CN107946341A - The manufacture method of display device and display device - Google Patents
The manufacture method of display device and display device Download PDFInfo
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- CN107946341A CN107946341A CN201711106322.4A CN201711106322A CN107946341A CN 107946341 A CN107946341 A CN 107946341A CN 201711106322 A CN201711106322 A CN 201711106322A CN 107946341 A CN107946341 A CN 107946341A
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- transparent area
- display panel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a kind of display device and the manufacture method of display device, belongs to display technology field, including:Display panel and camera;Display panel includes viewing area, the non-display area around viewing area, the first transparent area;Viewing area is set around the first transparent area;Orthographic projection of the camera to display panel is located in the first transparent area;Display panel includes the substrate layer, film transistor device layer, organic light emitting diode device layer for stacking gradually setting;The thickness of substrate layer in first transparent area is d1, and the thickness of the substrate layer beyond the first transparent area is d2, d1 < d2.The thickness of substrate layer in first transparent area is thinned, the light penetration of substrate layer in the first transparent area can be improved.Relative to the prior art, without display panel is arranged to special shape to avoid the region where camera, is conducive to improve screen accounting, lifts user experience.
Description
Technical field
The present invention relates to display technology field, more particularly, to a kind of display device and the manufacture method of display device.
Background technology
With the development of display technology, the terminal display device such as mobile phone pursues higher and higher screen accounting.
Please refer to Fig.1, Fig. 1 is a kind of structure diagram for display device that the prior art provides.Display dress shown in Fig. 1
Put including housing 01 and display panel 02, front camera 03 is provided with housing.
In order to lift user experience, research staff wishes that display panel 02 has the accounting of higher in housing 01.But
The setting of front camera 03 is limited to, display panel 02 needs to be arranged to special shape to avoid the place of front camera 03
Region, the shape of display panel 02 is restricted, and is unfavorable for realizing the screen accounting of higher.
The content of the invention
In view of this, the present invention provides a kind of display device and the manufacture method of display device.
The present invention provides a kind of display device, including:Display panel and camera;The camera lens of camera is towards display surface
The direction of plate is set;Display panel includes viewing area, the non-display area around viewing area, the first transparent area;Viewing area is around the
One transparent area is set;Orthographic projection of the camera to display panel is located in the first transparent area;Display panel includes stacking gradually setting
Substrate layer, film transistor device layer, the organic light emitting diode device layer put;Film transistor device layer includes multiple films
Transistor, organic light emitting diode device layer include multiple Organic Light Emitting Diodes;The thickness of substrate layer in first transparent area
For d1, the thickness of the substrate layer beyond the first transparent area is d2, d1 < d2.
Present invention also offers a kind of manufacture method of display device, including:Form display panel;Display panel includes aobvious
Show area, the non-display area around viewing area, the first transparent area, viewing area is set around the first transparent area;Assemble camera;Shooting
The camera lens of head is set towards the direction of display panel;Orthographic projection of the camera to display panel is located in the first transparent area;
Forming display panel includes:First substrate is provided;The first surface of first substrate includes lug boss;Form substrate
Layer, substrate layer are covered in the first surface of first substrate;Film transistor device layer is formed, film transistor device layer includes more
A thin film transistor (TFT);Organic light emitting diode device layer is formed, organic light emitting diode device layer includes multiple organic light emissions two
Pole pipe;Separate backing layer and first substrate;Substrate layer forms concave part in the corresponding position of lug boss, and concave part is saturating positioned at first
In light area, the thickness of the substrate layer in the first transparent area is d1, and the thickness of the substrate layer beyond the first transparent area is d2, d1 <
d2。
The present invention provides the manufacture method of another display device, including:Form display panel;Display panel includes aobvious
Show area, the non-display area around viewing area, the first transparent area, viewing area is set around the first transparent area;Assemble camera;Shooting
The camera lens of head is set towards the direction of display panel;Orthographic projection of the camera to display panel is located in the first transparent area;
Forming display panel includes:First substrate is provided;Form substrate layer;Patterned substrate layer, forms concave part, groove
Portion is located in the first transparent area, and the thickness of the substrate layer in the first transparent area is d1, the thickness of the substrate layer beyond the first transparent area
Spend for d2, d1 < d2;Form cushion, cushion at least fill part concave part;Film transistor device layer is formed, film is brilliant
Body tube device layer includes multiple thin film transistor (TFT)s;Form organic light emitting diode device layer, organic light emitting diode device layer bag
Include multiple Organic Light Emitting Diodes;Separate first substrate and substrate layer.
Compared with prior art, the manufacture method of display device and display device provided by the invention, at least realize as
Under beneficial effect:
In the manufacture method of display device and display device provided by the invention, it is provided with the viewing area of display panel
First transparent area, orthographic projection of the camera to display panel are located in the first transparent area.Can be with transmitted light in first transparent area
To meet the camera function of camera, also, the thickness of the substrate layer in the first transparent area is thinned, the first printing opacity can be improved
The light penetration of substrate layer in area.Relative to the prior art, without display panel is arranged to special shape to avoid taking the photograph
Region as where head, is conducive to improve screen accounting, lifts user experience.
Certainly, implement any of the products of the present invention must not specific needs reach all the above technique effect at the same time.
By referring to the drawings to the present invention exemplary embodiment detailed description, further feature of the invention and its
Advantage will be made apparent from.
Brief description of the drawings
It is combined in the description and the attached drawing of a part for constitution instruction shows the embodiment of the present invention, and even
It is used to explain the principle of the present invention together with its explanation.
Fig. 1 is a kind of structure diagram for display device that the prior art provides;
Fig. 2 is a kind of structure diagram of display device provided in an embodiment of the present invention;
Fig. 3 is a kind of cross-sectional view of the AA ' lines along Fig. 2;
Fig. 4 is the part section structural representation of another display device provided in an embodiment of the present invention;
Fig. 5 is the part section structural representation of another display device provided in an embodiment of the present invention;
Fig. 6 is the part section structural representation of another display device provided in an embodiment of the present invention;
Fig. 7 is the part section structural representation of another display device provided in an embodiment of the present invention;
Fig. 8 is a kind of flow chart of the manufacture method of display device provided in an embodiment of the present invention;
Fig. 9 is a kind of flow chart of the manufacture method of display panel provided in an embodiment of the present invention;
Figure 10 to Figure 15 is the structure diagram of the display panel for the manufacture method manufacture that Fig. 9 is provided;
Figure 16 is the flow chart of the manufacture method of another display panel provided in an embodiment of the present invention;
Figure 17 to Figure 22 is the structure diagram of the display panel for the manufacture method manufacture that Figure 16 is provided.
Embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should be noted that:Unless in addition have
Body illustrates that the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative to be never used as to the present invention below
And its application or any restrictions that use.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that:Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent attached drawing in a attached drawing.
Please refer to Fig.2 and Fig. 3, Fig. 2 be a kind of display device provided in an embodiment of the present invention structure diagram, Fig. 3 is
A kind of cross-sectional view of AA ' lines along Fig. 2.The present invention provides a kind of display device, including:Display panel 10 and take the photograph
As first 20;The camera lens of camera 20 is set towards the direction of display panel 10;Display panel 10 includes viewing area 11, around display
The non-display area 12 in area, the first transparent area 13;Viewing area 11 is set around the first transparent area 13;Camera 20 is to display panel 10
Orthographic projection be located in the first transparent area 13;Display panel 10 includes substrate layer 30, the thin film transistor (TFT) device for stacking gradually setting
Part layer 40, organic light emitting diode device layer 50;Film transistor device layer 40 includes multiple thin film transistor (TFT)s 41, organic light emission
Diode component layer 50 includes multiple Organic Light Emitting Diodes 51;The thickness of substrate layer 30 in first transparent area 13 is d1, the
The thickness of substrate layer 30 beyond one transparent area 13 is d2, d1 < d2.
In display device provided in this embodiment, including display panel 10 and camera 20.Wherein, display panel 10 is used for
Realize display function, camera 20 is used for realization the function such as take pictures, image.In the present embodiment, camera 20 is front camera,
The camera lens of camera 20 is set towards the direction of display panel 10, and the thing of 20 side of camera is deviated from for shooting display panel 10
Body.
Display panel 10 provided in this embodiment includes substrate layer 30, and substrate layer 30 has the function that substrate, is that film is brilliant
The film layer structures such as body tube device layer 40, organic light emitting diode device layer 50 provide substrate.
Film transistor device layer 40 includes multiple thin film transistor (TFT)s (Thin Film Transistor, abbreviation TFT) 41.
It should be noted that in order to clearly illustrate the technical solution of the present embodiment, two thin film transistor (TFT)s 41 are only illustrated in Fig. 3,
It is understood that in display panel provided in this embodiment, the quantity of thin film transistor (TFT) 41 be it is multiple, specifically can be according to aobvious
Show that the actual design demand of panel is configured, the present embodiment is not specifically limited this.Optionally, thin film transistor (TFT) 41 includes
Grid 411, semiconductor portion 412, source electrode 413 and drain electrode 414.
Organic light emitting diode device layer 50 includes multiple Organic Light Emitting Diodes (Organic Light Emitting
Diode, abbreviation OLED) 51.It should be noted that in order to clearly illustrate the technical solution of the present embodiment, only illustrated in Fig. 3
Two Organic Light Emitting Diodes 51, it is to be understood that in display panel provided in this embodiment, Organic Light Emitting Diode 51
Quantity is multiple, can be specifically configured according to the actual design demand of display panel, the present embodiment does not limit this specifically
System.Multiple Organic Light Emitting Diodes 51 are arranged in viewing area 11, are used for realization display function.Optionally, organic light-emitting diodes
Pipe 51 includes anode 511, cathode 512 and the organic light emission portion 513 being held and mounted between anode 511 and cathode 512.Its
In, the drain electrode 414 of thin film transistor (TFT) 41 and the anode 511 of Organic Light Emitting Diode 51 are electrically connected.
In order to meet the camera function of camera 20, the first transparent area 13 is provided with the viewing area 11 of display panel 10,
Light outside display panel can be passed through from the first transparent area 13.Orthographic projection of the camera 20 to display panel 10 is positioned at the
In one transparent area 13, camera 20 can shoot thing of the display panel 10 away from 20 side of camera by the first transparent area 13
Body.The present embodiment is not restricted for the concrete structure of camera 20.
Since viewing area 11 is set around the first transparent area 13, it is, orthographic projection quilt of the camera 20 to display panel 10
Viewing area 11 surrounds.Therefore, in display device provided in this embodiment, without by display panel 10 be arranged to special shape with
Avoid that the region where camera 20, only the first transparent area 13 need to be set inside viewing area 11, you can meet camera 20
Camera function.
, will in display device provided in this embodiment in order to further improve the transmitance of light in the first transparent area 13
30 thickness of substrate layer in first transparent area 13 is thinned.Specifically, the thickness of the substrate layer 30 in the first transparent area 13 is d1, the
The thickness of substrate layer 30 beyond one transparent area 13 is d2, d1 < d2.In the present embodiment, the substrate layer 30 in the first transparent area 13
Thickness is thinned, and is conducive to improve the transmitance of light, lifts the shooting performance of camera 20.
In display device provided in this embodiment, the first transparent area, camera are provided with the viewing area of display panel
Orthographic projection to display panel is located in the first transparent area.It can meet the shooting of camera in first transparent area with transmitted light
Function, also, the thickness of the substrate layer in the first transparent area is thinned, the light that can improve substrate layer in the first transparent area is saturating
Cross rate.Relative to the prior art, without display panel is arranged to special shape to avoid the region where camera, favorably
Shield accounting in improving, lift user experience.
In some optional embodiments, please continue to refer to Fig. 2 and Fig. 3, the material of substrate layer 30 includes polyimides
(Polyimide, abbreviation PI).Polyimides is one of optimal high-molecular organic material of comprehensive performance, has high temperature resistant, height absolutely
The advantages that edge performance.Using polyimides make substrate layer 30 be flexible, be conducive to display panel 10 realize it is bent
Performance.Known, the thickness for the substrate layer 30 that polyimides makes is related to light penetration, when the thickness of substrate layer 30 is 25
μm when, light penetration can reach about 67%;When the thickness of substrate layer 30 is 15 μm, light penetration can reach about
77%;When the thickness of substrate layer 30 is 12 μm, light penetration can reach about 80%.Optionally, the first transparent area 13 with
The thickness d 2 of outer substrate layer 30 could be provided as 15 μm, and the thickness d 1 of the substrate layer 30 in the first transparent area 13 could be provided as
Less than 15 μm, the light percent of pass of the substrate layer 30 in the first transparent area 13 is conducive to meet camera 20 more than 77% at this time
Camera function, further lifted camera 20 shooting performance.In addition, polyimides can be by being grafted different functional groups
The performance for adjusting polyimides is adapted for the making technology of display panel.For example it can be improved using yellow polyimide
Damage of the laser to film transistor device is prevented when being removed after the resistance to elevated temperatures and processing procedure of polyimides using laser
Wound.On the one hand the embodiment of the present invention can meet the need of display panel high temperature process using polyimides as the material of substrate layer
Ask, be on the other hand also prevented from damage of the laser to film transistor device.Pass through the thickness of the substrate layer in the first transparent area
Degree is thinned, and can improve the light penetration of substrate layer in the first transparent area so that and the first transparent area can place camera, from
And screen accounting is improved, lift user experience.
In some optional embodiments, please continue to refer to Fig. 2 and Fig. 3, d1=20%*d2.In the present embodiment, first is saturating
The thickness d 1 of substrate layer 30 in light area 13 is smaller, and the transmitance of light is bigger, so as to more be conducive to be lifted the bat of camera 20
Take the photograph performance.But the thickness d 1 of the substrate layer 30 in the first transparent area 13 is unsuitable too small, during less than 20%*d2, substrate layer 30
Mechanical performance is affected, it may occur however that it is damaged situations such as, reduce the yield of display panel, reduce the reliable of display panel
Property.
In display device provided in an embodiment of the present invention, the specific implementation of the thickness of the substrate layer in the first transparent area of reduction
Mode has a variety of.In some optional embodiments, lining of the array base palte provided in an embodiment of the present invention in the first transparent area
Concave part is provided with bottom, to reduce the thickness of the substrate layer in the first transparent area.Said in the following, the present invention is exemplary herein
The specific set-up mode of bright concave part.
In some optional embodiments, please refer to Fig.4, Fig. 4 is another display device provided in an embodiment of the present invention
Part section structural representation.Fig. 4 has continued to use the reference numeral of Fig. 3, and something in common repeats no more.In the present embodiment, substrate
Layer 30 includes concave part 31, and concave part 31 is located in the first transparent area 13;The opening of concave part 31 deviates from film transistor device
Layer 40.In display device provided in this embodiment, concave part 31 is provided with the substrate layer 30 in the first transparent area 13, to subtract
The thickness of substrate layer 30 in small first transparent area 13.In the present embodiment, by setting concave part 31 in substrate layer 30, make the
The thickness of substrate layer 30 in one transparent area 13 is thinned, and is conducive to improve the transmitance of light, lifts the shooting of camera 20
Energy.
In some optional embodiments, please continue to refer to Fig. 4.Display panel 10 further includes backboard 60, the first optical cement
Layer 70;Backboard 60 and substrate layer 30 are bonded by the first optical cement layer 70, the first optical cement layer 70 at least fill part concave part
31.In display device provided in this embodiment, there is provided backboard 70, backboard 70 has supporting role, can be with further protection
Film layer structure inside display panel 10, optionally, backboard 70 are made using transparent glass material.First optical cement layer 70 has
There are adhesive effect, backboard 60 and substrate layer 30 to be attached onto by the first optical cement layer 70.Optionally, the first optical cement layer 70
Material selection OCA optical cements (Optically Clear Adhesive, abbreviation OCA), have water white transparency, light penetration
More than 90%, cementing strength it is good, can cure under room temperature or medium temperature, and have the features such as cure shrinkage is small.Use OCA optics
Glue can be fabricated to a kind of two-sided joint adhesive band of no basis material, have the characteristic of two-sided fitting, can bond 60 He of backboard
Substrate layer 30.Also, OCA optical cements have the characteristics that light penetration is higher, be conducive to the camera function for meeting camera 20.
During fitting backboard 60 and substrate layer 30, the first optical cement layer 70 has mobility, can at least fill
Part recess portion 31.Optionally, the first optical cement layer 70 is completely fills in concave part 31, it is possible to reduce the sky in concave part 31
The influence that gas expands with heat and contract with cold for the structure of display panel, and the optical property of the first transparent area 13 can be improved.Fig. 4 only shows
Anticipate and completely fills the embodiment of the first optical cement layer 70 in concave part 31.Optionally, the first special optics can be selected
Glue-line 70, for example, the first optical cement layer 70 thickness at 31 corresponding position of concave part is thicker, is conducive to fill concave part 31.
In some optional embodiments, Fig. 5 is refer to, Fig. 5 is another display device provided in an embodiment of the present invention
Part section structural representation.Fig. 5 has continued to use the reference numeral of Fig. 3, and something in common repeats no more.In the present embodiment, substrate
Layer 30 includes concave part 31, and concave part 31 is located in the first transparent area 13;The opening of concave part 31 is towards film transistor device
Layer 40, clamps between film transistor device layer 40 and substrate layer 30 and is provided with cushion 80, at least fill part of cushion 80
Concave part 31.Cushion 80 usually selects inorganic material to make, and the structure of inorganic material is dense, and cushion 80, which has, to be stopped
The function of steam, oxygen and impurity in air, prevents steam, oxygen and impurity from being spread by substrate layer 30, into display surface
Inside plate 10, and provide on the upper surface of substrate layer 30 flat surface, to make the films such as film transistor device layer 40
Rotating fields.In display device provided in this embodiment, the opening of concave part 31 is aobvious making towards film transistor device layer 40
During showing panel, at least fill part concave part 31 of cushion 80 is used.It is understood that when cushion 80 it is relatively thin,
And the depth of concave part 31 it is deeper when, cushion 80 is not enough to concave part 31 being filled up completely, in film transistor device layer 40
Part film layer be sequentially filled according to the sequencing of making in concave part 31.In the present embodiment, by substrate layer 30
Concave part 31 is set, the thickness of the substrate layer 30 in the first transparent area 13 is thinned, is conducive to improve the transmitance of light, lifting
The shooting performance of camera 20.
In some optional embodiments, Fig. 6 is refer to, Fig. 6 is another display device provided in an embodiment of the present invention
Part section structural representation.Fig. 6 has continued to use the reference numeral of Fig. 4, and in the present embodiment, organic hair is directed toward along substrate layer 30
The direction of optical diode device layer 50, display panel further include the encapsulated layer 81 and polarizing layer 82 for stacking and setting;Polarizing layer 82 wraps
The first hollow-out parts 821 are included, the first hollow-out parts 821 run through polarizing layer 82, the first hollow-out parts 821 along the thickness direction of polarizing layer 82
In the first transparent area 13.In display device provided in this embodiment, encapsulated layer 81 is used to seal display panel, encapsulated layer 81
Have the function of to stop steam and oxygen, the structure in organic light emitting diode device layer 50 can be protected from the water in air
The erosion of vapour and oxygen.Encapsulated layer 81 can be made of a film layer, can also be formed by multiple film stacks, the present embodiment pair
It is not specifically limited in the structure and material of encapsulated layer 81.Polarizing layer 82 has light a polarization, outside display panel
Light enters inside display panel by polarizing layer 82, and a portion light occurs reflex and generates reflected light, reflects
Light again passes by polarizing layer 82 when projecting to outside display panel, can be filtered by polarizing layer 82, polarizing layer 82 can eliminate aobvious
Show the reflected light of panel, lift display quality.Since polarizing layer 82 has polarization to light, it is provided with polarizing layer 82
First hollow-out parts 821, the first hollow-out parts 821 are located in the first transparent area 13, can further improve the light of display panel
Transmitance, lifts the shooting performance of camera 20.
In some optional embodiments, Fig. 7 is refer to, Fig. 7 is another display device provided in an embodiment of the present invention
Part section structural representation.Fig. 7 has continued to use the reference numeral of Fig. 6, and in the present embodiment, display panel 10 further includes the second light
Learn glue-line 83 and cover board 84, cover board 84 and polarizing layer 82 are bonded by the second optical cement layer 83;Second optical cement layer 83 is at least filled out
Fill the first hollow-out parts of part 821.Optionally, the material selection OCA optical cements of the second optical cement layer 83.It is provided in this embodiment aobvious
In showing device, cover board 84 can further stop steam, oxygen and impurity in air, and cover board 84 can include display
Damage of the inside film layer structure of panel 10 from external force.Optionally, cover board 84 is made using transparent glass material, but this hair
It is bright that this is not limited.
In some optional embodiments, please continue to refer to Fig. 7, film transistor device layer 40 include gate metal layer,
Source-drain electrode metal layer;Gate metal layer and source-drain electrode metal layer are not overlapped with the first transparent area 13.In the present embodiment, film crystal
Metal layer where the grid 411 of pipe 41 is gate metal layer, and the material of gate metal layer includes metal;Source electrode 413 and drain electrode
Metal layer where 414 is source-drain electrode metal layer, and the material of source-drain electrode metal layer includes metal.Due to the translucency of metal material
It is poor, in the present embodiment, set gate metal layer and source-drain electrode metal layer not overlapped with the first transparent area 13, to avoid reduction by the
The light penetration of one transparent area 13.
In some optional embodiments, please continue to refer to Fig. 7, organic light emitting diode device layer 50 include anode layer,
Organic luminous layer and cathode layer;Anode layer and organic luminous layer are not overlapped with the first transparent area 13.In the present embodiment, organic light emission
Film layer where the anode 511 of diode 51 is anode layer;Film layer where organic light emission portion 513 is organic luminous layer;Cathode
Film layer where 512 is cathode layer.In some optional implementations, anode layer is made using opaque material, cathode
Layer is made using transparent material, and anode layer is not overlapped with the first transparent area 13, to avoid the light of the first transparent area 13 is reduced
Transmitance;Display panel has light to send when being shown in organic light emission portion 513, organic luminous layer and the first transparent area
13 do not overlap, and influence the normal work of camera 20 to avoid the light in organic light emission portion 513.
The present invention provides a kind of manufacture method of display device, Fig. 8 is refer to, production method includes:
Step S1:Form display panel;Display panel is saturating including viewing area, the non-display area 12, first around viewing area
Light area 13, viewing area are set around the first transparent area 13;
Step S2:Assemble camera;The camera lens of camera is set towards the direction of display panel;Camera is to display panel
Orthographic projection be located in the first transparent area 13;
Specifically, please referring to Fig.2 and Fig. 4, display panel 10 includes viewing area 11, the non-display area around viewing area 11
12nd, the first transparent area 13, viewing area 11 are set around the first transparent area 13.The camera lens of camera 20 is towards the side of display panel 10
To setting;Orthographic projection of the camera 20 to display panel 10 is located in the first transparent area 13.
It refer to Fig. 9, in manufacture method provided in this embodiment, forming display panel includes:
Step S11:First substrate is provided;The first surface of first substrate includes lug boss;
Specifically, incorporated by reference to reference to figure 10, there is provided the first surface G10 of first substrate G1, first substrate G1 include protrusion
Portion G11.Optionally, the material of first substrate G1 is glass.
Step S12:Substrate layer is formed, substrate layer is covered in the first surface of first substrate;
Specifically, incorporated by reference to reference to figure 11, substrate layer 30 is formed, substrate layer 30 is covered in the first surface of first substrate G1
G10.Substrate layer 30 has the function that substrate, and the film layer structure subsequently to be manufactured in display panel provides substrate.
Step S13:Film transistor device layer is formed, film transistor device layer includes multiple thin film transistor (TFT)s;
Specifically, incorporated by reference to reference to figure 12, film transistor device layer 40 is formed, film transistor device layer 40 includes more
A thin film transistor (TFT) 41.
Optionally, thin film transistor (TFT) 41 includes grid 411, semiconductor portion 412, source electrode 413 and drain electrode 414.
Step S14:Organic light emitting diode device layer is formed, organic light emitting diode device layer includes multiple organic light emissions
Diode;
Specifically, incorporated by reference to reference to figure 13, organic light emitting diode device layer 50, organic light emitting diode device layer are formed
50 include multiple Organic Light Emitting Diodes 51.
Optionally, Organic Light Emitting Diode 51 includes anode 511, cathode 512 and is held and mounted on anode 511 and the moon
Organic light emission portion 513 between pole 512.Wherein, the anode of the drain electrode 414 of thin film transistor (TFT) 41 and Organic Light Emitting Diode 51
511 are electrically connected.
Step S15:Separate backing layer and first substrate;Substrate layer forms concave part, groove in the corresponding position of lug boss
Portion is located in the first transparent area, and the thickness of the substrate layer in the first transparent area is d1, the thickness of the substrate layer beyond the first transparent area
Spend for d2, d1 < d2.
Specifically, incorporated by reference to reference to figure 14, substrate layer 30 is separated with first substrate G1;Substrate layer 3030 is in lug boss
The corresponding positions of G11 form concave part 31, and concave part 31 is located in the first transparent area 13.It is recessed due to being provided with substrate layer 30
Groove portion 31, the thickness of the substrate layer 30 in the first transparent area 13 are thinned, and the thickness of the substrate layer in the first transparent area is d1, and first
The thickness of substrate layer beyond transparent area is d2, d1 < d2.
In the display device of manufacture method provided in this embodiment manufacture, the substrate layer 30 of display panel 10 sets fluted
Portion 31, so that the thickness of the substrate layer 30 in the first transparent area 13 is d1, the thickness of the substrate layer 30 beyond the first transparent area 13
Spend for d2, d1 < d2.It can meet the camera function of camera 20 in first transparent area 13 with transmitted light, also, by first
The thickness of substrate layer 30 in transparent area 13 is thinned, and can improve the light penetration of substrate layer 30 in the first transparent area 13.Phase
For the prior art, without display panel 10 is arranged to special shape to avoid the region where camera 20, be conducive to
Screen accounting is improved, lifts user experience.
Optionally, 5 are please referred to Fig.1, backboard can be bonded away from the side of film transistor device layer 40 in substrate layer 30
60, backboard 60 and substrate layer 30 are bonded by the first optical cement layer 70, the first optical cement layer 70 at least fill part concave part 31.
Optionally, the material selection OCA optical cements (Optically Clear Adhesive, abbreviation OCA) of the first optical cement layer 70, make
A kind of two-sided joint adhesive band of no basis material can be fabricated to OCA optical cements, the characteristic with two-sided fitting, can bond
Backboard 60 and substrate layer 30.Also, OCA optical cements have the characteristics that light penetration is higher, be conducive to meet camera 20
Camera function.During fitting backboard 60 and substrate layer 30, the first optical cement layer 70 has mobility, can at least fill
Part recess portion 31.Optionally, the first optical cement layer 70 is completely fills in concave part 31, it is possible to reduce the sky in concave part 31
The influence that gas expands with heat and contract with cold for the structure of display panel, and the optical property of the first transparent area 13 can be improved.
Optionally, the material of substrate layer 30 includes polyimides.Polyimides can be by being grafted different functional group's tune
The performance of section polyimides is adapted for the making technology of display panel.For example it can be improved using yellow polyimide poly-
Damage of the laser to film transistor device is prevented when being removed after imido resistance to elevated temperatures and processing procedure using laser.
On the one hand the embodiment of the present invention can meet the demand of display panel high temperature process using polyimides as the material of substrate layer,
On the other hand it is also prevented from damage of the laser to film transistor device.Subtracted by the thickness of the substrate layer in the first transparent area
It is thin, the light penetration of substrate layer in the first transparent area can be improved so that the first transparent area can place camera, so as to carry
Height screen accounting, lifts user experience.
The present invention provides the manufacture method of another display device, refer to Fig. 8, and production method includes:
Step S1:Form display panel;Display panel includes viewing area, the non-display area around viewing area, the first printing opacity
Area, viewing area are set around the first transparent area;
Step S2:Assemble camera;The camera lens of camera is set towards the direction of display panel;Camera is to display panel
Orthographic projection be located in the first transparent area;
Specifically, please referring to Fig.2 and Fig. 5, display panel 10 includes viewing area 11, the non-display area around viewing area 11
12nd, the first transparent area 13, viewing area 11 are set around the first transparent area 13.The camera lens of camera 20 is towards the side of display panel 10
To setting;Orthographic projection of the camera 20 to display panel 10 is located in the first transparent area 13.
Incorporated by reference to reference to figure 16, in manufacture method provided in this embodiment, forming display panel includes:
Step T11:First substrate is provided;
Specifically, incorporated by reference to reference to figure 17, there is provided first substrate G2.Optionally, the material of first substrate G2 is glass.
Step T12:Form substrate layer;Patterned substrate layer, forms concave part, and concave part is located in the first transparent area, the
The thickness of substrate layer in one transparent area is d1, and the thickness of the substrate layer beyond the first transparent area is d2, d1 < d2;
Specifically, incorporated by reference to reference to figure 18, substrate layer 30 is formed, patterned substrate layer 30, forms groove 31, concave part 31
In the first transparent area 13.Due to being provided with concave part 31 in substrate layer 30, substrate layer 30 in the first transparent area 13
Thickness is thinned, and the thickness of the substrate layer in the first transparent area is d1, and the thickness of the substrate layer beyond the first transparent area is d2, d1 <
d2。
Step T13:Form cushion, cushion at least fill part concave part;
Specifically, incorporated by reference to reference to figure 19, cushion 80, at least fill part concave part 31 of cushion 80 are formed.Buffering
Layer 80 usually select inorganic material make, the structure of inorganic material is dense, cushion 80 have stop air in steam,
The function of oxygen and impurity, prevents steam, oxygen and impurity from being spread by substrate layer 30, into inside display panel 10, and
Flat surface is provided on the upper surface of substrate layer 30, to make follow-up film layer structure.
Step T14:Film transistor device layer is formed, film transistor device layer includes multiple thin film transistor (TFT)s;
Specifically, incorporated by reference to reference to figure 20, film transistor device layer 40 is formed, film transistor device layer 40 includes more
A thin film transistor (TFT) 41.
Optionally, thin film transistor (TFT) 41 includes grid 411, semiconductor portion 412, source electrode 413 and drain electrode 414.
Step T15:Organic light emitting diode device layer is formed, organic light emitting diode device layer includes multiple organic light emissions
Diode;
Specifically, incorporated by reference to reference to figure 21, organic light emitting diode device layer 50, organic light emitting diode device layer are formed
50 include multiple Organic Light Emitting Diodes 51.
Optionally, Organic Light Emitting Diode 51 includes anode 511, cathode 512 and is held and mounted on anode 511 and the moon
Organic light emission portion 513 between pole 512.Wherein, the anode of the drain electrode 414 of thin film transistor (TFT) 41 and Organic Light Emitting Diode 51
511 are electrically connected.
Step T16:Separate first substrate and substrate layer.
Specifically, incorporated by reference to reference to figure 22, first substrate G2 and substrate layer 30 are separated.
In the display device of manufacture method provided in this embodiment manufacture, the substrate layer 30 of display panel 10 sets fluted
Portion 31, so that the thickness of the substrate layer 30 in the first transparent area 13 is d1, the thickness of the substrate layer 30 beyond the first transparent area 13
Spend for d2, d1 < d2.It can meet the camera function of camera 20 in first transparent area 13 with transmitted light, also, by first
The thickness of substrate layer 30 in transparent area 13 is thinned, and can improve the light penetration of substrate layer 30 in the first transparent area 13.Phase
For the prior art, without display panel 10 is arranged to special shape to avoid the region where camera 20, be conducive to
Screen accounting is improved, lifts user experience.
Optionally, the material of substrate layer 30 includes polyimides.
By above-described embodiment, the manufacture method of display device and display device provided by the invention, is at least realized
Following beneficial effect:
In the manufacture method of display device and display device provided by the invention, it is provided with the viewing area of display panel
First transparent area, orthographic projection of the camera to display panel are located in the first transparent area.Can be with transmitted light in first transparent area
To meet the camera function of camera, also, the thickness of the substrate layer in the first transparent area is thinned, the first printing opacity can be improved
The light penetration of substrate layer in area.Relative to the prior art, without display panel is arranged to special shape to avoid taking the photograph
Region as where head, is conducive to improve screen accounting, lifts user experience.
Although some specific embodiments of the present invention are described in detail by example, the skill of this area
Art personnel it should be understood that example above merely to illustrating, the scope being not intended to be limiting of the invention.The skill of this area
Art personnel are it should be understood that without departing from the scope and spirit of the present invention can modify above example.This hair
Bright scope is defined by the following claims.
Claims (14)
- A kind of 1. display device, it is characterised in that including:Display panel and camera;The camera lens of the camera is set towards the direction of the display panel;The display panel includes viewing area, the non-display area around the viewing area, the first transparent area;The viewing area is set around first transparent area;Orthographic projection of the camera to the display panel is located in first transparent area;The display panel includes the substrate layer, film transistor device layer, organic light emitting diode device for stacking gradually setting Layer;The film transistor device layer includes multiple thin film transistor (TFT)s, and the organic light emitting diode device layer has including multiple Machine light emitting diode;The thickness of the substrate layer in first transparent area is d1, the thickness of the substrate layer beyond first transparent area Spend for d2, d1 < d2.
- 2. display device according to claim 1, it is characterised in thatThe material of the substrate layer includes polyimides.
- 3. display device according to claim 1, it is characterised in thatD1=20%*d2.
- 4. display device according to claim 1, it is characterised in thatThe substrate layer includes concave part, and the concave part is located in first transparent area;The opening of the concave part deviates from the film transistor device layer.
- 5. display device according to claim 4, it is characterised in thatThe display panel further includes backboard, the first optical cement layer;The backboard and the substrate layer pass through first optics Glue-line bonds;First optical cement layer concave part at least described in fill part.
- 6. display device according to claim 1, it is characterised in thatThe substrate layer includes concave part, and the concave part is located in first transparent area;The opening of the concave part is towards the film transistor device layer, the film transistor device layer and the substrate layer Between clamping be provided with cushion, concave part described in the cushion at least fill part.
- 7. display device according to claim 1, it is characterised in thatThe direction of the organic light emitting diode device layer is directed toward along the substrate layer, the display panel further includes stacking and sets The encapsulated layer and polarizing layer put;The polarizing layer includes the first hollow-out parts, and first hollow-out parts are along the thickness direction of the polarizing layer through described inclined Photosphere, first hollow-out parts are located in first transparent area.
- 8. display device according to claim 7, it is characterised in thatThe display panel further includes the second optical cement layer and cover board, and the cover board and the polarizing layer pass through second optics Glue-line bonds;First hollow-out parts described in second optical cement layer at least fill part.
- 9. display device according to claim 1, it is characterised in thatThe film transistor device layer includes gate metal layer, source-drain electrode metal layer;The gate metal layer and the source-drain electrode metal layer are not overlapped with first transparent area.
- 10. display device according to claim 1, it is characterised in thatThe organic light emitting diode device layer includes anode layer, organic luminous layer and cathode layer;The anode layer and the organic luminous layer are not overlapped with first transparent area.
- A kind of 11. manufacture method of display device, it is characterised in that including:Form display panel;The display panel includes viewing area, the non-display area around the viewing area, the first transparent area, The viewing area is set around first transparent area;Assemble camera;The camera lens of the camera is set towards the direction of the display panel;The camera is shown to described Show that the orthographic projection of panel is located in first transparent area;The formation display panel includes:First substrate is provided;The first surface of the first substrate includes lug boss;Substrate layer is formed, the substrate layer is covered in the first surface of the first substrate;Film transistor device layer is formed, the film transistor device layer includes multiple thin film transistor (TFT)s;Organic light emitting diode device layer is formed, the organic light emitting diode device layer includes multiple Organic Light Emitting Diodes;Separate the substrate layer and the first substrate;The substrate layer forms concave part in the corresponding position of the lug boss, The concave part is located in first transparent area, and the thickness of the substrate layer in first transparent area is d1, and described The thickness of the substrate layer beyond one transparent area is d2, d1 < d2.
- 12. manufacture method according to claim 11, it is characterised in thatThe material of the substrate layer includes polyimides.
- A kind of 13. manufacture method of display device, it is characterised in that including:Form display panel;The display panel includes viewing area, the non-display area around the viewing area, the first transparent area, The viewing area is set around first transparent area;Assemble camera;The camera lens of the camera is set towards the direction of the display panel;The camera is shown to described Show that the orthographic projection of panel is located in first transparent area;The formation display panel includes:First substrate is provided;Form substrate layer;The substrate layer is patterned, forms concave part, the concave part is located in first transparent area, institute The thickness for stating the substrate layer in the first transparent area is d1, and the thickness of the substrate layer beyond first transparent area is D2, d1 < d2;Form cushion, concave part described in the cushion at least fill part;Film transistor device layer is formed, the film transistor device layer includes multiple thin film transistor (TFT)s;Organic light emitting diode device layer is formed, the organic light emitting diode device layer includes multiple Organic Light Emitting Diodes;Separate the first substrate and the substrate layer.
- 14. manufacture method according to claim 13, it is characterised in thatThe material of the substrate layer includes polyimides.
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