JP2012099719A - Bump coining head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bump coining head that facilitates the parallel adjustment of a bump press jig of the bump coining head and a surface of an electronic component.SOLUTION: A bump coining head 1 that presses the apex of a bump 6 of an electronic component 5 held by a substrate holding base 90 includes: attachment members 10 and 20; a bump press jig 80; and an angle adjustment member that adjusts the angle of a bottom surface of the bump press jig. The angle adjustment member includes: an upper plate 30; a lower plate 70 located in the lower part of the upper plate; a lower part holding member 83 for the attachment of the bump press jig; and an angle holding member 76 that is for the attachment of the upper plate 10 and the lower plate 70, rotatably holds the lower plate 70 with respect to the upper plate 10 by a specific angle by holding the center of the lower plate 70, and maintains an angle obtained when the substrate holding base 90 by which an electronic component 5 is held is located to be parallel to a bottom surface 81 of the bump press jig 80.

Description

  The present invention is attached to the tip of a bump flattening device that forms a top surface of a plurality of bumps formed on the surface of an electronic component such as a substrate, a chip capacitor, and an IC chip on a flat surface. The present invention relates to a bump coining head that presses the top of a bump of an electronic component held on a holding table.

On the surface of an electronic component such as a substrate, a chip capacitor, or an IC chip, bumps raised from the surface of the electronic component are formed by solder or gold as terminals for electrical connection.
The bumps formed of such solder or gold are connected to the connection terminals formed on the electronic component which is the other component to be connected. To ensure this connection, the top of the bump is flattened. To be done.

  For example, as shown in FIG. 18, a wiring board 105 on which a plurality of bumps 106 are formed is held on a board holding stand 190, and a bump press jig 180 heated to 140 to 170 ° C. from above is pressed to make a bump press. There is one that flattens the top of the bump 106 with the lower surface 181 of the jig 180 (see, for example, Patent Document 1).

  Further, as shown in FIG. 19, the wiring board 205 on which the plurality of bumps 206 are formed is held on the board holding table 290, and the bump press jig 280 is pressed from above, so that ultrasonic vibration is applied to the height of the bumps 206. In some cases, the top of the bump 206 is flattened by the lower surface 281 of the bump press jig 280 in a direction parallel to the direction (see, for example, Patent Document 1).

However, in order to increase the production efficiency, when the tops of a large number of bumps formed on the surface of the electronic component are formed on a flat surface, a large number of bumps are pressed at once, but the press is It must be uniform.
In other words, if the pressing force is uneven, the height and size of the flat surface of the bump differs depending on the location of one electronic component, resulting in non-uniformity and insufficient connection with the counterpart component.

In particular, in the bump press jig of the bump coining head that presses the top of the bump, when the lower surface is not parallel to the surface of the electronic component held on the substrate holder, the flat surface of the pressed bump is uneven. Will occur.
Since the width of the electronic component is 20 to 50 mm × 20 to 50 mm, and the height of the bump is usually about 20 to 100 μm, this parallelism is required to be adjusted very precisely.

  In addition, the height and size of the electronic parts that are pressed against the top of the bumps are various, and each time the bump press jig of the bump coining head is replaced, the bump press jig and the surface of the electronic part can be adjusted in parallel. This adjustment took a long time, and improvement was demanded from the viewpoint of production efficiency.

JP 2003-218161 A JP 2002-270630 A

  Accordingly, the present invention is to provide a bump coining head in which the bump press jig of the bump coining head and the surface of the electronic component can be easily adjusted in parallel.

In order to solve the above-mentioned problems, the present invention of claim 1 is attached to the tip of a bump flattening device for forming the tops of a plurality of bumps formed on the surface of an electronic component on a flat surface, and is attached to a substrate holder. A bump coining head that presses the top of a bump of a held electronic component,
The bump coining head has an attachment member for attaching the bump coining head to the bump flattening device, a bump press jig that contacts the top of the bump of the electronic component, and an angle adjustment member that adjusts the angle of the lower surface of the bump press jig,
The angle adjustment member attaches the upper plate attached to the lower surface of the attachment member, the lower plate located at the lower part of the upper plate, the lower holding member for attaching the bump press jig to the lower surface of the lower plate, the upper plate and the lower plate, Holds the center of the lower plate and holds it at a predetermined angle with respect to the upper plate, and maintains the angle when the substrate holding table holding the electronic components and the lower surface of the bump press jig are positioned in parallel. A bump coining head having an angle holding member.

  In the first aspect of the present invention, the bump coining head includes an attachment member attached to the bump flattening device, a bump press jig that contacts the top of the bump of the electronic component, and an angle adjustment that adjusts the angle of the lower surface of the bump press jig. It has a member. For this reason, when the bump coining head is attached to the bump flattening device by the attaching member, the angle between the lower surface of the bump press jig and the electronic component can be precisely made parallel by the angle adjusting member.

  The angle adjustment member includes an upper plate attached to the lower surface of the attachment member, a lower plate positioned below the upper plate, and a lower holding member that attaches the bump press jig to the lower surface of the lower plate. For this reason, the upper plate can be fixed to the bump flattening device by the mounting member, and the bump press jig can be fixed to the lower plate. The attachment member can be manufactured by being divided into a plurality of members.

  Mount the upper plate and the lower plate, hold the center of the lower plate and hold it at a predetermined angle with respect to the upper plate. After mounting the bump coining head on the bump flattening device, tilt the angle of the lower plate. Thus, the angle of the lower surface of the bump press jig can be made parallel to the angle of the surface of the electronic component on which the substrate holder and the bump are formed.

  There is an angle holding member that maintains the angle when the substrate holding table on which the electronic component is held and the lower surface of the bump press jig are positioned in parallel. For this reason, once the angle of the lower surface of the bump press jig is made parallel to the angle of the upper surface of the substrate holding table and the surface of the electronic component on which the bump is formed, the parallelism is maintained and the top of the bump is continuously formed. Can be made a uniform flat surface.

  According to the present invention of claim 2, the angle holding member connects the center of the upper plate and the center of the lower plate with a mounting joint having a ball joint at the tip, and the shaft portion of the mounting joint is screwed to the upper plate, The ball holding portion of the ball joint at the tip of the joint is attached to the lower plate, and the angle between the upper plate and the lower plate is maintained by a bump coining head in which the upper plate and the lower plate are fixed with a plurality of bolts.

  According to the second aspect of the present invention, since the angle holding member connects the center of the upper plate and the center of the lower plate with a mounting joint having a ball joint at the tip, the center of the lower plate is formed by the ball joint attached to the upper plate. With the center of rotation, the angle of the lower plate can be tilted in either the front, rear, left or right direction.

Since the shaft portion of the mounting joint is screwed to the upper plate, and the ball holding portion of the ball joint at the tip of the mounting joint is mounted to the lower plate, the mounting joint is fixed to the upper plate, and the lower plate is fixed to the ball holding portion. It is fixed and the inclination angle can be freely set with respect to the upper plate.
The angle between the upper plate and the lower plate is maintained by fixing the upper plate and the lower plate with a plurality of bolts. By screwing a plurality of bolts, the angle of the lower plate is firmly fixed at an arbitrary angle. The angle with the electronic component can be maintained.

According to the third aspect of the present invention, at least one of the lower surface of the upper plate and the upper surface of the lower plate is formed in an inclined shape so as to gradually narrow the distance between the upper plate and the lower plate. In addition, an intermediate plate is provided, and an intermediate plate central hole is formed at the center of the intermediate plate.
A plurality of intermediate plate sliding recesses are formed radially outwardly around the center plate center hole. The intermediate plate sliding recess has a ball inside and the upper and lower surfaces abut against the upper and lower plates, respectively. A ball retainer having a flat surface is slidably inserted, and the ball retainer is biased toward the center of the intermediate plate,
A guide plate is rotatably inserted into the middle plate center hole, and the guide plate is located at a position corresponding to the same number of the middle plate sliding recesses, and the guide plate recess between the guide plate projections. The bump coining head is formed in such a manner that the ball retainer can be brought into contact with the guide plate protrusion and the guide plate recess sequentially by the rotation of the guide plate.

  According to the third aspect of the present invention, an intermediate plate is provided between the upper plate and the lower plate, and an intermediate plate central hole is formed at the center of the intermediate plate. For this reason, members, such as an attachment joint and a guide plate which hold | maintain an upper plate and a lower plate in the center of an intermediate | middle plate, can be provided. In addition, the guide plate can be rotatably provided.

  At least one of the lower surface of the upper plate and the upper surface of the lower plate is formed in a slope shape so as to gradually reduce the distance between the two toward the central direction, and a plurality of radially outwards are formed around the central plate center hole. An intermediate plate sliding recess is formed, and a ball retainer having a ball inside and having a flat surface in which the upper surface and the lower surface are in contact with the upper plate and the lower plate, respectively, is slidably inserted into the intermediate plate sliding recess.

  For this reason, the angle between the upper plate and the lower plate can be adjusted by the sliding position of the ball retainer. That is, when the position of the ball retainer is on the outside in the radial direction, the ball retainer forms a gap with respect to the lower surface of the upper plate and the upper surface of the lower plate, and the lower plate can change the angle with respect to the upper plate. When the ball retainer is positioned on the center side, there is no gap between the lower surface of the upper plate and the upper surface of the lower plate, and the ball retainer can be positioned in a direction that fixes the angle between the upper plate and the lower plate.

  Since the ball retainer is biased toward the center of the intermediate plate, the ball retainer always moves so as to contact the lower surface of the upper plate and the upper surface of the lower plate, so that the ball retainer is positioned between the upper plate and the lower plate. It can be positioned to fix the angle and acts to stop the movement of the lower plate.

  A guide plate is rotatably inserted into the middle plate center hole, and the guide plate is located at a position corresponding to the same number of the middle plate sliding recesses, and the guide plate recess between the guide plate projections. The ball retainer is formed so as to be able to contact the guide plate protrusion and the guide plate recess by the rotation of the guide plate. For this reason, the guide plate protrusion can push the position of the ball retainer radially outward by the rotation of the guide plate, and the ball retainer slides in the center direction along the guide plate recess by the further rotation. A gap can be given.

  According to a fourth aspect of the present invention, the guide plate is a bump coining head in which the slide pin is moved in the circumferential direction to be rotatable.

  In the present invention of claim 4, since the slide pin is attached to the outer peripheral portion of the guide plate and the slide pin is moved in the circumferential direction so that the guide plate can be rotated, the guide plate is rotated by moving the slide pin. The ball retainer is slid to move the ball retainer radially outward, allowing the lower plate to tilt.

  The present invention of claim 5 is a bump coining head in which the upper plate and the lower plate are fixed at the four corners by four bolts and the angle between the lower plate and the electronic component of the lower plate is maintained.

  In the present invention of claim 5, since the upper plate and the lower plate of the upper plate and the lower plate are fixed by the four bolts at the four corners, any one of the four bolts can be screwed in With the angle, the angle of the lower plate is firmly fixed, and the angle of the lower plate with the electronic component can be adjusted and maintained. Since there are four bolts, it is easy to adjust the angle of the lower plate.

  According to a sixth aspect of the present invention, the bolt is a bump coining head into which a white metal washer is inserted.

  In the present invention of claim 6, since the bolt is fitted with a white metal washer, the bolt can be smoothly rotated and can be worn or deformed even when used for a long time. The bolt can be fixed.

  According to a seventh aspect of the present invention, the attachment member is a bump coining head formed of an attachment plate attached to the bump flattening device and a holding block connecting the attachment plate and the upper plate.

  In the present invention of claim 7, since the attachment member is formed from an attachment plate attached to the bump flattening device and a holding block that connects the attachment plate and the upper plate, the attachment plate is formed in a plate shape, and the holding block Is easy to manufacture.

  According to the present invention of claim 8, the ball retainer is a bump coining head formed of spring steel.

  In the present invention of claim 8, since the ball retainer is formed of spring steel, it has elasticity, and by screwing a plurality of bolts, the ball retainer is slightly deformed, and the lower surface of the bump press jig and the substrate A minute angle between the holding base and the electronic components of the lower plate can be adjusted.

The upper plate and lower plate are mounted, and the lower plate is held at a predetermined angle with respect to the upper plate. Therefore, the angle of the lower plate is rotated to change the angle of the lower surface of the bump press jig to the electronic component on which the bump is formed. Can be parallel to the surface angle.
Once the angle of the lower surface of the bump press jig is made parallel to the angle of the surface of the electronic component on which the bump is formed by the angle holding member, the top of the bump is continuously flattened while maintaining the parallelism. It can be a good surface.

  At least one of the lower surface of the upper plate and the upper surface of the lower plate is formed in a slope shape so as to gradually reduce the distance between the two toward the central direction, and a plurality of radially outwards are formed around the central plate center hole. An intermediate plate sliding recess is formed, and in the intermediate plate sliding recess, a ball retainer having a ball inside and having a flat surface in which the upper surface and the lower surface are in contact with the upper plate and the lower plate, respectively, is slidably inserted. The angle between the upper plate and the lower plate can be fixed by the sliding position of the ball retainer.

1, showing an embodiment of the present invention, is a front view showing an overall configuration of a bump coining head. FIG. 1, showing an embodiment of the present invention, is a side view showing the overall configuration of a bump coining head. FIG. FIG. 2 shows an embodiment of the present invention, and is a cross-sectional view taken along line AA in FIG. 1 showing the overall configuration of the bump coining head. 1, showing an embodiment of the present invention, is a bottom view of a bump coining head. FIG. 1, showing an embodiment of the present invention, is a front view of an upper plate used in a bump coining head. FIG. 1, showing an embodiment of the present invention, is a bottom view of an upper plate used in a bump coining head. FIG. 1, showing an embodiment of the present invention, is a side view of an upper plate used in a bump coining head. FIG. 1 shows an embodiment of the present invention, in which a ball retainer and a guide plate are assembled to an intermediate plate used in a bump coining head, and the guide plate protrusion is in contact with the ball retainer in FIG. It is sectional drawing along a line. FIG. 1 shows an embodiment of the present invention, in which a ball retainer and a guide plate are assembled to an intermediate plate used in a bump coining head, and the concave portion of the guide plate is rotated so as to contact the ball retainer. It is sectional drawing along the -B line. 1, showing an embodiment of the present invention, is a plan view of an intermediate plate used in a bump coining head. FIG. 1, showing an embodiment of the present invention, is a side view of an intermediate plate used in a bump coining head. FIG. 1, showing an embodiment of the present invention, is a plan view of a guide plate used in a bump coining head. FIG. 1, showing an embodiment of the present invention, is a side view of a guide plate used in a bump coining head. FIG. 1 is a front view of a ball retainer used in a bump coining head according to an embodiment of the present invention. 1, showing an embodiment of the present invention, is a plan view of a lower plate used in a bump coining head. FIG. 1, showing an embodiment of the present invention, is a front view of a lower plate used in a bump coining head. FIG. 1, showing an embodiment of the present invention, is a sectional view of a lower plate used in a bump coining head. FIG. It is sectional drawing of the conventional bump coining head. It is a front view of the other conventional bump coining head.

An embodiment of the present invention will be described with reference to FIGS.
The bump coining head of the present invention is attached to the tip of a bump flattening device (not shown). The bump flattening device forms the tops of a plurality of bumps formed on the surface of an electronic component on a flat surface.

  On the surface of an electronic component such as a substrate, chip capacitor, or IC chip, which is an electronic substrate, bumps raised from the surface of the electronic component are formed by solder or gold as terminals for electrical connection. This bump is connected to a connection terminal formed on the electronic component that is the other component to be connected. To ensure this connection, the bump flattening device is used to flatten the top of the bump. Is done. A bump coining head is attached to the tip of the bump flattening device and presses the top of the bump of the electronic component.

As shown in FIG. 1, the bump coining head 1 includes a mounting plate 10 for attaching the bump coining head 1 to a bump flattening device, a holding block 20 thereunder, an upper plate 30 attached to the lower part of the holding block 20, A lower plate 70 attached with a gap underneath, an intermediate plate 50 and a guide plate 60 attached between the upper plate 30 and the lower plate 70, a ball retainer 55 connecting the upper plate 30 and the lower plate 70, A bump press jig 80 is attached to the lower surface of the lower plate 70 by a jig holder as a lower holding member. The mounting plate 10 and the holding block 20 constitute a mounting member.
Hereinafter, each component will be described.

  The mounting plate 10 is formed in a flat plate shape, is fixed to the lower surface of the tip of the bump flattening device with mounting pins 11, and the bump flattening device with mounting screws 21 inserted into the mounting plate screw holes 12 together with a holding block 20 to be described later. Mounted on. The entire bump coining head 1 can be moved up and down by a servo motor provided in the bump flattening device. An air cylinder or the like can be used instead of the servo motor.

  A holding block 20 is attached to the lower surface of the mounting plate 10. The upper portion of the holding block 20 is formed with a block upper screw hole 26 into which the mounting screw 21 is inserted, and is positioned so as to communicate with the mounting plate screw hole 12 of the mounting plate 10. 10 is attached to the tip of the bump flattening device. The mounting plate 10 and the holding block 20 which are mounting members can be integrally formed.

The block main body 22 of the holding block 20 extends downward from the upper part of the holding block 20 in a column shape. Below the block body 22, a block lower portion 23 that is in contact with the upper plate 30 is integrally formed. The lower surface of the block lower portion 23 is formed in a planar shape, and is in contact with the upper surface of an upper plate 30 described later.
Further, a block pin hole 28 into which the block pin 25 is inserted is formed in a portion slightly inside a block lower screw hole 27 described later. The block pin hole 28 does not penetrate. The block lower portion 23 and the upper plate 30 are fixed by block pins 25.

A block recess 24 is formed in the lower part of the central part of the block lower part 23.
In the present embodiment, as shown in FIGS. 1 and 3, the block recess 24 has a quadrangular cross section and is formed so as to penetrate in a direction perpendicular to the paper surface of FIG.
Block lower screw holes 27 into which lower plate holding bolts 76 described later are inserted are formed at the four corners of the block lower portion 23.

  As shown in FIG. 2, on the side surface of the block lower portion 23, a rotation stop plate extending to the upper portion of the lower plate 70 so that the upper plate 30, the intermediate plate 50 and the lower plate 70 do not rotate in the horizontal direction. 29 is attached by a rotation stop plate screw 29a.

  In the present embodiment, the upper plate 30 is formed in a square plate shape as shown in FIGS. 5 to 7, and an upper plate bolt hole 34 into which a lower plate holding bolt 76 described later is inserted passes through the four corners. It is formed as follows. An upper plate pin hole 35 is formed in a portion from the center of the upper surface of the upper plate 30 so as not to penetrate through the upper plate bolt hole 34. The upper plate pin hole 35 communicates with the block pin hole 28 and fixes the holding block 20 and the upper plate 30 with the block pin 25.

  An upper plate central hole 33 is formed at the center of the upper plate 30 and a mounting joint 40 described later is inserted therein. An upper plate center convex portion 32 protruding downward is formed around the upper plate center hole 33 of the upper plate lower surface 31 of the upper plate 30. The upper plate central hole 33 is formed at a position corresponding to the block recess 24 of the holding block 20. In the present embodiment, the upper plate lower surface 31 is formed flat.

A lower plate 70 is provided below the upper plate 30 at a distance from the upper plate 30. As shown in FIGS. 15 to 17, the lower plate 70 is formed in a gentle conical shape with a slightly raised center at the top and a slightly lower side to form a lower plate upper slope 73. Lower plate bolt holes 71 into which lower plate holding bolts 76 to be described later are inserted are formed at the four corners of the lower plate 70 so as not to penetrate.
Note that the upper plate lower surface 31 can be formed in the shape of an inclined surface in the same manner as the lower plate upper inclined surface 73 instead of the lower plate upper inclined surface 73 or together with the lower plate upper inclined surface 73.

A lower plate central recess 72 is formed at the center of the upper surface of the lower plate 70. The lower surface of the lower plate 70 is formed in a planar shape, and a lower plate lower mounting hole 75 for attaching a bump press jig 80 described later is formed.
A heating unit 74 that heats the bump press jig 80 is formed below the lower plate 70. A heater is attached to the heating unit 74.
In the lower plate lower mounting hole 75, a jig holder bolt 84 for fixing a jig holder 83 to which the bump press jig 80 is attached is inserted.

  As shown in FIGS. 1 and 3, the ball holding portion 44 of the attachment joint 40 is attached to the lower plate central recess 72. The mounting joint 40 has a shaft portion 42 and a nut 41 at the upper portion, a metal spherical ball 43 is provided at the lower portion of the shaft portion 42, and a ball holding portion that is rotatable so as to wrap around the ball 43. 44 is formed.

  The shaft portion 42 of the attachment joint 40 is inserted into the upper plate central hole 33 of the upper plate 30 and attached to the upper plate 30 with a nut 41 on the upper surface of the upper plate 30. Since the ball holding portion 44 of the attachment joint 40 is fixed to the lower plate central recess 72, the lower plate 70 is attached to the upper plate 30 so as to be able to incline at a predetermined angle with respect to each other at a central portion. The upper part of the shaft part 42 of the mounting joint 40 and the nut 41 can be located in the block recess 24 of the holding block 20. The lower plate 70 can be inclined about 20 degrees with respect to the upper plate 30.

An intermediate plate 50 and a guide plate 60 are attached between the upper plate 30 and the lower plate 70 as shown in FIGS.
As shown in FIGS. 10 and 11, the intermediate plate 50 is formed in a plate shape, and is formed so that intermediate plate bolt holes 51 into which lower plate holding bolts 76 to be described later are inserted pass through the four corners. Therefore, the upper plate 30, the intermediate plate 50 and the lower plate 70 are fixed by the lower plate holding bolt 76.

  A metal washer is provided between the heads of the upper plate 30 and the lower plate holding bolt 76. For this reason, the lower plate holding bolt 76 can be smoothly rotated, and the lower plate holding bolt 76 can be fixed without being worn or deformed even when used for a long time.

An intermediate plate center hole 54 is formed at the center of the intermediate plate 50. A plurality of intermediate plate sliding recesses 52 are radially formed around the intermediate plate central hole 54 radially outward. In the present embodiment, six intermediate plate sliding recesses 52 are formed. As shown in FIGS. 8 and 9, a ball retainer 55 is fitted in each of the intermediate plate sliding recesses 52.
The ball retainer 55 is urged toward the center of the intermediate plate 50.

  An intermediate plate slide hole 53 is formed on the side surface of the intermediate plate 50. A guide plate slide pin 63 attached to a later-described guide plate 60 is slidably inserted into the intermediate plate slide hole 53 so that the guide plate 60 can be rotated.

  As shown in FIG. 14, the ball retainer 55 has a ball 56 inside, and has upper and lower surfaces that are in contact with the upper plate 30 and the lower plate 70, respectively. The ball retainer 55 can be formed of spring steel. For this reason, as will be described later, it can be elastically deformed when compressed by the upper plate 30 and the lower plate 70.

  A guide plate 60 is rotatably inserted into the intermediate plate central hole 54. As shown in FIGS. 12 and 13, the guide plate is formed in a flat circular shape, and has guide plate protrusions 61 at positions corresponding to the same number as the intermediate plate sliding recesses 52. Guide plate recesses 65 are formed between the guide plate protrusions 61 and the guide plate protrusions 61, and the guide plate protrusions 61 and the guide plate recesses 65 are alternately formed. The guide plate protrusion 61 and the guide plate recess 65 abut on the ball 56 of the ball retainer 55 fitted in the intermediate plate sliding recess 52.

  A guide plate slide pin 63 for rotating the guide plate 60 is attached to the guide plate 60. The guide plate slide pin 63 is screwed into the guide plate pin hole 62. Therefore, by rotating the guide plate 60, the guide plate protrusion 61 can push the position of the ball retainer 55 outward in the radial direction by rotation. When the ball is further rotated, the ball retainer 55 enters the guide plate recess 65, and the ball retainer 55 can be slid in the center direction.

  A guide plate center hole 64 is formed at the center of the guide plate 60, and the upper plate center convex portion 32 of the upper plate 30 is fitted into the guide plate center hole 64 along the circumference of the guide plate center hole 64. . As a result, the guide plate 60 can smoothly rotate in the circumferential direction. Further, the attachment joint 40 is inserted into the guide plate central hole 64.

  As shown in FIG. 4, a bump press jig 80 is attached to the lower plate 70. In the bump press jig 80, the lower surface 81 of the bump press jig, which is the lower surface, is formed in a very smooth flat shape, and the upper portion 82 of the bump press jig is formed so that the periphery projects sideways. The bump press jig 80 can be mounted by attaching a jig holder 83 as a lower holding member to the bump press jig upper part 82 and attaching the jig holder 83 to the lower plate lower mounting hole 75 with the jig holder bolt 84. The bump press jig 80 can be made of die steel, stainless steel, silicon nitride, tungsten, silicon carbide, or the like.

  A heating unit 74 is provided below the lower plate 70. A heater or the like is embedded in the heating unit 74 so that the bump press jig 80 can be heated. For this reason, when the bump 6 is pressed, the bump 6 can be pressed while being heated, and the top of the bump 6 can be smoothly flattened. The heating of the bump press jig 80 is about 100 to 120 degrees.

A substrate holding base 90 of the bump flattening apparatus is provided under the bump press jig 80, and the wiring substrate 5 having the bumps 6 formed on the surface is installed on the upper surface of the substrate holding base 90.
The substrate holding table 90 and the bump press jig lower surface 81 are formed in parallel.
When the bump coining head 1 of the bump flattening apparatus is lowered, the bump press jig lower surface 81 can press the top of the bump 6.

Next, a method for using the bump coining head 1 will be described.
First, the bump coining head 1 is attached to the tip of the bump flattening device. In the bump coining head 1, an upper plate 30 and a lower plate 70 are attached by an attachment joint 40 so as to be inclined at a predetermined angle. Between the upper plate 30 and the lower plate 70, an intermediate plate 50, a guide plate 60, a ball A retainer 55 is attached.
A bump press jig 80 is screwed to the lower surface of the lower plate 70 by a jig holder 83.
As shown in FIG. 1, the attachment plate 10 is brought into close contact with the lower surface of the tip of the bump flattening device, and after the attachment pins 11 are inserted, the attachment plate 10 and the holding block 20 are attached simultaneously with the attachment screws 21.

Next, adjustment is performed so that the bump press jig lower surface 81 and the substrate holding table upper surface 91 are strictly parallel.
The lower plate holding bolt 76 that passes through the holding block 20 and the upper plate 30 and fixes the position of the lower plate 70 is slightly loosened, and the guide plate slide pin 63 is slid as shown in FIG. Then, the guide plate projection 61 comes into contact with the ball retainer 55, and the ball retainer 55 moves in the radially outward direction in the intermediate plate sliding recess 52. As a result, a gap is formed between the ball retainer 55 and the lower plate 70, and the lower plate 70 can be inclined in the vertical direction by a predetermined angle around the ball 43 of the mounting joint 40.

Thereafter, by lowering the tip of the bump flattening device, the bump coining head 1 is moved downward to bring the bump press jig lower surface 81 into close contact with the substrate holding table upper surface 91.
When the guide plate slide pin 63 is returned, the guide plate protrusion 61 is disengaged from the ball retainer 55, and the ball retainer 55 is biased in the center direction, so that the ball retainer 55 is intermediate along the guide plate recess 65. The plate sliding recess 52 is moved in the center direction.

  The upper surface of the ball retainer 55 contacts and slides on the lower surface 31 of the upper plate, and the lower surface of the ball retainer 55 contacts and slides on the upper inclined surface 73 of the lower plate. At this time, since the lower plate upper slope 73 is formed so as to gradually increase in the center direction, the gap between the upper plate 30 and the lower plate 70 is formed so as to gradually narrow toward the center direction. Has been. Therefore, the biased ball retainer 55 slides between the upper plate 30 and the lower plate 70 until they are in close contact with each other, and the lower surface 70 of the bump press jig is in close contact with the upper surface 91 of the substrate holding table. The position of is fixed and sliding stops.

In this state, the lower plate holding bolts 76 at the four corners are tightened to fix the lower plate 70 and the bump press jig 80. Then, the bump coining head 1 is moved upward.
In this state, the bump press jig lower surface 81 is substantially parallel to the substrate holding table upper surface 91, and the parallelism is a difference of about 5 μ at the maximum. Here, the parallelism is the size of the maximum gap between the bump press jig lower surface 81 and the substrate holding table upper surface 91 when a part of the bump press jig lower surface 81 contacts the substrate holding table upper surface 91. is there.

  Thereafter, a pressure-sensitive test paper is placed on the upper surface 91 of the substrate holding table, the bump coining head 1 is lowered once again, the bump press jig lower surface 81 is brought into close contact with the upper surface 91 of the substrate holding table, and the parallelism is measured. When the pressure-sensitive test paper is taken out, the parallelism can be tested because the narrow portion of the gap between the bump press jig lower surface 81 and the substrate holding table upper surface 91 is more discolored.

  When the lower plate holding bolt 76 corresponding to the portion where the bump press jig lower surface 81 strongly contacts the substrate holding table upper surface 91 is slightly tightened, the corresponding portion of the lower plate 70 moves slightly upward. At this time, since the ball retainer 55 is made of spring steel, it has elasticity, and by screwing the lower plate holding bolt 76, the ball retainer 55 can be slightly elastically deformed, and the lower surface of the bump press jig A minute angle with 81 can be adjusted.

  By this screwing, the parallelism between the bump press jig lower surface 81 and the substrate holding table upper surface 91 can be adjusted to a difference of about 2 μm at maximum. In this way, the parallelism between the bump press jig lower surface 81 and the substrate holding table upper surface 91 can be easily and precisely adjusted by one adjustment.

  After the adjustment as described above, as shown in FIG. 1, the wiring board 5 is placed on the board holding table upper surface 91, the bump coining head 1 is lowered, and the tops of the numerous bumps 6 on the wiring board 5 are bump press jigs. By pressing with 80, a uniform pressing surface of the top of the bump 6 can be obtained. Since the upper plate 30 and the lower plate 70 are firmly fixed by the lower plate holding bolts 76, the bump press jig 80 can maintain a parallel degree and can continuously work even in many pressing operations. .

1 Bump coining head 5 Wiring substrate 6 Bump 10 Mounting plate 20 Holding block 30 Upper plate 40 Mounting joint 43 Ball 50 Intermediate plate 52 Intermediate plate sliding recess 55 Ball retainer 60 Guide plate 63 Slide pin 70 Lower plate 72 Lower plate central recess 73 Lower plate upper slope 80 Bump press jig 90 Substrate holder

Claims (8)

Bump coining that is attached to the tip of a bump flattening device that forms the top of a plurality of bumps formed on the surface of the electronic component on a flat surface and presses the top of the bump of the electronic component held on the substrate holder. Head,
The bump coining head includes an attachment member for attaching the bump coining head to the bump flattening device, a bump press jig that contacts the top of the bump of the electronic component, and an angle adjustment member that adjusts the angle of the lower surface of the bump press jig. Have
The angle adjustment member includes: an upper plate attached to the lower surface of the attachment member; a lower plate positioned below the upper plate; a lower holding member for attaching the bump press jig to the lower surface of the lower plate; and the upper plate And the lower plate are attached, the central portion of the lower plate is held so as to be rotatable at a predetermined angle with respect to the upper plate, and the substrate holding table on which the electronic components are held and the bump press jig A bump coining head comprising an angle holding member for maintaining the angle when the lower surface is positioned in parallel.   The angle holding member connects the center of the upper plate and the center of the lower plate with a mounting joint having a ball joint at the tip, and the shaft portion of the mounting joint is screwed to the upper plate, 2. The bump according to claim 1, wherein a ball holding portion of a ball joint at a tip is attached to the lower plate, and the angle between the upper plate and the lower plate is maintained by fixing the upper plate and the lower plate with a plurality of bolts. Coining head. At least one of the lower surface of the upper plate and the upper surface of the lower plate is formed in a slope shape so as to gradually reduce the distance between the two toward the center, and an intermediate plate is provided between the upper plate and the lower plate. In the middle of the intermediate plate, an intermediate plate central hole is formed,
A plurality of intermediate plate sliding recesses are formed radially outwardly around the center plate central hole, and the upper and lower surfaces of the intermediate plate sliding recess have balls inside and the upper and lower surfaces, respectively. A ball retainer having a flat surface in contact with the plate is slidably inserted, and the ball retainer is urged toward the center of the intermediate plate,
A guide plate is rotatably inserted into the intermediate plate central hole, and the guide plate is located between the guide plate protrusion and the guide plate protrusion at a position corresponding to the same number as the intermediate plate sliding recess. The bump coining according to claim 1 or 2, wherein a guide plate recess is formed in the guide plate, and the ball retainer is formed so as to be able to contact the guide plate protrusion and the guide plate recess in order by rotation of the guide plate. head.   The bump coining head according to any one of claims 1 to 3, wherein a slide pin is attached to an outer peripheral portion of the guide plate, and the guide pin is rotatable by moving the slide pin in a circumferential direction.   5. The upper plate and the lower plate are fixed at the four corners by four bolts, and the angle between the lower plate and the electronic component is maintained. Bump coining head as described.   The bump coining head according to claim 5, wherein a white metal washer is inserted into the bolt.   7. The bump coining according to claim 1, wherein the mounting member is formed of a mounting plate that is mounted on the bump flattening device, and a holding block that connects the mounting plate and the upper plate. 8. head.   The bump coining head according to any one of claims 1 to 7, wherein the ball retainer is formed of spring steel.

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