东莞市沃德精密机械有限公司 | Diaphragm incision sealing device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202495431U (en) * | 2012-03-24 | 2012-10-17 | 精工伟达科技(深圳)有限公司 | Positioning and hot pressing device of single IC chip module |
CN203523163U (en) * | 2013-09-13 | 2014-04-02 | 深圳市立德通讯器材有限公司 | FPC hot-pressing positioning jig |
CN203765160U (en) * | 2014-04-03 | 2014-08-13 | 华为技术有限公司 | Hot press leveling structure |
KR20150000433A (en) * | 2013-06-24 | 2015-01-02 | 통-타이 머신 앤드 툴 코., 엘티디. | Feeding and leveling method and system for a flexible pcb drilling machine |
CN207766677U (en) * | 2017-12-28 | 2018-08-24 | 苏州广林达电子科技有限公司 | FPC hot pressing positioning devices |
-
2017
- 2017-12-28 CN CN201711454298.3A patent/CN107969075B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202495431U (en) * | 2012-03-24 | 2012-10-17 | 精工伟达科技(深圳)有限公司 | Positioning and hot pressing device of single IC chip module |
KR20150000433A (en) * | 2013-06-24 | 2015-01-02 | 통-타이 머신 앤드 툴 코., 엘티디. | Feeding and leveling method and system for a flexible pcb drilling machine |
CN203523163U (en) * | 2013-09-13 | 2014-04-02 | 深圳市立德通讯器材有限公司 | FPC hot-pressing positioning jig |
CN203765160U (en) * | 2014-04-03 | 2014-08-13 | 华为技术有限公司 | Hot press leveling structure |
CN207766677U (en) * | 2017-12-28 | 2018-08-24 | 苏州广林达电子科技有限公司 | FPC hot pressing positioning devices |
Also Published As
Publication number | Publication date |
---|---|
CN107969075A (en) | 2018-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Liang Xianguang Inventor after: Qian Taiyu Inventor after: Zheng Changping Inventor after: Xie Yong Inventor before: Niu Chengjie Inventor before: Lin Yutang Inventor before: Zheng Changping Inventor before: Kong Shuangquan Inventor before: Sun Yinglong Inventor before: Wang Jian |
|
CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: FPC hot press positioning device Granted publication date: 20240119 Pledgee: Bank of China Limited Suzhou Xiangcheng sub branch Pledgor: SUZHOU GRANDA ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2024980013308 |