CN110430685B - Device for welding microelectronic circuit board on two sides - Google Patents
Device for welding microelectronic circuit board on two sides Download PDFInfo
- Publication number
- CN110430685B CN110430685B CN201910751747.3A CN201910751747A CN110430685B CN 110430685 B CN110430685 B CN 110430685B CN 201910751747 A CN201910751747 A CN 201910751747A CN 110430685 B CN110430685 B CN 110430685B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- rotating arm
- pin
- seat
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003466 welding Methods 0.000 title claims abstract description 43
- 238000004377 microelectronic Methods 0.000 title claims abstract description 27
- 230000006835 compression Effects 0.000 claims description 48
- 238000007906 compression Methods 0.000 claims description 48
- 238000003825 pressing Methods 0.000 claims description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 239000002893 slag Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 2
- 238000003780 insertion Methods 0.000 abstract description 6
- 230000037431 insertion Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Abstract
The invention discloses a device for welding a microelectronic circuit board on two sides, which comprises a workbench, a rotating arm, a circuit board clamping head and a positioning disk, wherein the workbench is composed of a bottom plate, an upright post and a cross beam; the swinging angle of the rotating arm is controlled through the insertion connection of a first locating pin on the rotating arm and a locating disc; the second locating pin on the rotating arm is inserted into the inserting disc on the circuit board clamping head to control the welding surface or welding position of the microelectronic circuit board, so that the elements are prevented from being extruded and damaged. The invention has the advantages of convenient adjustment, high-precision welding, and improved welding quality and working efficiency.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, and is used for welding a circuit board, in particular to a device for welding a microelectronic circuit board on two sides.
Background
The circuit board is divided into a single panel according to the number of layers, the double panel and the multi-layer circuit board are divided into three major categories, the parts of the single panel are concentrated on one side, the wires are concentrated on the other side, copper-coated wires are arranged on both sides of the double panel, the wires between the two layers can be conducted through the through holes, the multi-layer circuit board is formed by pressing a conductive pattern layer with more than three layers and an insulating material layer between the conductive pattern layer and the conductive pattern layer, and the panel with any structure needs to be welded on the panel.
The welding device used in the prior art mainly adopts a fixed welding platform, a circuit board is placed on the platform for welding, and the problem is that the welding mode is inconvenient to adjust the welding angle and the direction, and when the front and back welding is carried out, the circuit board is required to be turned over, so that the components at the bottom of the circuit board are easy to crush, the welding efficiency is low, and the accuracy is not high.
Disclosure of Invention
The invention aims at overcoming the defects of the prior art and provides a device for welding a microelectronic circuit board on two sides, which adopts a workbench formed by a bottom plate, a stand column and a beam, wherein a rotating arm is hinged on the beam, one end of the rotating arm is hinged with a circuit board clamping head, when the device works, a microelectronic circuit board to be welded is clamped on the circuit board clamping head, the height position of the circuit board clamping head relative to the workbench is adjusted through the swinging of the rotating arm relative to the beam, and the front and back sides and the welding orientation of the microelectronic circuit board are adjusted through the rotation of the circuit board clamping head relative to the rotating arm; the swinging angle of the rotating arm is controlled through the insertion connection of a first locating pin on the rotating arm and a locating disc; and the welding surface or welding orientation of the microelectronic circuit board is controlled by inserting a second locating pin on the rotating arm into the inserting disc on the circuit board clamping head. The invention has the advantages of convenient adjustment, high-precision welding, and improved welding quality and working efficiency.
The specific technical scheme for realizing the aim of the invention is as follows:
a device for welding microelectronic circuit boards on two sides is characterized by comprising a workbench, a rotating arm, a circuit board clamping head and a positioning disk;
the workbench consists of a bottom plate, upright posts and a cross beam; one end of the cross beam is provided with a first shaft seat, and the other end of the cross beam is provided with a rotating arm seat; the upright post is vertically fixed on the bottom plate, and the cross beam is horizontally fixed on the upright post through the other end;
the rotating arm is a rod piece with a first locating pin at one end, a second shaft seat at the other end, a second locating pin and a hinge shaft in the middle;
the positioning disc is provided with a disc inserting hole and is arranged on a rotating arm seat of the upper cross beam of the workbench;
the rotating arm is hinged with a first shaft seat of an upper cross beam of the workbench through a hinge shaft in the middle, and a first locating pin on the rotating arm is spliced with a plug hole of the locating disc;
the circuit board clamping head consists of a rotating shaft, a fixed frame and an inserting disc; one end of the rotating shaft is provided with a rotating handle and a tray inserting seat, the tray inserting seat is provided with a tray inserting hole, the tray inserting seat is arranged on the tray inserting seat of the rotating shaft, and the fixing frame is arranged at the other end of the rotating shaft;
the circuit board clamping head is hinged with the second shaft seat of the rotating arm through the rotating shaft, and the second locating pin on the rotating arm is spliced with the inserting disc hole of the inserting disc on the circuit board clamping head.
The fixed frame is in a channel steel shape, a plurality of compression bar seats are arranged on one side face of the channel steel, and a spring compression bar is arranged on each compression bar seat.
The first locating pin and the second locating pin are composed of a pin shaft shell, a pin shaft and a pin shaft spring, and the pin shaft spring are arranged in the pin shaft shell.
The spring compression bar is composed of a compression bar spring and a compression sheet, the compression bar is arranged on a compression bar seat of the fixed frame, the compression bar spring is arranged between the compression bar seat and the compression bar, and the compression sheet is arranged at the bottom of the compression bar.
And a welding slag collecting groove is arranged on the table top of the workbench.
The invention adopts a workbench composed of a bottom plate, a stand column and a cross beam, a rotating arm is hinged on the cross beam, one end of the rotating arm is hinged with a circuit board clamping head, when in operation, a microelectronic circuit board to be welded is clamped on the circuit board clamping head, the height position of the circuit board clamping head relative to the workbench is adjusted through the swinging of the rotating arm relative to the cross beam, and the front and back sides and the welding orientation of the microelectronic circuit board are adjusted through the rotation of the circuit board clamping head relative to the rotating arm; the swinging angle of the rotating arm is controlled through the insertion connection of a first locating pin on the rotating arm and a locating disc; and the welding surface or welding orientation of the microelectronic circuit board is controlled by inserting a second locating pin on the rotating arm into the inserting disc on the circuit board clamping head. The invention has the advantages of convenient adjustment, high-precision welding, and improved welding quality and working efficiency.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of a circuit board clamping head according to the present invention;
FIG. 3 is a schematic view of a spring plunger according to the present invention;
fig. 4 is a schematic structural view of a first positioning pin according to the present invention.
Detailed Description
Referring to fig. 1, the invention comprises a workbench 1, a rotating arm 2, a circuit board clamping head 3 and a positioning disk 4;
referring to fig. 1 and 4, the workbench 1 is composed of a bottom plate 11, upright posts 12 and a cross beam 13; one end of the cross beam 13 is provided with a first shaft seat 131, and the other end is provided with a rotating arm seat; the upright post 12 is vertically fixed on the bottom plate 11, and the cross beam 13 is horizontally fixed on the upright post 12 through the other end;
the rotating arm 2 is a rod piece with a first positioning pin 21 at one end, a second shaft seat 22 at the other end, a second positioning pin 23 and a hinge shaft 24 in the middle;
the positioning disc 4 is provided with a disc inserting hole, and the positioning disc 4 is arranged on a rotating arm seat of the upper beam 13 of the workbench 1;
the rotating arm 2 is hinged with a first shaft seat 131 of the upper cross beam 13 of the workbench 1 through a hinge shaft 24 in the middle, and a first locating pin 21 on the rotating arm 2 is spliced with a plug hole of the locating disc 4.
Referring to fig. 1, 2 and 4, the circuit board clamping head 3 is composed of a rotating shaft 31, a fixed frame 32 and an inserting disc 33; one end of the rotating shaft 31 is provided with a rotating handle and a tray seat, a tray 33 is provided with a tray hole, the tray 33 is arranged on the tray seat of the rotating shaft 31, and the fixed frame 32 is arranged at the other end of the rotating shaft 31;
the circuit board clamping head 3 is hinged with the second shaft seat 22 of the rotating arm 2 through the rotating shaft 31, and the second positioning pin 23 on the rotating arm 2 is spliced with a plug hole of the plug 33 on the circuit board clamping head 3.
Referring to fig. 2 and 3, the fixing frame 32 is in a channel shape, a plurality of compression bar seats are disposed on one side of the channel, and a spring compression bar 321 is disposed on the compression bar seats.
Referring to fig. 1 and 4, the first positioning pin 21 and the second positioning pin (23) are each composed of a pin housing 231, a pin 232 and a pin spring 233, and the pin 232 and the pin spring 233 are disposed in the pin housing 231.
Referring to fig. 1 and 3, the spring compression bar 321 is composed of a compression bar 322, a compression bar spring 323 and a compression bar 324, the compression bar 322 is disposed on a compression bar seat of the fixed frame 32, the compression bar spring 323 is disposed between the compression bar seat and the compression bar 322, and the compression bar 324 is disposed at the bottom of the compression bar 322.
Referring to fig. 1, a welding slag collecting groove is arranged on the surface of the workbench 1.
The operation process of the invention is as follows:
step one: clamping a microelectronic circuit board to be soldered:
referring to fig. 1, 2 and 3, the pressing bar 322 on the spring pressing bar 321 is pulled upward, the pressing bar 324 at the bottom of the pressing bar 322 is lifted, the edge of the microelectronic circuit board is placed in the channel steel of the fixing frame 32, then the pressing bar 322 is released, and the pressing bar 14 fixes the microelectronic circuit board on the fixing frame 32 by using the elastic force of the pressing bar spring 323.
Step two: adjusting the height position of the circuit board clamping head relative to the workbench:
referring to fig. 1, 2, 3 and 4, the pin shaft 232 of the first positioning pin 21 on the rotating arm 2 is pulled out from the insertion hole of the positioning disk 4 against the elasticity of the pin shaft spring 233, the rotating arm 2 swings up and down around the first shaft seat 131 on the cross beam 13, so that the height position of the circuit board clamping head 3 on the rotating arm 2 relative to the workbench 1 reaches an ideal position, the pin shaft 232 of the first positioning pin 21 on the rotating arm 2 is aligned with the corresponding insertion hole of the positioning disk 4, and the pin shaft 232 is inserted into the corresponding insertion hole of the positioning disk 4 under the action of the elasticity of the pin shaft spring 233, so that the adjustment of the height position of the circuit board clamping head 3 relative to the workbench 1 is completed.
Step three: adjusting the welding surface or welding direction of the microelectronic circuit board to be welded:
referring to fig. 1, 2, 3 and 4, the pin shaft 232 of the second positioning pin 23 on the rotating arm 2 is pulled out from the insert disc hole of the insert disc 33 against the elastic force of the pin shaft spring 233, the circuit board clamping head 3 is rotated around the second shaft seat 22 on the rotating arm 2, so that the front, the back or any welding orientation of the microelectronic circuit board on the circuit board clamping head 3 on the rotating arm 2 reaches the ideal welding orientation, the pin shaft 232 of the second positioning pin 23 on the rotating arm 2 is aligned with the corresponding insert disc hole on the insert disc 33, and the pin shaft 232 is inserted into the corresponding insert disc hole on the insert disc 33 under the elastic force of the pin shaft spring 233, so that the adjustment of any welding orientation of the microelectronic circuit board on the circuit board clamping head 3 is completed.
Due to the application of the invention, the microelectronic circuit board is in a suspended state in the welding process of any welding orientation, so that the extrusion of components on the front side or the back side is avoided.
Referring to fig. 1 and 4, the first positioning pin 21 and the second positioning pin 23 are the same, the first positioning pin 21 and the second positioning pin 23 are both arranged on the rotating arm 2 through the pin housing 231, and the pin 232 and the pin spring 233 are arranged in the pin housing 231.
Referring to fig. 1, 2 and 3, the fixing frame 32 of the present invention is in a channel steel shape, a side surface of the channel steel is provided with a plurality of compression bar seats, a spring compression bar 321 is arranged on the compression bar seats, the spring compression bar 321 is composed of a compression bar 322, a compression bar spring 323 and a compression bar 324, the compression bar 322 is arranged on the compression bar seats of the fixing frame 32, the compression bar spring 323 is arranged between the compression bar seats and the compression bar 322, and the compression bar 324 is arranged at the bottom of the compression bar 322. In order to prevent the compression bar 322 from scratching the microelectronic circuit board, the cup-shaped flexible compression bar 324 is arranged at the bottom of the compression bar 322, and the compression bar 324 contacts the microelectronic circuit board during fixation, so that the scratching of the microelectronic circuit board in the welding process is avoided.
Referring to fig. 1, in order to prevent the phenomenon of welding slag outflow during the process of welding a microelectronic circuit board, the invention provides a welding slag collecting groove on the surface of a workbench 1, thereby ensuring the safety and the neatness of the working environment.
While the invention has been described in terms of specific embodiments, it should be understood that the invention is not limited to those precise embodiments, and that various other embodiments may be apparent to one skilled in the art from consideration of the specification without departing from the scope of the invention as set forth in the appended claims.
Claims (3)
1. The device for welding the microelectronic circuit board on the two sides is characterized by comprising a workbench (1), a rotating arm (2), a circuit board clamping head (3) and a positioning disc (4);
the workbench (1) is composed of a bottom plate (11), upright posts (12) and a cross beam (13); one end of the cross beam (13) is provided with a first shaft seat (131), and the other end is provided with a rotating arm seat; the upright post (12) is vertically fixed on the bottom plate (11), and the cross beam (13) is horizontally fixed on the upright post (12) through the other end;
the rotating arm (2) is a rod piece with one end provided with a first positioning pin (21), the other end provided with a second shaft seat (22) and a second positioning pin (23), and the middle part provided with a hinge shaft (24);
the positioning disc (4) is provided with a disc inserting hole, and the positioning disc (4) is arranged on a rotating arm seat of an upper cross beam (13) of the workbench (1);
the rotating arm (2) is hinged with a first shaft seat (131) of an upper cross beam (13) of the workbench (1) through a hinge shaft (24) in the middle, and a first positioning pin (21) on the rotating arm (2) is spliced with a plug hole of the positioning disc (4);
the circuit board clamping head (3) consists of a rotating shaft (31), a fixed frame (32) and an inserting disc (33); one end of the rotating shaft (31) is provided with a rotating handle and a tray inserting seat, a tray inserting hole is formed in the tray inserting (33), the tray inserting (33) is arranged on the tray inserting seat of the rotating shaft (31), and the fixing frame (32) is arranged at the other end of the rotating shaft (31);
the circuit board clamping head (3) is hinged with a second shaft seat (22) of the rotating arm (2) through a rotating shaft (31), and a second positioning pin (23) on the rotating arm (2) is spliced with a plug hole of a plug (33) on the circuit board clamping head (3);
the fixing frame (32) is in a channel steel shape, one side surface of the channel steel is provided with a plurality of compression bar seats, and the compression bar seats are provided with spring compression bars (321);
and a welding slag collecting groove is arranged on the table top of the workbench (1).
2. The device for double-sided soldering of microelectronic circuit boards according to claim 1, characterized in that the first positioning pin (21) and the second positioning pin (23) are each composed of a pin housing (231), a pin (232) and a pin spring (233), and the pin (232) and the pin spring (233) are arranged in the pin housing (231).
3. The device for soldering a microelectronic circuit board according to claim 1, wherein the spring pressing rod (321) is composed of a pressing rod (322), a pressing rod spring (323) and a pressing sheet (324), the pressing rod (322) is arranged on a pressing rod seat of the fixing frame (32), the pressing rod spring (323) is arranged between the pressing rod seat and the pressing rod (322), and the pressing sheet (324) is arranged at the bottom of the pressing rod (322).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910751747.3A CN110430685B (en) | 2019-08-15 | 2019-08-15 | Device for welding microelectronic circuit board on two sides |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910751747.3A CN110430685B (en) | 2019-08-15 | 2019-08-15 | Device for welding microelectronic circuit board on two sides |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110430685A CN110430685A (en) | 2019-11-08 |
| CN110430685B true CN110430685B (en) | 2024-03-22 |
Family
ID=68414813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910751747.3A Active CN110430685B (en) | 2019-08-15 | 2019-08-15 | Device for welding microelectronic circuit board on two sides |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110430685B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111225504B (en) * | 2019-11-22 | 2021-07-30 | 阜阳美连德电子科技有限公司 | Positioner is used in circuit board production |
| CN112157330B (en) * | 2020-08-21 | 2022-11-29 | 苏州浪潮智能科技有限公司 | Circuit board welding table |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990035538A (en) * | 1997-10-31 | 1999-05-15 | 전주범 | Flexible PCB Soldering Jig for Optical Pickup |
| CN201755731U (en) * | 2010-03-20 | 2011-03-09 | 邬烈保 | Automobile instrument panel support welding clamp |
| DE102009055213A1 (en) * | 2009-12-22 | 2011-06-30 | Endress + Hauser GmbH + Co. KG, 79689 | Method for equipping and soldering components e.g. retaining pin, on mixed, two-sided equippable printed circuit board, involves fixing cover on board after completion of soldering works of parts, pins and surface mounted device components |
| CN203887438U (en) * | 2014-05-23 | 2014-10-22 | 上海信息技术学校 | Clamp for manual circuit board welding |
| CN207783326U (en) * | 2018-02-05 | 2018-08-28 | 深圳生溢快捷电路有限公司 | A kind of interlayer type double-side aluminum board production device |
| CN208613961U (en) * | 2018-06-26 | 2019-03-19 | 王鑫钊 | A kind of circuit board welding table |
-
2019
- 2019-08-15 CN CN201910751747.3A patent/CN110430685B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990035538A (en) * | 1997-10-31 | 1999-05-15 | 전주범 | Flexible PCB Soldering Jig for Optical Pickup |
| DE102009055213A1 (en) * | 2009-12-22 | 2011-06-30 | Endress + Hauser GmbH + Co. KG, 79689 | Method for equipping and soldering components e.g. retaining pin, on mixed, two-sided equippable printed circuit board, involves fixing cover on board after completion of soldering works of parts, pins and surface mounted device components |
| CN201755731U (en) * | 2010-03-20 | 2011-03-09 | 邬烈保 | Automobile instrument panel support welding clamp |
| CN203887438U (en) * | 2014-05-23 | 2014-10-22 | 上海信息技术学校 | Clamp for manual circuit board welding |
| CN207783326U (en) * | 2018-02-05 | 2018-08-28 | 深圳生溢快捷电路有限公司 | A kind of interlayer type double-side aluminum board production device |
| CN208613961U (en) * | 2018-06-26 | 2019-03-19 | 王鑫钊 | A kind of circuit board welding table |
Non-Patent Citations (1)
| Title |
|---|
| 电子焊接生产辅助机械臂设计;马琪;;机械(第05期);全文 * |
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| Publication number | Publication date |
|---|---|
| CN110430685A (en) | 2019-11-08 |
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