JP2006187829A - High-pressure liquid jet type cutting device and high-pressure liquid jet type cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-pressure liquid jet type cutting device which corrects a distortion having occurred at the time of cutting a first cutting line group, and then correctly cuts a second cutting line group. <P>SOLUTION: According to the operation of the high-pressure liquid jet type cutting device, after the first cutting line group of a workpiece 35 has been cut, the workpiece 35 is mounted on a workpiece holding means 200, and when the second cutting line group is cut, a high-pressure liquid jetting means is relatively moved only in a Y axial direction without moving the location thereof in an X-axial direction with respect to the workpiece holding means 200, followed by cutting the second cutting line group. The high-pressure liquid jet type cutting device is formed of a pressing member 220 for pressing the workpiece 35 in the X axial direction; a butting member 230 against which the workpiece 35 pressed by the pressing member 220 is butted, to thereby lock the workpiece 35 at a predetermined location; and a moving means 250 for moving the workpiece 35 which has been cut along second cutting lines 359 into chips, in the Y axial direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a high-pressure liquid injection type cutting device and a high-pressure liquid injection type cutting method for cutting a workpiece into a lattice shape by high-pressure liquid injection.

  The water jet is a jet of high-pressure water formed by applying energy to water by an ultra-high pressure pump or the like, and has a flow velocity of 2 to 3 times the speed of sound, for example. In recent years, methods and apparatuses for cutting various workpieces (workpieces) using this water jet have been developed (see Patent Documents 1 and 2). In particular, in order to improve cutting efficiency, attention has been focused on abrasive jets in which high-pressure water is mixed with a solid abrasive. This abrasive material is made of a material with high hardness such as garnet, alumina oxide, silicon carbide, etc., and is a granular material having a particle size of, for example, several tens to several hundreds μm. These abrasive materials are processed together with high-pressure water. Collides with an object at high speed, destroys a part of the workpiece and cuts it.

  Such water jet cutting has the advantage that it can be cut without affecting the workpiece, and the occurrence of burrs on the cut surface can be reduced by the abrasive. Furthermore, in addition to being able to cut without problems even if the cutting line is a curve, there is an advantage that it is suitable for cutting composite materials and difficult-to-work materials. For this reason, in recent years, in order to dice a semiconductor substrate, particularly a packaged substrate, a cutting process using a water jet instead of a conventional cutting blade has been studied.

  When a substrate is cut into a lattice by a water jet and divided into a plurality of chips, first, a plurality of cutting lines (hereinafter referred to as “first channels”) extending in the same direction are cut, and then. It is common to cut a plurality of cutting lines (hereinafter referred to as “second channels”) extending in a direction orthogonal to the first channel.

Japanese Utility Model Publication No. 2-15300 JP 2000-246696 A

  By the way, in the water jet cutting device, high pressure water generated using high pressure water generating means such as a high pressure pump is injected from the injection nozzle, but once this high pressure water generating means is stopped, it is restarted. It takes a very long time. Therefore, when cutting the first channel of the substrate, the high pressure water generating means is continuously operated, and the water jet is continuously acted on the substrate in a zigzag-shaped locus so that all the cutting lines of the first channel are cut. It is preferable to cut with one stroke (see Japanese Patent Application No. 2003-403292). The same applies when the second channel is subsequently disconnected.

  However, in the substrate in which the first channel is cut in a zigzag shape with a single stroke, the cut portion cut into a strip shape is supported only on one side of the four sides. For this reason, there is a problem that the next second channel cannot be cut accurately because the substrate is deformed and distorted because the cut portion is warped in the vertical direction or laterally displaced in the horizontal direction.

  In order to solve this problem, the inventors of the present invention do not perform the one-stroke cutting process described above when cutting the first channel, but temporarily stop the jet of water jet from the spray nozzle, or A configuration has been conceived in which the nozzle is moved at a high speed so as not to cut a portion between adjacent cutting lines of the first channel (see Japanese Patent Application No. 2003-408676). With such a configuration, after the first channel is cut, the cut portion of the substrate is supported by the two opposite sides, so that it is possible to suppress a large deformation such as the cut portion being warped or laterally displaced.

  However, since the pressure of the water jet acts on the substrate, there is a problem that the substrate is inevitably distorted. In particular, when the workpiece is required to have a cutting accuracy of micron units, such as a semiconductor substrate, the cutting line can be accurately set at the time of the next second channel cutting even if there is a slight distortion. It was a factor that could not be cut.

  In addition, when the size of the chip to be cut out is small, the interval between the cutting lines of the first channel is narrow. Therefore, when the water jet moves between adjacent cutting lines, the gap between the cutting lines is small. There was also a problem that the part was cut off.

  Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to correct the distortion of the work piece generated when the first channel is cut, and to accurately cut the second channel. It is an object of the present invention to provide a new and improved high-pressure liquid injection type cutting device and high-pressure liquid injection type cutting device which can be used.

  In order to solve the above problems, according to one aspect of the present invention, a first cutting line comprising a plurality of first cutting lines extending in a predetermined direction of a workpiece by high-pressure liquid ejected from high-pressure liquid ejecting means. After cutting the group (first channel), the workpiece is cut by cutting a second cutting line group (second channel) consisting of a plurality of second cutting lines orthogonal to the first cutting line group. In order to divide into a plurality of chips; after cutting the first cutting line group of the workpiece, the workpiece is placed on the workpiece holding means, and at least when cutting the second cutting line group The high pressure liquid injection means for cutting the second cutting line group of the work piece by moving the high pressure liquid injection means relative to the work piece holding means at the same position in the X axis direction only in the Y axis direction. A cutting device is provided. In this high-pressure liquid injection type cutting device, an extruding member for extruding the work piece in the X-axis direction is abutted on the work holding means; and the work piece extruded by the extruding member is abutted against the work piece. An abutting member that is locked at a predetermined position on the workpiece holding means; and a transfer means that moves the workpiece that has been cut into a chip shape by cutting the second cutting line in the Y-axis direction. The X-axis and Y-axis directions are orthogonal to the horizontal direction.

  With this configuration, when the second cutting line group is cut, each time the second cutting line is cut by the high-pressure liquid jetting means, the work piece divided into one row of chips is transferred by the transferring means. After that, the plurality of second cutting lines can be sequentially and suitably cut one by one by packing the workpiece in the X-axis direction at intervals of the second cutting line by the pushing means. When cutting the second cutting line group, even if the workpiece is deformed and distorted by the cutting process of the first cutting line group, the workpiece is clamped by the pushing means and the abutting member. This can correct the distortion of the workpiece. Therefore, it is possible to cut the second cutting lines one by one accurately and sequentially. In addition, the workpiece is always cut at the next second cutting line without the cutting groove formed by the cutting process at the previous second cutting line. Not affected.

  Further, according to the above configuration, when the second cutting line group is cut, the high pressure liquid ejecting means is positioned as in the prior art when the ejection position of the high pressure liquid ejecting means is sequentially positioned with respect to each second cutting line. And the workpiece holding means are not moved relative to each other in the X-axis direction, but the extrusion means provided on the workpiece holding means is operated to move the workpiece in the X-axis direction. There is no need to relatively move the ejection means in the X-axis direction. This extrusion means is generally smaller in size than the high-pressure liquid injection means and the workpiece holding means, so that precise control can be performed. Accordingly, each second cutting line of the second cutting line group can be accurately positioned and cut at the high pressure liquid injection position.

  Further, on the workpiece holding means, an alignment means for aligning the workpiece divided into chips moved by the transfer means may be further provided. As a result, since the workpieces divided into chips transferred by the transfer means can be aligned on the workpiece holding means, the area of the workpiece holding means can be reduced and space saving can be achieved.

  Further, a pressing member that presses the workpiece abutted against the abutting member from above may be further provided on the workpiece holding means. Thus, when the second cutting line group is cut, the workpiece can be stably held not only in the horizontal direction but also in the vertical direction, and distortion of the workpiece can be corrected appropriately.

  Moreover, in order to solve the said subject, according to another viewpoint of this invention, the high pressure liquid injection type cutting method in the high pressure liquid injection type cutting device mentioned above is provided. This high-pressure liquid jet cutting method includes (1) extruding a workpiece placed on the workpiece holding means in the X-axis direction by an extrusion means after cutting the first cutting line group, A step of sandwiching the workpiece by the pushing means and the abutting member by abutting; and (2) a second cutting line group of the workpiece by the high pressure liquid ejected from the high pressure liquid ejecting means, Cutting the second cutting line closest to the abutting member and dividing the work piece into chips by one row in the Y-axis direction; and (3) the workpiece divided into chips in one row. And (4) repeating the steps (1) to (3) until all of the second cutting lines are cut. It is characterized by.

  With this configuration, when the second cutting line group is cut, each time the second cutting line is cut by the high-pressure liquid jetting means, the work piece divided into one row of chips is transferred by the transferring means. After that, the plurality of second cutting lines can be sequentially and suitably cut one by one by packing the workpiece in the X-axis direction at intervals of the second cutting line by the pushing means. When cutting the second cutting line group, even if the workpiece is deformed and distorted by the cutting process of the first cutting line group, the workpiece is clamped by the pushing means and the abutting member. This can correct the distortion of the workpiece. Therefore, it is possible to cut the second cutting lines one by one accurately and sequentially. In addition, the workpiece is always cut at the next second cutting line without the cutting groove formed by the cutting process at the previous second cutting line. Not affected.

  The high-pressure liquid injection type cutting apparatus further includes alignment means for aligning the workpieces divided into a row of chips moved by the transfer means on the work-piece holding means; In the expression cutting method, at least prior to the step (3), the alignment means moves the entire workpiece divided into one or more rows of chips already moved by the transfer means in the X-axis direction, Forming a space capable of accommodating the workpieces divided into a row of chips, and in the step (3), the workpieces divided into a row of chips are transferred by the transfer means. It may be moved in the Y-axis direction and accommodated in a space.

  As a result, the workpieces divided into one row of chips generated each time one second cutting line is cut can be sequentially transferred to the alignment region by the transfer means. Furthermore, the workpieces divided into one or more rows of chips transferred to the alignment region can be aligned by the alignment means.

  The high-pressure liquid injection type cutting device further includes a pressing member that presses the workpiece abutted against the abutting member from above on the workpiece holding means; After the step (1), the workpiece is pressed from above by the pressing member between the position where the workpiece contacts the abutting member and the second cutting line closest to the abutting member. A step of: Thus, when cutting the second cutting line group, the workpiece can be stably held not only in the horizontal direction but also in the vertical direction, and the distortion of the workpiece can be preferably corrected, and a row of chips can be formed. It is possible to prevent the workpiece divided into pieces from being scattered apart.

  Further, the workpiece has a substantially rectangular shape, and a pair of opposing edges of the workpiece are substantially parallel to the second cutting line group and are located closest to the edges. It may be formed so that the distance from the cutting line to the edge is substantially the same as the interval between the plurality of second cutting lines. As a result, even if the edges on both sides of the workpiece in the first cutting line direction and the cutting line of the second channel are not parallel, the edge of the workpiece is formed in advance. Thus, the cutting process of the second cutting line group as described above can be suitably executed.

  As described above, according to the present invention, even if the workpiece is deformed and distorted by cutting the first cutting line group (first channel), the workpiece is clamped by using the pushing means and the abutting member. Therefore, the distortion of the workpiece can be corrected. Therefore, the second cutting lines of the second cutting line group (second channel) can be accurately cut one by one.

  Further, when the second cutting line group is cut, the high pressure liquid ejecting means and the work piece holding means are not moved relative to each other in the X-axis direction, but the work piece is moved by the pushing means which is a relatively small device. Since each cutting line interval is packed in the X-axis direction and cut, each second cutting line can be cut at an accurate position.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
The high pressure liquid injection cutting device according to the first embodiment of the present invention will be described below. The high-pressure liquid jet cutting device according to the present embodiment is, for example, a water jet cutting device that cuts a workpiece with a jet of high-pressure water (abrasive jet) mixed with an abrasive as described below. Although configured, the present invention is not limited to such an example.

  First, based on FIG. 1 and FIG. 2, the whole structure of the water jet cutting device 1 concerning this embodiment is demonstrated roughly. FIG. 1 is a schematic diagram showing the overall configuration of the water jet cutting device 1 according to the present embodiment. FIG. 2 is a perspective view showing a configuration around the cutting region of the water jet cutting apparatus 1 according to the present embodiment.

  As shown in FIG. 1, the water jet cutting device 1 according to the present embodiment cuts a substrate 35 relatively freely by spraying high-pressure water containing an abrasive onto a substrate 35 that is a workpiece. This is a cutting device capable of cutting (i.e., water jet processing) with high accuracy on a line. The substrate 35 to be cut by the water jet cutting apparatus 1 is, for example, a packaged semiconductor substrate such as a QFN (Quad Flat Non-Leaded Package) substrate or a CSP (Chip Size Package) substrate. It is not limited to.

  As shown in FIG. 1, the water jet cutting device 1 includes, for example, a high-pressure liquid supply means 10, an abrasive mixing means 20, an injection nozzle 30, a holding table 40, a table moving means 42, and a catch tank 50. And an abrasive recovery means 60.

The high-pressure liquid supply means 10 is composed of, for example, a high-pressure pump and a motor, which will be described later, and pressurizes water supplied from the outside, for example, 600 to 700 bar (1 bar = about 1.02 kgf / cm ² ). The high pressure water can be generated and supplied. The water supplied from the outside is, for example, tap water, but is not limited to this example, and may be pure water or the like. The high-pressure water generated by the high-pressure liquid supply means 10 is supplied to the abrasive material mixing means 20 via the high-pressure pipe 11 that is a pipe for carrying the high-pressure fluid.

  The abrasive material mixing means 20 is composed of a plurality of abrasive material mixture storage tanks and pressure adjusting means, which will be described later, and stores abrasive material mixed water in which abrasive material (abrasive grains) and water are mixed. The abrasive mixing means 20 mixes the abrasive at a predetermined ratio with the high-pressure water supplied from the high-pressure liquid supply means 10, and sends the high-pressure water mixed with the abrasive to the injection nozzle 30. This abrasive is made of a material with high hardness such as garnet, alumina oxide, silicon carbide, diamond, etc., and is a granular material having a particle size of, for example, about several tens to several hundreds μm, and has a function of increasing the cutting efficiency of high-pressure water. Have In this embodiment, for example, alumina oxide having a particle size of 40 to 100 μm is used as the abrasive. High-pressure water mixed with such an abrasive (hereinafter also referred to as “high-pressure abrasive mixed water”) is supplied from the abrasive mixing means 20 to the injection nozzle 30 via the high-pressure pipe 21.

  The injection nozzle 30 is configured as an example of a high-pressure liquid injection unit that injects high-pressure liquid, and includes, for example, a nozzle pipe 31 and an orifice 32. The spray nozzle 30 is supplied with high-pressure abrasive mixed water from the abrasive mixing means 20 via the high-pressure pipe 21. The injection nozzle 30, for example, injects this high-pressure abrasive mixed water onto the substrate 35 held by the holding table 40 at a high speed from above. As shown in FIG. 2, the spray nozzle 30 is stably fixed to the main body 2 of the water jet cutting apparatus 1 by a nozzle fixing member 33.

  Further, as shown in a partially enlarged view in FIG. 1, an orifice 32 for reducing the ejection diameter of the high-pressure water is attached to the tip of the nozzle tube 31 of the injection nozzle 30. The orifice 32 includes, for example, an orifice body 322 having a predetermined fine diameter jet outlet 321 formed at the tip thereof, and an orifice cover provided so as to cover the orifice body 322 and screwed to the tip portion of the nozzle tube 31. 323. The orifice body 322 is fixed to the tip of the injection nozzle 30 by screwing the orifice cover 323.

  The flow rate of the high-pressure water jet (i.e., water jet) J jetted from the jet nozzle 30 is about 2 to 3 times the speed of sound, for example. The distance between the tip of the injection nozzle 30 and the surface of the substrate 35 is, for example, 50 μm to 1 mm, and is adjusted so that both are as close as possible. By bringing the injection nozzle 30 and the substrate 35 close to each other in this way, it is possible to suppress the diffusion of the injected high-pressure water jet J as much as possible and prevent the cutting width of the substrate 35 from becoming wide. Further, the diameter of the injection nozzle 30 (the diameter of the injection outlet 321) is, for example, about 250 μm, and in this case, the cutting width of the substrate 35 is, for example, about 300 μm.

  Thus, the substrate 35 can be cut by the energy of the high-pressure water by spraying the water jet J, which is a jet of the abrasive mixed water, onto the substrate 35 by the spray nozzle 30. At this time, the abrasive material collides with the substrate 35 together with the high-pressure water to destroy and cut a part of the substrate 35, so that the cutting efficiency can be improved. Thus, the water jet J according to the present embodiment is configured as an abrasive jet.

  The holding table 40 is configured as an example of a workpiece holding unit that holds a workpiece. As shown in FIGS. 1 and 2, the holding table 40 is a plate-like member formed of a hard metal such as stainless steel, and holds and fixes a substrate 35 as a workpiece. In more detail, in the present embodiment, the substrate 35 has a first channel cutting holding member and a second channel cutting holding member (not shown in FIGS. 1 and 2) that are detachable from the holding table 40. (Refer to FIGS. 3 and 6), the holding member 40 is held and fixed on the holding table 40. Details of the first and second channel cutting holding members will be described later.

  Further, the holding table 40 is formed with a table window 401 which is an opening for allowing the water jet J to pass through at a portion where the substrate 35 is fixed. Since the water jet J ejected by the ejection nozzle 30 passes through the portion of the table window 401, the holding table 40 itself is not cut by the water jet J.

  Also, at the four corners around the table window 401 on the upper surface of the holding table 40, holding member mounting pins 402 for accurately positioning and mounting a first channel cutting holding member and a second channel cutting holding member, which will be described later, It is installed protruding upwards.

  The table moving means 42 includes, for example, a base part and a drive mechanism such as an electric motor, and supports the holding table 40, and also holds the holding table 40 in the horizontal direction (X-axis and Y-axis directions) and in the vertical direction. Move in the direction (Z-axis direction).

  Specifically, as shown in FIG. 2, the holding table 40 is supported by first to fourth base portions 411, 421, 431, 441 that are slidably connected to each other. When the holding table 40 is moved horizontally in the X-axis direction, the first male screw rod 415 is rotated in the forward or reverse direction by the first electric motor 413 to engage the first male screw rod 415. The base part 421 is moved in the X-axis direction along the first guide rail 417 provided on the first base part 411. When the holding table 40 is moved vertically in the Z-axis direction, the second electric motor 423 rotates the second male screw rod 425 in the forward or reverse direction and engages with the second male screw rod 425. The three base parts 431 are moved up and down in the Z-axis direction along the second guide rails 427 provided on the second base part 421. Furthermore, when the holding table 40 is moved horizontally in the Y-axis direction, the third male screw rod 435 is rotated in the forward or reverse direction by the third electric motor 433 and is engaged with the third male screw rod 435. The four base parts 441 are moved in the Y-axis direction along the third guide rails 437 provided on the third base part 431.

  By moving the holding table 40 in the horizontal direction (X-axis and Y-axis directions) by the table moving means 42 having such a configuration, the substrate 35 held by the holding table 40 is moved with respect to the ejection nozzle 30 in the X-axis. And relative movement in the Y-axis direction. Thereby, the injection position (cutting part) of the water jet J with respect to the board | substrate 35 can be changed, and the board | substrate 35 can be cut | disconnected by a continuous line. The feeding speed of the substrate 35 at the time of cutting varies depending on the thickness and material of the substrate 35 to be cut, but is, for example, 20 mm / second.

  Further, by moving the holding table 40 in the Z-axis direction by the table moving means 42, the holding table 40 is held by the tip of the injection nozzle 30 and the holding table 40 in accordance with the type, thickness, surface irregularity, etc. of the substrate 35. The distance to the substrate 35 can be adjusted.

  The configuration of the table moving means 42 is not limited to the above example, and various designs can be changed as long as the substrate 35 can be moved at least in the horizontal direction. For example, instead of moving the holding table 40 in the Z-axis direction, an elevating mechanism that moves the injection nozzle 30 in the Z-axis direction may be provided.

  The catch tank 50 is, for example, a vertically long water tank whose upper surface is open. For example, the catch tank 50 is provided below the holding table 40 and directly below the injection nozzle 30. The catch tank 50 stores therein water containing abrasives up to a predetermined height, and supply and discharge of water to the catch tank 50 are controlled in order to keep the water surface constant. .

  The catch tank 50 functions as a water receiving tank for the water jet J. In other words, the catch tank 50 can receive the water jet J that has been cut through the substrate 35 as described above with the stored water as a buffer material with reduced power. At the bottom of the catch tank 50, the abrasive contained in the abrasive mixture water received as described above settles and accumulates. Further, a pipe 51 is connected to, for example, the side bottom of the catch tank 50, and the abrasive and water in the catch tank 50 are discharged through this pipe 51 and transferred to the abrasive collecting means 60. .

  The abrasive recovery means 60 recovers an abrasive having a reusable predetermined particle size (for example, 30 to 100 μm) from the abrasive mixed water transferred from the catch tank 50 via the pipe 51, Transfer to abrasive mixing means 20. The abrasive recovery means 60 includes an abrasive recovery filter (not shown) that allows the reusable abrasive particles to pass therethrough, and recovers the abrasive that passes through the abrasive recovery filter. The stored abrasive mixed water containing the recovered abrasive is transferred to the abrasive mixing means 20 via the pipe 61. Further, the abrasive mixed water including the abrasive not recovered through the abrasive recovery filter is discharged to the outside through the drain pipe 62, for example.

  The water jet cutting device 1 configured as described above is configured to move the holding table 40 relative to the spray nozzle 30 in the X-axis and / or Y-axis direction while spraying the water jet J from the spray nozzle 30. The substrate 35 can be cut by causing the water jet J containing an abrasive to act along the cutting lines of the first and second channels of the substrate 35.

  As described above, the water jet cutting apparatus according to the present embodiment employs a cutting method in which the injection nozzle 30 is fixed and the substrate 35 is moved by the holding table 40 during the cutting process. By adopting such a cutting method, since the position of the injection nozzle 30 is fixed, there is an advantage that the catch tank 50 can be downsized, the installation area can be reduced, and the configuration of the moving mechanism can be simplified. However, the present invention is not limited to this example, and the cutting may be performed by fixing the holding table 40 and horizontally moving the injection nozzle 30 in the X-axis and / or Y-axis direction.

  The water jet cutting apparatus 1 automatically circulates an abrasive having a particle size suitable for the cutting process in the apparatus using the abrasive mixing means 20, the catch tank 50, the abrasive recovery means 60, and the like. Can be reused. As a result, the abrasive can be reused without manpower to increase the utilization efficiency, and continuous cutting without stopping the high-pressure liquid supply means 10 can be performed. Can be reduced.

  By the way, the water jet cutting apparatus 1 according to the present embodiment increases the cutting accuracy of the second channel of the substrate 35. Therefore, in the cutting processing of the second channel, as described below, Is characterized by the use of different special cutting methods. Accordingly, the first channel cutting holding member used at the time of cutting the first channel and the second channel cutting holding member used at the time of cutting the second channel are greatly different in configuration. These first and second channel cutting holding members are detachably attached to the holding table 40 in order to hold the substrate 35 suitably, and are interchangeable. Therefore, hereinafter, the configurations of the first channel cutting holding member and the second channel cutting holding member, and the cutting processing method using these holding members will be described.

  First, the configuration of the substrate 35, which is a workpiece according to the present embodiment, and the first channel cutting holding member 100 (hereinafter referred to as "first holding member 100") will be described with reference to FIG. FIG. 3 is a perspective view showing the substrate 35 and the first holding member 100 according to the present embodiment.

  In the following description, a QFN (Quad Flat Non-Leaded Package) substrate as shown in FIG. 3 will be described as an example of the substrate 35 that is a workpiece. QFN is one of IC chip packaging methods, and is characterized in that external input / output pins do not appear outside.

  As shown in FIG. 3, the substrate 35 which is a QFN substrate has, for example, a substantially rectangular flat plate shape as a whole. The substrate 35 includes a metal frame 351 serving as a base and a package portion 353 formed on one side surface of the metal frame 351. The package portion 353 is a portion in which a plurality of regularly arranged semiconductor elements (circuits) are molded with resin.

  On this substrate 35, circuit regions 35a, 35b, and 35c, which are collection regions of a plurality of regularly arranged semiconductor elements, are formed. In the substrate 35 shown in FIG. 3, an example of the substrate 35 in which three circuit regions 35 a to 35 c are formed is shown. However, the number of circuit regions is not limited to three, one for each substrate 35. , Two, or four or more circuit regions may be formed.

  In each of the circuit areas 35a to 35c, first and second cutting lines (streets) 357 and 359 are arranged in a lattice pattern, and a plurality of rectangular areas 355 are defined by the first cutting lines 357 and 359. Has been. A semiconductor element is formed in each of the rectangular regions 355.

  Of the cutting lines arranged in a grid pattern, the first cutting line 357 is a plurality of cutting lines extending in the short direction of the substrate 35 (the Y-axis direction in FIG. 3) and having substantially the same length. is there. The plurality of first cutting lines 357 constitute a first channel that is a first cutting line group. On the other hand, the second cutting lines 359 are a plurality of lines extending in the longitudinal direction (Y-axis direction in FIG. 3) of the substrate 35 and having substantially the same length. The plurality of second cutting lines 359 constitute a second channel which is a first cutting line group. The first cutting line 357 and the second cutting line 359 are orthogonal to each other. As a result, the first channel direction (Y-axis direction in FIG. 3) and the second channel direction (X-axis direction in FIG. 3) are the same. Orthogonal.

  By jetting high-pressure water as described above, the substrate 35 is first cut by cutting all the first cutting lines 357 of the first channel and then by cutting all the second cutting lines 359 of the second channel. The circuit regions 35a to 35c can be diced into a lattice shape and divided into a plurality of chips having a substantially rectangular shape. Although it is possible to cut the first channel after cutting the second channel, in this embodiment, a procedure for cutting the first channel first will be described.

  Next, the first holding member 100 used when cutting the first channel of the substrate 35 will be described. As shown in FIG. 3, the first holding member 100 has a rectangular shape formed of a metal material such as stainless steel, and includes a support plate 102 that supports a substrate 35 placed on the upper surface thereof, and a support plate 102. On the other hand, the cover member 104 is attached via a hinge member 106 so as to be opened and closed.

  Substantially rectangular windows 102 a and 104 a for allowing the water jet J to pass therethrough are formed through the central portions of the support plate 102 and the cover member 104, respectively. Further, a step 102b is formed on the inner peripheral surface of the window 102a of the support plate 102, and the support plate 102 stabilizes the substrate 35 by fitting the peripheral portion of the substrate 35 to the step 102b. Can be supported. In addition, mounting through holes 103 that engage with the holding member mounting pins 402 (see FIG. 2) of the holding table 40 described above are formed at the four corners of the support plate 102b. A stopper 108 is provided on one side of the cover member 104, and a recess 110 is formed on the side surface of the support plate 102. This stopper 108 engages with the recess 110 when the cover member 104 is closed, and prevents the cover member 104 from opening.

  The first holding member 100 having such a configuration is attached to the holding frame 40 while holding the substrate 35 when the first channel is cut. Specifically, first, after placing the substrate 35 on the support plate 102 of the first holding member 100 so as to fit the stepped portion 102b, the cover member 104 is closed, and the concave portion 110 and the clasp 108 are connected. Engage. Accordingly, the substrate 35 can be stably held using the first holding member 100. Next, the first holding member 100 holding the substrate 35 in this way is placed on the holding table 40. At this time, by inserting the holding member mounting pin 402 of the holding table 40 into the mounting through hole 103 of the first holding member 100, the first holding member 100 is accurately positioned with respect to the holding table 40 and stable. Can be attached.

  Next, a method of cutting the first channel of the substrate 35 held by the first holding member 100 and the holding table 40 will be described with reference to FIGS. FIG. 4 is a plan view showing the trajectory T of the water jet J acting on the substrate 35 when the first channel according to the present embodiment is cut. FIG. 5 is a plan view showing the substrate 35 in which the first channel according to the present embodiment is cut by one stroke.

  As shown in FIG. 4, in the present embodiment, a one-stroke cutting method is employed when the first channel is cut. This “single-stroke cutting” means that the workpiece is continuously cut by one cutting line without stopping the injection of the high-pressure liquid.

  Specifically, by continuously injecting the water jet J from the injection nozzle 30 along the first channel while moving the holding table relative to the fixed injection nozzle 30 in the X-axis and Y-axis directions. , All the first cutting lines 357 constituting the first channel are cut by one stroke. At this time, as shown in FIG. 4B, the trajectory T on the XY plane of the water jet J acting on the substrate 35 is the upper end of all the first cutting lines 357 constituting the first channel. Alternatively, it becomes a zigzag locus alternately connected at the lower end. By performing the one-line drawing process of the first channel on all the circuit areas 35a to 35c of the substrate 35, as shown in FIG. A zigzag cutting groove 37 that connects the first cutting lines 357 with a single stroke is formed so as to complete the cutting of the first channel.

  By such one-line cutting of the first channel, the rectangular regions 355 adjacent to each other in the second channel direction (X-axis direction in FIG. 5) are divided in the circuit regions 35a to 35c, but the first channel direction ( The rectangular regions 355 adjacent to each other in the Y-axis direction in FIG. 5 are not divided. As a result, an aggregate of a plurality (eight in FIG. 5) of rectangular regions 355 arranged in the first channel direction has a strip shape, and only one of the four sides (upper side or lower side in FIG. 5). It becomes the state supported by. Therefore, in the substrate 35 cut with a single stroke, the strip-shaped portion may be deformed by warping in the vertical direction or laterally shifting in the horizontal direction.

  Furthermore, in this embodiment, as shown in FIGS. 5A and 5B, the substrate 35 having the first channel cut as described above is cut as a preparation for the next second channel cutting process. The circuit regions 35a to 35c are divided. The substrate 35 including only one circuit region 35a to 35c divided in this way is a unit for cutting the second channel.

  Next, the configuration of the second channel cutting holding member 200 (hereinafter referred to as “second holding member 200”), which is a feature of the present embodiment, will be described with reference to FIGS. 6 and 7. The second holding member 200 and the holding table 40 constitute a workpiece holding means in the present embodiment. 6 and 7 are perspective views showing the configuration of the second holding member 200 according to the present embodiment. However, in FIG. 7, the illustration of the transfer means 250 shown in FIG. 6 is omitted and the substrate 35 is shown for convenience of explanation.

  As shown in FIGS. 6 and 7, the second holding member 200 is a member attached to the holding table 40 while holding the substrate 35 in order to cut the second channel of the substrate 35. The second holding member 200 includes a mounting plate 210, an extruding unit 220, an abutting member 230, a pressing unit 240, a transfer unit 250, and an alignment unit 260.

  The mounting plate 210 is, for example, a metal or resin flat plate having a substantially rectangular shape, and its upper surface is a smooth flat surface. As shown in FIG. 7, a substrate 35 (see FIG. 5B) obtained by cutting out one circuit region 35a after the first channel is cut is placed on the mounting plate 210. In the substrate 35, all the first cutting lines 357 of the first channel are cut as described above to form the cutting grooves 37. The substrate 35 is placed in a space (cutting region 212) between the pushing means 220 and the abutting member 230 on the placement plate 210 so that the first channel direction coincides with the X-axis direction. The mounting plate 210 supports the substrate 35 placed in this way and the chip into which the substrate 35 is divided by cutting a second channel described later from below. However, since these substrates 35 and chips are not fixed on the mounting plate 210, they can slide in the horizontal direction on the mounting plate 210 if other external forces are applied.

  The upper surface of the mounting plate 210 is roughly divided into a cutting area 212 and an alignment area 214. The cutting area 212 is an area for cutting the second channel of the mounted substrate 35. On the other hand, the alignment area 214 is an area for regularly aligning a plurality of chips divided by cutting the second channel. In such a cutting area 212, an extruding means 220, a butting member 230, and a pressing means 240 are provided, while an aligning means 260 is provided in the alignment area 214. The transfer means 250 is provided so as to straddle the cutting area 212 and the alignment area 214.

  Further, mounting through holes 202 that engage with the holding member mounting pins 402 (see FIG. 2) of the holding table 40 described above are formed at the four corners of the mounting plate 210. When the second holding member 200 is attached to the holding table 40, the second holding member 200 is attached to the holding table 40 by inserting the holding member attaching pin 402 of the holding table 40 into the attachment through hole 202. Accurate positioning and stable mounting.

  The extruding means 220 includes, for example, an extruding plate 222 that is a substantially rectangular flat plate thicker than the substrate 35, and a cylinder mechanism 224 that reciprocates the extruding plate 222 in the X-axis direction. Further, the abutting member 230 is formed of, for example, a substantially rectangular flat plate thicker than the substrate 35, and is fixed on the mounting plate 210 so as to face the extrusion means 220 with the substrate 35 interposed therebetween. Yes. The abutting member 230 is abutted against the substrate 35 pushed out by the pushing member 220 and locks the substrate 35 at a predetermined position of the cutting region 212 on the mounting plate 210. Note that the pressing surface 222a, which is the front side surface of the extrusion plate 222, and the contact surface 230a, which is the rear side surface of the butting member 230, are both vertical surfaces parallel to the Y-axis direction, and are mutually sandwiched with the substrate 35 interposed therebetween. Opposite to.

  By the pushing means 220 and the abutting member 230, the substrate 35 can be sandwiched and held from both sides in the X-axis direction. More specifically, the push-out means 220 advances the push-out plate 222 in the negative direction of the X axis by the cylinder mechanism 224 and presses one side surface of the substrate 35 placed on the placement plate 210 with the press surface 222a. As a result, the substrate 35 is pushed toward the abutting member 230 in the negative X-axis direction, and the other side surface of the substrate 35 is brought into contact with the abutting surface 230 a of the abutting member 230. As a result, as shown in FIG. 8, the substrate 35 is sandwiched between the pressing surface 222 a of the pushing plate 222 and the abutting surface 230 a of the abutting member 230. Thereby, the distortion (curvature, lateral deviation, etc. of the strip-shaped portion described above) generated in the substrate 35 by the cutting process of the first channel can be corrected.

  The pressing means 240 has a function of assisting the holding operation of the substrate 35 by the pushing means 220 and the abutting member 230. For example, the pressing means 240 is installed on the abutting member 230 and presses and holds the end of the substrate 35 on the abutting member 230 side from above. The pressing means 240 includes, for example, a pressing member 242 that is a substantially rectangular flat plate, and a support driving mechanism 244 that supports the pressing member 242 so as to be movable between a holding position and a retracted position. As shown in FIG. 8, the pressing means 240 moves the pressing member 242 in the retracted position to the holding position when the substrate 35 is sandwiched between the pushing means 220 and the abutting member 230. The end of the substrate 35 on the abutting member 230 side is pressed from above by the lower end surface of the pressing member 242 and is held on the mounting plate 210. Accordingly, the substrate 35 is not only clamped from the horizontal direction by the pushing means 220 and the abutting member 230 but also held from the vertical direction by the pressing means 240, so that the substrate 35 is more stably placed on the mounting plate 210. Can be retained. The pressing means 240 is not necessarily installed.

  In the state where the substrate 35 is held by the pushing means 220, the abutting member 230 and the pressing means 240 configured as described above, the second channel is formed by the water jet J ejected from the ejection nozzle 30 as shown in FIG. The second cutting line 359 is cut. Specifically, the holding table 40 to which the second holding member 200 is attached is moved relative to the injection nozzle 30 in the Y-axis direction to form a plurality of second cuts constituting the second channel of the substrate 35. Among the lines 359, the water jet J is caused to act along one second cutting line 359 at the extreme end (most abutting member 230 side), and the one second cutting line 359 is cut. The At this time, as shown in FIGS. 7 and 8, the water jet J ejected from the ejection nozzle 30 and penetrating the substrate 35 passes through the escape groove 216 formed in the mounting plate 210 so as to extend in the Y-axis direction. Therefore, the mounting plate 210 itself is not cut. The escape groove 216 is formed in the cutting region 212 at a position (X-axis direction position) away from the contact surface 230a of the abutting member 230 by the cutting line interval of the second channel of the substrate 35. .

  In this way, by cutting one second cutting line 359 located closest to the abutting member 230 among the cutting lines of the second channel of the substrate 35 whose first channel has already been cut. As shown in FIG. 9, a linear cutting groove 38 is formed along the second cutting line 359. As a result, one row 34 in the Y-axis direction positioned at the end portion of the substrate 35 on the abutting member 230 side (that is, the rectangular region 355 aligned in the Y-axis direction positioned at the end portion of the substrate 35 on the abutting member 230 side). One row) is divided into chips. At the time of cutting, the row 34 in the Y-axis direction located at the end of the substrate 35 is pressed and fixed from above by the pressing member 242 of the pressing means 240. For this reason, the divided chips are not scattered apart by the water pressure of the water jet J that moves relatively in the Y-axis direction.

  Further, as shown in FIG. 6, the transfer means 250 moves the substrate 34 divided into the above-mentioned row of chips (hereinafter referred to as “a row of chips 34”) in the positive direction of the Y-axis, Transfer from the cutting area 212 to the alignment area 214. The transfer means 250 is engaged with a drive unit 252 made of an electric motor or the like, a male screw rod 254 and a guide rail 255 extending in the Y-axis direction above the mounting plate 210, and a male screw rod 254 inside. A slider 256 and a transfer plate 258 connected to the lower portion of the slider 256 are provided.

  The transfer means 250 rotates the male screw rod 254 by the drive unit 252 and moves the slider 256 and the transfer plate 258 along the guide rail 255 in the Y-axis direction. The transfer plate 258 is, for example, a flat plate member disposed upright, and the thickness in the X-axis direction is less than the cutting line interval (chip width) of the second channel. Further, since the height position of the lower end surface of the transfer plate 258 is substantially the same as or slightly above the upper surface of the mounting plate 210, the pressing surface 258a, which is the side surface of the transfer plate 258, is a chip on which the substrate 35 is divided. It is possible to contact with the side surface.

  The transfer means 250 configured as described above moves the transfer plate 258 in the positive direction of the Y-axis (the direction from the cutting region 212 toward the array region 214) when transferring the row of chips 34, thereby pressing the transfer plate 258 on the pressing surface. The one row of chips 34 is pushed out by 258a, and the entire row is moved to the alignment region 214 (see FIG. 12C described later).

  During the transfer of the rows of chips 34, the holding operation in which the pushing means 220 pushes the substrate 35 against the abutting member 230 is released, and the pushing member 242 of the pushing means 240 is moved by the support driving mechanism 244. The water jet J that is retreated to the retreat position and further ejected from the ejection nozzle 30 is continuously formed in the direction perpendicular to the escape groove 216 (the X-axis positive direction) from the end of the escape groove 216. It is retracted into the groove 218 (see FIG. 7). Thereby, since the transfer plate 258 is not obstructed by the pressing member 242 or the water jet J, the transfer operation of the chips 34 for the one row can be suitably executed.

  Further, the entire transfer means 250 can be reciprocated in the X-axis direction along a pair of guide grooves 259 formed in the mounting plate 210 by a drive mechanism (not shown). Thus, when the second cutting line 359 of the second channel is cut by the spray nozzle 30, the transfer means 250 is moved in the negative direction of the X axis and retracted from above the escape groove 216, thereby causing the transfer means 250 to move the water. It is possible not to obstruct the course of Jet J.

  The alignment unit 260 has a function of collecting and aligning a plurality of chips transferred to the alignment region 214 by the transfer unit 250. The alignment means 260 includes, for example, an alignment plate 262 that is a substantially rectangular flat plate thicker than the chip, and a cylinder mechanism 264 that reciprocates the alignment plate 262 in the X-axis direction. On one side (the side far from the cutting region 212) of the front end portion of the alignment plate 262, a substantially rectangular protruding portion 262a is formed to protrude. In addition, a pressing surface 262c, which is an end surface of a portion where the protruding portion 262a is not formed at the tip portion of the alignment plate 262, is formed to be a vertical surface parallel to the Y-axis direction.

  The alignment operation of the alignment means 260 having such a configuration will be described. The row of chips 34 transferred in the positive Y-axis direction by the transfer means 250 is in contact with the contact surface 262b, which is the inner end surface of the protrusion 262a, and further movement is restricted (described later). (See FIG. 12D). As a result, the rows of chips 34 are sandwiched between the transfer plate 258 of the transfer means 250 and the protrusion 262a of the alignment means 260 and are aligned in the Y-axis direction.

  Further, the aligning means 260 advances the aligning plate 262 in the negative direction of the X-axis by the cylinder mechanism 264, and the one or more rows of chips 36 that have already been transferred to the aligning region 262 are transferred to the pressing surface 262c of the aligning plate 262. By pushing with, one or more rows of chips 36 are pushed out in the negative direction of the X axis (see FIG. 12A described later). The extrusion width at this time is, for example, at least the distance between the second cutting lines 359 (the width of the chip in the first channel direction). Thus, by pushing the chip group in the X-axis direction by the aligning means 260, the one or more rows of chips 36 can be aligned in the X-axis direction. Further, by pulling back the alignment plate 262 advanced as described above, a space 219 for accommodating the next row of chips 34 to be transferred can be secured on the alignment region 214 (see FIG. 12B).

  Heretofore, the configuration of the water jet cutting device 1 including the second holding member 200 that is a feature according to the present embodiment has been described.

  In the conventional water jet cutting apparatus, when the second channel of the substrate 35 is cut, the holding table 40 is moved in the Y-axis direction to cut one second cutting line 359, and then the holding table 40 is moved in the X-axis direction. It was moved and the injection nozzle 30 was positioned on the next second cutting line 359 and cut.

  On the other hand, in the water jet cutting device 1 according to the present embodiment, when the second channel is cut, the ejecting means 220 provided on the second holding member 200 without moving the spray nozzle 30 and the holding table 40. The substrate 35 is pushed out in the X-axis direction, and the next second cutting line 359 is positioned below the injection nozzle 30 and cut. Accordingly, the ejection nozzle 30 and the second holding member 200 (holding table 40) are configured not to move relative to each other in the X-axis direction. In general, as compared with the injection nozzle 30 or the holding table 40, the push-out means 220 is small as a device, so that precise control can be performed. Therefore, in this embodiment, the second cutting line 359 of the second channel can be accurately positioned at the spray position of the water jet J and cut as compared with the conventional case.

  Next, based on FIGS. 10 to 12, a method of cutting the first channel and the second channel of the substrate 35 using the water jet cutting device 1 as described above and dividing the substrate into chips will be described in detail. In addition, FIG. 10 is a flowchart which shows the cutting method (high pressure liquid injection type cutting method) of the board | substrate 35 using the water jet cutting device 1 concerning this embodiment. FIG. 11 is a plan view showing the substrate 35 formed in the second channel cutting preparation step according to the present embodiment. 12A to 12F are perspective views for explaining the cutting process of the second cutting line group using the second holding member 200 according to the present embodiment, respectively. For convenience of explanation, the pressing means 240 and the conveying means are shown. A part of the means 250 is not shown.

  As shown in FIG. 10, first, in step S102, the first channel of the substrate 35 as the workpiece is cut (step S102). Specifically, first, the substrate 35 is fixed to the holding table 40 using the first holding member 100 (see FIG. 3). Next, the jet nozzle 30 and the holding table 40 are moved relative to each other, and the water jet J acts continuously along the plurality of first cutting lines 357 of the first channel along the locus T as shown in FIG. Let As a result, as shown in FIG. 5, the first channel of the substrate 35 is cut with a single stroke, and zigzag cutting grooves 37 are continuously formed.

  Next, in step S104, as a preparation process for the second channel cutting process in the following steps S106 to S118, first, the substrate 35 having one circuit region 35a is cut out from the substrate 35 after the first channel cutting, The edge part of the board | substrate 35 is shape | molded (step S104).

  Specifically, as shown in FIG. 5, first, a substrate 35 having a plurality of circuit regions 35a to 35c in which the first channel is cut is divided into circuit regions 35a to 35c to obtain one circuit region 35a. The substrate 35 having only the substrate is cut out.

  Next, as shown in FIG. 11, the edge portions 39 on both sides in the first channel direction of the cut out substrate 35 are cut to form the substrate 35. Hereinafter, this forming process will be described in more detail.

  As shown in FIG. 11A, the cut-out substantially rectangular substrate 35 has a pair of opposite edges 361 on both sides in the first channel direction of the substrate 35 due to the manufacturing quality of the substrate 35. There are times when the second cutting line 359 is not parallel and has shifted. Since the second holding member 200 of the water jet cutting apparatus 1 according to the present embodiment has the above-described apparatus configuration, if the edge 361 of the substrate 35 and the second cutting line 359 are not parallel, the second channel is set. It cannot be cut accurately.

  Therefore, before starting the cutting process of the second channel, as shown in FIG. 11B, the edge portions 39 on both sides in the first channel direction of the substrate 35 are cut, and the edge 361 of the substrate 35 and the It shape | molds so that the 2nd cutting line 359 of 2 channels may become parallel. Thus, when the molded substrate 35 is placed on the placement plate 210 of the second holding member 200 and sandwiched between the pushing means 220 and the abutting member 230, the first channel direction of the substrate 35 is set. The pair of edges 361 on both sides, the second cutting line 359 of the second channel, the pressing surface 222a of the pushing means 220, and the contact surface 230a of the abutting member 230 are parallel to each other. Therefore, the second cutting line 359 can be accurately cut using the second holding member 200.

  Further, in this forming process, as shown in FIG. 11 (b), among the plurality of second cutting lines 359, the second cutting line at the position closest to the edge 361 (the upper end and the lower end in FIG. 11). The upper and lower two edge portions 39 are cut such that the distance Q from 359 to the edge 361 is the same as the interval P between the plurality of second cutting lines 359. As a result, the cutting process for the first row in the Y-axis direction described above can be started easily and accurately only by performing a process of cutting and removing one row which is a new edge 39 ′ of the substrate 35. become.

  In this way, even when the edge 361 of the substrate 35 and the second cutting line 359 are not parallel, by forming the substrate 35 in advance before cutting the second channel, The cutting of the second channel using the second holding member 200 can be performed accurately.

  Note that the water jet cutting device 1 or a separate cutting device may be used for the cutting process and the forming process in step S104. Further, the cutting process and / or the forming process in step S104 may be performed before the cutting process of the first channel in step S102.

  Next, returning to FIG. 10, in step S106, the substrate 35 from which the first channel has been cut is placed on the placement plate 210 of the second holding member 200 (step S106). Specifically, first, the first holding member 100 on the holding table 40 is replaced and fixed to the second holding member 200. Next, on the cutting area 212 of the mounting plate 210 of the second holding member 200, the circuit board 35a cut out and molded after the cutting of the first channel as described above is placed. . At this time, the substrate 35 is placed in a direction in which the first channel direction coincides with the extrusion direction (X-axis direction) of the extrusion means 220.

  Thereafter, in step S <b> 108, the substrate 35 placed on the placement plate 210 is pushed out in the X-axis direction by the pushing plate 222 of the pushing means 220 and is pushed against the butting member 230. Thereby, the board | substrate 35 is clamped from the X-axis direction both sides with the extrusion board 222 and the abutting member 230 (step S108).

  Further, when the substrate 35 is not held with a tape or the like, the end of the substrate 35 is held using the pressing means 240. Specifically, the pressing member 242 of the pressing means 240 is moved to the holding position, and the end portion on the abutting member 230 side of the sandwiched substrate 35 is pressed from above and pressed onto the mounting plate 210. To hold. As a result, the substrate 35 can be stably held on the mounting plate 210 by the pushing means 220, the abutting member 230 and the pressing means 240.

  Next, in step S110, as shown in FIG. 12A, the injection nozzle 30 for injecting the water jet J and the holding table 40 to which the second holding member 200 is attached are relatively moved in the Y-axis direction so as to be sandwiched. A water jet J is sprayed onto the substrate 35. Thereby, one second cutting line 359 located closest to the abutting member 230 among the plurality of cutting lines of the second channel is cut, and the row 34 of the substrate 35 in the Y-axis direction is divided into chips. (Step S110). FIG. 12A shows a state in which the fourth second cutting line 359 is cut from the end of the substrate 35 before cutting.

  In the cutting process of the second channel, the row 34 of the substrate 35 divided into chips is still held by being pressed from above by the pressing means 240, so that it is laterally shifted or scattered by the water pressure of the water jet J. There is nothing to do. Further, since the water jet J penetrating the substrate 35 passes through the escape groove 216 positioned immediately below the second cutting line 359, the water jet J does not bounce off the mounting plate 210. Accordingly, the substrate 35 is not lifted by water pressure from below, so that the second cutting line 359 can be accurately cut.

  Furthermore, in step S112, as shown in FIG. 12A, the alignment plate 262 of the alignment means 260 is advanced in the X-axis negative direction by the cutting line interval P of the second channel (see FIG. 11), and then shown in FIG. 12B. Thus, the alignment plate 262 is pulled back to the original position in the X-axis positive direction. As a result, the two rows of chips 36 that have already been transferred to the alignment region 214 are pushed out by the cutting line interval P of the second channel, aligned in the X-axis direction, and then transferred onto the alignment region 214. A space 219 (a gap between the pressing surface 262c of the alignment plate 262 and the two rows of chips 36) for accommodating the next row of chips 34 is opened (step S112). In addition, this step S112 should just be a process before the transfer process of following step S114, and may be performed before the said step S108 or S110.

  Thereafter, in step S114, as shown in FIG. 12C, the transfer plate 258 of the transfer means 250 pushes out the rows 34 of the chips 34 divided by the cutting in step S110 and moves them in the Y-axis direction (step S114). . Thereby, the chip | tip 34 for the said line is transferred from the cutting area | region 212 to the alignment area | region 214, and is accommodated in the space 219 vacated by said step S112. Further, as shown in FIG. 12D, the transferred chips 34 are in contact with the contact surface 262b of the protruding portion 262a of the alignment plate 262, and further movement is restricted. As a result, the transferred rows of chips 34 are sandwiched between the transfer plate 258 and the protruding portion 262a and aligned in the Y-axis direction.

  Next, in step S116, as shown in FIG. 12E, the injection nozzle 30 and the conveying plate 258 are returned to their original positions (step S116).

  Further, in step S118, for example, a control unit (not shown) of the water jet cutting device 1 determines whether all the cutting lines 259 of the second channel have been cut (step S118). As a result, when it is determined that all the cutting lines 259 are not cut, the process returns to step S108, and steps S108 to S116 are repeated in the same manner as described above to cut the next one cutting line 259. .

  Specifically, in step S108, as shown in FIG. 12F, the extrusion means is formed so as to fill the space 221 in which the chips 34 for one row moved in step S114 existed on the cutting area 212. The remaining substrate 35 is pushed out again in the negative direction of the X axis by the push plate 222 of 220 and brought into contact with the abutting member 230. Accordingly, the remaining substrate 35 is sandwiched again by the push plate 222 and the abutting member 230 (step S108). Next, the second cutting line 359 next to the second channel is cut by the water jet J (step S110), and thereafter, steps S112 to S118 similar to the above are performed.

  If it is determined that all the cutting lines 259 of the second channel have been cut by repeating such steps (step S118), all the steps are finished.

  The water jet cutting device 1 according to the present embodiment and the cutting method using the same have been described above. According to the water jet cutting device 1 and the cutting method, even if the substrate 35 is distorted by the cutting process of the first channel, the substrate 35 is sandwiched and held between the pushing means 220 and the abutting member 230 of the second holding member 200. Thus, the distortion of the substrate 35 can be corrected in the Y-axis direction. In the conventional cutting method, a cutting groove is formed in the workpiece by cutting the second cutting line, and the cutting groove is distorted, thereby adversely affecting the cutting accuracy of the subsequent second cutting line. However, in the cutting method according to the present embodiment, the next second cutting line 359 can be cut in a state where the past cutting groove 38 does not exist in the workpiece 12. Therefore, the cutting line 259 of the second channel can be cut accurately.

  Further, at the time of cutting the second channel, the substrate 35 is moved in the X-axis direction by the pushing means 220 without moving the spray nozzle 30 or the holding table 40 in the X-axis direction. Usually, compared with the injection nozzle 30 or the holding table 40, the push-out means 220 is small as a device, so that precise movement control can be performed and cutting accuracy can be improved.

  The preferred embodiments and examples of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be obvious to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

  For example, the workpiece is not limited to the example of the QFN substrate 35, and may be a semiconductor substrate such as a package substrate such as various semiconductor wafers, a CSP substrate, a GPS substrate, and a BGA substrate. Further, the workpiece may be a sapphire substrate, a glass material, a ceramic material, a metal material, a synthetic resin material such as plastic, or an electronic material substrate for forming a magnetic head, a laser diode head, or the like. .

  Moreover, although the said embodiment demonstrated the example which employ | adopted the water jet cutting device 1 as a high pressure liquid injection type cutting device, this invention is not limited to this example. The high-pressure liquid injection type cutting device can be variously modified as long as it has high-pressure liquid injection means for injecting high-pressure liquid and can cut and process a workpiece by high-pressure liquid injection. For example, the liquid to be jetted and stored is not limited to the above water example, and may be any liquid such as alcohol or oil, or a liquid in which various chemical substances are dissolved in various solvents. There may be. Also, the abrasive mixture liquid is not limited to the above example of the abrasive mixture water.

  In the above-described embodiment, the first channel is cut by one stroke. However, the present invention is not limited to this reason, and the first channel may be cut by another cutting method. For example, by temporarily stopping the jet of water jet from the jet nozzle or moving the jet nozzle at a high speed, the portion between the first cut lines 357 adjacent to each other in the first channel is not cut. , A plurality of substantially parallel cutting grooves may be formed by cutting so that only the first cutting line 357 is cut.

  The present invention is applicable to a high-pressure liquid injection type cutting apparatus and a high-pressure liquid injection type cutting method for cutting a workpiece by high-pressure liquid injection.

It is the schematic which shows the whole structure of the water jet cutting device concerning the 1st Embodiment of this invention. It is a perspective view which shows the structure of the cutting process area periphery in the water jet cutting device concerning the embodiment. It is a perspective view which shows the board | substrate and 1st holding member concerning the embodiment. It is a top view which shows the locus | trajectory of the water jet which acts on a board | substrate at the time of the cutting | disconnection of the 1st channel concerning the embodiment. It is a top view which shows the board | substrate by which the 1st channel concerning the same embodiment was cut by one stroke. It is a perspective view which shows the structure of the 2nd holding member concerning the embodiment. It is a perspective view which shows the structure of the 2nd holding member concerning the embodiment. It is a longitudinal cross-sectional view which shows the board | substrate hold | maintained by the 2nd holding member concerning the embodiment. It is a top view which shows the board | substrate by which one 2nd cutting line of the 2nd channel concerning the embodiment was cut | disconnected. It is a flowchart which shows the cutting method of the board | substrate using the water jet cutting device concerning the embodiment. It is a top view which shows the board | substrate shape | molded in the preparatory process of the 2nd channel cutting concerning the embodiment. It is a perspective view which shows the cutting process of one 2nd cutting line using the 2nd holding member concerning the embodiment. It is a perspective view which shows the alignment process using the 2nd holding member concerning the embodiment. It is a perspective view which shows the transfer process using the 2nd holding member concerning the embodiment. It is a perspective view which shows the transfer process using the 2nd holding member concerning the embodiment. It is a perspective view which shows the process of returning the injection nozzle etc. which used the 2nd holding member concerning the embodiment. It is a perspective view which shows the cutting process of the following 2nd cutting line using the 2nd holding member concerning the embodiment.

Explanation of symbols

1: Water jet cutting device 30: Spray nozzle 34: One row of substrates divided into chips (chips for one row)
35: Substrate (workpiece)
35a to c: Circuit area 36: One or more rows of chips that have already been transferred 37: Cutting groove of the first cutting line group 38: Cutting groove of the second cutting line 40: Holding table 100: First channel cutting Holding member (first holding member)
200: Second channel cutting holding member (second holding member)
210: Mounting plate 212: Cutting area 214: Alignment area 216: Escape groove 220: Extruding means 230: Abutting member 240: Pressing means 242: Pressing member 250: Transfer means 260: Aligning means 357: First cutting line 359 : Second cutting line J: Water jet

Claims (7)

After cutting a first cutting line group composed of a plurality of first cutting lines extending in a predetermined direction of the workpiece by the high pressure liquid ejected from the high pressure liquid ejecting means, the first cutting line group is orthogonal to the first cutting line group. In order to divide the workpiece into a plurality of chips by cutting a second cutting line group consisting of a plurality of second cutting lines,
After cutting the first cutting line group of the workpiece, the workpiece is placed on the workpiece holding means, and at least during the cutting process of the second cutting line group, the high-pressure liquid injection High-pressure liquid jet cutting for cutting the second cutting line group of the workpiece by moving the means relative to the workpiece holding means only in the Y-axis direction at the same X-axis direction position The device:
On the workpiece holding means,
An extrusion member for extruding the workpiece in the X-axis direction;
An abutting member that abuts the workpiece extruded by the extruding member and locks the workpiece at a predetermined position on the workpiece holding means;
Transfer means for moving the workpiece, which has been cut in the second cutting line and divided into chips, in the Y-axis direction;
A high-pressure liquid injection type cutting device comprising:   2. The high-pressure liquid jet according to claim 1, further comprising alignment means for aligning the workpiece divided into chips moved by the transfer means on the workpiece holding means. Type cutting device.   3. The pressing member according to claim 1, further comprising: a pressing member that presses the workpiece abutted against the abutting member from above on the workpiece holding means. The high-pressure liquid injection type cutting device as described. A high-pressure liquid injection cutting method in the high-pressure liquid injection cutting device according to claim 1, wherein:
(1) After cutting the first cutting line group, the work piece placed on the work piece holding means is pushed out in the X-axis direction by the push-out means and abutted against the abutting member. , And sandwiching the workpiece by the pushing means and the abutting member;
(2) The second cutting line at the position closest to the abutting member in the second cutting line group of the workpiece is cut by the high-pressure liquid ejected from the high-pressure liquid ejecting means. , Dividing the workpiece into chips by one row in the Y-axis direction;
(3) a step of moving the workpieces divided into chips for one row in the Y-axis direction by the transfer means;
(4) repeating the steps (1) to (3) until all the second cutting lines are cut;
A high-pressure liquid jet cutting method characterized by comprising: The high-pressure liquid jet cutting apparatus further includes an aligning unit that aligns the workpieces divided into chips for one row moved by the transfer unit on the workpiece holding unit;
The high-pressure liquid jet cutting method is at least prior to the step (3),
By the alignment means, the whole work piece divided into one or more rows of chips already moved by the transfer means is moved in the X-axis direction, and the work divided into one row of chips is processed. Forming a space capable of accommodating an object;
Further including
In the step (3),
5. The high-pressure liquid injection cutting method according to claim 4, wherein the workpieces divided into chips in one row are moved in the Y-axis direction by the transfer unit and are accommodated in the space. . The high-pressure liquid injection type cutting device further includes a pressing member that presses the workpiece abutted against the abutting member on the workpiece holding means from above.
In the high-pressure liquid injection cutting method, after the step (1),
Pressing the workpiece from above by the pressing member between the position at which the workpiece contacts the butting member and the second cutting line at the position closest to the butting member;
The high-pressure liquid injection cutting method according to claim 4, further comprising: The workpiece has a substantially rectangular shape, and the pair of opposing edges of the workpiece are substantially parallel to the second cutting line group and are closest to the edges. 7. The molding process according to claim 4, wherein the processing is performed such that a distance from the two cutting lines to the edge is substantially the same as an interval between the plurality of second cutting lines. The high-pressure liquid jet cutting method described.

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