JP5887629B2 - Electronic component peeling device - Google Patents

Description

  The present invention relates to an apparatus capable of efficiently recovering electronic components such as an IC chip from a mounting substrate which is a basis for recovering (recycling) useful metal elements from used electronic devices, and more particularly The present invention relates to an electronic component peeling apparatus that simply and highly efficiently removes an electronic component from a substrate while maintaining a separable shape according to constituent material characteristics such as the shape and material of the electronic component.

  In recent years, there is a strong demand for the recycling of useful rare metals used in electronic devices and the like, as well as the tightness of resources. However, with regard to the recycling of useful rare metals from the mounting board on which the electronic parts frequently used in these electronic devices are mounted on the board material, it becomes impossible to introduce a manual decomposition process as the density and miniaturization thereof increase. This is the current situation.

  Attempts have also been made to completely destroy the mounting substrate and collect the rare metals that are required, but the efficiency and efficiency are different because the types and amounts of metal elements used by electronic devices and parts are different. In order to achieve a simple recycling process, it is strongly required to establish a separation / decomposition method that enables sorting work for each type of part as the first step.

  On the other hand, as one of the trials targeting the above-mentioned separation for each type of component, a method of heating / decomposing the substrate material (plastic) of the mounting substrate has also been attempted, but harmful substances ( For example, it is extremely difficult to prevent the generation of halide), and a large cost is required to remove the harmful substances.

  Furthermore, although it depends on the heating conditions, etc., it is difficult to say that the shape of the electronic components recovered by the same process is always in its original form, and the useful substances contained in the electronic components due to physical and chemical changes induced by heating. Volatilization and alteration may occur and become a major obstacle to recycling.

  As another method, a method of recovering an electronic component by softening or dissolving a substrate material using an organic solvent or the like has been tried. However, a solvent capable of softening or dissolving the substrate material and its processing conditions are the same as those of the substrate material. Depending on the material, it is necessary to confirm and sort the material of the substrate material in advance when recycling when various types of mounting boards are mixed.

  Therefore, the present invention solves the problems in the rare metal recycling process from the mounting board as described above, from the mounting board serving as a basis for recovering useful metal elements and the like from used electronic devices. Provided is an electronic component peeling apparatus for peeling an electronic component from a substrate in a simple, high-efficiency and high-speed manner while maintaining a separable shape according to the characteristics of constituent materials such as the shape and material of the electronic component such as an IC chip. For the purpose.

  In order to solve the above-described problems, the present invention provides (1) an apparatus for peeling the electronic component from a mounting board on which the electronic component is mounted on a substrate material, and cutting the terminal of the electronic component by moving a cutting blade. The electronic component peeling apparatus is configured to peel the electronic component from the substrate. (2) The configuration of the electronic component peeling apparatus according to (1), wherein the tip of the cutting blade is translated along the surface of the substrate material.

  (3) The configuration of the electronic component peeling apparatus according to (1) or (2), wherein a substrate fixing floor is provided for fixing the surface of the substrate material in parallel with the moving surface of the tip of the cutting blade. It was. (4) The electronic component according to any one of (1) to (3), wherein a substrate angle adjusting mechanism is provided to hold the surface of the substrate material at an arbitrary angle with respect to the blade bed of the cutting blade. The peeling device was configured as follows.

  (5) The electronic component according to any one of (1) to (4), wherein a substrate plane angle adjustment mechanism for arbitrarily setting and fixing the plane rotation angle of the substrate material on the substrate fixing floor is provided. The peeling device was configured as follows.

  (6) The electronic component peeling apparatus according to any one of (1) to (5), wherein a shaft driving mechanism is provided that allows the cutting blade to move in both directions of the shaft via a shaft. The configuration. (7) The electronic component peeling apparatus according to (6) is provided with a swing mechanism that rotates the shaft driving mechanism in the front-back direction of the substrate.

  The present invention can move the cutting edge of the terminal of the electronic component, more specifically, by moving the tip of the cutting edge of the terminal in parallel with the surface of the substrate material, so that the terminal can be cut at high speed and is effective, and It is possible to collect the electronic components whose terminals have been cut while retaining the original shape.

FIG. 1 is a schematic view of an example of an electronic component peeling apparatus according to the present invention. FIG. 2 is a schematic diagram of an example of a cutting blade angle adjusting mechanism provided in the cutting blade fixing block. FIG. 3 is a conceptual diagram of the substrate plane rotation angle adjusting mechanism. It is a cutting load (Kgf) graph for every cutting-blade moving distance when the substrate plane rotation angle β is 0 °. It is a cutting load (Kgf) graph for every cutting-blade moving distance when the substrate plane rotation angle β is 4 °. It is a cutting load (Kgf) graph for every cutting-blade moving distance when the substrate plane rotation angle β is 7 °. It is a cutting load (Kgf) graph for every cutting-blade moving distance when the substrate plane rotation angle β is 14 °. It is the figure which put together the graph of FIGS. 4-7 in the figure of 1. FIG.

  Hereinafter, with reference to FIGS. 1-3, the specific structure of the peeling apparatus of the electronic component which is this invention is demonstrated in detail. In addition, this invention is not limited to the form illustrated here, The other form which belongs to the technical scope of invention is included.

  An electronic component peeling apparatus 20 shown in FIG. 1 includes a cutting blade 1, a fixed block 3 that fixes the cutting blade 1, a drive shaft 5 that is connected to the fixed block 3, and a shaft drive mechanism that moves the drive shaft 5 up and down. 12, a movable body 15 connected to the shaft driving mechanism 12 and moving back and forth, and a substrate angle adjusting mechanism 9 that includes a substrate fixing floor 8 on which the mounting substrate 6 is placed and adjusts the orientation of the substrate 6 with respect to the cutting blade 1. .

  Further, the substrate fixed floor 8 has a substrate plane angle adjusting mechanism 10 that rotates and fixes the substrate 6 in the horizontal direction on the substrate fixed floor 8, and the shaft drive mechanism 12 is rotated in the front-rear direction with the moving body 15 as a fulcrum. An oscillating shaft 14 may be provided.

  1 and 2, the cutting blade 1 has a flat blade bed 1 a, and a one-blade blade whose tip surface is horizontal to the blade bed 1 a is fixed to a fixed block 3 with a screw 2. Although illustrated, the cutting blade 1 is not limited to this shape, The front end surface of the cutting blade 1 may be slanted, or may be a rotating body.

  The fixed block 3 is connected to the drive shaft 5 that is driven up and down, and assists the cutting of the terminal 7a by the cutting blade 1 by its own weight. In addition, as will be described later with reference to FIG.

  The drive shaft 5 is a device that moves up and down by itself to move the cutting blade 1 up and down. The shaft drive mechanism 12 is a drive device that moves the drive shaft 5 up and down, and examples thereof include an air cylinder.

  The moving body 15 is a member that slides on a rail 13 laid on a table 16 or the like, and is connected to the shaft driving mechanism 12 to move the shaft driving mechanism 12 horizontally as the moving body 15 moves. Further, when the moving body 15 and the shaft driving mechanism 12 are connected, the swing shaft 14 may be interposed so that the shaft driving mechanism 12 can be moved back and forth with the moving body 15 as a fulcrum.

  The substrate angle adjusting mechanism 9 includes a support 9b suspended from a base 9a, a substrate fixed floor 8 having one end rotatably connected to the support 9b via a rotation shaft 8a, and one end on the back of the substrate fixed floor 8. The shaft 9c is connected and fixed at the other end with a screw 9d so that the other end can be inserted into and removed from the column 9b. By changing the fixing position of the shaft 9c to the column 9b, the inclination of the moving surface at the tip of the cutting blade 1 and the surface of the substrate fixing floor 8 can be changed.

  The means for adjusting the inclination of the surface of the substrate fixing floor 8 is not limited to that illustrated in FIG. 1, and any means can be used as long as the inclination of the surface of the substrate fixing floor 8 can be fixed at a desired position. Means may be selected. The substrate plane angle adjustment mechanism 10 will be described later with reference to FIG.

  Here, the angle α between the moving surface of the blade bed 1a or the tip of the cutting blade and the surface of the substrate material 6a varies depending on the shape of the cutting blade 1, the moving / driving conditions, the material of the target member, etc. In the case of a single-edged blade having a flat blade bed 1a which is one of the simplest blade shapes shown in FIGS. 1 and 2, it is approximately several degrees to 15 ° from the viewpoint of a clearance angle during cutting. A range of is desirable.

  Further, the moving body 15 and the rail 13 that move the shaft driving mechanism 12 back and forth are provided to correct the distance between the cutting blade 1 and the surface of the substrate material 6a that changes as the cutting progresses. If the cutting distance is short and the angle α between the blade bed 1a and the surface of the substrate material 6a is within the above-mentioned clearance angle, the front and rear of the shaft drive mechanism 12 by sliding on the rail of the moving body 15 It is possible to replace the forward / backward movement of the shaft drive mechanism 12 with the swing shaft 14 as a fulcrum (for example, the forward / backward movement using a traction rubber string).

  The electronic component peeling apparatus 20 thus configured moves the cutting blade 1 from the upper end portion to the lower end portion of the substrate 6 placed on the substrate fixed floor 8 by contraction of the drive shaft 5. At that time, the moving body 15 slides on the rail 13 to move the shaft driving mechanism 12 that expands and contracts the driving shaft 5 in the surface direction of the substrate 6, and the distance between the tip of the cutting blade 1 and the substrate material 6 a is made constant. Can be kept. The broken line is the position of each component after the cutting blade 1 has moved to the end of the substrate 6 while cutting the terminal. A broken line double arrow indicates a rotation or movement direction.

  Although not shown, the mounting substrate 6 may be fixed to the substrate fixing floor 8 by using a generally used vacuum suction fixing or applying external pressing force to the mounting substrate, either alone or in combination. Is possible.

  In FIG. 2, the schematic diagram of an example of the cutting blade angle adjustment mechanism which adjusts the angle of the cutting blade 1 provided in the cutting blade fixed block 3 was shown. The cutting blade angle adjusting mechanism connects one end of the drive shaft 5 that moves up and down to the rotary shaft 4 inserted through the fixed block 3 in which the hole 3a having a diameter larger than the diameter of the drive shaft 5 is drilled. Then, the fixed block 3 is fixed to the rotary shaft 4 with the screw 3c, the rotation of the fixed block 3 is stopped, and the inclination of the cutting blade 1 is adjusted.

  Since the hole 3 a has a larger diameter than the drive shaft 5, a space 3 b for the drive shaft 5 to move within the hole 3 a can be formed, and the fixed block 3 is allowed to rotate. A broken line shows a position when the fixed block 3, the screw 3c, and the cutting blade 1 are rotated.

  The cutting blade angle adjusting mechanism can adjust the angle α between the blade bed 1a and the surface of the substrate material 6a, similarly to the substrate angle adjusting mechanism 9 shown in FIG. Note that the angle adjusting mechanism of the cutting blade 1 and the substrate angle adjusting mechanism 9 are complementary functions, and the angle (α) of the cutting blade 1 can be adjusted independently or in combination depending on the target substrate 6 to be cut. .

  FIG. 3 shows a conceptual diagram of the substrate plane rotation angle adjusting mechanism. 3A is a plan view of the substrate fixed floor 8 viewed from the surface on which the substrate 6 is placed, FIG. 3B is a cross-sectional view taken along line AA ′ in FIG. 3A, and FIG. It is BB 'sectional drawing of (B).

  As shown in FIG. 3C, the substrate plane angle adjusting mechanism 10 has an L-shaped lowermost portion of the substrate fixing floor 8, and a protrusion 8c is provided above the tip to form a gap 8b. The substrate 6 has a plurality of grooves 11 at predetermined intervals on the bottom thereof. The flat side surface of the substrate material 6a of the substrate 6 may be fitted into the gap 8b. By inserting the corner portion of the substrate material 6 a into the groove 11, the substrate 6 can be rotated and fixed on the surface of the substrate fixing floor 8 in the horizontal direction. Then, an arbitrary substrate plane rotation angle (β = 0 ° to 45 °: in the case of 0 °, no gap is used) between the side surface of the substrate material 6a and the bottom side of the substrate fixing floor 8 (= tip of the cutting blade 1). Is given. As a result, an arbitrary angle β can be formed in the row of terminals 7 a of the electronic component such as the IC chip 7 and the tip of the cutting blade 1.

  The role of the board plane angle adjusting mechanism 10 is to cut the approach direction (cutting direction) of the cutting blade 1 with respect to the alignment surface of the terminal 7a to be cut when cutting the terminals 7a of the electronic components arranged and arranged on the board material 6a. In order to reduce the cutting load (stress) required for cutting per unit cut surface.

  At the same time, when the cutting direction is inclined with respect to the alignment surface of the terminal 7a to be cut, a kind of “drawing” effect different from the case of simple “pushing” occurs. Reduction of cutting stress can be expected. Such reduction of the cutting stress is a very important factor for preventing the deformation of the substrate material 6a and the accompanying damage as well as increasing the cutting speed and improving the efficiency.

  Further, in adjusting the substrate plane rotation angle β, the method of inserting and fixing the lower corner of the substrate material 6a in the predetermined groove 11 is such that the inserted vertical and horizontal side surfaces exhibit a function as a kind of wedge. It is possible to prevent the substrate 6 from being laterally displaced and deformed with respect to the cutting stress.

  If there is no fear of lateral displacement or deformation of the substrate 6 described above, or if there is a mechanism for preventing them (such as installation of a side stopper), the substrate plane angle adjustment mechanism 10 that supports the lower end surface of the substrate material 6a. Alternatively, the same effect can be expected by giving a significant angle to the entire fixed substrate floor 8 with respect to the tip surface of the cutting blade 1.

  The effect of the angle α between the blade bed 1a and the surface of the substrate material 6a was verified. For this test, the electronic device peeling apparatus 20 of FIG. 1 was used. The size of the mounting substrate used for the test was 52.5 mm × 70 mm, and electronic components (7.41 mm × 18.7 mm) having two rows of 6-pin terminals were arranged in 2 rows × 2 rows.

The weight of the fixed block 3 that holds the used cutting blade 1 was 5 kg, and an air cylinder was used as the shaft drive mechanism 12 for moving the cutting blade 1. In this test, considering that the moving distance of the cutting blade 1 is short, the moving body 15 for moving the shaft driving mechanism 12 is fixed to the rail, and the shaft driving mechanism 12 is moved back and forth via the swing shaft 14. The system was adopted and the substrate plane rotation angle β was 0 °.

Table 1 shows the test results (rigid pressure (Mpa)) when the angle α between the blade bed 1a and the surface of the substrate material 6a is changed in the range of 0 ° to 8 ° at intervals of 2 °.

When the cutting blade angle α = 0 °, the cutting blade 1 finally got over the electronic component and finished. Therefore, it was judged as NG because the cutting was poor. On the other hand, in the case of α = 2 ° to 8 °, the cutting of the terminal 7a was completed in all cases.

  When the rigidity pressure (Mpa) at the start of cutting was observed, the value decreased as α increased, but showed a tendency to increase again when α = 6 °. As can be seen from these results, whether or not the terminal 7a can be cut has an important relationship with whether or not α can be considered as a kind of clearance angle. In order to start cutting with a low rigidity pressure, it is effective to set the α value within a certain range (in this case, approximately 4 ° to 8 °).

  The effect of the substrate plane rotation angle β was verified. For this test, the electronic component peeling apparatus 20 shown in FIGS. The size of the provided mounting board is 52.5 mm × 70 mm, and electronic components (7.41 mm × 18.7 mm) having two rows of 7-pin terminals are arranged in 3 rows × 2 rows.

  The equipment used for the test and the conditions such as the moving / driving method of the cutting blade 1 are the same as in the first embodiment. The angle α between the blade bed 1a and the surface of the substrate material 6a was fixed at 6 °. The test results when the substrate plane rotation angle β (plane angle) is changed in the range of 0 ° to 14 ° are shown in Table 2 and FIGS.

  The maximum cutting load (kgf) in Table 2 indicates the maximum value of the cutting load (kgf) when the terminal 7a is cut by the cutting blade 1 as seen in FIGS.

  As a result of the test, compared to the cutting load at β = 0 ° where the row of terminals 7a of the electronic components arranged on the substrate 6a and the tip of the cutting blade 1 are parallel, the row of terminals 7a of the electronic components is cut. The maximum cutting load at β = 4 ° or more where the tip of the blade 1 is not parallel was reduced to about ¼. For this reason, rotating the row of terminals 7a of the electronic component from the position parallel to the tip of the cutting blade 1 at a significant angle is extremely effective in reducing the cutting load on the terminals 7a of the electronic component.

  Note that the effective value of the substrate plane rotation angle β at the time of cutting an electronic component is not uniquely determined because it varies depending on the size and shape of the mounting substrate, the arrangement form of the electronic component, the mounting density, etc. A range of 5 ° to 15 ° is effective.

  As is clear from the results of Examples 1 and 2, by using the electronic component peeling apparatus according to the present invention, the electronic component can be peeled and recovered easily, quickly and economically while retaining the original shape of the electronic component. can do. Therefore, the present invention is considered to greatly contribute to the recycling of rare metals and the like.

  As described above in detail, according to the present invention, the electronic component on the mounting substrate can be peeled and collected easily, quickly and economically while keeping its original shape. In electronic devices that lie at the foundation of modern society, so-called rare metals are often used, but in recent years these materials have been depleted of resources themselves worldwide. Needless to say, an electronic component is a product in which those substances are concentrated, and it is considered that the present invention exerts a very large ripple effect on its recycling.

DESCRIPTION OF SYMBOLS 1 Cutting blade 1a Blade floor 2 Screw 3 Fixed block 3a Hole 3b Space 3c Screw 4 Rotating shaft 5 Drive shaft 6 Substrate 6a Substrate material 7 IC chip 7a Terminal 8 Substrate fixed floor 8a Rotating shaft 8b Gap 8c Protrusion 9 Substrate angle adjustment mechanism 9a Base 9b Post 9c Shaft 9d Screw 10 Substrate plane angle adjustment mechanism 11 Groove 12 Axis drive mechanism 13 Rail 14 Swing shaft 15 Moving body 16 Stand 20 Electronic component peeling device

JP 2011-574 A JP 2009-125934 A JP 2000-228578 A JP 2001-308515 A JP 09-271748 A JP 2007-92138 A JP 2003-181414 A

“Past and Past of PCB Recycling”: TOKYO (MRB.ne.jp), 2010-05-03

Claims (6)

An apparatus for separating the electronic component from a mounting substrate on which the electronic component is mounted on a substrate material,
A cutting blade;
A fixing block for fixing the cutting blade;
A drive shaft connected to the fixed block;
A shaft drive mechanism for moving the drive shaft up and down;
A movable body connected to the shaft drive mechanism and moving back and forth;
The angle between the flat blade bed of the cutting blade or the moving surface of the tip of the cutting blade and the surface of the substrate material, which includes the substrate fixing floor on which the mounting substrate is placed and is oriented with respect to the cutting blade of the substrate material a substrate angle adjusting mechanism for adjusting α to a range of 2 ° to 15 °;
Consists of
The cutting shaft fixed to the fixed block while keeping the distance between the tip of the cutting blade and the substrate material constant while the shaft driving mechanism horizontally moves with the movement of the moving body, and the distance between the tip of the cutting blade and the substrate material is kept constant. An electronic component peeling apparatus, wherein the tip of the blade is translated along the surface of the substrate material, the terminal of the electronic component is cut by the cutting blade, and the electronic component is peeled from the substrate material. The substrate angle adjustment mechanism is
A column suspended from the table,
The substrate fixing floor, one end of which is rotatably connected to the support via a rotation shaft;
A shaft having one end connected to the back surface of the substrate fixing floor and the other end fixed to the support column with a screw;
The electronic component peeling apparatus according to claim 1, comprising: 2. The electronic component peeling apparatus according to claim 1, further comprising a substrate plane angle adjusting mechanism for arbitrarily setting and fixing a substrate plane rotation angle β of the substrate material on the substrate fixing floor. The shaft drive mechanism and the moving body are connected via a swing shaft, and after the shaft drive mechanism stops moving back and forth, the shaft drive mechanism is moved in the front and back direction of the substrate material by the swing shaft. The electronic device peeling apparatus according to claim 1, wherein the electronic device peeling device is rotated. 2. The electronic component peeling apparatus according to claim 1, wherein the fixing block assists in cutting the terminal by the cutting blade under its own weight. It said fixed block, the peeling device of the electronic component according to claim 1, characterized in that it comprises a mechanism for rotating adjusting the tilt of the cutting blade.

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