CN107967960A - 平行对线缆 - Google Patents
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- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 238000000151 deposition Methods 0.000 claims abstract description 9
- 230000008021 deposition Effects 0.000 claims abstract description 9
- 238000001465 metallisation Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 238000004804 winding Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011888 foil Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 230000008054 signal transmission Effects 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
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- H—ELECTRICITY
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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- H01B11/02—Cables with twisted pairs or quads
- H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
- H01B11/10—Screens specially adapted for reducing interference from external sources
- H01B11/1058—Screens specially adapted for reducing interference from external sources using a coating, e.g. a loaded polymer, ink or print
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
- H01B11/20—Cables having a multiplicity of coaxial lines
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
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- H01B7/0216—Two layers
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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- H01B7/08—Flat or ribbon cables
- H01B7/0807—Twin conductor or cable
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0823—Parallel wires, incorporated in a flat insulating profile
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0861—Flat or ribbon cables comprising one or more screens
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- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
- H01B7/282—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable
- H01B7/2825—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable using a water impermeable sheath
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0098—Shielding materials for shielding electrical cables
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- H01B11/00—Communication cables or conductors
- H01B11/02—Cables with twisted pairs or quads
- H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
- H01B11/10—Screens specially adapted for reducing interference from external sources
- H01B11/1008—Features relating to screening tape per se
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
- H01B13/222—Sheathing; Armouring; Screening; Applying other protective layers by electro-plating
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Abstract
本发明提供一种平行对线缆,该平行对线缆包括:一对金属线,其以预定间隔平行排列;绝缘树脂,其构造为整体地覆盖该对金属线,并具有椭圆形的截面形状;以及屏蔽层,其设置在绝缘树脂的外周上。屏蔽层是通过将金属镀覆或气相沉积在绝缘树脂的外周表面上而形成的层。
Description
技术领域
本发明涉及平行对线缆。
背景技术
专利文献1披露了用于差分信号传输的线缆,该线缆包括:一对导电线材,其间隔开且平行排列;绝缘体,其构造为覆盖该对导电线材,且该绝缘体的宽度方向上的截面具有这样的外周形状:该形状是由多个具有不同曲率半径的曲线结合成的形状;以及金属箔带,其缠绕在绝缘体上。
专利文献1:JP-A-2012-169251
专利文献1所披露的用于差分信号传输的线缆存在这样的问题:金属箔带的缠绕状态可能松动或可能产生缠绕褶皱。因此,金属箔带移动,使得对信号线(该对导电线材)的屏蔽效果变得不稳定,并且共模的输出量(Scd21)相对于差模的输入信号可能增大。另外,在高频信号区域可能产生快速信号衰减(骤降(dip))。
发明内容
本发明的示例性实施例提供这样的平行对线缆:在传输差分信号时,该平行对线缆能够使共模的输出量(Scd21)相对于差模的输入信号减小,并且能够防止在高频信号区域中产生快速信号衰减(骤降)。
根据示例性实施例的平行对线缆,包括:
一对金属线,其以预定间隔平行排列;
绝缘树脂,其构造为整体地覆盖所述一对金属线,并具有椭圆形的截面形状;以及
屏蔽层,其设置在所述绝缘树脂的外周上,
其中,所述屏蔽层是通过将金属镀覆或气相沉积在所述绝缘树脂的外周表面上而形成的层。
根据示例性实施例,在传输差分信号时,可以使共模的输出量(Scd21)相对于差模的输入信号减小,并且可以防止在高频信号区域中产生快速信号衰减(骤降)区。
附图说明
图1是描绘根据示例性实施例的平行对线缆的构造的透视图。
图2是与图1的平行对线缆的纵向垂直的剖视图。
图3是与根据示例性实施例的变型例的平行对线缆的纵向垂直的剖视图。
具体实施方式
(本发明的示例性实施例的描述)
首先,描述本发明的示例性实施例。
(1)根据示例性实施例的平行对线缆,包括:
一对金属线,其以预定间隔平行排列;
绝缘树脂,其构造为整体地覆盖所述一对金属线,并具有椭圆形的截面形状;以及
屏蔽层,其设置在所述绝缘树脂的外周上,
其中,所述屏蔽层是通过将金属镀覆或气相沉积在所述绝缘树脂的外周表面上而形成的层。
根据以上构造,由于屏蔽层是通过将金属镀覆或气相沉积在绝缘树脂的外周表面上而形成的层,因此无需担心在金属箔带的情况下产生的缠绕状态松动或产生缠绕褶皱。因此,在传输差分信号时,可以使共模的输出量(Scd21)相对于差模的输入信号减小,并且可以防止在高频信号区域中产生快速信号衰减(骤降)区。
(2)所述平行对线缆还包括:
绝缘护套层,其围绕所述屏蔽层设置。
设置绝缘护套层使得可以将屏蔽层绝缘,防止来自外部的污染物并且提供防水线缆。
(本发明的示例性实施例的细节)
在下文中,将参考附图对根据本发明的示例性实施例的平行对线缆的具体实例进行描述。
同时,本发明不限于这些实例,本发明由权利要求书限定并且包括在与权利要求书等同的意义和范围内的全部变化。
如图1和图2所示,平行对线缆1包括:一对金属线2,其以预定间隔平行排列;绝缘树脂3,其构造为整体地覆盖该对金属线2。另外,平行对线缆1包括:屏蔽层4,其设置在绝缘树脂3的外周上;以及护套层5,其围绕屏蔽层4设置。
金属线2是由诸如铜、铝、包括作为主要成分的铜和铝的合金等导体、或由镀覆有锡、银等的导体形成的单个线材或绞合线。用于金属线2的导体的尺寸基于AWG(美国电线规格)标准为AWG38至AWG22。该对金属线2的中心之间的距离优选为导体直径的0.5至5倍。
绝缘树脂3由诸如聚乙烯(PE)、聚丙烯(PP)等具有低介电常数的热塑性树脂形成。绝缘树脂3由挤出机供应并且覆盖至该对金属线2。例如,当从截面观看时,绝缘树脂3具有椭圆形状。绝缘树脂3的宽高比优选为宽度1.2至2.5比高度1。另一方面,可以使用诸如聚乙烯、聚氯乙烯(PVC)、氟树脂等热塑性树脂来挤制和涂覆绝缘树脂3。绝缘树脂3可以是固体层。作为选择,绝缘树脂3可以是泡沫层(发泡层)。泡沫层是优选的,这是由于泡沫层具有小于固体层的介电常数。在采用泡沫层的情况下,当施加1kg的载荷持续30分钟时绝缘树脂的剩余直径比(当向绝缘树脂施加外力时,通过将变形后在压迫方向上的绝缘树脂的直径除以变形前绝缘树脂的直径得到的值)优选为80%至99%。
同时,在说明书中,术语“截面”意为从平行对线缆的纵向观看时的截面。另外,术语“椭圆形”意为包括以下形状:标准椭圆形;通过将圆形形状压扁得到的卵形;通过用圆弧形曲线连接两个平行线而获得的形状,等等。
屏蔽层4是通过镀覆或气相沉积而形成在绝缘树脂3的外周表面上的金属层。屏蔽层4被镀覆或气相沉积以便直接附着于绝缘树脂3而不需要诸如粘合剂或树脂带等其它构件。使用钢、铝、银、镍等作为屏蔽层4的金属。
使用化学镀法等作为金属镀覆方法。在化学镀中,根据要镀覆的材料,可以使用钯催化剂等。另外,可以使用诸如真空气相沉积法等物理气相沉积法、诸如热化学气相沉积(CVD)法和离子体CVD法等化学气相沉积法作为金属气相沉积方法。
屏蔽层4的厚度优选为0.1μm至10μm。通常,当金属层的厚度较薄时(例如,1μm以下),通过气相沉积得到金属层,并且当金属层的厚度较厚时,通过镀覆得到金属层。根据平行对线缆1的使用,确定屏蔽层4的优选厚度并且适当地选择镀覆或气相沉积方法。
护套层5是这样的绝缘层:其构造为覆盖屏蔽层4,并且由诸如聚对苯二甲酸乙二醇酯(PET)、聚氯乙烯(PVC)、聚乙烯等的树脂带形成。构造护套层5的树脂带优选为例如螺旋状地缠绕(成螺旋形地缠绕)在屏蔽带4的周围。在图1和图2的实例中,通过缠绕一个树脂带形成护套层5。然而,也可以缠绕多个树脂带。在图2中,省略了带的重叠部分。例如,可以通过双重缠绕两个树脂带形成护套层。当缠绕两个树脂带时,缠绕方向可以彼此相同或可以彼此相反。当护套层5的带沿相同方向缠绕时,对线缆的柔性是有利的,而当带沿相反方向缠绕时,线缆中几乎不会产生扭转变形。同时,可以通过挤出诸如聚乙烯、聚氯乙烯、氟树脂等热塑性树脂来形成护套层5。
另外,如根据示例性实施例的变型例的平行对线缆1A(参见图3)那样,当加蔽线6(诸如铜线等金属线)布置在护套层5与屏蔽层4之间时,可以通过将加蔽线6与基板或连接器的接地端子相连接来使屏蔽层4接地。因此,可以容易地实施平行对线缆的连接处理。在图3的实例中,两个金属线2和加蔽线6横向地布置。两个加蔽线可以横向地布置在屏蔽层4的两侧处。然而,加蔽线6可以布置在护套层5与屏蔽层4之间的任何位置处(例如,金属线2的上方或下方的位置)。另外,加蔽线6的数量可以是一个或多个。
接下来,描述平行对线缆1的制造方法。
首先,以预定距离平行布置两个金属线2。然后,例如通过挤出泡沫聚乙烯来覆盖该对金属线2,从而形成截面形状为椭圆形的绝缘树脂3。
随后,在绝缘树脂3的外周表面上实施金属镀覆或金属气相沉积,从而形成由诸如铜、铝、银、镍等金属制成的屏蔽层4。然后,围绕屏蔽层4螺旋状地缠绕树脂带,从而形成绝缘护套层5。从而,制造出具有与绝缘树脂3成一体的金属层(屏蔽层4)的平行对线缆1。
根据具有以上构造的平行对线缆1,由于屏蔽层4是通过将金属镀覆或气相沉积在绝缘树脂3的外周表面上而形成的层,因此不存在缠绕在绝缘树脂3的外周上的屏蔽金属箔带导致的麻烦。因此,与屏蔽带缠绕在绝缘树脂的周围的情况相比,在传输差分信号时,可以使共模的输出量(Scd21)相对于差模的输入信号减小,并且可以防止在高频信号区域中产生快速信号衰减(骤降)区。
另外,由于绝缘护套层5围绕屏蔽层4设置,因此可以使屏蔽层4绝缘,防止来自外部的污染物并且提供防水的平行对线缆1。当通过多个树脂带形成护套层5时,例如,当通过沿相反方向螺旋状地缠绕两个树脂带而形成护套层时,可以进一步提高屏蔽层4的绝缘性和平行对线缆1的防水性。
[实例]
对实例和比较例的平行对线缆的模式转换量(Scd21)和骤降(频带空段现象)的测量结果进行描述。
同时,Scd21表示从端口1到端口2的差模向共模的转换量,并且是混合模式S参数之一。在USB线缆(例如,USB3.0)的符合性试验中,Scd21被设定为-20dB/m以下。另外,骤降(dip)表明信号衰减量的频率特性在约20GHz的频带中快速降低。
在测量中,当20GHz以上的高频信号传输至具有3m长的平行对线缆时,将Scd21值的最大值为-20dB/m以下的平行对线缆判定为良好,并且将最大值为-25dB/m以下的平行对线缆判定为优秀。另外,将Scd21值的最大值大于-20dB/m的平行对线缆判定为有缺陷。另外,还检查是否产生骤降。
(实例1)
实例1的平行对线缆具有图1和图2所示的构造,并且制备如下。
将AWG30(外径0.29mm)的两个金属线2以1.2mm的间隔平行排列,并且将泡沫聚乙烯(绝缘树脂3)通过挤出而覆盖金属线2。将绝缘树脂3形成为具有卵形的截面形状。利用真空气相沉积法通过气相沉积铜将具有1μm的厚度的屏蔽层4形成在绝缘树脂3的外周表面上。在图1和图2中,由一个树脂带形成护套层5。然而,在实例1中,通过沿相反方向螺旋状地缠绕两个树脂带而形成护套层5。
将实例1的平行对线缆制造为具有3m的长度,传输20GHz以上的高频信号并且测量Scd21和骤降。
作为测量的结果,Scd21值的最大值为-25dB/m以下,从而实例1的平行对线缆的质量被判定为优秀。另外,直到25GHz的频带都没有产生骤降。
(比较例1)
通过将设置在铜制金属层上的PET带(金属箔带)螺旋状地缠绕在绝缘树脂的周围而形成屏蔽层。铜制金属层的厚度为6μm,并且PET带的厚度为9μm。其它构造与实例1类似。
将比较例1的平行对线缆制造为具有3m的长度,传输20GHz以上的高频信号并且测量Scd21和骤降。
作为测量的结果,Scd21值的最大值为大于-20dB/m,从而比较例1的平行对线缆的质量被判定为有缺陷。另外,在20GHz至25GHz的频带中产生骤降。这被认为是由于在围绕绝缘树脂螺旋状地缠绕的金属箔带中产生松动或缠绕褶皱而导致的。
(比较例2)
通过将设置在铜制金属层上的PET带(金属箔带)纵向地包裹在绝缘树脂的周围而形成屏蔽层。铜制金属层的厚度为6μm,并且PET带的厚度为9μm。其它构造与实例1类似。
将比较例2的平行对线缆制造为具有3m的长度,传输20GHz以上的高频信号并且测量Scd21和骤降。
作为测量的结果,Scd21值的最大值为大于-20dB/m,从而比较例2的平行对线缆的质量被判定为有缺陷。另外,在20GHz至25GHz的频带中产生骤降。这被认为是由于在纵向地包裹在绝缘树脂的周围的金属箔带中产生松动或缠绕褶皱而导致的。
尽管已经参考具体示例性实施例对本发明进行了详细描述,但是对于本领域的技术人员来说显而易见的是,在不背离本发明的要旨和范围的情况下可以作出各种变化和修改。另外,上述构成部件的数量、位置、形状等不限于示例性实施例,并且可以更改为适于本发明的实施方式的数量、位置、形状等。
Claims (2)
1.一种平行对线缆,包括:
一对金属线,其以预定间隔平行排列;
绝缘树脂,其构造为整体地覆盖所述一对金属线,并具有椭圆形的截面形状;以及
屏蔽层,其设置在所述绝缘树脂的外周上,
其中,所述屏蔽层是通过将金属镀覆或气相沉积在所述绝缘树脂的外周表面上而形成的层。
2.根据权利要求1所述的平行对线缆,还包括:
绝缘护套层,其围绕所述屏蔽层设置。
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US20050011664A1 (en) * | 2003-07-16 | 2005-01-20 | Chang-Chi Lee | Structure of a cable |
CN103208336A (zh) * | 2012-01-17 | 2013-07-17 | 日立电线株式会社 | 平行型发泡同轴电缆 |
CN203444821U (zh) * | 2013-07-26 | 2014-02-19 | 昆山联滔电子有限公司 | 线缆 |
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