DE102009055213A1 - Method for equipping and soldering components e.g. retaining pin, on mixed, two-sided equippable printed circuit board, involves fixing cover on board after completion of soldering works of parts, pins and surface mounted device components - Google Patents

Abstract

The method involves equipping and soldering clamping parts, retaining pins and clamping brackets on a two-sided equippable printed circuit board, in addition to surface mounted device (SMD) components and if necessary through-hole-technology components. A cover e.g. cup-shaped housing, is fixed on the printed circuit board, after completion of soldering works of the clamping parts, retaining pins and the SMD components, where the cover is made up of electrically conductive plastic, suitably coated plastic or metal.

Description

The invention relates to methods for equipping and soldering a two-sided mixed-stock circuit board, are provided in the holding devices on the circuit board.

It is known to use on a circuit board metal holding devices for holding and contacting of pins of wired components. It is also known to provide components on a circuit board with covers to protect them, for example, against mechanical or thermal exposure or against electromagnetic interference. Many such covers are designed as cup-shaped housing and require a complex attachment to the circuit board. Especially screw fasteners such covers have a considerable space and require a usually time-consuming installation.

The invention is therefore an object of the invention to provide using the known art for mounting and contacting of pins of wired components by holding devices on printed circuit boards, a simple mounting of the holders and the covers on printed circuit boards and a secure attachment and any electrical contacting of the covers guarantee.

According to the invention, this object is achieved by a method assembly and soldering a two-sided mixed equippable circuit board, in addition to SMD components and optionally wired components and parts of holders are mounted on the circuit board and soldered after completion of the soldering of said components for Attach a cover or a clamp on the circuit board.

In an advantageous embodiment of the method according to the invention, the holding devices essentially comprise clamping parts and holding pins.

In a further embodiment of the method according to the invention, the cover forms a cover for a housing which accommodates the printed circuit board.

Another embodiment of the method according to the invention provides that the cover itself is designed as a housing open on one side.

In still further embodiments of the method according to the invention, the covers consist essentially of plastic or of metal.

Still other embodiments of the method according to the invention provide that the retaining pins are soldered to the circuit board and the clamping parts are injected into the plastic cover or that the clamping parts are soldered to the circuit board and the retaining pins are injected into the plastic cover.

Alternatively, according to yet another embodiment of the method according to the invention, the clamping parts are glued to the circuit board and the retaining pins are injected into the plastic cover.

Yet another method according to the invention provides that the cover consists of an electrically conductive plastic or correspondingly coated plastic.

In yet another method of the invention, either the retaining pins on the circuit board are soldered and the clamping members are integrated in the metal cover, or the clamping members are soldered to the circuit board and the retaining pins are integrated into the metal cover.

In particularly advantageous embodiments of the method according to the invention to be soldered to the circuit board retaining pins and clamping parts can be equipped by a machine and soldered to the circuit board holding pins or clamping parts are electrically connected to a circuit board arranged on the circuit board.

The above object is also achieved j according to the invention by a method for equipping and soldering a two-sided mixed equippable circuit board, in addition to SMD components and optionally wired components and clamping parts are mounted on the circuit board into which a clamp is used, the Bracket of a wired component used in overhead reflow in a reflow soldering oven.

Again, in particular embodiments of the method according to the invention, the clamping parts are either soldered or glued to the circuit board.

It has been found in practice that the inventive method considerably simplify the mounting of the cover or a clamp on the printed circuit board and can be carried out as robust processes. It is particularly advantageous that the soldering on the circuit board holding pins and clamping parts can be equipped by a machine. The soldered to the circuit board according to the invention retaining pins and clamping parts require little space and can be considered in the layout of the respective circuit board in a simple manner.

The invention will be explained and described in more detail below with reference to the exemplary embodiments illustrated in the attached drawing, in which:
Showing:

1 a flow chart of a first embodiment of the method according to the invention;

2 a flow chart of a second embodiment of the method according to the invention;

3 a flowchart of a third embodiment of the method according to the invention;

4 a flow chart of a fourth embodiment of the method according to the invention;

5 a perspective view of a solderable clamping device on an enlarged scale;

6 FIG. 2 is a sectional view of a portion of a first circuit board produced by one of the methods of FIG 1 and 2 fitted and soldered;

7 FIG. 2 is a sectional view of a portion of a second circuit board produced by one of the methods of FIG 1 and 2 fitted and soldered;

8th FIG. 3 is a perspective view of a housing accommodating a third circuit board produced by one of the methods of FIG 1 and 2 equipped and soldered, with a cover as a housing cover;

9 a flowchart of a further embodiment of the method according to the invention; and

10 : another illustration of several process steps of the method according to 9 the example of a fourth circuit board with a soldering THT component.

For simplicity, like reference numerals will be used for like acts, elements and modules in the following description of the figures of the figures. If necessary, wired components are also referred to as "THT components" (through-hole technology).

In 1 is a flowchart of a first embodiment of the method according to the invention for equipping and for soldering a both sides equippable circuit board 44 (see 6 . 7 and 10 ). At the in 1 chosen representation sets the method with the application 10 , preferably printing, a solder paste on a first side of the circuit board 44 one.

After printing 10 the first solder paste on the first side of the PCB 44 finds a fitting there 12 with electronic components and retaining pins 48 or clamping parts 43 (see 5 . 6 . 7 ) instead of. In the process, SMD components are inserted into the solder paste on the soldering pads on the first side 60 (see 6 . 7 . 10 ) of the circuit board 44 used. Be soldered retaining pins 48 or clamping parts 34 These are also desired in the solder paste on the designated solder pads 52 (please refer 6 . 7 ), with the retaining pins 48 in the provided through holes 46 (please refer 6 . 7 ) in the circuit board 44 be used. Subsequently, the soldering takes place 14 the first page 60 the circuit board 44 , preferably in a reflow soldering furnace, not shown here.

After passing through the reflow soldering oven, a turn occurs 16 the circuit board 44 and printing 18 the second page 62 (see 6 . 7 . 10 ) of the circuit board 44 with solder paste. After that there will be another assembly 20 with electronic components, with the SMD components in the solder paste on the designated solder pads 52 (please refer 6 . 7 ) on the second page 62 the circuit board 44 be used. After soldering 22 the second page 62 the circuit board 44 will be a designated cover 54 (please refer 6 . 7 ) on the circuit board 44 what happened in the process of 1 by " 24 "Is illustrated. As 6 and 7 clarify, grab the holding devices forming retaining pins 48 or clamping parts 34 into each other and hold the covers 54 safely on the circuit board 44 ,

In 2 is a flowchart of a second embodiment of the method according to the invention for equipping and for soldering a both sides equippable circuit board 44 (see 6 . 7 and 10 ). The in 2 The procedure shown differs from that in 1 illustrated first method that after printing 10 the first solder paste on the first side of the PCB 44 there a fitting 12 with only electronic components takes place, which in 2 by " 26 "Is illustrated. An assembly 28 with retaining pins 48 or clamping parts 43 (see 5 . 6 . 7 ) together with the ones for the second page 62 the circuit board 44 provided electronic components, which is in 2 by " 28 "Is illustrated. The other steps in the process are in accordance with the 1 and 2 match.

In the 3 and 4 are flowcharts of a third and a fourth embodiment of the method according to the invention for equipping and soldering a both sides equippable circuit board 44 (see 6 . 7 and 10 ). The in the 3 and 4 Processes shown differ from those in the 1 and 2 illustrated method that here the retaining pins 48 or clamping parts 43 (see 5 . 6 . 7 ) not on the circuit board 44 soldered but glued. This can also serve an SMD adhesive, as for the attachment of other components on the circuit board 44 is used.

In the case of the method according to the invention 3 The glue is added directly before or after printing 10 the first solder paste on the first page 60 the circuit board 44 (see also 10 ), what in 3 by " 30 "Is illustrated. The further process steps, including touchdown 24 the cover 54 (please refer 6 . 7 ) agree with the procedures according to 3 and 1 match.

In the case of the method according to the invention 4 The glue is added directly before or after printing 18 the second solder paste on the second side 62 the circuit board 44 (see also 10 ), what in 4 by " 32 "Is illustrated. The further process steps, including touchdown 24 the cover 54 (please refer 6 . 7 ) agree with the procedures according to 4 and 2 match.

5 shows an example of a solderable clamping part 34 on an enlarged scale, which has proved to be particularly suitable in practice for the inventive method. As in 5 to see clearly, it is a made of very thin sheet metal, open at both ends and down to the bottom housing 36 , Bottom support rails 38 be on the circuit board 44 soldered. On the support rails 38 opposite side of the clamping part 34 there is a top 40 , in the two mutually separately movable clamping tongues 42 are cut. The clamping tongues 42 lie down when inserting a retaining pin 48 (please refer 6 . 7 ) in the clamping device 34 to the retaining pin 48 and hold it together with the cover 54 firmly. clamping parts 34 , as in 5 illustrated are available strapped on the market and are suitable for assembly by machines.

6 is a sectional view of a section of a first circuit board 44 , which after one of the procedures after the 1 and 2 equipped and soldered. The retaining pins 48 were in through holes 46 the circuit board 44 either when loading 12 the first page 60 the circuit board 44 to 1 or when loading 28 the second page 62 the circuit board 44 to 2 and in there previously applied solder paste 50 used and then soldered. It makes sense to have at least one of the solder pads 52 with which the retaining pins 48 are soldered, with a conductor track 52 , preferably a ground conductor, of a circuit on the circuit board 44 connected. A cover 54 in the form of a cup-shaped housing sketchy here is on the first page 60 the circuit board 44 be set to protect, for example, there located, not shown here component.

At the in 6 illustrated cover 54 it is a cup-shaped housing, which consists essentially of plastic. If the housing is to form a shield, it should consist of an electrically conductive plastic or a correspondingly coated plastic. The clamping parts 34 (see 5 ) are either additional parts (see 5 ) in the cover 54 injected from plastic, as shown in the left part of the illustration 6 illustrated, or integrated as tongues directly into the plastic, as in the right part of the representation of the 6 illustrated.

Alternatively, instead of the cover 54 made of plastic and a cup-shaped housing made of metal, preferably a stamped sheet metal bent part can be used. In this case, it is easier, the clamping parts 34 as tongues directly into the metal cover 54 to integrate, as in the right part of the representation of the 6 is illustrated. Again, of course, there is the possibility of clamping parts as additional parts (see 5 ) in the cover 54 from metal to be integrated by soldering or the like, as in the left part of the diagram of the 6 is illustrated.

7 is a sectional view of a section of a second circuit board 44 , which after one of the procedures after the 1 and 2 equipped and soldered. In this case, the clamping parts 34 (please refer 5 ) over the corresponding through holes 46 the circuit board 44 soldered. The clamping parts 34 are either when equipping 12 the first page 60 the circuit board 44 to 1 or when loading 28 the second page 62 the circuit board 44 to 2 and in there on the designated solder pads 52 previously applied solder paste 50 used and then soldered. The clamping parts 34 (see 5 ) are preferably after 5 and are either on the first page 60 the circuit board 44 soldered, as in the left part of the illustration of 7 illustrated, or alternatively on the second page 62 the circuit board 44 soldered, as in the right part of the representation of the 7 illustrated.

It makes sense to have at least one of the solder pads 52 with which the clamping parts 34 are soldered, with a conductor track 52 , preferably a ground conductor, of a circuit on the circuit board 44 connected. The cover 54 in the form of a cup-shaped housing sketchy here is on the first page 60 the circuit board 44 be set to protect, for example, there located, not shown here component.

Also at the in 7 illustrated cover 54 it is a cup-shaped housing which either consists essentially of plastic or is a stamped sheet-metal bent part. If the housing forms a shield, it should be an electrically conductive plastic or a corresponding coated plastic used. The retaining pins 48 are right in the cover 54 integrated. With a cover 54 Made of plastic, they are injected more meaningfully and with either a metal cover 54 fastened metallic.

In both embodiments according to the 6 and 7 can the clamping parts 34 and / or the retaining pins 48 on the circuit board 44 can also be attached by gluing instead of soldering them. You will then according to one of the procedures according to the 3 or 4 fitted and glued. In any case, whether soldered or glued, form the clamping parts 34 with the retaining pins 48 a secure holding device for the cover 54 on the circuit board 44 ,

8th shows a perspective view of an electronics housing 64 that is a third circuit board 44 according to one of the methods after 1 and 2 equipped and soldered. Here, the previously presented cover acts as a lid 66 for the electronics housing 64 , As previously described, are on the circuit board 44 retaining pins 48 soldered or glued, in cooperation with clamping parts 34 over or in corresponding holes in the lid 66 a firm, secure holder of the lid 66 on the circuit board 44 and thus on the electronics housing 64 enable.

In 9 is related to 10 a flowchart of a further embodiment of the method according to the invention shown, which essentially parts of the method 1 corresponds, provided clamping parts 34 on the first page 60 the circuit board 44 to be soldered (see 6 . 7 ). Should the clamping parts 34 on the first page 60 the circuit board 44 glued instead of being soldered, glue is instead before or immediately after printing 10 of solder paste 50 on the first page 60 the circuit board 44 to apply what is in 9 by " 30 "Is illustrated and in principle the same step 30 to 3 equivalent.

Another special feature is the in 9 illustrated method, since no plugging 24 the cover 54 after soldering 22 the second page 62 the circuit board 44 he follows. In this case, the cover serves as a clamp 78 , with a thermally critical, to be held THT component 74 (see 10 ) on the first page 60 the circuit board 44 to be held while its connecting pins 72 along with the components on the second page 62 the circuit board 44 in the reflow soldering oven, preferably after an overhead soldering, soldered.

At the in 9 Therefore, the method is found after soldering 14 the first page 60 the circuit board 44 from just this first page 60 the circuit board 44 ago an assembly with at least one thermally critical THT component 74 instead of adding the connection pins 72 of the THT component 74 in the provided connection holes of the circuit board 44 be used. In the already soldering 14 the first page 60 the circuit board 44 on the circuit board 44 soldered clamping parts 34 (see also 5 ) becomes a clamp 78 plugged the THT component 74 at the subsequent turning 16 the circuit board 44 and in the subsequent process steps 18 . 20 and 22 firmly on the circuit board 44 holds.

In 10 are some of the in 9 illustrated process steps again. Under "a)" is the printed circuit board 44 after soldering 14 the first page 60 the circuit board 44 shown with already soldered clamping parts 34 via associated holes and an SMD component shown here by way of example 76 , In addition, there are continuous through holes for receiving connection pins 72 a THT component 74 shown. Under "b)" it becomes clear that first the connection pins 72 of the THT component 74 be inserted into the connection holes and then a clamp 78 via the THT component 74 placed and in clamping parts 34 on the first page 60 the circuit board 44 is used. The result is in 10 illustrated under "c)". clearly seen is that the clamp 78 the THT component 74 firmly on the first page 60 the circuit board 44 holds even if as under "d)" the circuit board 44 at the next process step 16 is turned.

Will not solder the clamping parts 34 on the first page 60 the circuit board 44 desired, they can also be glued in what 9 by process step " 30 "Is illustrated.

LIST OF REFERENCE NUMBERS

10

Print solder paste on the first side of the circuit board

12

Assembly of components, holding pins or clamping parts on the first side of the printed circuit board

14

Soldering 1st side of the circuit board

16

Turning the circuit board

18

Print solder paste on the 2nd side of the circuit board

20

Assembly of components on the 2nd side of the printed circuit board

22

Soldering 2nd side of the circuit board

24

Attach the cover

26

Assembly of components on the first side of the printed circuit board

28

Assembly of components, holding pins or clamping parts on the 2nd side of the printed circuit board

30

Apply adhesive to the first side of the circuit board

32

Apply adhesive on the 2nd side of the circuit board

34

clamping part

36

Headers

38

support rail

40

top

42

clamping tongue

44

circuit board

46

Through Hole

48

retaining pin

50

solder

52

Trace, solder pad

54

cup-shaped housing

56

integrated clamping device

58

tongues

60

first page PCB

62

second side circuit board

64

Electronic housing

66

Covering cap

68

Equip critical THT-BT

70

Inserting clamp

72

connector pin

74

THT component

76

SMD

78

clamp

Claims (17)

Procedure for equipping ( 12 . 20 . 26 . 28 ) and for soldering ( 14 . 22 ) of a two-sided mixed equipped circuit board ( 44 ), in addition to SMD components ( 76 ) and possibly wired components ( 74 ) also parts of holding devices ( 34 . 48 . 78 ) on the printed circuit board ( 44 ) are fitted and soldered, which after completion of the soldering of said components ( 34 . 48 . 76 ) for fixing a cover ( 54 . 64 ) on the printed circuit board ( 44 ) serve. Method according to Claim 1, in which the holding devices consist essentially of clamping parts ( 34 ) and retaining pins ( 48 ). Method according to one of claims 1 or 2, wherein the cover is a lid ( 66 ) for a housing ( 64 ) is that the printed circuit board ( 44 ). Method according to one of claims 1 or 2, in which the cover ( 54 ) is designed as a unilaterally open housing. Method according to one of claims 1 to 4, wherein the cover ( 54 . 66 ) consists essentially of plastic. Method according to Claim 5, in which the retaining pins ( 48 ) on the printed circuit board ( 44 ) and the clamping parts ( 34 ) in the cover ( 54 ) are injected from plastic. Method according to Claim 5, in which the clamping parts ( 34 ) on the printed circuit board ( 44 ) and the retaining pins ( 48 ) in the cover ( 54 ) are injected from plastic. Method according to Claim 5, in which the clamping parts ( 34 ) on the printed circuit board ( 44 ) and the retaining pins ( 48 ) in the cover ( 54 ) are injected from plastic. Method according to one of Claims 5 to 8, in which cover ( 54 . 66 ) consists of an electrically conductive plastic or coated plastic. Method according to one of claims 1 to 4, wherein the cover ( 54 . 66 ) is made of metal. Method according to Claim 10, in which the retaining pins ( 48 ) on the printed circuit board ( 44 ) and the clamping parts ( 34 ) in the cover ( 54 . 66 ) are made of metal. Method according to Claim 10, in which the clamping parts ( 34 ) on the printed circuit board ( 44 ) and the retaining pins ( 48 ) in the cover ( 54 ) are made of metal. A method according to any one of claims 1 to 12, in which the on the printed circuit board ( 44 ) to be soldered retaining pins ( 48 ) and clamping parts ( 34 ) can be equipped by a machine. A method according to any one of claims 1 to 12, in which the on the printed circuit board ( 44 ) soldered retaining pins ( 48 ) and clamping parts ( 34 ) electrically with one on the printed circuit board ( 44 ) arranged circuit are connected. Procedure for equipping ( 12 . 20 . 26 . 28 ) and for soldering ( 14 . 22 ) of a two-sided mixed equipped circuit board ( 44 ), in addition to SMD components ( 76 ) and possibly wired components ( 74 ) also clamping parts ( 34 ) on the printed circuit board ( 44 ), into which a clamping bracket ( 78 ) used to hold a wired component ( 74 ) is used in overhead reflow in a reflow soldering oven. Method according to Claim 15, in which the clamping parts ( 34 ) on the printed circuit board ( 44 ) are glued. Method according to Claim 14, in which the clamping parts ( 34 ) on the printed circuit board ( 44 ) are soldered.

Images