JP2005230994A - Water jet machining method and protection member for workpiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a water jet machining method by which the form of a workpiece can be maintained even if the workpiece is divided into individual chips by water jet cutting, and a protection member for a workpiece. <P>SOLUTION: In the water jet machining method, the workpiece is cut along the scheduled dividing line by injecting machining water mixed with abrasive grains along a prescribed scheduled dividing line to the workpiece held to a workpiece holding table. The method includes a protection member mounting step, in which protection sheets 112, 113 of the protection member 11 composed of a reinforcing member 111 formed into a net shape and a protection sheet mounted on the surface of the reinforcing member are stuck to the workpiece, a workpiece holding step, in which the protection member side of the workpiece stuck to the protection member is held on the workpiece holding table, and a cutting step, in which the machining water is injected along the scheduled dividing line of the workpiece held on the workpiece holding table and the workpiece is cut along the scheduled dividing line. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a water jet machining method for cutting a plate-like workpiece such as a semiconductor wafer by jetting a high-pressure water jet, and a workpiece protection member.

In the semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and each region where the circuits are formed is defined on a predetermined street. Individual semiconductor chips are manufactured by dicing along a cutting line. The semiconductor chip thus divided is packaged and widely used in electric devices such as mobile phones and personal computers.
Electric devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology that can reduce the size of a semiconductor chip package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-Lead Package (QFN) has been put into practical use. The package technology called QFN is a method in which a plurality of semiconductor chips are formed on a metal plate such as a copper plate in which a plurality of connection terminals corresponding to the connection terminals of the semiconductor chip are formed and streets partitioned for each semiconductor chip are formed in a lattice shape. Are arranged in a matrix, and the CSP substrate is formed by integrating the metal plate and the semiconductor chip by a resin portion obtained by molding resin from the back side of the semiconductor chip. The CSP substrate is cut along the streets to divide into individually packaged chip size packages (CSP).

  The CSP substrate is generally cut by a precision cutting device called a dicing device. The dicing apparatus includes a cutting blade having an annular abrasive grain layer, and the CSP substrate is cut along the street by rotating the cutting blade and moving relatively along the street of the CSP substrate. Divide into chip size packages (CSP). However, when the CSP substrate is cut with a cutting blade, there is a problem that burrs are generated in the connection terminals, and the adjacent connection terminals are short-circuited to deteriorate the quality and reliability of the chip size package (CSP).

In addition, when a workpiece such as a semiconductor wafer is cut with a cutting blade, not only a CSP substrate, there is a problem that fine cutting waste adheres to the surface of the workpiece and is contaminated.
As a cutting technique to solve such problems in cutting with a cutting blade, high-pressure processing water in which abrasive particles such as silica, garnet, diamond, etc. are mixed into the workpiece held by the workpiece holding mechanism is sprayed from the nozzle. A water jet cutting process for cutting a workpiece is proposed. (For example, refer to Patent Document 1.)
JP 2002-205298 A

  Thus, even if the above-described water jet cutting process is performed in a state where the protective tape is attached to the back surface of the workpiece such as the CSP substrate, the protective tape is also cut together with the workpiece. There is a problem that it becomes difficult to carry out subsequent conveyance.

  The present invention has been made in view of the above facts, and its main technical problem is to maintain the form of the workpiece even when the workpiece is cut into water chips by cutting with water jet. It is to provide a water jet machining method and a workpiece protection member.

In order to solve the above-mentioned main technical problem, according to the present invention, a workpiece is injected by spraying machining water mixed with abrasive grains along a predetermined division line on the workpiece held by the workpiece holding table. Is a water jet processing method of cutting along a line to be divided,
A protective member attaching step for attaching the protective sheet of a protective member comprising a reinforcing member formed in a net shape and a protective sheet attached to the surface of the reinforcing member to a workpiece;
A workpiece holding step of holding the workpiece stuck to the protection member on the workpiece holding table on the workpiece holding table;
A cutting step of injecting machining water along a planned division line of the workpiece held on the workpiece holding table, and cutting the workpiece along the planned division line.
A water jet machining method is provided.

Moreover, according to the present invention, the protective member is attached to a workpiece,
It consists of a reinforcing member formed in a net-like shape and a protective sheet attached to the surface of the reinforcing member, and a workpiece is adhered to the protective sheet.
A workpiece protection member is provided.

  The reinforcing member is formed in a net shape by fine metal wires.

  According to the present invention, even if the workpiece is cut by water jet and divided into individual chips, the reinforcing member formed in a mesh shape that constitutes the protective member attached to the workpiece is not cut. Therefore, since the form of a to-be-processed object is maintained, conveyance becomes easy.

  Hereinafter, preferred embodiments of a water jet machining method and a workpiece support member according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a main part of a water jet machining apparatus for carrying out the water jet machining method according to the present invention. The water jet machining apparatus shown in FIG. 1 includes a stationary base 2, a first movable base 3, a second possible base 4, and a third movable base 5. A pair of guide rails 21, 21 extending in parallel along the direction indicated by the arrow X is provided on the side surface on the near side of the stationary base 2.

  The first movable base 3 is slidably fitted to a pair of guide rails 21 and 21 provided on the stationary base 2 and formed in the direction indicated by the arrow X on one side surface facing the stationary base 2. A pair of guided grooves 31 and 31 are provided, and a pair of guide rails 32 and 32 provided on the other side surface and extending parallel to the direction indicated by the arrow Z are provided. The first movable base 3 configured as described above is fitted in the direction indicated by the arrow X on the stationary base 2 by fitting the pair of guided grooves 31 and 31 to the pair of guide rails 21 and 21. It is supported movably. The water jet machining apparatus in the illustrated embodiment is a first for moving the first movable base 3 in the direction indicated by the arrow X along the pair of guide rails 21, 21 provided on the stationary base 2. The moving means 30 is provided. The first moving means 30 includes a male screw rod 301 disposed between the pair of guide rails 21 and 21 in parallel with the guide rail, and a pulse motor 302 for driving the male screw rod 301 to rotate. It is out. The male screw rod 301 is screwed into the female screw 33 provided on the first movable base 3, and one end of the male screw rod 301 is rotatably supported by a bearing member 303 provided on the stationary base 2. The pulse motor 302 has a drive shaft connected to the other end of the male screw rod 301, and drives the male screw rod 301 to rotate forward and reverse, thereby causing the first movable base 3 to be paired with the stationary base 2. It is moved along the guide rails 21 and 21 in the direction indicated by the arrow X.

  The second movable base 4 includes a pair of guide rails 32 formed on the first movable base 3 and formed in a direction indicated by an arrow Z on one side surface facing the first movable base 3. A pair of guided grooves 41, 41 slidably fitted to 32, and a pair of guide rails 42 provided on a side surface perpendicular to the one side surface and extending parallel to the direction indicated by arrow Y , 42 are provided. The second movable base 4 configured in this way is fitted with the pair of guided grooves 41, 41 into the pair of guide rails 32, 32, so that the first movable base 3 is indicated by an arrow Z. It is supported so as to be movable in the direction shown. The water jet machining apparatus in the illustrated embodiment moves the second movable base 4 along the pair of guide rails 32, 32 provided on the first movable base 3 in the direction indicated by the arrow Z. The second moving means 40 is provided. The second moving means 40 includes a male screw rod 401 disposed between the pair of guide rails 32 and 32 in parallel with the guide rail, and a pulse motor 402 for driving the male screw rod 401 to rotate. It is out. The male screw rod 401 is screwed into the female screw 43 provided on the second movable base 4, and one end of the male screw rod 401 is rotatably supported by a bearing member 403 provided on the first movable base 3. Yes. The drive shaft of the pulse motor 402 is connected to the other end of the male screw rod 401, and the second movable base 4 is provided on the first movable base 3 by driving the male screw rod 401 to rotate forward and backward. It is moved along the pair of guide rails 32, 32 in the direction indicated by the arrow Z.

  The third movable base 5 is formed in a direction indicated by an arrow Y on one side surface facing the second movable base 4 and is provided with a pair of guide rails 42 provided on the second movable base 4. , 42 are slidably fitted into the guide grooves 51, 51 (only one of the upper grooves is shown in FIG. 1). By being fitted to the guide rails 42, 42, the second movable base 4 is supported so as to be movable in the direction indicated by the arrow Y. In the illustrated embodiment, the water jet machining apparatus moves the third movable base 5 in the direction indicated by the arrow Y along the pair of guide rails 42 and 42 provided on the second movable base 4. The third moving means 50 is provided. The third moving means 50 includes a male screw rod 501 disposed between the pair of guide rails 42 and 42 in parallel with the guide rail, and a pulse motor 502 for driving the male screw rod 501 to rotate. It is out. The male screw rod 501 is screwed into a female screw (not shown) provided on the third movable base 5, and one end of the male screw rod 501 is rotatable to a bearing member 503 provided on the second movable base 4. It is supported by. The drive shaft of the pulse motor 502 is connected to the other end of the male screw rod 501, and the third movable base 5 is provided on the third movable base 4 by driving the male screw rod 501 forward and backward. It is moved along the pair of guide rails 42, 42 in the direction indicated by the arrow Y.

  On the other surface of the third movable base 5, a workpiece holding table 6 extending in the direction indicated by the arrow X is mounted. The workpiece holding table 6 is formed with a rectangular opening 61, and four positioning pins 62 project from the upper surface around the opening 61. The water jet processing apparatus in the illustrated embodiment includes a water tank 60 that is disposed below the workpiece holding table 6 and stores water for buffering a water jet described later.

  Above the workpiece holding table 6 described above, a nozzle 7 having an outlet having a diameter of about 200 μm for injecting a water jet onto the workpiece held on the workpiece holding table 6 is disposed. Is done. The nozzle 7 is attached to a nozzle support member 8 fixed to the stationary base 2, and processing water mixed with abrasive grains is supplied by a processing water supply means described later.

Next, processing water supply means for supplying processing water mixed with abrasive grains to the nozzle 7 will be described with reference to FIG.
The processing water supply unit 9 shown in FIG. 2 includes a water tank 91, a high-pressure water generation unit 92, a processing water storage unit 93, and a processing water delivery unit 94. The water tank 91 contains fresh water such as tap water or pure water. The high-pressure water generating unit 92 boosts the water supplied from the water tank 91 to 50 to 100 megapascals (MPa), and supplies it to the processed water delivery unit 94.

  The processing water storage unit 93 includes a processing water storage tank 931 and a pressurizing unit 932 that pressurizes the processing water stored in the processing water storage tank 931. The processed water storage tank 931 contains processed water in which fine abrasive grains such as silica, garnet, and diamond are mixed. The pressurizing means 932 is disposed in the air pump 933, a pressure pipe 934 that communicates the air pump 933 and the air inlet formed in the upper wall of the processing water storage tank 931, and the pressure pipe 934. The electromagnetic switching valve 935 is provided.

  The processed water delivery means 94 includes a first processed water delivery means 94a and a second processed water delivery means 94b in the illustrated embodiment. The first processed water delivery means 94a and the second processed water delivery means 94b are respectively slid into the first cylinder 941a and the second cylinder 941b, and the first cylinder 941a and the second cylinder 941b, respectively. A first piston 944a and a second piston 944b that are arranged in a cylinder and divide the cylinder into first chambers 942a and 942b and second chambers 943a and 943b are provided. Instead of the first piston 944a and the second piston 944b, a diaphragm that divides the inside of the cylinder into a first chamber and a second chamber may be used. That is, the piston or diaphragm that divides the inside of the cylinder into the first chamber and the second chamber functions as a partition member that divides the inside of the cylinder into the first chamber and the second chamber and can be displaced by the pressure of the two chambers. To do.

  The first chambers 942a and 942b of the first cylinder 941a and the second cylinder 941b constituting the first processed water delivery means 94a and the second processed water delivery means 94b are respectively connected via high-pressure pipes 951a and 951b. The high-pressure water generating means 92 is communicated. Electromagnetic switching valves 961a and 961b are disposed in the high-pressure pipes 951a and 951b, respectively. The first chambers 942a and 942b of the first cylinder 941a and the second cylinder 941b are communicated with the drainage means 97, respectively. The drainage means 97 is disposed in a vacuum pump 971 as a suction means, drainage pipes 972a and 972b communicating with the vacuum pump 971 and the first chambers 942a and 942b, and drainage pipes 972a and 972b, respectively. The electromagnetic switching valves 973a and 973b.

  The second chambers 943a and 943b of the first cylinder 941a and the second cylinder 941b constituting the first processed water delivery means 94a and the second processed water delivery means 94b are respectively introduced through introduction pipes 952a and 952b. The processing water storage tank 931 is in communication. Electromagnetic switching valves 962a and 962b are disposed in the introduction pipes 952a and 952b, respectively. The second chambers 943a and 943b of the first cylinder 941a and the second cylinder 941b communicate with the nozzle 7 via delivery pipes 953a and 953b, respectively. Electromagnetic switching valves 963a and 963b are disposed in the delivery pipes 953a and 953b, respectively.

The processing water supply means 9 shown in FIG. 2 is configured as described above, and the operation thereof will be described below.
At the start of the operation of the processing water supply means 9, the high-pressure water generating means 92, the vacuum pump 971 and the air pump 933 are operated, and all the electromagnetic switching valves are deenergized (OFF) as shown in FIG. To operate the first processed water delivery means 94a from the state shown in FIG. 2, the electromagnetic switching valve 973a of the draining means 97 is energized (ON) and the electromagnetic switching valve 962a is energized (ON). As a result, the high-pressure water in the first chamber 942a of the first cylinder 941a is sucked into the vacuum pump 971 through the drain pipe 972a and the electromagnetic switching valve 973a, and the processing water in the processing water storage tank 931 is introduced into the introduction pipe 952a. And the electromagnetic switching valve 962a is introduced into the second chamber 943a of the first cylinder 941a, and the first piston 944a is moved upward in FIG. When the first piston 944a moves to the upper position indicated by the two-dot chain line in FIG. 2, the electromagnetic switching valve 973a and the electromagnetic switching valve 962a are deenergized (OFF). Next, the electromagnetic switching valve 963a is energized (ON) and the electromagnetic switching valve 961a is energized (ON). Accordingly, the high-pressure water generated by the high-pressure water generating means 92 is introduced into the first chamber 942a of the first cylinder 941a through the high-pressure pipe 951a and the electromagnetic switching valve 961a, and the first piston 944a moves downward in FIG. Press as much as possible. As a result, the processing water in the second chamber 943a of the first cylinder 941a is introduced into the nozzle through the delivery pipe 953a and the electromagnetic switching valve 963a, and is jetted as a water jet. When the first piston 944a of the first cylinder 941a reaches the lower position shown by the solid line in FIG. 2, the electromagnetic switching valve 961a is deenergized (OFF) and the electromagnetic switching valve 963a is deenergized (OFF). As a result, the state shown in FIG. 2 is restored.

Next, the operation of the second processed water delivery means 94b will be described.
In the state shown in FIG. 2, the second piston 944b constituting the second processed water delivery means 94b moves to an upper position indicated by a solid line, and the processed water is introduced into the second chamber 943a of the second cylinder 941b. It is in the state. From this state, when the electromagnetic switching valve 963b is energized (ON) and the electromagnetic switching valve 961b is energized (ON), the high-pressure water generated by the high-pressure water generating unit 92 passes through the high-pressure pipe 951b and the electromagnetic switching valve 961b. The cylinder 941b is introduced into the first chamber 942b, and the piston 944b presses to move downward in FIG. As a result, the processing water in the second chamber 943b of the second cylinder 941b is introduced into the nozzle 7 through the delivery pipe 953b and the electromagnetic switching valve 963b, and is ejected as a water jet. When the piston 944b of the second cylinder 941b reaches the lower position indicated by a two-dot chain line in FIG. 2, the electromagnetic switching valve 961b is deenergized (OFF) and the electromagnetic switching valve 963b is deenergized (OFF). Next, when the electromagnetic switching valve 973b is energized (ON) and the electromagnetic switching valve 962b is energized (ON), the high-pressure water in the first chamber 942b of the second cylinder 941b is discharged into the drain pipe 972b and the electromagnetic switching valve 973b. 2, the processing water in the processing water storage tank 931 is introduced into the second chamber 943b of the second cylinder 941b through the introduction pipe 952b and the electromagnetic switching valve 962b, and the piston 944b is shown in FIG. After being moved upward, the state shown in FIG. 2 is restored.

  By alternately operating the first processed water delivery means 94 a and the second processed water delivery means 94 b described above, the processed water can be continuously ejected from the nozzle 7. The first processing water delivery means 94a and the second processing water delivery means 94b for delivering the processing water to the nozzle 7 are in operation when the first chamber 942a, the second chamber 943a, and the second chamber 942a of the first cylinder 941a are operated. Since the first chamber 942b and the second chamber 943b of the cylinder 941b have substantially the same pressure and no pressure difference is generated, the processing water in the second chamber 943a and the second chamber 943b is transferred to the first chamber 942a and the first chamber 943b. No entry into the chamber 942b side. Therefore, wear of the cylinder walls of the first cylinder 941a and the second cylinder 941b and the first piston 944a and the second piston 944b due to the abrasive particles mixed in the processing water is reduced.

  In the illustrated embodiment, an example is shown in which a vacuum pump 971 as a suction unit is provided in the drainage unit 97 and a pressurizing unit 932 that pressurizes the processing water stored in the processing water storage tank 931 is provided. However, either one of the vacuum pump 971 and the pressurizing means 932 may be used. For example, when the vacuum pump 971 is provided and the pressurizing means 932 is not provided, the processed water storage tank 931 is opened to the atmosphere. In this case, the electromagnetic switching valve 962a disposed in the introduction pipes 952a and 952b that communicates the processing water storage tank 931 with the second chamber 943a of the first Linder 941a and the second chamber 943b of the second Linder 941b. And 962b may be check valves that allow flow from the processing water storage tank 931 side to the first and second Linders 941a and 941b but block flow in the reverse direction. On the other hand, when the pressurizing means 932 is provided and the vacuum pump 971 is not provided, the vacuum pump 971 side is opened to the atmosphere from the electromagnetic switching valves 973a and 973b in the drain pipes 972a and 972b.

Next, a CSP substrate as a workpiece to be cut by the above-described water jet machining apparatus will be described with reference to FIG.
The CSP substrate 10 shown in FIG. 3 is divided into, for example, three blocks 10a, 10b, and 10c and is formed continuously. In the three blocks 10a, 10b, and 10c constituting the CSP substrate 10, a plurality of streets 101 are formed in a lattice shape, and chip size packages (CSPs) 102 are respectively arranged in a plurality of sections by the streets 101. Yes. The CSP substrate 10 formed in this way is divided into chip size packages (CSPs) cut along the streets 101 and individually packaged.

  When the CSP board 10 described above is cut along the street 101, a protective member is attached to the CSP board 10. FIG. 4 shows an embodiment of the protection member 11, FIG. 4A shows an exploded perspective view of components constituting the protection member 11, and FIG. 4B shows the protection member 11. A perspective view is shown. The protective member 11 shown in FIG. 4 includes a reinforcing member 111 formed in a net shape, a protective sheet 112 attached to the upper surface of the reinforcing member 111, and a protective sheet 113 attached to the lower surface of the reinforcing member 111. It is made up of. The reinforcing member 111 is formed in a net shape by a thin metal wire such as a piano wire having a diameter of about 0.1 to 0.5 mm. The protective sheet 112 is a double-sided adhesive sheet in which acrylic resin glue is applied to both sides of a resin sheet such as polyethylene terephthalate or polyvinyl chloride having a thickness of 0.1 to 0.2 mm. Is bonded to the upper surface of the reinforcing member 111. The protective sheet 113 is composed of a single-sided adhesive sheet in which acrylic resin glue is applied to the upper surface in the figure of a resin sheet such as polyethylene terephthalate or polyvinyl chloride having a thickness of 0.1 to 0.2 mm. The upper surface is bonded to the lower surface of the reinforcing member 111, and the reinforcing member 111 is sandwiched between the protective sheet 112 and the protective sheet 112. Note that the protective sheet 113 is not necessarily required as long as the adhesion between the protective sheet 112 and the reinforcing member 111 is strong. As shown in FIG. 5, the back surface of the CSP substrate 10 is attached to the upper surface of the protective sheet 112 of the protective member 11 thus configured (protective member mounting step).

  As described above, the CSP substrate 10 attached to the protective member 11 is held by the workpiece holding jig 12 shown in FIG. 6 and held on the workpiece holding table 6 of the water jet machining apparatus. A workpiece holding jig 12 shown in FIG. 6 includes a lower clamping plate 13 and an upper clamping plate 14, and one side of each is hinged to each other by two hinges 15 and 15. The lower clamping plate 13 and the upper clamping plate 14 are provided with openings 131 and 141, respectively. The openings 131 and 141 are similar in shape to the CSP substrate 10 and have a slightly smaller size than the CSP substrate 10. A step 131 a corresponding to the thickness of the CSP substrate 10 and the protection member 11 is provided from the upper surface of the lower clamping plate 13 around the opening 131 of the lower clamping plate 13, and accommodates the CSP substrate 10. To do. Further, the lower clamping plate 13 is provided with four pin holes 132 around the opening 131 for fitting with the four positioning pins 62 disposed on the workpiece holding table 6. An engaging piece 16 for locking is attached to the other side of the upper holding plate 14, and an engaging recess 133 is provided on the other side of the lower holding plate 13 to engage the engaging piece.

  In order to cut the CSP substrate 10 along the street 101, first, the CSP substrate 10 attached to the protective member 11 on the step 131a formed on the lower holding plate 13 of the workpiece holding jig 12 is used. The protection member 11 side is placed, the upper clamping plate 14 is overlapped, and the engagement piece 16 is engaged with the engagement recess 133. The workpiece holding jig 12 holding the CSP substrate 10 between the lower clamping plate 13 and the upper clamping plate 14 is placed on the workpiece holding table 6 of the water jet machining apparatus shown in FIG. At this time, the four pin holes 132 provided in the lower holding plate 13 are engaged with the four positioning pins 62 provided in the workpiece holding table 6, thereby holding the CSP substrate 10. The object holding jig 12 is held at a predetermined position of the workpiece holding table 6.

  When the workpiece holding jig 12 holding the CSP substrate 10 is held at a predetermined position of the workpiece holding table 6 in the water jet machining apparatus, the first moving means 30 and the third moving means 50 are operated. Then, the first movable base 3 and the third movable base 5 are moved in the directions indicated by the arrows X and Y, and the CSP substrate 10 held on the workpiece holding table 6 is moved below the nozzle 7. Move to a certain processing area. Then, as shown in FIG. 7A, the nozzle 7 is aligned with the leftmost street 101 in the left block 10c forming the CSP substrate 10. Then, the second moving means 40 is operated to move the second movable base 4 in the direction indicated by the arrow Z, and the nozzle 7 is placed above the surface of the CSP substrate 10 at a predetermined interval (for example, 50 μm). Position it at the specified position.

  Next, the processing water supply means 6 is operated as described above to inject the processing water mixed with abrasive grains from the nozzle 7 and the third moving means 50 and the first moving means 30 are operated to operate the first. 3 and the first movable base 3 are sequentially moved in the directions indicated by the arrows Y and X so that the workpiece holding table 6, that is, the CSP substrate 10 is moved along the street 101 with respect to the nozzle 7. 7A, the CSP substrate 10 and the nozzle 7 are moved relative to each other in the direction of the arrow Y and the direction of the arrow X as indicated by the arrow A in FIG. 7B. In this movement, data such as intervals and lengths of the streets 101 are stored in advance in the memory of the control means (not shown), and the control means (not shown) based on the stored data is used for the third movement means 50. And by controlling the first moving means 30. As a result, the block 10c forming the CSP substrate 10 is cut along the street 101 as shown by a one-dot chain line in FIG. 7 (first cutting step). At the time of this cutting, the protective sheets 112 and 113 of the protective member 11 adhered to the CSP substrate 10 are penetrated, but the reinforcing member 111 is not cut because it is formed in a net shape with fine metal wires. At the time of cutting, the water jet penetrates the CSP substrate 10 and the protection member 11, but the momentum of the water jet after cutting is relieved by buffering water stored in the water tank 60.

  When the CSP substrate 10 is cut as shown by a one-dot chain line in FIG. 7A, the first moving base 3 and the third moving base 3 and the third moving base 50 are operated by operating the first moving means 30 and the third moving means 50. The movable base 5 is moved in the direction indicated by the arrow X and the arrow Y, and as shown in FIG. 8A, the leftmost block 10c in the left block 10c in which the CSP substrate 10 is formed immediately below the nozzle 7 again. Position street 101. Then, the processing water supply means 6 is operated as described above to inject the processing water mixed with abrasive grains from the nozzle 7 and the first moving means 30 and the third moving means 50 are operated to operate the first. By sequentially moving the movable base 3 and the third movable base 5 in the directions indicated by the arrows X and Y, the workpiece holding table 6 and thus the CSP substrate 10 is moved along the street 101 with respect to the nozzle 7. 8A, the CSP substrate 10 and the nozzle 7 are sequentially moved relative to each other in the direction of the arrow X and the direction of the arrow Y as indicated by the arrow B in FIG. 8B. As a result, 10c forming the CSP substrate 10 is cut along the street 101 as shown by a two-dot chain line in FIG. 8A (second cutting step). At the time of this cutting, the protective sheets 112 and 113 of the protective member 11 adhered to the CSP substrate 10 are penetrated, but the reinforcing member 111 is not cut because it is formed in a net shape with fine metal wires.

  As described above, the block 10c for forming the CSP substrate 10 by performing the first cutting step and the second cutting step is shown in FIG. 7A and FIG. It is cut along the street 101 as indicated by a chain line and divided into individual chip size packages (CSP). When the first cutting step and the second cutting step are performed on the block 10c forming the CSP substrate 10 in this manner, the first cutting step is similarly performed on the block 10b and the block 10a forming the CSP substrate 10. By performing the cutting process and the second cutting process, the block 10 b and the block 10 a are also cut along the street 101 and divided into individual chip size packages (CSP) 102. In addition, since the reinforcing member 111 of the protective member 11 attached to the CSP substrate 10 is not cut as described above, the CSP substrate 10 is divided into individual chip size packages (CSPs), so that the shape of the substrate is maintained. Transport becomes easy.

The principal part perspective view of the water-jet processing apparatus comprised according to this invention. FIG. The fluid circuit diagram of the process water supply means with which the water jet processing apparatus shown in FIG. 1 is equipped. The perspective view of the CSP board | substrate as a to-be-processed object. The perspective view of the protection member with which the CSP board | substrate as a to-be-processed object is mounted | worn. The perspective view which shows the state which mounted | wore the protection member to the CSP board | substrate as a to-be-processed object. The perspective view of the workpiece holding jig for hold | maintaining the CSP board | substrate as a workpiece mounted with the protection member, and mounting on the workpiece holding table of a water jet processing apparatus. Explanatory drawing of the 1st cutting process which cut | disconnects the CSP board | substrate as a to-be-processed object with the water jet processing apparatus shown in FIG. Explanatory drawing of the 2nd cutting process which cut | disconnects the CSP board | substrate as a to-be-processed object with the water jet processing apparatus shown in FIG.

Explanation of symbols

2: stationary base 21: guide rail 3: first movable base 30: first moving means 31: guided groove 32: guide rail 30: first moving means 4: second possible base 40: Second moving means 41: Guided groove 42: Guide rail 5: Third movable base 50: Third moving means 51: Guided groove 52: Guide rail 6: Workpiece holding table 61: Opening 62: Positioning pin 60: Water tank 7: Nozzle 8: Nozzle support member 9: Processing water supply means 91: Water tank 92: High pressure water generation means 93: Processing water storage means 931: Processing water storage tank 932: Pressurization means 933: Air pump 94: Processing water delivery means 94a: First processing water delivery means 941a: First cylinder 944a: First piston 94b: Second processing water delivery means 941b: Second cylinder 944b: First piston 10: CSP substrate (workpiece)
11: Protection member 111: Reinforcement member 112: Protection sheet 113: Protection sheet 12: Workpiece holding jig

Claims (3)

This is a water jet machining method in which machining water in which abrasive grains are mixed along a predetermined division line is sprayed onto the workpiece held on the workpiece holding table to cut the workpiece along the division line. And
A protective member attaching step for attaching the protective sheet of a protective member comprising a reinforcing member formed in a net shape and a protective sheet attached to the surface of the reinforcing member to a workpiece;
A workpiece holding step of holding the workpiece stuck to the protection member on the workpiece holding table on the workpiece holding table;
A cutting step of injecting machining water along a planned division line of the workpiece held on the workpiece holding table, and cutting the workpiece along the planned division line.
The water jet processing method characterized by the above-mentioned. A protective member to be adhered to a workpiece,
It consists of a reinforcing member formed in a net-like shape and a protective sheet attached to the surface of the reinforcing member, and a workpiece is adhered to the protective sheet.
A workpiece protection member characterized by the above.   The workpiece reinforcing member according to claim 2, wherein the reinforcing member is formed in a net shape by fine metal wires.

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