CN1799793A - High-pressure spraying cutting device and method thereof - Google Patents
High-pressure spraying cutting device and method thereof Download PDFInfo
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- CN1799793A CN1799793A CN 200610051340 CN200610051340A CN1799793A CN 1799793 A CN1799793 A CN 1799793A CN 200610051340 CN200610051340 CN 200610051340 CN 200610051340 A CN200610051340 A CN 200610051340A CN 1799793 A CN1799793 A CN 1799793A
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Abstract
To provide a high-pressure liquid jet type cutting device which corrects a distortion having occurred at the time of cutting a first cutting line group, and then correctly cuts a second cutting line group. According to the operation of the high-pressure liquid jet type cutting device, after the first cutting line group of a workpiece 35 has been cut, the workpiece 35 is mounted on a workpiece holding means 200, and when the second cutting line group is cut, a high-pressure liquid jetting means is relatively moved only in a Y axial direction without moving the location thereof in an X-axial direction with respect to the workpiece holding means 200, followed by cutting the second cutting line group. The high-pressure liquid jet type cutting device is formed of a pressing member 220 for pressing the workpiece 35 in the X axial direction; a butting member 230 against which the workpiece 35 pressed by the pressing member 220 is butted, to thereby lock the workpiece 35 at a predetermined location; and a moving means 250 for moving the workpiece 35 which has been cut along second cutting lines 359 into chips, in the Y axial direction.
Description
Technical field
The present invention relates to machined object be cut into cancellate high-pressure liquid jet formula shearing device and high-pressure liquid jet formula cutting-off method by the injection of highly pressurised liquid.
Background technology
Water flow jet is to apply the jet flow of the water under high pressure that energy forms by super-pressure pump etc. to water, for example, has 2～3 times flow velocity of velocity of sound.Developed in recent years and utilized this water flow jet to cut off the method and apparatus (with reference to patent documentation 1,2) of various machined objects (workpiece).Especially, in order to improve cut-out efficient, the grinding agent of sneaking into solid abrasive material (grinding agent) in water under high pressure sprays and has obtained concern.This grinding-material is made of the material of the high rigidity of diamond dust, aluminium oxide, carborundum etc., though be that particle diameter is the shot-like particle about for example tens of～hundreds of μ m, but these grinding-materials collide with machined object at high speed with water under high pressure, destroy machined object a part, cut off.
The cut-out that utilizes such water flow jet to carry out can not apply heat affecting ground to machined object and cuts off, and has the advantage that can reduce the burning knurl that produces owing to grinding-material on section.And, be that curve also can cut off no problemly even cut off line, have the advantage of the material that is suitable for cutting off composite or processing difficulties in addition.Therefore, in recent years, for to semiconductor substrate, the especially cut-outs such as substrate of encapsulationization are being studied and are replaced existing cutting tip, utilize water flow jet to cut off processing.
Utilizing water flow jet substrate to be cut into clathrate, be divided under the situation of a plurality of substrates, general many of at first being breaking at certain same direction extension cut off lines (hereinafter referred to as " first route (the 1st チ ヤ Application ネ Le) "), then, be breaking at many cut-out lines (hereinafter referred to as " second route (the 2nd チ ヤ Application ネ Le) ") that extend with this first route orthogonal direction.
[patent documentation 1] opens flat 2-15300 communique in fact
[patent documentation 2] spy opens the 2000-246696 communique
But, in the water flow jet shearing device,,, then need just can restart for a long time if produce mechanism in case stop this water under high pressure though utilize the water under high pressure of high-pressure pump etc. to produce the water under high pressure that mechanism produces from nozzle ejection.Therefore, when cutting off first route of substrate, preferably make water under high pressure produce mechanism and turn round continuously, make water flow jet to substrate with zigzag track continuous action, with all cut-out lines of first route quickly (a Pen Books I) cut off (with reference to the special 2003-403292 of hope specification).And, also use the same method when cutting off second route afterwards.
But, being cut in the zigzag substrate at first route quickly, the cut-out portion that is cut off rectangularity is in only by the state of a support in the four edges.Therefore, cut-out portion is crooked or lateral shift in the horizontal direction in vertical direction, and therefore base plate deformation, crooked has the problem that can not cut off the second following route exactly.
In order to address this problem, inventors of the present invention have considered following structure, promptly, when cutting off first route, do not carry out the above-mentioned processing of cut-out quickly, but temporarily stop or the high-speed mobile nozzle by making from the water flow jet of nozzle ejection, with this, the part between the adjacent cut-out line of unlikely cut-out first route (with reference to special hope 2003-408676 specification).By such structure, after cutting off first route, the cut-out portion of substrate is supported by two relative limits, therefore can suppress bigger distortion such as bending of cut-out portion or lateral shift.
But, because the pressure of water flow jet to the substrate effect, therefore all has the crooked problem of generation on substrate in any case.Especially be under the situation of cut-out machining accuracy of the requirement micron unit as semiconductor substrate at machined object, even small crookedly also can become when cutting off next second route, can not correctly cut off the reason of line.
In addition, under the less situation of the size of cut substrate, because therefore the cut-out line narrow gaps of first route when the part of water flow jet between adjacent cut-out line is mobile, has the cut problem of part between this cut-out line.
Therefore, the present invention proposes in view of the above problems, the purpose of this invention is to provide and can correct the crooked of the machined object that when cutting off first route, produces, and new the high pressure liquid injecting type shearing device and the high pressure liquid injecting type cutting-off method through improvement that can carry out the cut-out of second route exactly.
Summary of the invention
In order to solve above-mentioned problem, according to viewpoint of the present invention, following high pressure liquid injecting type shearing device is provided, promptly, for: utilize the high pressure liquid of spraying from the high pressure liquid injection equipment, cut-out is cut off the first cut-out line-group that line constitutes by many first that extend to the prescribed direction of machined object, then, cut-out is by cutting off the second cut-out line-group that many second vertical cut-out lines of line-group constitute with above-mentioned first, with this above-mentioned machined object is divided into a plurality of substrates, and after cutting off the above-mentioned first cut-out line-group of above-mentioned machined object, above-mentioned machined object is positioned on the machined object maintaining body, at least add man-hour in the cut-out of carrying out the above-mentioned second cut-out line-group, make above-mentioned high pressure liquid injection equipment with respect to above-mentioned machined object maintaining body, on identical X-direction position, only relatively move, cut off above-mentioned second of above-mentioned machined object with this and cut off line-group to Y direction.This high pressure liquid injecting type shearing device has parts, positioning element and the conveying mechanism of release on the machined object maintaining body, above-mentioned release parts are released above-mentioned machined object to X-direction; Above-mentioned positioning element props up the above-mentioned machined object of being released by above-mentioned release parts, with this machined object fastening on the assigned position on the above-mentioned machined object maintaining body; The above-mentioned machined object that above-mentioned conveying mechanism made and cut off the above-mentioned second cut-out line, was divided into the substrate shape moves to Y direction.In addition, the mutual in the horizontal direction orthogonal of X-axis and Y direction.
Pass through said structure, when cutting off the second cut-out line-group, when cutting off one second cut-out line by the high pressure liquid injection equipment at every turn, the machined object that will be divided into the substrate shape of row is carried by conveying mechanism, by ejecting mechanism machined object is inserted each second interval that cuts off line in X-direction then, with this can many second cut off line one rules successively, suitably cut-out.Add man-hour in cut-out of carrying out this second cut-out line-group, even owing to the first cut-out processing of cutting off line-group makes machined object distortion, crooked, also can be by correcting the crooked of machined object with ejecting mechanism and positioning element clamping machined object.Therefore, can cut off line one rule successively, cut off exactly with second.And, owing to machined object always not by on carry out next second under the state of the cut-out groove that forms of one second cut-out processing of cutting off line and cut off the cut-out of line, therefore when cut-out, be not subjected to the crooked influence that forms by this cut-out groove.
And, according to said structure, add man-hour in the cut-out of carrying out the second cut-out line-group, when the eject position of high pressure liquid injection equipment is located successively with respect to each second cut-out line, not as existing, high pressure liquid injection equipment and machined object maintaining body relatively moved to X-direction, but make the ejecting mechanism action that is arranged on the machined object maintaining body, machined object is moved on X-direction, therefore the high pressure liquid injection equipment is relatively moved in X-direction.Such ejecting mechanism is compared with high pressure liquid injection equipment and machined object maintaining body, in general is small-sized mechanism, therefore can carry out precision control.Therefore, second each that cut off line-group second can be cut off line and be positioned at exactly on the eject position of high pressure liquid and cut off.
And, on above-mentioned machined object maintaining body, can also have the mechanism of piling up of piling up the above-mentioned machined object that is divided into the substrate shape that moves by above-mentioned conveying mechanism.By like this, owing to the machined object that is divided into the substrate shape that transports by conveying mechanism can be piled up on the machined object maintaining body, therefore can dwindle the area of machined object maintaining body, save the space.
And, on above-mentioned machined object maintaining body, can also have the pressing component of pushing the above-mentioned machined object that is connected to above-mentioned positioning element from the top.By like this, when cutting off the second cut-out line-group,, also can stably keep machined object from vertical direction not only from horizontal direction, can suitably correct the crooked of machined object.
In addition, in order to solve above-mentioned problem,, provide the high pressure liquid injecting type cutting-off method of above-mentioned high pressure liquid injecting type shearing device according to other viewpoint of the present invention.The feature of this high pressure liquid injecting type cutting-off method is to have following operation, promptly, (1) after cutting off the above-mentioned first cut-out line-group, the above-mentioned machined object that is positioned on the above-mentioned machined object maintaining body is released to X-direction by above-mentioned ejecting mechanism, by being connected to above-mentioned positioning element, utilize above-mentioned ejecting mechanism and the above-mentioned machined object of above-mentioned positioning element clamping; (2) utilize the high pressure liquid of spraying from above-mentioned high pressure liquid injection equipment, be breaking at above-mentioned second of above-mentioned machined object cut off in the line-group apart from above-mentioned positioning element nearest above-mentioned second cut off line, and above-mentioned machined object is divided on the Y direction the only substrate shape of row; (3) by above-mentioned conveying mechanism the above-mentioned machined object that is divided into the substrate shape of row is moved to Y direction; (4) repeat the operation of above-mentioned (1)～(3), cut off line up to cutting off all above-mentioned second.
By above-mentioned formation, when cutting off the second cut-out line, when cutting off one second cut-out line by the high pressure liquid injection equipment at every turn, the machined object that one row is divided into the substrate shape is carried by conveying mechanism, by ejecting mechanism machined object is inserted each in X-direction then and second cuts off line at interval, can a plurality of second cut off line one rules successively, suitably cut-out.Add man-hour carrying out this second cut-out of cutting off line-group, even owing to first cut off the cut-out processing of line-group, machined object deforms, crooked, by with ejecting mechanism and positioning element clamping machined object, also to correct the crooked of machined object.Therefore, can cut off line one rule successively, cut off exactly with second.And, since machined object always not by before the state of the cut-out groove that is processed to form of second cut-out of cutting off line under carry out next second and cut off the cut-out of line, therefore when cutting off, be not subjected to the crooked influence of this cut-outs groove generation.
And, also can for: above-mentioned high pressure liquid injecting type shearing device on above-mentioned machined object maintaining body, also have the mechanism of piling up of the machined object of piling up the above-mentioned substrate shape that is divided into row that moves by above-mentioned conveying mechanism; Above-mentioned high pressure liquid injecting type cutting-off method is at least before the operation of above-mentioned (3), also has following operation, promptly, by the above-mentioned mechanism of piling up machined object integral body is moved to X-direction, formation can be accommodated the above-mentioned space that is divided into the machined object of a substrate shape that is listed as, above-mentioned machined object integral body has been moved and has been divided into the substrate shape of above-mentioned row or multiple row by above-mentioned conveying mechanism, in the operation of above-mentioned (3), by above-mentioned conveying mechanism, the above-mentioned machined object that is divided into the substrate shape of row is moved in Y direction, and accommodate in the above-mentioned space.
By like this, can cut off the machined object that row that line generated are divided into the substrate shape with cut off one second at every turn, carry to piling up the zone successively by conveying mechanism.And, can pile up by to piling up the row carried in the zone or by piling up mechanism more than or equal to the machined objects that are divided into the substrate shape of two row.
And, also can be above-mentioned high pressure liquid injecting type shearing device, also have on the above-mentioned processed maintaining body from above push the pressing component of the above-mentioned machined object that is connected to above-mentioned positioning element; Above-mentioned high pressure liquid injecting type cutting-off method is after the operation of above-mentioned (1), also has following operation, promptly, cutting off the line to nearest apart from above-mentioned positioning element above-mentioned second, push above-mentioned machined object from the top by above-mentioned pressing component from above-mentioned machined object and above-mentioned positioning element position contacting.By like this, cutting off second when cutting off line-group, not only from horizontal direction, also can stably keep machined object, correct the deflection of machined object preferably from vertical direction, simultaneously, it is at random to prevent that row are divided into the machined object of substrate shape.
And, its can for: above-mentioned machined object is formed processing, so that it has the essentially rectangular shape, the relative a pair of edge of above-mentioned machined object and above-mentioned second cuts off the line-group almost parallel, and, roughly the same to the interval that the distance and above-mentioned a plurality of second at above-mentioned edge is cut off lines from the above-mentioned second cut-out line nearest apart from above-mentioned edge.By like this, even cut off at first of machined object under the uneven situation of cut-out line of the edge of line direction both sides and second route, form by prior marginal end portion, also can suitably carry out processing as the second above-mentioned cut-out of cutting off line-group to machined object.
As mentioned above, according to the present invention, even, also can the deflection of machined object be corrected by using ejecting mechanism and positioning element clamping because first cut-out of cutting off line-group (first route) makes machined object distortion, crooked.Therefore, can a rule cutting off second exactly cuts off second of line-group (second route) and cuts off line.
And, when cutting off the second cut-out line-group, because high pressure liquid injection equipment and machined object maintaining body are relatively moved in X-direction, and the ejecting mechanism by small-sized mechanism as a comparison with machined object X-direction insert each second cut off line at interval, cut off, therefore, can cut off each second cut-out line in correct position.
Description of drawings
Fig. 1 is the integrally-built skeleton diagram of the water flow jet shearing device of expression first embodiment of the present invention.
Fig. 2 is the stereogram of cut-out machining area peripheral structure of the water flow jet shearing device of this embodiment of expression.
Fig. 3 is the substrate of this embodiment of expression and the stereogram of first holding member.
Fig. 4 is expression when cutting off first route of this embodiment, to the vertical view of the track of the water flow jet of substrate effect.
Fig. 5 is the vertical view of the substrate after first route quilt of this embodiment of expression cuts off quickly.
Fig. 6 is the stereogram of structure of second holding member of this embodiment of expression.
Fig. 7 is the stereogram of structure of second holding member of this embodiment of expression.
Fig. 8 is the longitudinal section of expression by the substrate of second holding member maintenance of this embodiment.
Fig. 9 is one second vertical view that cuts off the substrate after line is cut off of second route of this embodiment of expression.
Figure 10 is the flow chart of the substrate cutting-off method of the expression water flow jet shearing device that uses this embodiment.
Figure 11 is the vertical view that is illustrated in the substrate that is shaped in the preparatory process of cut-out of second route of this embodiment.
Figure 12 A is one second stereogram that cuts off the cut-out operation of line of second holding member of this embodiment of expression use.
Figure 12 B is the stereogram of piling up operation that expression utilizes second holding member of this embodiment.
Figure 12 C is the stereogram of conveying operation that expression utilizes second holding member of this embodiment.
Figure 12 D is the stereogram of conveying operation that expression utilizes second holding member of this embodiment.
Figure 12 E is the stereogram that makes the operation that nozzle etc. returns of expression second holding member that utilizes this embodiment.
Figure 12 F is the stereogram that the next one second of expression second holding member that utilizes this embodiment cuts off the cut-out operation of line.
The specific embodiment
Following one side is with reference to accompanying drawing, and one side is elaborated with regard to the embodiment of the best of the present invention.In this specification and accompanying drawing, the structural detail that has the identical function structure is in fact used identical symbol, and omit repeat specification.
First embodiment
Below, describe with regard to the high pressure liquid injecting type shearing device of first embodiment of the present invention.Though the high pressure liquid injecting type shearing device of present embodiment as following illustrated, for example, the water flow jet shearing device that cuts off machined object as the jet flow (grinding agent injection) of the water under high pressure by sneaking into grinding-material constitutes, and still, the present invention is not limited to these examples.
At first, according to Fig. 1 and Fig. 2, carry out diagrammatic illustration with regard to the overall structure of the water flow jet shearing device 1 of present embodiment.Fig. 1 is the integrally-built skeleton diagram of the water flow jet shearing device 1 of expression present embodiment.Fig. 2 is the stereogram that the cut-out machining area periphery of the water flow jet shearing device 1 of expression present embodiment constitutes.
As shown in Figure 1, the water flow jet shearing device 1 of present embodiment is by the substrate 35 as machined object is sprayed the water under high pressure that contains grinding-material, so that can carry out the shearing device that (being water flow jet processing) processed in high-precision cut-out to cut off line more freely to substrate 35.For example be the semiconductor substrate etc. of the encapsulationization of QFN (Quad Flat Non-leaded Package) substrate, CSP (Chip Size Package) substrate etc. as the substrate 35 of the cut-out object of this water flow jet shearing device 1, but be not limited thereto.
As shown in Figure 1, these water flow jet shearing devices 1 mainly have for example high pressure liquid feed mechanism 10, grinding-material mixed organization 20, nozzle 30, maintenance platform 40, table transferring mechanism 42, collecting box 50 and grinding-material recovering mechanism 60.
High pressure liquid feed mechanism 10 for example is made of high-pressure pump described later and motor etc., to the water pressurization of supplying with from the outside, can produce for example 600～700 crust (1 crust=about 1.02kgf/cm
2) water under high pressure and supply with.The water of supplying with from the outside for example is running water, but is not limited thereto, and also can be pure water.The water under high pressure that produces by high pressure liquid feed mechanism 10 is by supplying with to grinding-material mixed organization 20 as the high-voltage tube 11 of the pipeline that is used to carry high-pressure fluid.
Grinding-material mixed organization 20 is made of a plurality of grinding-material mixed liquor storage bins described later and pressure adjustmenting mechanism etc., stores the grinding-material mixing water that has mixed grinding-material (abrasive particle) and water.This grinding-material mixed organization 20 with the ratio mixed grinding material of regulation, is sent the water under high pressure that is mixed with this grinding-material to the water under high pressure of supplying with from high pressure liquid feed mechanism 10 to nozzle 30.This grinding-material for example is made of the material of the high rigidity of diamond dust, aluminium oxide, carborundum, diamond etc., is that particle diameter for example is the shot-like particle about tens of～hundreds of μ m, has the function of the cut-out efficient that can improve water under high pressure.In the present embodiment, for example using as this grinding-material, particle diameter is the aluminium oxide of 40～100 μ m.The water under high pressure (below be also referred to as " high pressure grinding-material mixing water ") that is mixed with this grinding-material is supplied with to nozzle 30 by high-voltage tube 21 from grinding-material mixed organization 20.
And, shown in the local expanded view among Fig. 1, the nozzle head 32 of the ejection reduced that is used to make water under high pressure is installed at the front end of the blast tube 31 of nozzle 30.This nozzle head 32 for example have front end be formed with regulation fine diameter ejiction opening 321 nozzle head body 322 and be provided with and screw thread is fixed on the nozzle head-shield 323 of the leading section of blast tube 31 from the mode that covers this nozzle head body 322.Fix by this nozzle head-shield 323 is carried out screw thread, nozzle head body 322 is fixed on the front end of nozzle 30.
The flow velocity of water under high pressure jet flow (that is the water flow jet) J that ejects from such nozzle 30 for example is about 2～3 times of velocity of sound.And the distance on the surface of the front end of this nozzle 30 and substrate 35 for example is 50 μ m～1mm, both sides is adjusted to approaching as much as possible.Like this, by making the diffusion of nozzle 30 and substrate 35, can prevent that the cut-out width of substrate 35 from enlarging near the water under high pressure jet flow J that can do one's utmost to suppress to spray.And the bore of nozzle 30 (diameter of ejiction opening 321) for example is about 250 μ m, and in this case, the cut-out width of substrate 35 for example is about 300 μ m.
By spraying to substrate 35 by nozzle 30, can utilize the energy of water under high pressure to cut off substrate 35 like this as the water flow jet J of the jet flow of grinding-material mixing water.At this moment, because grinding-material collides substrate 35, destroys cutting partially of substrate 35 with water under high pressure, therefore can improve cut-out efficient.Like this, the water flow jet J in the present embodiment sprays as grinding agent and constitutes.
Keep platform 40 to constitute as an example of the machined object maintaining body that keeps machined object.As depicted in figs. 1 and 2, this maintenance platform 40 for example is the plate-shaped member that the hard metal by stainless steel etc. forms, and keeps, fixing substrate 35 as machined object.More specifically be, in the present embodiment, substrate 35 by with respect to keep platform 40 removably first route cut off to cut off with holding member and (in Fig. 1 and Fig. 2, do not have diagram with the holding member and second route, with reference to Fig. 3, Fig. 6 etc.), be held, be fixed on the maintenance platform 40, should the cut-out of first and second routes will describe in detail in the back with holding member.
And, on this keeps platform 40, on the part of fixing base 35, form platform window 401 as the peristome that is used to make water flow jet J to pass through.Because therefore the water flow jet J that said nozzle 30 sprays keeps platform 40 itself can not cut off by water flow jet J by the part of this window 401.
And on four angles of platform window 401 peripheries on keep platform 40, being used for exactly, location and installation first route cut-out described later is provided with pin 402 upward highlightedly with the holding member installation that the holding member and second route cut off with holding member.
Table transferring mechanism 42 for example is made of the driving mechanism of pedestal part and electro-motor etc. etc., supports above-mentioned maintenance platform 40, simultaneously, makes to keep platform 40 (X-axis and Y direction) and vertical direction (Z-direction) are mobile in the horizontal direction.
Specifically be as shown in Figure 2, to keep platform 40 to support by first～the 4th pedestal part 411,421,431,441 that links slidably mutually.Make maintenance platform 40 when X-direction moves horizontally, make first male threaded stem 415 to just or opposite spin by first electro-motor 413, second pedestal part 421 that engages with first male threaded stem 415 is moved to X-direction along first guide rail 417 that is arranged on first pedestal part 411.And, keep platform 40 vertical when mobile making to Z-direction, make second male threaded stem 425 to just or opposite spin by second electro-motor 423, make the 3rd pedestal part 431 that engages with second male threaded stem 425 along being arranged on second guide rail 427 on second pedestal part 421 in the Z-direction lifting.And, make maintenance platform 40 when the Y-axis horizontal direction moves, make the 3rd male threaded stem 435 to just or opposite spin by the 3rd electro-motor 433, the 4th pedestal part 441 that engages with the 3rd male threaded stem 435 is moved to Y direction along the 3rd guide rail 437 that is arranged on the 3rd pedestal part 431.
By the table transferring mechanism 42 of such formation, make keep platform 40 in the horizontal direction (X-direction and Y direction) move, can make by the substrate 35 that keeps platform 40 to keep with this to relatively move to X-axis and Y direction with respect to nozzle 30.By like this, change the eject position (cut-off part) of water flow jet J with respect to substrate 35, can cut off substrate 35 with continuous line.Though the transporting velocity of the substrate 35 when this cuts off for example is 20mm/ second because of the thickness or the material of cut substrate 35 are different.
And, move in Z-direction by utilizing table transferring mechanism 42 to make to keep platform 40, can be according to the kind of substrate 35, thickness, surface concavo-convex etc., the distance between the front end of adjusting nozzle 30 and the substrate 35 that is maintained on the maintenance platform 40.
In addition, the formation of table transferring mechanism 42 is not limited to above-mentioned example, so long as the structure that substrate 35 is moved in the horizontal direction at least can be carried out various design alterations.For example, the elevating mechanism that nozzle 30 is moved in Z-direction can be set substitutes to make and keeps platform 40 to move in Z-direction.
Collecting box 50 for example is the catch basin of the lengthwise opened above.This collecting box 50 for example is arranged on the downside of above-mentioned maintenance platform 40, that is, and and under the nozzle 30.This collecting box 50 portion within it stores the water that contains grinding-material with the height of stipulating, for the height with this water surface keeps certain, control is to the supply and the discharge of the water of collecting box 50.
The effect of the water receiving tank of such collecting box 50 performance water flow jet J.That is, collecting box 50 as padded coaming, can weaken the water that stores and catch with the power of cutting off, connect the water flow jet J of substrate 35 as described above.Be included in the bottom of precipitating, be deposited in this collecting box 50 as the grinding-material in the grinding-material mixing water of catching above-mentionedly.And, being connected with pipeline 51 in for example side bottom side of collecting box 50, grinding-material and water by this pipeline 51 is discharged in the collecting box 50 are transported to grinding-material recovering mechanism 60.
Grinding-material recovering mechanism 60, from the grinding-material mixing water that transports by above-mentioned collecting box 50 by pipeline 51, (for example reclaim particle diameter that can utilize again, that have prescribed limit, 30～100 μ m) grinding-material, and be transported to grinding-material mixed organization 20.This grinding-material recovering mechanism 60 has the grinding-material that the grinding-material that makes the above-mentioned particle diameter that can utilize again passes through and reclaims filter (not having diagram), to reclaim grinding-material recovery, the storage of filter by this grinding-material, the grinding-material mixing water that will contain this grinding-material that is recovered is transported to grinding-material mixed organization 20 by pipeline 61.And, will not reclaim the grinding-material mixing water of the grinding-material of filter recovery by above-mentioned grinding-material, discharge to the outside by for example drainpipe 62.
The water flow jet shearing device 1 as constituted above, spraying J by one side from nozzle 30 injection waters simultaneously makes maintenance platform 40 move in X-axis and/or Y direction with respect to this nozzle 30, can be along the cut-out line of first and second routes of substrate 35, make the water flow jet J effect that contains grinding-material, substrate 35 is cut off processing.
Like this, in the water flow jet shearing device of present embodiment, add man-hour cutting off, adopted fixed nozzle 30, by keeping the cut-out mode of platform 40 moving substrates 35.By adopting such cut-out mode, the position of nozzle 30 is fixed, and therefore can make collecting box 50 miniaturizations, has and can dwindle the advantage that area is set and can makes simple for structureization of travel mechanism.But, be not limited to such example, also can fix maintenance platform 40, nozzle 30 is moved horizontally in X-axis and/or Y direction, cut off processing.
And above-mentioned water flow jet shearing device 1 uses grinding-material mixed organization 20, collecting box 50 and grinding-material recovering mechanism 60 etc., and the grinding-material of the particle diameter that is suitable for cutting off processing is circulated in device, automatically utilizes again.By like this, owing to need not spend the utilization again that manually just can carry out grinding-material, improve utilization ratio, and can not stop high pressure liquid feed mechanism 10 and carry out continuous cutting-off processing, therefore can make to cut off and process high efficiency, reduce production costs.
But, the water flow jet shearing device 1 of present embodiment, for the cut-out machining accuracy of second route that improves substrate 35, as described below, in the cut-out processing of second circuit, have the advantages that to have adopted the special cut-out processing mode different with the cut-out processing of first route.Meanwhile, add man-hour employed first route in the cut-out of first route and cut off cut-out with the holding member and second route and add man-hour employed second route and cut off aspect the usefulness holding member, its structural difference is very big.These first and second routes cut off uses holding member, in order suitably to keep substrate 35, can be installed on the maintenance platform 40 with freely loading and unloading, can exchange mutually.Therefore, below should cut off with holding member and second route cut-out structure of holding member by first route, and utilize the cut-out processing mode of these holding members to describe respectively.
At first, according to Fig. 3, just the structure of cutting off with holding member 100 (hereinafter referred to as " first holding member 100 ") as the substrate 35 and first route of the machined object of present embodiment describes.Fig. 3 is the substrate 35 of expression present embodiment and the stereogram of first holding member 100.
In the following description, the substrate 35 as machined object is that example describes with QFN shown in Figure 3 (Quad Flat Non-leaded Package) substrate.QFN is one of method for packing of IC substrate, it is characterized in that externally can't see the pin of outside output input usefulness.
As shown in Figure 3, as for example whole writing board shape of the substrate 35 of QFN substrate with essentially rectangular.This substrate 35 is by constituting as the metal framework 351 of base and the packed part 353 that is formed on the side of this metal framework 351.Packed part 353 is the molded parts that form of a plurality of semiconductor elements (circuit) of rule being piled up with resin.
On this substrate 35, be formed with circuit region 35a, 35b, the 35c of the collection area of a plurality of semiconductor elements of piling up as rule.In substrate shown in Figure 3 35, show the example of the substrate 35 of the 35a～c that is formed with three circuit regions, but this circuit region is not limited to three, on a substrate 35, also can form one, two or more than or equal to four circuit region.
On this each circuit region 35a～c, first and second cut off line (street) 357,379 is piled up into clathrate, marks off a plurality of rectangular areas 355 by this first cut-out line 357,359.On each rectangular area 355, form semiconductor element.
In being configured to cancellate cut-out line, the first cut-out line 357 is many almost parallel and cut-out lines that have roughly the same length that extend in horizontal (Y direction of Fig. 3) of substrate 35.These many first first routes that cut off line 357 formations as the first cut-out line-group.On the other hand, the second cut-out line 359 is many almost parallel and lines that have roughly the same length that extend in vertical (Y direction of Fig. 3) of substrate 35.These many second second routes that cut off line 359 formations as the first cut-out line-group.First cuts off line 357 and second cuts off line 359 orthogonals, its result, first route direction (Y direction of Fig. 3) and second route direction (X-direction of Fig. 3) orthogonal.
By spraying above-mentioned water under high pressure, by at first cutting off the first all cut-out line 357 of first route, cut off the second all cut-out line 359 of second route then, the circuit region 35a～c of substrate 35 can be cut into grid shape, be divided into a plurality of substrates with essentially rectangular shape.In addition, though can cut off first route after cutting off second route, in the present embodiment, the order of just cutting off first route earlier describes.
Below, first holding member 100 when just being used to cut off first route of substrate 35 describes.As shown in Figure 3, first holding member 100 is made of gripper shoe 102 and cover 104, and gripper shoe 102 has the rectangular shape that formed by the metal material of stainless steel etc. etc., supports disposed thereon substrate 35; Cover 104 can be installed on the gripper shoe 102 by hinge member 106 with opening and closing.
The central portion of gripper shoe 102 and cover 104 respectively breakthrough form become to be useful on to make window 102a, the 104a of the essentially rectangular that water flow jet J passes.And, be formed with step difference 102b at the inner peripheral surface of the window 102a of gripper shoe 102, chimeric by the circumference and this step difference 102b that make substrate 35, gripper shoe 102 is supporting substrate 35 stably.And, on four angles of gripper shoe 102b, be formed with the holding member of above-mentioned maintenance platform 40 the installation through hole 103 that engages with pin 402 (with reference to Fig. 2) be installed.And, in a side of cover 104 block 108 is set, form recess 110 in the side of gripper shoe 102.This block 108 engages with recess 110 when closing cap parts 104, prevents that cover 104 from opening.
First holding member 100 of Gou Chenging is installed on the above-mentioned maintenance framework 40 with the state that keeps aforesaid substrate 35 when cutting off first route like this.Specifically be that at first, to be positioned on the gripper shoe 102 of first holding member 100 with the chimeric mode of step difference 102b, then, closing cap parts 104 make recess 110 and block 108 engagings with substrate 35.Can utilize first holding member 100 stably to keep substrate 35 like this.Then, first holding member 100 that keeps the state of substrate 35 like this is positioned on the maintenance platform 40.At this moment, by the holding member that will keep platform 40 installation of using pin 402 to insert first holding member 100 is installed and uses in the through hole 103, first holding member 100 can be located exactly with respect to maintenance platform 40, and stably install.
Below, according to Fig. 4 and Fig. 5, the mode of just cutting off first route of the substrate 35 that keeps by above-mentioned first holding member 100 and maintenance platform 40 describes.Fig. 4 be expression cut off present embodiment first route time, to the vertical view of the track T of the water flow jet J of substrate 35 effects.Fig. 5 is the vertical view of the substrate 35 after first route quilt of expression present embodiment cuts off quickly.
As shown in Figure 4, in the present embodiment, adopt the mode of quickly cutting off when cutting off first route.Should " cut off " be meant quickly and do not stop inject high pressure liquid, cut off line with one and cut off machined object continuously.
Specifically be, make by one side to keep platform to relatively move in X-axis and Y direction with respect to fixing nozzle 30, one side make water flow jet J from nozzle 30 along the first route continuous injection, cut off quickly and constitute all first of first route and cut off line 357.At this moment, shown in Fig. 4 (b),, form to make and constitute all first of first route and cut off line 357 in the top or the zigzag track that alternately links of lower end the track T on the XY plane of the water flow jet J of substrate 35 effect.Implement the processing of cut-out quickly of the first such route by all circuit region 35a～c to substrate 35, shown in Fig. 5 (a), on the circuit region 35a～c of substrate 35, connect and form the zigzag cut-out groove 37 that the first cut-out line 357 is linked quickly, finish the cut-out processing of first route.
By cut off first route so quickly, on each circuit region 35a～c, though the rectangular area 355 adjacent with second route direction (X-direction of Fig. 5) is cut off, the rectangular area 355 adjacent with first route direction (Y direction of Fig. 5) is not cut off.Its result, the aggregate of piling up a plurality of (being 8 in Fig. 5) rectangular area 355 on first route direction forms rectangle, is in the state of a limit (being top or bottom in Fig. 5) support of only using in its four edges.Therefore, in the substrate 35 that is quickly cut off, above-mentioned rectangular part might produce distortion in the vertical direction bending, to the horizontal direction lateral shift.
And, in the present embodiment, as the preparation that the cut-out of next second route is processed, shown in Fig. 5 (a), cut off the substrate 35 that has cut off first route as mentioned above, be divided into each circuit region 35a～c, the substrate 35 that includes so cut only circuit region 35a～c is the cut-out process unit of second route.
Below, according to Fig. 6 and Fig. 7, just the structure of cutting off with holding member 200 (hereinafter referred to as " second holding member 200 ") as second route of present embodiment feature describes.This second holding member 200 and above-mentioned maintenance platform 40 constitute the machined object maintaining body of present embodiment.Fig. 6 and Fig. 7 are the stereograms of structure of second holding member 200 of expression present embodiment.But in Fig. 7, for convenience of description, omitted the diagram of conveying mechanism shown in Figure 6 250, only illustrated substrate 35.
As shown in Figure 6 and Figure 7, second holding member 200 is in order to cut off second route of substrate 35, and is installed in parts on the above-mentioned maintenance platform 40 with the state that keeps substrate 35.This second holding member 200 has mounting plate 210, ejecting mechanism 220, positioning element 230, pressing mechanism 240, conveying mechanism 250 and piles up mechanism 260.
Mounting plate 210 for example for having the metal or the resinous flat board of rectangular shape, forms level and smooth tabular surface above it.As shown in Figure 7, this above mounting plate 210 mounting the substrate 35 (with reference to Fig. 5 (b)) of cutting next circuit region 35a after cutting off above-mentioned first route and forming is arranged.This substrate 35 cuts off all first cut-out line 357, the formation of first route as described above and cuts off groove 37.Such substrate 35, its first route direction and X-direction as one man are positioned in the ejecting mechanism 220 and the space between the positioning element 230 on the mounting plate 210 and (cut off zone 212).Mounting plate 210 is from the substrate 35 of the such mounting of supported underneath with by cutting off the substrate that second route described later divides cutting board 35 to form.But,,, mounting plate 210 is slided in the horizontal direction if therefore other external force effect is arranged because these substrates 35 or substrate are not fixed on the mounting plate 210.
Be broadly divided into above this mounting plate 210 and cut off zone 212 and pile up zone 214.Cutting off zone 212 is the zones that are used to cut off by second route of the substrate 35 of mounting.On the other hand, piling up zone 214 is to be used for concentrating by cutting off a plurality of substrates that second route is divided into and the zone of piling up regularly.Such cut-out zone 212 is provided with ejecting mechanism 220, positioning element 230 and pressing mechanism 240, on the other hand, piles up zone 214 and is provided with and piles up mechanism 260.And conveying mechanism 250 is configured to across cutting off zone 212 and the mode of piling up on the zone 214.
And, on four angles of mounting plate 210, be formed with the holding member of above-mentioned maintenance platform 40 the installation through hole 202 that engages with pin 402 (with reference to Fig. 2) be installed.In the time of on this second holding member 200 being installed to maintenance platform 40, install with pin 402 these installations of insertion through holes 202, second holding member 200 can be positioned at exactly on the maintenance platform 40, carry out stable installation by the holding member that will keep platform 40.
By such ejecting mechanism 220 and positioning element 230, can and keep substrate 35 from the X-direction sandwich.Specifically, ejecting mechanism 220 makes head board 222 move to the X-axis negative sense by cylinder mechanism 224, by be positioned in a side of the substrate 35 on the mounting plate 210 with pushing face 222a pushing, this substrate 35 is released to the X-axis negative direction towards positioning element 230, made the another side of this substrate 35 and the bearing surface 230a butt of positioning element 230.Its result, as shown in Figure 8, substrate 35 is in the state between the bearing surface 230a of the pushing face 230a that is clamped in head board 222 and positioning element 230.By like this, can correct owing to the deflection (bending of above-mentioned rectangular segment, lateral shift etc.) that is created on the substrate 35 is processed in the cut-out of first route.
And pressing mechanism 240 has the function of the maintenance action that auxiliary above-mentioned ejecting mechanism 220 and 230 pairs of substrates of positioning element 35 carry out.This pressing mechanism 240 for example is set on the above-mentioned positioning element 230, pushes the end of positioning element 230 sides that keep substrate 35 from the top.Such pressing mechanism 240 for example has the pressing component 242 as the flat board of essentially rectangular, and can support the support driving mechanism 244 of this pressing component 242 between holding position and retreating position movably.As shown in Figure 8, this pressing mechanism 240, in case substrate 35 is in the state that is clamped between ejecting mechanism 220 and the positioning element 230, the pressing component 242 that is positioned at retreating position is moved to the holding position, push the end of positioning element 230 sides of this substrate 35 from the top by the lower surface of this pressing component 242, and to keep by the mode that is pressed on the mounting plate 210.By like this and since substrate 35 not only by above-mentioned ejecting mechanism 220 and positioning element 230 from the horizontal direction clamping, but also the mechanism 240 that is pressed keeps from vertical direction, therefore substrate 35 more stably can be remained on the mounting plate 210.In addition, this pressing mechanism 240 neither be provided with.
As shown in Figure 7, keep under the state of substrate 35 at the ejecting mechanism 220 that utilizes said structure, positioning element 230 and pressing mechanism 240, by the water flow jet J that sprays from nozzle 30, one second that cuts off second route is cut off line 359.Specifically be, the relative nozzle of the maintenance platform 40 that second holding member 200 is installed 30 is relatively moved in Y direction, in many second cut-out line 359 of second route that constitutes substrate 35, make water flow jet J cut off line 359 and act on, cut off this one second and cut off line 359 along one second that is positioned at foremost (the most close positioning element 230 sides).At this moment, as shown in Figure 7 and Figure 8, spray, connect the water flow jet J of substrate 35, connect the escape 216 that is formed on the mounting plate 210 owing to pass, so mounting plate 210 can not be cut off itself along Y direction from nozzle 30.In addition, this escape 216 is formed on from the bearing surface 230a of positioning element 230 and only leaves on the cut-out line position (position of X-direction) at interval of second route that is equivalent to substrate 35 in cutting off zone 212.
Like this, in the cut-out line of second route of the substrate 35 that has cut off first route, one second that is positioned at from the nearest position of positioning element 230 by cut-out is cut off line 359, as shown in Figure 9, second cuts off the cut-out groove 38 that line 359 forms linearities along this.Its result, the row 34 (that is row of the rectangular area 355 of arranging on the Y direction of the end of positioning element 230 sides that are positioned at substrate 35) of Y direction of end that are positioned at positioning element 230 sides of substrate 35 are divided into the substrate shape.In addition, when carrying out this cut-out, the row 34 of Y direction of end that are positioned at substrate 35 by the pressing component 242 of above-mentioned pressing mechanism 240 from the top by press fit.Therefore, by the hydraulic pressure of the water flow jet J that relatively moves in Y direction, divided substrate can be not at random.
And as shown in Figure 6, conveying mechanism 250 makes the substrate that is divided into the substrate shape 34 (hereinafter referred to as " substrates 34 of row ") of above-mentioned row move to the Y-axis forward, and carries to piling up zone 214 from cutting off zone 212.This conveying mechanism 250 has the drive division 252 that is made of electro-motor etc., above mounting plate 210 Y direction extend the male threaded stem 254 that is provided with and guide rail 255, the inner slide block 256 that engages with male threaded stem 254 and with the delivery board 258 of the bottom binding of this slide block 256.
This conveying mechanism 250 makes male threaded stem 254 rotation by drive division 252, and slide block 256 and delivery board 258 are moved in Y direction along guide rail 255.Delivery board 258 for example is the flat parts that erect setting, and the thickness of its X-direction is littler than the cut-out line interval (substrate width) of second route.And, because the height and position of the lower surface of this delivery board 258 is positioned at and the top roughly the same of mounting plate 210 or the position of top slightly, therefore as the pushing face 258a of the side of delivery board 258 can with the contacts side surfaces of substrate behind minute cutting board 35.
The conveying mechanism 250 of Gou Chenging is when carrying the substrate 34 of above-mentioned row like this, by delivery board 258 is moved to Y-axis forward (from cutting off zone 212 towards the direction of piling up zone 214), release above-mentioned one substrate 34 that is listed as with this pushing face 258a, make row move (with reference to Figure 12 C described later) to piling up zone 214 together by delivery board 258.
In addition, when carrying the substrate 34 of these row, ejecting mechanism 220 is disengaged with respect to the maintenance action of positioning element 230 pushing substrates 35, simultaneously, retreating position is kept out of the way by support driving mechanism 244 in the press section 242 of above-mentioned pressing mechanism 240, and the water flow jet J that sprays from nozzle 30 keeps out of the way to be formed on keeping out of the way with the through slot 218 (with reference to Fig. 7) on the direction (X-axis forward) vertical with escape 216 continuously from the end of escape 216.By like this, the moving of delivery board 258 because therefore the obstruction of be not pressed parts 242 or water flow jet J can suitably carry out the conveying action of the substrate 34 of above-mentioned row.
And whole conveying mechanism 250 can not move back and forth on X-direction along a pair of guide groove 259 that is formed on the mounting plate 210 by there being illustrated driving mechanism.Like this, when cutting off the second cut-out line 359 of second route by said nozzle 30, move, keep out of the way to the X-axis negative sense, can make conveying mechanism 250 not hinder the route of water flow jet J from the top of escape 216 by making conveying mechanism 250.
Piling up mechanism 260 has and piles up the function that a plurality of substrates of zone in 214 are concentrated, piled up with being transported to by above-mentioned conveying mechanism 250.This is piled up mechanism 260 and for example has piling up plate 262 and making this pile up the cylinder mechanism 264 that plate 262 moves back and forth on X-direction as the flat board of the essentially rectangular thicker than substrate.The outstanding protuberance 262a that is formed with essentially rectangular of a side (from cutting off regional 212 sides far away) at the leading section of piling up plate 262.And as the pushing face 262c of the end face of the part that does not form above-mentioned protuberance 262a on the leading section of piling up plate 262, being shaped as becomes the vertical plane parallel with Y direction.
The action of piling up of piling up mechanism 260 that like this constitutes describes.Be transported to a row substrate 34 of Y-axis forward by above-mentioned conveying mechanism 250, the bearing surface 262b butt with as the inner side end of above-mentioned protuberance 262a limits it and continues to move (with reference to Figure 12 D described later).Its result, the substrate 34 of row is transferred the delivery board 258 of mechanism 250 and piles up the protuberance 262a clamping of mechanism 260, piles up in Y direction.
And, piling up mechanism 260 makes by cylinder mechanism 264 and piles up plate 262 and advance to the X-axis negative sense, by being transported to the row of piling up zone 262 with the pushing face 262c pushing of piling up plate 262 or, having released to X-axis negative sense (with reference to Figure 12 A described later) with these row or more than or equal to the substrates 36 of two row more than or equal to the substrates 36 of two row.The release width of this moment for example is equivalent to the compartment (width segments that is equivalent to first route direction of substrate) of the second cut-out line 359 at least.Like this, the substrate group is released to X-direction, also can pile up in X-direction with above-mentioned row or more than or equal to the substrate 36 of two row by piling up mechanism 260.And, as mentioned above, be withdrawn into original position by the plate 262 of piling up after will advancing, can pile up the space 219 (with reference to Figure 12 B described later) of guaranteeing to accommodate a row substrate 34 that next is transferred on the zone 214.
The structure that below just has as the water flow jet shearing device 1 of second holding member 200 of the feature of present embodiment is illustrated.
In existing water flow jet shearing device, when cutting off second route of substrate 35, make to keep platform 40 to move, cut off one second cut-out line 359 in Y direction, then, make to keep platform 40 to move, nozzle 30 is positioned at next second cuts off on the line 359 and cut off in X-direction.
On the contrary, in the water flow jet shearing device 1 of present embodiment, when cutting off second route, moving nozzle 30 and keep platform 40 not, but by the ejecting mechanism 220 that is arranged on above-mentioned second holding member 200 substrate 35 is released to X-direction, cut off line 359 with next second and be positioned at the below of nozzle 30 and cut off.Therefore, the nozzle 30 and second holding member 200 (keeping platform 40) are the structures that does not relatively move on X-direction.It generally is small-sized that ejecting mechanism 220 is compared with nozzle 30 or maintenance platform 40, therefore can carry out precision control.Therefore, in the present embodiment, compared with the existing, second of second route can be cut off line 359 and be positioned at exactly on the eject position of water flow jet J and cut off.
Below, according to Figure 10～12, just utilize above-mentioned water flow jet shearing device 1 to cut off first route and second route of substrate 35, the method that is divided into the substrate shape is elaborated.Figure 10 is the flow chart of cutting-off method (high pressure liquid injecting type cutting-off method) of the substrate 35 of the expression water flow jet shearing device 1 that uses present embodiment.And Figure 11 is the vertical view that is illustrated in the substrate 35 that is shaped in the cut-out preparatory process of second route of present embodiment.And Figure 12 A～F is respectively applied for second stereogram that cuts off the cut-out operation of line-group that explanation utilizes second holding member 200 of present embodiment, for convenience of description, has omitted the diagram of the part etc. of pressing mechanism 240 and conveying mechanism 250.
As shown in figure 10, at first, in step S102, cut off first route (step S102) as the substrate 35 of machined object.Specifically be at first to utilize first holding member 100 (with reference to Fig. 3) that substrate 35 is fixed on and keep platform 40.Then, make nozzle 30 and keep platform 40 to relatively move, water flow jet J is acted on along the first a plurality of cut-out line 357 of first route continuously according to track T shown in Figure 4.By like this, as shown in Figure 5, first route of substrate 35 is cut off quickly, forms jagged cut-out groove 37 continuously.
Then, in step S104, as the preparatory process of the cut-out of second route among following step S106～S118 operation, at first, cut the substrate 35 that the next one has circuit region 35a the substrate 35 after cutting off first route, and the end (step S104) of this substrate 35 that is shaped.
Specifically be that at first as shown in Figure 5, the substrate 35 that will have a plurality of circuit region 35a～c that cut off first route and form is divided into each circuit region 35a～c, downcuts the substrate 35 that only has a circuit region 35a.
Then, as shown in figure 11, the marginal end portion 39 of the first route direction both sides of the substrate 35 that downcuts is cut off forming board 35.The processing that below should be shaped is described in detail.
Shown in Figure 11 (a), the substrate 35 of cut essentially rectangular shape, the quality of production of its substrate 35 becomes key factor, and a pair of opposed edges 361 and second that produces the first route direction both sides of substrate 35 is sometimes cut off the problem that line is 359 not parallel, form skew.Because second holding member 200 of the water flow jet shearing device 1 of present embodiment is above-mentioned apparatus structure,, then can not cut off second route exactly if therefore the edge 361 of such substrate 35 is not parallel with the second cut-out line 359.
Therefore, shown in Figure 11 (b),, cut off the marginal end portion 39 of the first route direction both sides of substrate 35, the edge 361 of substrate 35 and the second cut-out line 359 of second route are shaped abreast in the cut-out first being processed that begins to carry out second route.By like this, substrate 35 after will being shaped is positioned on the mounting plate 210 of second holding member 200, during with ejecting mechanism 220 and positioning element 230 clampings, be positioned at bearing surface 230a that second of a pair of edge 361 of the first route direction both sides of substrate 35 and second route cut off the pushing face 222a of line 359, ejecting mechanism 220 and positioning element 230 and form and be parallel to each other.Therefore, utilize second holding member 200 can cut off second exactly and cut off line 359.
And, shown in Figure 11 (b), in this is shaped processing, cut off two marginal end portion 39 up and down, make at many second and cut off in the line 359, from be arranged in from second of above-mentioned edge 361 proximal most position (is top and bottom at Figure 11) cut off line 359 till the above-mentioned edge 361 apart from Q, equate with the interval P of a plurality of second cut-out lines 359.By like this, only handle by the row as the new marginal end portion 39 ' of substrate 35 are cut off to remove, just can be easily and the cut-out that is listed as that begins most that begins above-mentioned Y direction exactly process.
Like this, even cut off under the line 359 uneven situations,, also can implement to use the cut-out to second route of second holding member 200 exactly by prior shaping substrate processing 35 before the cut-out processing of second route at the edge 361 and second of substrate 35.
In addition, the cutting-out processing and the processing that is shaped among the above-mentioned steps S104 can be used water flow jet shearing device 1, also can use other shearing device.And, the cutting-out of this step S104 processing with and/or the processing that is shaped also can before the cut-out operation of first route of above-mentioned steps S102, carry out.
Then, return Figure 10, in step S106, the above-mentioned substrate 35 that has cut off first route is positioned on the mounting plate 210 of second holding member 200 (step S106).Specifically be at first will keep first holding member 100 on the platform 40 to change second holding member 200 into and fix.Then, mounting substrate 35 on the cut-out zone 212 of the mounting plate 210 of this second holding member 200, this substrate 35 are cut next circuit region 35a, are formed processing as mentioned above after cutting off first route.At this moment, with the release direction (X-direction) of first route direction and ejecting mechanism 220 consistent towards this substrate 35 of mounting.
Then, in step S108, the substrate 35 that is positioned on the mounting plate 210 is released to X-direction by the head board 222 of ejecting mechanism 220, and run into positioning element 230.Like this, by head board 222 and positioning element 230 from X-direction sandwich substrate 35 (step S108).
And, under without situations such as maintenance substrate 35 such as adhesive tapes, the end that utilizes pressing mechanism 240 to keep substrates 35.Specifically be, the pressing component 242 of pressing mechanism 240 is moved to the holding position, push the end of positioning element 230 sides of above-mentioned nipped substrate 35 from the top, and to keep by the mode on mounting plate 210.Its result can stably remain on substrate 35 on the mounting plate 210 by ejecting mechanism 220, positioning element 230 and pressing mechanism 240.
Then, in step S110, shown in Figure 12 A, make injection water spray the nozzle 30 of J and maintenance platform 40 that second holding member 200 is installed relatively moves in Y direction, above-mentioned nipped substrate 35 injection waters are sprayed J.By like this, one second that is breaking at the most close positioning element 230 sides in a plurality of cut-out lines of second route is cut off line 359, and row 34 of the Y direction of substrate 35 are divided into substrate shape (step S110).In addition, in Figure 12 A, second several the 4th the state when cutting off line 359 of the end of the substrate 35 of cut-out before cut off is shown.
In the cut-out of this second route processing still push, keep from the top owing to be divided into row 34 of the substrate 35 of substrate shape by pressing mechanism 240, therefore can be owing to the hydraulic pressure of water flow jet J lateral shift or at random.And, since connect the water flow jet J of substrate 35 pass be positioned at second cut off line 359 under escape 216, so water flow jet J can not splash on mounting plate 210.Therefore, because substrate 35 can not float because of the hydraulic pressure from the below, therefore can cut off second exactly and cut off line 359.
And, in step S112, shown in Figure 12 A, make pile up mechanism 260 pile up plate 262 to only the advance cut-out line amount of P (with reference to Figure 11) at interval of second route of X-axis negative sense, then, shown in Figure 12 B, this is piled up plate 262 be withdrawn into original position to the X-axis forward.By like this, release the amount of the cut-out line interval P of second route with being transported to 36 of two row substrates piling up zone 214, on X-direction, pile up, simultaneously, reserve the space 219 (piling up the pushing face 262c of plate 262 and the gap between the two row substrates 36) (step S112) of accommodating the row substrate 34 that the next one transports on 214 piling up the zone.In addition, this step S112 can be the operation before the conveying operation of next procedure S114, also can carry out before step S108 or S110.
Then, in step S114, shown in Figure 12 C,, will release, and make it move (step S114) to Y direction by the row substrate 34 that the cut-out of above-mentioned steps S110 is cut apart by the delivery board 258 of conveying mechanism 250.By like this, substrate 34 of these row is carried to piling up zone 214 from cutting off zone 212, is accommodated in the space of vacating in above-mentioned steps S112 219.And shown in Figure 12 D, a row substrate 34 that is transferred and the bearing surface 262b butt of piling up the protuberance 262a of plate 262 limit it and continue to move.By like this, a row substrate 34 that is transferred is transferred plate 258 and protuberance 262a clamping, and piles up on Y direction.
Then, in step S116, shown in Figure 12 E, nozzle 30 and delivery board 258 return original position (step S116).
Then, in step S118, for example, judge whether that all cut-out lines 259 of second route all are cut off (step S118) by the control part (not having diagram) of water flow jet shearing device 1.Its result does not cut off under the situation of whole cut-out lines 259 in judgement, returns step S108, with the above-mentioned S108～S116 of repeating step similarly, cuts off next bar and cuts off line 259.
Specifically be, turn back among the step S108, shown in Figure 12 F, cutting off on the zone 212, in order to fill up the space 221 that the row substrate 34 that is moved once existed in above-mentioned steps S114, head board 222 by ejecting mechanism 220 is released remaining substrate 35 once more to the X-axis negative direction, makes itself and positioning element 230 butts.Thus, by head board 222 and the positioning element 230 remaining substrate 35 of clamping (step S108) again.Then, the next one second that cuts off second route by water flow jet J cuts off line 359 (step S110), afterwards, carries out step S112 same as described above～S118.
By carrying out such step repeatedly, judge that all cut-out lines 259 of second route all are cut off under the situation of (step S118), finish whole operation.
More than, with regard to the water flow jet shearing device 1 of present embodiment and utilize the cutting-off method of this device to be illustrated.According to this water flow jet shearing device 1 and cutting-off method, even because the cut-out of first route processing makes substrate 35 that deflection take place, clamp maintenance by the ejecting mechanism 220 and the positioning element 230 that utilize second holding member 200, also can on Y direction, correct the crooked of substrate 35.In addition, in existing cut-out mode, on machined object, form the cut-out groove by the second cut-out processing of cutting off line, because this cuts off the groove distortion, after having influenced second cut off the cut-out machining accuracy of line, but in the cut-out mode of present embodiment, can be under the state of the cut-out groove 38 before not existing on the machined object 12, second below cutting off cut off line 359.Therefore, can cut off the cut-out line 259 of second route exactly.
And, when cutting off second route,, but pass through ejecting mechanism 220 at X-direction moving substrate 35 not at X-direction moving nozzle 30 or maintenance platform 40.Compare with nozzle 30 or maintenance platform 40, ejecting mechanism 220 is small-sized usually, therefore can carry out accurate mobile control, can improve the cut-out precision.
More than, one side is illustrated with regard to preferred implementation of the present invention and embodiment with reference to the accompanying drawing one side, but the present invention is not limited to these examples.Those skilled in the art can expect the various modifications in the category of the described technological concept of claim or revise example that these also belong in the technical scope of the present invention certainly obviously.
For example, machined object is not limited to the example of above-mentioned QFN substrate 35, can be the semiconductor substrates such as base plate for packaging of various semiconductor wafers, csp substrate, GPS substrate, BGA substrate etc.In addition, machined object can be synthetic resin materials such as sapphire substrate, glass material, ceramic material, metal material, plastics, or is used to form first-class electronic material substrate of magnetic head, laser diode etc.
And, in the above-described embodiment,, be illustrated with regard to the example that adopts water flow jet shearing device 1, but the present invention is not limited thereto as high pressure liquid injecting type shearing device.High pressure liquid injecting type shearing device is so long as have the high pressure liquid injection equipment of inject high pressure liquid, and can cut off the device of processing machined object by the injection of high pressure liquid, can carry out various design alterations.For example, spraying and the liquid that stores is not limited to the water shown in above-mentioned, can be alcohol, wet goods liquid arbitrarily, perhaps various chemical substances etc. is dissolved in liquid in all kinds of solvents etc.And the grinding-material mixed liquor also is not limited to the grinding-material mixing water shown in above-mentioned.
And in the above-described embodiment, though first route has been carried out cutting off processing quickly, the present invention is not limited to this example, also can cut off first route with other cut-out modes.For example, by temporarily stopping perhaps to make the nozzle high-speed mobile, do not cut off first part cut off line 357 between adjacent with first route from the nozzle ejection water flow jet, cut off processing and only cut off the first cut-out line, 357 ground, form the cut-out groove of many almost parallels.
The present invention is applicable to the high pressure liquid injecting type shearing device and the high pressure liquid injecting type cutting-off method that machined object are cut off processing by inject high pressure liquid.
Claims (7)
1. high pressure liquid injecting type shearing device, for: utilize the high pressure liquid of spraying from the high pressure liquid injection equipment, cut-out is cut off the first cut-out line-group that line constitutes by many first that extend to the prescribed direction of machined object, then, cut-out is by cutting off the second cut-out line-group that many second vertical cut-out lines of line-group constitute with above-mentioned first, with this above-mentioned machined object is divided into a plurality of substrates
And after cutting off the above-mentioned first cut-out line-group of above-mentioned machined object, above-mentioned machined object is positioned on the machined object maintaining body, at least add man-hour in the cut-out of carrying out the above-mentioned second cut-out line-group, make above-mentioned high pressure liquid injection equipment with respect to above-mentioned machined object maintaining body, on identical X-direction position, only relatively move to Y direction, cut off above-mentioned second of above-mentioned machined object with this and cut off line-group
It is characterized in that having parts, positioning element and the conveying mechanism of release on the machined object maintaining body, above-mentioned release parts are released above-mentioned machined object to X-direction; Above-mentioned positioning element props up the above-mentioned machined object of being released by above-mentioned release parts, with this machined object fastening on the assigned position on the above-mentioned machined object maintaining body; The above-mentioned machined object that above-mentioned conveying mechanism made and cut off the above-mentioned second cut-out line, was divided into the substrate shape moves to Y direction.
2. high pressure liquid injecting type shearing device as claimed in claim 1 is characterized in that, also has the mechanism of piling up of piling up the above-mentioned machined object that is divided into the substrate shape that moved by above-mentioned conveying mechanism on above-mentioned machined object maintaining body.
3. high pressure liquid injecting type shearing device as claimed in claim 1 or 2 is characterized in that, on above-mentioned machined object maintaining body, also has the pressing component of pushing the above-mentioned machined object that is connected to above-mentioned positioning element from the top.
4. a high pressure liquid injecting type cutting-off method is the high pressure liquid injecting type cutting-off method in the described high pressure liquid injecting type of claim 1 shearing device, it is characterized in that having following operation:
(1) after cutting off the above-mentioned first cut-out line-group, the above-mentioned machined object that is positioned on the above-mentioned machined object maintaining body is released to X-direction by above-mentioned ejecting mechanism, by being connected to above-mentioned positioning element, utilize above-mentioned ejecting mechanism and the above-mentioned machined object of above-mentioned positioning element clamping;
(2) utilize the high pressure liquid of spraying from above-mentioned high pressure liquid injection equipment, be breaking at above-mentioned second of above-mentioned machined object cut off in the line-group apart from above-mentioned positioning element nearest above-mentioned second cut off line, and above-mentioned machined object is divided on the Y direction the only substrate shape of row;
(3) by above-mentioned conveying mechanism the above-mentioned machined object that is divided into the substrate shape of row is moved to Y direction;
(4) repeat the operation of above-mentioned (1)～(3), cut off line up to cutting off all above-mentioned second.
5. high pressure liquid injecting type cutting-off method as claimed in claim 4, it is characterized in that, above-mentioned high pressure liquid injecting type shearing device is on above-mentioned machined object maintaining body, and what also have the machined object of piling up the above-mentioned substrate shape that is divided into row that moves by above-mentioned conveying mechanism piles up mechanism;
Above-mentioned high pressure liquid injecting type cutting-off method is at least before the operation of above-mentioned (3), also has following operation, promptly, by the above-mentioned mechanism of piling up machined object integral body is moved to X-direction, formation can be accommodated the above-mentioned space that is divided into the machined object of a substrate shape that is listed as, above-mentioned machined object integral body has been moved and has been divided into the substrate shape of above-mentioned row or multiple row by above-mentioned conveying mechanism
In the operation of above-mentioned (3),, the above-mentioned machined object that is divided into the substrate shape of row is moved in Y direction, and accommodate in the above-mentioned space by above-mentioned conveying mechanism.
6. as claim 4 or 5 described high pressure liquid injecting type cutting-off methods, it is characterized in that, above-mentioned high pressure liquid injecting type shearing device, also have on the above-mentioned processed maintaining body from above push the pressing component of the above-mentioned machined object that is connected to above-mentioned positioning element;
Above-mentioned high pressure liquid injecting type cutting-off method is after the operation of above-mentioned (1), also has following operation, promptly, cutting off the line to nearest apart from above-mentioned positioning element above-mentioned second, push above-mentioned machined object from the top by above-mentioned pressing component from above-mentioned machined object and above-mentioned positioning element position contacting.
7. as each described high pressure liquid injecting type cutting-off method in the claim 4 to 6, it is characterized in that, above-mentioned machined object is formed processing, so that it has the essentially rectangular shape, the relative a pair of edge of above-mentioned machined object and above-mentioned second cuts off the line-group almost parallel, and, roughly the same to the interval that the distance and above-mentioned a plurality of second at above-mentioned edge is cut off lines from the above-mentioned second cut-out line nearest apart from above-mentioned edge.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005000972 | 2005-01-05 | ||
| JP2005000972A JP4690051B2 (en) | 2005-01-05 | 2005-01-05 | High pressure liquid jet cutting device and high pressure liquid jet cutting method |
| JP2005-000972 | 2005-01-05 |
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| Publication Number | Publication Date |
|---|---|
| CN1799793A true CN1799793A (en) | 2006-07-12 |
| CN1799793B CN1799793B (en) | 2010-08-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200610051340 Active CN1799793B (en) | 2005-01-05 | 2006-01-05 | High-pressure spraying cutting device and method thereof |
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| JP (1) | JP4690051B2 (en) |
| CN (1) | CN1799793B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103640053A (en) * | 2013-11-20 | 2014-03-19 | 苏州蓝王机床工具科技有限公司 | Novel digging machine tool |
| CN109411160A (en) * | 2017-08-16 | 2019-03-01 | 厦门海普锐科技股份有限公司 | A kind of multi-pipe-diameter automatic insertion number pipe device |
| CN109571643A (en) * | 2018-12-29 | 2019-04-05 | 肇庆鼎晟电子科技有限公司 | Thermistor chip water knife cutting-up technique |
| CN112780208A (en) * | 2021-01-06 | 2021-05-11 | 中国矿业大学 | Gas extraction drilling fault-breaking deformation area repairing system and repairing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2997880B1 (en) * | 2012-11-13 | 2015-09-04 | Christophe Ribot | PROCESS FOR CUTTING RECTANGLES |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0219500U (en) * | 1988-07-26 | 1990-02-08 | ||
| FR2647049B1 (en) * | 1989-05-18 | 1995-04-14 | Grudzinski Richard | METHOD FOR CUTTING MATERIALS USING A JET OF VOLATILE LIQUID |
| JPH04372400A (en) * | 1991-06-14 | 1992-12-25 | Furukawa Electric Co Ltd:The | Cutting process of laminated metallic thin plate |
| JP2005230994A (en) * | 2004-02-20 | 2005-09-02 | Disco Abrasive Syst Ltd | Water jet machining method and protection member for workpiece |
-
2005
- 2005-01-05 JP JP2005000972A patent/JP4690051B2/en active Active
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2006
- 2006-01-05 CN CN 200610051340 patent/CN1799793B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103640053A (en) * | 2013-11-20 | 2014-03-19 | 苏州蓝王机床工具科技有限公司 | Novel digging machine tool |
| CN109411160A (en) * | 2017-08-16 | 2019-03-01 | 厦门海普锐科技股份有限公司 | A kind of multi-pipe-diameter automatic insertion number pipe device |
| CN109411160B (en) * | 2017-08-16 | 2023-09-12 | 厦门海普锐科技股份有限公司 | Multi-diameter automatic sleeve number tube penetrating device |
| CN109571643A (en) * | 2018-12-29 | 2019-04-05 | 肇庆鼎晟电子科技有限公司 | Thermistor chip water knife cutting-up technique |
| CN112780208A (en) * | 2021-01-06 | 2021-05-11 | 中国矿业大学 | Gas extraction drilling fault-breaking deformation area repairing system and repairing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006187829A (en) | 2006-07-20 |
| CN1799793B (en) | 2010-08-04 |
| JP4690051B2 (en) | 2011-06-01 |
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