CN110277423A - The production method and display panel and display device of a kind of display panel - Google Patents
The production method and display panel and display device of a kind of display panel Download PDFInfo
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- CN110277423A CN110277423A CN201910574620.9A CN201910574620A CN110277423A CN 110277423 A CN110277423 A CN 110277423A CN 201910574620 A CN201910574620 A CN 201910574620A CN 110277423 A CN110277423 A CN 110277423A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 94
- 239000012788 optical film Substances 0.000 claims abstract description 123
- 239000010408 film Substances 0.000 claims abstract description 107
- 239000010410 layer Substances 0.000 claims description 528
- 239000010409 thin film Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 claims description 12
- 238000000231 atomic layer deposition Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004568 cement Substances 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
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- 238000000034 method Methods 0.000 abstract description 57
- 230000008569 process Effects 0.000 description 37
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- 238000005516 engineering process Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 238000002834 transmittance Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 5
- 238000005401 electroluminescence Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000009738 saturating Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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Abstract
The embodiment of the invention discloses a kind of production method of display panel and display panel and display devices.The production method of display panel includes: the clear area pad level for being formed on rigid basal layer and being located at and in clear area and being intervally arranged, and form patterned flexible base layer, after forming light emitting device layer and the first film encapsulated layer (TFE1 layers), successively remove the TFE1 layer being located in clear area and flexible base layer, to form the first optical film layer in the side for exposing clear area pad level, then remove rigid basal layer and clear area pad level, and formed with the first optical film layer in clear area to the second optical film layer being bonded.The embodiment of the present invention solves the problems, such as the problem of penetrance of light in clear area generally existing in existing transparent display panel is poor and the yield and technique of display panel are affected by segment difference.
Description
Technical field
This application involves but be not limited to display technology and semiconductor process technique field, espespecially a kind of production of display panel
Method and display panel and display device.
Background technique
With the development of display technology and flexible technology, it is more wide that transparence display and local transparence display are increasingly becoming application
A kind of general display requirement.
It there is also some problems in current transparent display panel as follows: first, due to only having yellow polyimide
(Polyimide, referred to as are as follows: PI) glue can bear higher temperature, and transparent PI glue can only often bear 250 degrees Celsius of (DEG C) left sides
Right temperature, at this stage can not be in flexible cryogenic polycrystalline silicon technology (Low Temperature Poly- so as to cause transparent PI glue
Silicon, referred to as are as follows: LTPS) applied in technique, thus yellow PI glue is a greatly barrier for transparence display
Hinder, the influence for light transmittance is very big；Second, in the technical process of production transparent display panel, due to thicker
Flexible substrates are engraved structure, bring pole since segment difference is excessive in the technique of subsequent backboard (Back Plate, referred to as are as follows: BP)
Big difficulty, and then have larger impact to yield and technique；Third, due in the setting of display panel clear area, some films
Layer need to remove, then matched again with other film layer, film layer after removing itself often with of other film layers
Poor with property, the matching of especially refractive index will receive larger impact, to further affect the penetrance of light.
It to sum up analyzes, in existing transparent display panel, due to using yellow PI glue and index matching after removal film layer
It is poor, and cause the penetrance of light in clear area poor；In addition, since the segment difference of luminous zone backboard is excessive, and to display surface
The product yield and production technology of plate have large effect.
Summary of the invention
In order to solve the above-mentioned technical problem, the embodiment of the invention provides a kind of production method of display panel, Yi Jixian
Show panel and display device, it is poor with the penetrance for solving light in clear area generally existing in existing transparent display panel
The problem of yield and technique of problem and display panel are affected by segment difference.
The embodiment of the present invention provides a kind of production method of display panel, comprising:
Form the clear area pad level being intervally arranged on rigid basal layer, and in the rigid basal layer and described transparent
Flexible base layer is formed on area's pad level, the clear area pad level is located at the clear area of the display panel；
Light emitting device layer and the first film encapsulated layer, the light emitting device layer shape are sequentially formed in the flexible base layer
The luminous zone of display panel described in Cheng Yu；
The first film encapsulated layer being located in the clear area and the flexible base layer are successively removed, it is sudden and violent after removal
Expose the clear area pad level；
The is formed far from the side of the rigid basal layer in the first film encapsulated layer and the clear area pad level
One optical film layer；
Successively remove the rigid basal layer and the clear area pad level, and in the flexible base layer far from described the
The side of one optical film layer forms the second optical film layer, and second optical film layer and first optical film layer of formation are in institute
Clear area is stated to fit.
Optionally, in the production method of display panel as described above, described successively remove is located in the clear area
The first film encapsulated layer and the flexible base layer, comprising:
Remove the first film encapsulated layer being located in the clear area；
Using the figure of the first film encapsulated layer after removing as exposure mask, the flexibility being located in the clear area is removed
Basal layer.
Optionally, described in the first film encapsulated layer and described in the production method of display panel as described above
Clear area pad level forms the first optical film layer far from the side of the rigid basal layer, comprising:
The second thin-film encapsulation layer is formed on the first film encapsulated layer and the clear area pad level；
Optical film layer, the optical film layer and second thin-film encapsulation layer are formed in second thin-film encapsulation layer
Refractive index matches.
Optionally, in the production method of display panel as described above, second thin-film encapsulation layer is inkjet printing IJP
Layer or optically clear adhesive OCA glue-line.
Optionally, described in the first film encapsulated layer and described in the production method of display panel as described above
Clear area pad level forms the first optical film layer far from the side of the rigid basal layer, comprising:
Coated optical glue and solidify on the first film encapsulated layer and the clear area pad level；
Protective film, the refractive index phase of the protective film and the optical cement are attached on the optical cement after the solidification
Match.
Optionally, in the production method of display panel as described above, described formed in the flexible base layer shines
Device layer, comprising:
The luminous zone backsheet layer and luminescent layer positioned at the luminous zone are sequentially formed in the flexible base layer.
It optionally, include that multiple intervals are set in the production method of display panel as described above, in the flexible base layer
The groove set, the depth of the groove is identical as the height of the clear area pad level, and the depth of the groove is described soft
60% to the 99% of the height of property basal layer.
Optionally, in the production method of display panel as described above, the first film encapsulated layer is single layer or lamination
Atomic layer deposition ALD layer.
Optionally, in the production method of display panel as described above, second optical film layer and first optics
The refractive index of film layer matches.
Optionally, in the production method of display panel as described above, the shape of the clear area pad level includes following
It is one or more: circle, rectangle, diamond shape and polygon.
The embodiment of the present invention provides also a kind of display panel, is made of the production method of such as any of the above-described display panel
The display panel out, the display panel include: luminous zone and the clear area that is intervally arranged between the luminous zone；
The luminous zone includes light emitting device layer and the flexible base layer for being set to the light emitting device layer backlight side, described
Light emitting device layer is provided with the first optical film layer far from the side of the flexible base layer, and the flexible base layer is far from photophore
The side of part layer is provided with the second optical film layer；Wherein, first optical film layer and second optical film layer are described
Area pellucida fits.
Optionally, in display panel as described above, the light emitting device layer is remote including being set to the flexible base layer
Luminous zone backsheet layer from the rigid basal layer side, and the luminous zone backsheet layer is set to far from the flexible substrates
The luminescent layer of layer side.
Optionally, in display panel as described above, the refraction of second optical film layer and first optical film layer
Rate matches.
Optionally, in display panel as described above, first optical film layer include refractive index match it is second thin
Film encapsulated layer and optical film layer.
The embodiment of the present invention provides also a kind of display device, comprising: the display panel as described in any of the above-described.
The production method and display panel and display device of display panel provided in an embodiment of the present invention, wherein display
The production method of panel includes: the clear area pad level for being formed on rigid basal layer and being located at and in clear area and being intervally arranged, and
Patterned flexible base layer is formed, after forming light emitting device layer and TFE1 layers, successively removes the TFE1 layer being located in clear area
And flexible base layer, clear area pad level is exposed after removal, to form first in the side for exposing clear area pad level
Optical film layer then removes rigid basal layer and clear area pad level, and formed with the first optical film layer in clear area to being bonded
The second optical film layer.The production side of display panel provided in an embodiment of the present invention, by being formed on rigid basal layer every row
The clear area pad level of cloth can form patterned and thinned in clear area flexible base layer, be conducive in subsequent technique
Flexible base layer in middle removal clear area, and be conducive to caused by being reduced due to removing flexible base layer in the subsequent process
Segment difference influences, and in improving display panel clear area while light light transmittance, also improves the production yield of display panel.Separately
Outside, the first optical film layer and the second optical film layer that refractive index matches reach the light loss of clear area in display panel
To minimum, the penetrance of light in clear area is further increased.
Detailed description of the invention
Attached drawing is used to provide to further understand technical solution of the present invention, and constitutes part of specification, with this
The embodiment of application technical solution for explaining the present invention together, does not constitute the limitation to technical solution of the present invention.
Fig. 1 is a kind of structural schematic diagram of transparent display panel in the prior art；
Fig. 2 is the schematic diagram to form a kind of technical process of transparent display panel shown in Fig. 1；
Fig. 3 is the remaining schematic diagram of film caused by the transparent display panel that is formed using technical process shown in Fig. 2；
Fig. 4 is a kind of workflow graph of the production method of display panel provided in an embodiment of the present invention；
Fig. 5 is a kind of schematic diagram of technical process in the production method of display panel provided in an embodiment of the present invention；
Fig. 6 is the schematic diagram of another technical process in the production method of display panel provided in an embodiment of the present invention；
Fig. 7 is a kind of structural representation of clear area pad level in the production method of display panel provided in an embodiment of the present invention
Figure；
Fig. 8 is that the structure of another clear area pad level in the production method of display panel provided in an embodiment of the present invention is shown
It is intended to；
Fig. 9 is the flow chart of the production method of another display panel provided in an embodiment of the present invention；
Figure 10 is the flow chart of the production method of another display panel provided in an embodiment of the present invention；
Figure 11 is the schematic diagram of another technical process in the production method of display panel provided in an embodiment of the present invention；
Figure 12 is the flow chart of the production method of another display panel provided in an embodiment of the present invention；
Figure 13 is a kind of structural schematic diagram of display panel provided in an embodiment of the present invention；
Figure 14 is the structural schematic diagram of another display panel provided in an embodiment of the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention
Embodiment be described in detail.It should be noted that in the absence of conflict, in the embodiment and embodiment in the application
Feature can mutual any combination.
Existing transparent display panel, such as electroluminescence display panel (Electro luminescent Display,
Referred to as are as follows: LED), ORGANIC ELECTROLUMINESCENCE DISPLAYS (Organic Light-Emitting Diode, referred to as are as follows: OLED) panel etc.,
By its low-power consumption, high color saturation, wide viewing angle, thin thickness, the excellent properties such as flexibility are able to achieve, are increasingly becoming display field
Main product, can be widely applied in the end products such as smart phone, tablet computer, TV.In addition, flexible display panels
Product is gradually shown with the mainstream that it can satisfy various special constructions and become development, it is transparent with the development of flexible technology
Display and local transparence display are increasingly becoming a kind of widely used display requirement.Along with wearable and augmented reality
The further expansion of (Augmented Reality, referred to as are as follows: AR) equipment etc. and innovate, flexible and transparent display panel at
For one of display application mode mostly important at this stage.
The penetrance that light in the clear area of existing transparent display panel is had been described above in above-mentioned background technique poor is asked
Topic, and the segment difference of luminous zone backboard is excessive, to have the problem of large effect to product yield and production technology.Below
It is described in detail in conjunction with the structure of transparent display panel, as shown in Figure 1, for a kind of knot of transparent display panel in the prior art
Structure schematic diagram illustrates the luminous zone 100a and clear area 100b of transparent display panel 100, the transparent display panel 100 in Fig. 1
Luminous zone 100a and clear area 100b in include following film layer: high temperature PI film layer 111, buffer layer (Buffer) 112, first
Gate insulating layer (Gate Insulation Layer, referred to as are as follows: GI layers) (following presentation are as follows: GI1 layers) 122, second grid are exhausted
Edge layer (following presentation are as follows: GI2 layers) 124 and interlayer dielectric layer (Interlayer Dielectric Layer, abbreviation are as follows: ILD
Layer) 126；It is provided with switching transistor and luminescent layer in the 100a of luminous zone, the film layer for forming switching transistor includes: active area
(Active Area, referred to as are as follows: AA) 121, GI1 layer 122, first grid layer (abbreviation are as follows: Gate1 layers) 123, GI2 layer 124, the
Two grid layers (referred to as are as follows: Gate2 layers) 125, ILD layer 126 and source-drain electrode layer (Source-Drain Electrode
Layer, referred to as are as follows: SD layers) 127；Following film layer: flatness layer is additionally provided on ILD layer 126 and SD layer 127
(Planarization Layer, referred to as are as follows: PLN layers) 131, pixel defining layer (Pixel Definition Layer, abbreviation
Are as follows: PDL) 132 and supporting layer (Photo Spacer, referred to as are as follows: PS) 133；Aperture and the filling use in hole in PLN layer 131
In the anode layer (Anode) 141 of connection transistor, technique forms sun before exposing in aperture and opening area on PDL132
Pole layer 141, and luminescent layer 142 is filled in hole, which is connected to the SD layer 127 of transistor, sets on the anode layer 141
It is equipped with luminescent layer (Electro-Luminescence, referred to as are as follows: EL layers) 142 and cathode layer (Cathode) 143；In addition, buffering
Light shield layer 113 is also provided in layer 112 and below AA121, (i.e. cathode layer 143 is remote for the outermost of display panel 100
Side from luminescent layer 142) it is additionally provided with encapsulated layer 150.
It can be seen that from the structure of transparent display panel 100 shown in Fig. 1.On the one hand, there is high temperature PI in the 100b of clear area
Film layer 111, buffer layer 112, GI1 layer 122, GI2 layer 124 and ILD layer 126, high temperature PI film layer 111 is yellow PI glue, to light transmission
The influence of light transmittance is very big in area 100b, and the refractive index of above-mentioned each film layer mismatches, and light sets out in interface layer
Raw reflection and refraction, further affect the penetrance of light, in addition, turning back back for light generates astigmatism phenomenon, to transparent aobvious
To show panel 100 may will form ghost image, strong influence display effect.On the other hand, as shown in Fig. 2, to be formed shown in Fig. 1
A kind of schematic diagram of technical process of transparent display panel does not illustrate the specific structure of 131 or less film layer of PLN layer in Fig. 2, only
The underlying process layer for schematically representing PLN layer 131 is ILD layer 126 and SD layer 127 and other film layers, anode layer 141
The film layer 160 of top is the photoresist layer 160 in exposure technology, is exposed using the region that black dotted lines mark out as deep hole in Fig. 2
Region, the depth L1 of the deep hole exposure area is 2.5 microns (um) and arrives 3um, and the exposure depth L2 in other regions is 1.5um, by
It is larger in the segment difference of PLN layer 131, film residual can be generated when forming PDL132, cause light transmittance inhomogenous.As shown in figure 3, being
The remaining schematic diagram of film caused by the transparent display panel formed using technical process shown in Fig. 2, due to biggish segment difference pair
Technique brings extreme difficulties, and the film residual phenomena generated when continuing film layer after its formation is as shown in Figure 3.
As can be seen that the transparent display panel 100 of existing structure shown in Fig. 1, and the backboard of luminous zone 100a may be deposited
The film residual the phenomenon that, to influence the illumination effect of transparent display panel 100, in the 100b of clear area, due to yellow PI glue and
The unmatched problem of refractive index between each film layer, can seriously affect the light transmittance of clear area 100b.Therefore, it is urgent to provide a kind of excellent
Technology mode improve above-mentioned each problem of existing transparent display panel 100.
The present invention provides following specific embodiment and can be combined with each other, for the same or similar concept or process
It may be repeated no more in some embodiments.
Fig. 4 is a kind of workflow graph of the production method of display panel provided in an embodiment of the present invention.It is provided in this embodiment
The production method of display panel, may include steps of:
S210 forms the clear area pad level being intervally arranged on rigid basal layer, which is located at display
The clear area of panel；
S220 forms flexible base layer on rigid basal layer and clear area pad level.
In the production method of the display panel of the embodiment of the present invention, mainly to saturating in flexible and transparent display panel manufacture craft
The generation type in area pellucida carries out improvement processing, and the display panel in the following embodiment of the present invention refers both to flexible and transparent display surface
Plate.Normally, in the manufacturing process of existing flexible and transparent display panel, one layer of flexible substrates can be made on rigid basal layer
Layer, the hardness basal layer can guarantee the stability of display panel structure in the production process, will be to this after completing
Rigid basal layer carries out removal processing, and above-mentioned hardness basal layer is, for example, the rigid substrate of glass substrate or other materials, flexible
Basal layer is usually high temperature PI glue material, since existing manufacture craft can not be to the high temperature in flexible and transparent display panel clear area
PI film layer carries out removal processing, the structure of transparent display panel 100 as shown in Figure 1, therefore, transparent display panel 100 it is transparent
The transparent effect of area 100b is had a greatly reduced quality.
As shown in figure 5, for a kind of signal of technical process in the production method of display panel provided in an embodiment of the present invention
Figure.In production method provided in an embodiment of the present invention, it is desirable that improve to the clear area 300b of display panel 300, to improve
The light transmittance of clear area 300b in manufacture craft unlike the prior art can be first on rigid basal layer 311
The clear area pad level 313 being intervally arranged is formed, which is set to the clear area 300b of display panel 300
In, certain interval is formed between each clear area pad level 313, and arrange the figure of established practice then.Then, clear area is being formed
On the basis of pad level 313, flexible base layer 312 is formed, the production method of the flexible base layer 312 for example can be coating PI
Glue is formed by PI film layer, due to foring interval on rigid basal layer 311 before forming flexible base layer 312
The clear area pad level 313 of arrangement includes multiple spaced grooves, package in these grooves in the flexible base layer 312
Clear area pad level 313, therefore, the depth of these grooves are identical as the height of clear area pad level 313, and the depth of these grooves
Degree is 60% to the 99% of the height of flexible base layer 312, in preferred embodiment, can be set the depth of groove by technological parameter
It is set to 90% to the 98% of the height of flexible base layer 312.In the technique for forming flexible base layer 312, display panel 300
Flexible base layer 312 is normal thickness, for example, 5um in luminous zone 300a (region of i.e. not set clear area pad level 313)
To 20um, the thickness of flexible base layer 312 is smaller in clear area 300b (being provided with the region of clear area pad level 313), example
For example 3000 angstromsIt arrives
S230 sequentially forms light emitting device layer and the first film encapsulated layer in flexible base layer, the light emitting device layer shape
At in the luminous zone of display panel.
Production method provided in an embodiment of the present invention is forming above-mentioned clear area pad level 313 and flexible base layer 312
On the basis of, the light emitting device layer that can form display panel (is shown so that light emitting device layer includes 321 and 322 as an example in Fig. 5
Out) and the first film encapsulates (Thin Film Encapsulation, referred to as are as follows: TFE) layer (following presentation are as follows: TFE1 layers)
331, wherein light emitting device layer (321 in such as Fig. 5 and 322) is formed in the luminous zone 300a of display panel 300, that is, is formed
In in the flexible base layer 312 of the not set clear area pad level 313 in lower section, (wrapped as shown in figure 5, illustrating light emitting device layer
321 and forming position 322) are included, which is the structure and film layer in display panel 300 with luminous power,
Position is set with the clear area pad level 313 in the 300b of clear area just at complementary positional relationship, TFE1 layer 331 is then for protecting
The device architecture in display panel 300 is protected, is open generation type, is i.e. all areas are all formed with the TFE1 layer 331.
In practical applications, the mode that light emitting device layer is formed in the embodiment of the present invention, may include: in flexible base layer
312 sequentially form luminous zone backsheet layer 321 and luminescent layer 322 on the position of 300 luminous zone 300a of display panel, wherein
Luminous zone backsheet layer 321 is the composite structure for controlling the transistor of the switch of luminescent layer 322, in luminous zone backsheet layer 321
The structure of transistor can be with reference to film layer AA121 to the SD layer 127 in Fig. 1, or the transistor of other process structures, this
Inventive embodiments are with no restrictions.In addition, luminescent layer 322 can be through evaporation process formation, TFE1 layer 331 can be single layer
Or stacked package layer, for example, ALD layer of single layer or lamination, it can be denoted as: TFE1-ALD layers.
S240 successively removes the first film encapsulated layer being located in clear area and flexible base layer, exposes after removal
Area pellucida pad level；
S250 forms the first optical film far from the side of rigid basal layer in the first film encapsulated layer and clear area pad level
Layer；
S260 successively removes rigid basal layer and clear area pad level；
S270 forms the second optical film layer, the second light of formation far from the side of the first optical film layer in flexible base layer
Film layer is learned to fit with the first optical film layer in clear area.
Production method provided in an embodiment of the present invention, in the light emitting device layer for forming luminous zone and (i.e. TFE1 layers of encapsulated layer
331) after, in order to improve the light transmittance of clear area 300b in display panel 300, which can be carried out
Film layer removes technique, and the principle for removing film layer is: removing the film layer that translucent effect is influenced in the 300b of clear area.
As shown in fig. 6, showing for another technical process in the production method of display panel provided in an embodiment of the present invention
It is intended to, the technique that film layer removes twice is carried out in the embodiment of the present invention, the film layer removed for the first time is positioned at clear area 300b
In TFE1 layer 331 and flexible base layer 312, that is, TFE1 layer 331 and flexible base layer 312 be located at clear area pad level
Part film layer right above 313, removes above-mentioned film layer until exposing clear area pad level 313.First time film layer removes
Afterwards, the side far from rigid basal layer 311, outmost film layer are the TFE1 layer 331 and clear area 300b in the 300a of luminous zone
In clear area pad level 313, at this point, in the side of TFE1 layer 331 and clear area pad level 313 far from rigid basal layer 311
The first optical film layer 341 is formed, that is, completes the film layer setting of 300 emission side of display panel.
It is above-mentioned it is stated that using the display panel 300 of production method provided in an embodiment of the present invention production to be flexible saturating
Bright display panel, second of film layer removal are the production of each device in completing display panel 300 for rigid basal layer 311
It moves back except the hardness basal layer 311, so that display panel 300 has flex capability, after removing the hardness basal layer 311, due to
In order to form the flexible base layer 312 being thinned in graphical and clear area 300b, i.e., the setting of above-mentioned clear area pad level 313 is
The clear area pad level 313 is the sacrificial layer in manufacturing process, in the subsequent process and to be removed.Removing above-mentioned hardness
After basal layer 311 and clear area pad level 313, the backlight side of display panel 300 is only arranged in the 300a of luminous zone flexible
Basal layer 312 can be in flexible base layer 312 in order to protect the structure of display panel 300 and realize good translucent effect
Side far from the first optical film layer 341 forms the second optical film layer 342, due to the film layer quilt completely in clear area 300b at this time
It removes, therefore the second optical film layer 342 formed fits with the first optical film layer 341 in clear area 300b.
It should be noted that selecting the principle of optical film layer in the embodiment of the present invention is: the second optical film layer 342 and first
The refractive index of optical film layer 341 matches, for example, the second optical film layer 342 is equal with the refractive index of the first optical film layer 341 is
Optimal situation is also possible to refractive index of the refractive index as close as the first optical film layer 341 of the second optical film layer 342,
Require light pass through two optical film layers interface when, reflection and refraction it is considerably less, not influence display effect as principle.
In addition, the first optical film layer 341 can also attach the protective film that one layer of rate of penetrating matches far from the side of the second optical film layer 342
343.Then, the subsequent other techniques of display panel 300 are completed.
The production method of display panel provided in an embodiment of the present invention is making compared with existing transparent display panel 100
Technologic difference and validity feature are as described below:
First, it include existing transparent display panel in the film layer of removal by removing all film layers in the 300b of clear area
Fail the flexible base layer 312 (being equivalent to the high temperature PI film layer in Fig. 1 in the 100b of clear area) removed in 100, improves transparent
The penetrance of area 300b；
Second, the clear area pad level 313 being intervally arranged is set on rigid basal layer 311, and in clear area pad level
The mode that flexible base layer 312 is formed in 313 structure basis, can form patterned flexible base layer 312, and make office
The thickness of flexible base layer 312 is very thin in portion region (clear area 300b), is conducive to remove clear area in the subsequent process
Flexible base layer 312 in 300b, and be conducive to reduce section caused by due to removing flexible base layer 312 in the subsequent process
Difference influences；
Third, remove in the 300b of clear area film layer (including successively remove TFE1 layer 331, flexible base layer 312 and saturating
Area pellucida pad level 313) and rigid basal layer 311 after, by the way that continuous and index matching optical film layer (packet up and down is arranged
Include the first optical film layer 341 and the second optical film layer 342) so that the light loss of clear area 300b can achieve in display panel 300
It minimizes, further improves the penetrance of light in the 300b of clear area.
The production method of display panel provided in an embodiment of the present invention forms on rigid basal layer 311 and is located at clear area
In 300b and the clear area pad level 313 that is intervally arranged, and patterned flexible base layer 312 is formed, forms light emitting device layer
After 320 and TFE1 layer 331, the TFE1 layer 331 being located in the 300b of clear area and flexible base layer 312 are successively removed, it is sudden and violent after removal
Expose clear area pad level 313, to form the first optical film layer 341 in the side for exposing clear area pad level 313, then
Remove rigid basal layer 311 and clear area pad level 313, and formed with the first optical film layer 341 in clear area 300b to being bonded
The second optical film layer 342.The production side of display panel provided in an embodiment of the present invention, by being formed on rigid basal layer 311
The clear area pad level 313 every arrangement, can be formed it is patterned and clear area 300b be thinned flexible base layer 312,
Be conducive to remove the flexible base layer 312 in the 300b of clear area in the subsequent process, and be conducive to reduce in the subsequent process
Segment difference caused by due to removing flexible base layer 312 influences, the light light transmittance in improving 300 clear area 300b of display panel
Meanwhile also improving the production yield of display panel 300.In addition, the first optical film layer 341 and the second light that refractive index matches
Film layer 342 is learned to further increase transparent so that the light loss of clear area 300b can achieve minimum in display panel 300
The penetrance of light in area 300b.
The above-mentioned clear area pad level 313 having been formed on rigid basal layer 311 is intervally arranged, and arranges established practice
Then figure.
In a kind of possible implementation of the embodiment of the present invention, if red, green and blue in display panel 300
(Red, Green, Blue, referred to as are as follows: RGB) sub-pixel be array arrangement and be that the figure of each sub-pixel is identical, then clear area
Pad level 313 can be identical as the shape of sub-pixel, and is intervally arranged.As shown in fig. 7, being display provided in an embodiment of the present invention
A kind of structural schematic diagram of clear area pad level in the production method of panel, the RGB sub-pixel illustrated in Fig. 7 (including 322R,
322G and 322B) be above-mentioned luminescent layer 322 luminescent color, the RGB sub-pixel in Fig. 7 is rectangle, and is array arrangement
Form, 313 (such as Fig. 7 of setting clear area pad level that can be spaced between pixel (one group RGB sub-pixel be a pixel)
It is shown), the setting clear area pad level 313 that can also be spaced between RGB sub-pixel.
In the alternatively possible implementation of the embodiment of the present invention, the size of the RGB sub-pixel in display panel 300
Different, arrangement mode is not array arrangement shown in Fig. 7 yet, but is arranged based on the light emission luminance of RGB sub-pixel different
Shape, size and the arrangement mode of color sub-pixels, the setting clear area pad level 313 that will be spaced between RGB sub-pixel should
The size and arrangement mode of clear area pad level 313 are referred to the size and arrangement form of each sub-pixel, for example, clear area is padded
The shape of high level 313 may include one or more of: the change of circle, rectangle, diamond shape, polygon and various relational graphs
Shape and combination.As shown in figure 8, for another clear area pad level in the production method of display panel provided in an embodiment of the present invention
Structural schematic diagram, R sub-pixel 322R and B the sub-pixel 322B in Fig. 8 is hexagon, and area is larger, due to G sub-pixel
The light emission luminance of 322G is higher, and therefore, the area of G sub-pixel 322G is smaller, and shape is pentagon, it can be seen that two G
Pixel 322G splicing is equivalent to a R sub-pixel 322R or B sub-pixel 322B, Fig. 8 with the shape of clear area pad level 313 and big
It is small it is identical as RGB sub-pixel for shown, i.e. the size and shape of clear area pad level 313 in some clear areas 300b
It is identical as R sub-pixel 322R or B sub-pixel 322B, the size and shape of the clear area pad level 313 in the 300b of some clear areas
It is identical as G sub-pixel 322G.
Optionally, Fig. 9 is the flow chart of the production method of another display panel provided in an embodiment of the present invention.In Fig. 4
On the basis of illustrated embodiment, in production method provided in an embodiment of the present invention, the TFE1 layer being located in the 300b of clear area is removed
331 and flexible base layer 312 implementation, i.e. the implementation of S240 may include:
S241 removes the first film encapsulated layer being located in clear area；
S242 removes the flexible base being located in clear area using the figure of the first film encapsulated layer after removing as exposure mask
Bottom.
In this hair embodiment, TFE1 floor 331 first can be removed using patterning process and be located at the area in the 300b of clear area
Domain during the patterning process, can form photoresist, and use pre-set pattern mask on TFE1 layer 331
Plate carries out exposure mask, exposure, development and etching technics, exposes flexible base layer 312 after removal in the 300b of clear area；Above description
TFE1 layer 331 is usually single layer or lamination ALD, as TFE1-ALD layers, since ALD layer is fine and close film layer, be can be used as hard
Property mask plate (Hard Mask), it can using above-mentioned TFE1-ALD layer be used as mask pattern, continue removal flexible base layer
312 are located at the region in the 300b of clear area.
The first film layer carried out in the embodiment of the present invention removes technique, i.e., is patterned technique to clear area 300b,
During being somebody's turn to do, using encapsulated layer (i.e. TFE1-ALD layers) figure is formed after patterning process, by the respective area of flexible base layer 312
Domain (i.e. flexible base layer 312 is located at the region in the 300b of clear area) all removes, until clear area pad level 313 is exposed,
Above-mentioned removal film layer technology mode removes two layers of film layer and uses only a photolithography plate (Mask), reduces light in technical process
Mechanical usage quantity, and reduce the correlation step of photoetching process, be conducive to save the process cost, and improve production
Efficiency reduces the production cost of product.
In production method provided in an embodiment of the present invention, the first optical film layer can be formed using different technology modes
341, the technology mode of two kinds of formation as described below, first optical film layer 341.
In an implementation of the embodiment of the present invention, as shown in Figure 10, for it is provided in an embodiment of the present invention another
The flow chart of the production method of display panel.On the basis of the various embodiments described above, production method provided in an embodiment of the present invention
It is shown on the basis of process shown in Fig. 4, forms the implementation of the first optical film layer 341, the i.e. reality of S250
Existing mode may include:
S251 forms the second thin-film encapsulation layer on the first film encapsulated layer and clear area pad level；
S252 forms optical film layer in the second thin-film encapsulation layer, the refraction of the optical film layer and the second thin-film encapsulation layer
Rate matches.
As shown in figure 11, show for another technical process in the production method of display panel provided in an embodiment of the present invention
It is intended to.In embodiments of the present invention, after removing TFE1 layer 331 and the flexible base layer 312 in the 300b of clear area, display panel
TFE1 layer 331 in 300 luminous zone 300a and the clear area pad level 313 in the 300b of clear area are exposed to the table of emission side
Face, the generation type that can form the second thin-film encapsulation layer (i.e. TFE2 layers) 341a, the TFE2 layers of 341a at this time are, for example, to be coated with
Ink-jet printed layer (Ink Jet Printing, referred to as are as follows: IJP) layer or optically clear adhesive (Optically Clear
Adhesive, referred to as are as follows: OCA) layer, it is denoted as: TFE2-IJP or TFE2-OCA；Then, it is pasted on TFE2-IJP or TFE2-OCA
Attached optical film layer 341b.
It should be noted that in above-mentioned technology mode, the refractive index of TFE2 layers of 341a material will with attached in subsequent technique
The refractive index of optical film layer 341b match, such as TFE2 layers of 341a refractive index equal or close to optical film layer 341b's
Refractive index, so that generation reflection and refraction that light is as few as possible in the intersection of two kinds of film layers, to improve the penetrance of light.
Furthermore it is also possible to attach the protective film 343 that one layer of refractive index matches on optical film layer 341b.
In an implementation of the embodiment of the present invention, as shown in figure 12, for it is provided in an embodiment of the present invention another
The flow chart of the production method of display panel.On the basis of the various embodiments described above, production method provided in an embodiment of the present invention
It is shown on the basis of process shown in Fig. 4, forms the implementation of the first optical film layer 341, the i.e. reality of S250
Existing mode may include:
S253 coated optical glue and solidifies on the first film encapsulated layer and clear area pad level；
S254 attaches protective film on optical cement after hardening, and the refractive index of the protective film and optical cement matches.
Technical process as shown in Figure 6 above.In embodiments of the present invention, the TFE1 layer 331 in the 300b of clear area is removed
After flexible base layer 312, TFE1 layer 331 in the luminous zone 300a of display panel 300 and transparent in the 300b of clear area
Area's pad level 313 is exposed to the surface of emission side, can be formed directly form the first optical film layer on TFE1 layer 331 at this time
341, the mode for forming first optical film layer 341 can be with are as follows: coated optical glue simultaneously solidifies, and the optical adhesive layer after solidification is
One optical film layer 341 then can attach the protective film 343 of index matching, protective film 343 on the first optical film layer 341
It is usually pre-set with the refractive index of the first optical film layer 341, with guarantee light two kinds of film layers intersection as far as possible
Few generation reflection and refraction, to improve the penetrance of light.
The production method of display panel provided in an embodiment of the present invention, carry out optical film layer setting technical process in, can
To use pre-production, good optical film layer is attached, and optical cement also can be used and coated and solidified, attaching later
Guarded cover film and counterdie.It is therefore desirable to protective film 343, optical film layer (or optical cement) (i.e. the first optical film layer 341) and guarantor
Continuous refractive index is formed between river bottom protection film (i.e. the second optical film layer 342), it is possible to reduce the light loss of clear area 300b, into one
Step improves the penetrance of light, and then improves the whole penetrance of display panel 300.
Production method based on the display panel that the above embodiment of the present invention provides, the embodiment of the present invention also provide a kind of aobvious
Show panel, the production method for the display panel which is provided by any of the above-described embodiment of the present invention is made.
It as shown in figure 13, is a kind of structural schematic diagram of display panel provided in an embodiment of the present invention.The embodiment of the present invention
The display panel 300 of offer is flexible and transparent display panel, i.e. the overall structure of the display panel 300 may include: luminous zone
The 300a and clear area 300b being intervally arranged between the 300a of luminous zone.
In the display panel 300 of the embodiment of the present invention, luminous zone 300a includes light emitting device layer 320 and is set to photophore
The flexible base layer 312 of 320 backlight side of part layer, the light emitting device layer 320 are provided with first far from the side of flexible base layer 312
Optical film layer 341, the flexible base layer 312 are provided with the second optical film layer 342 far from the side of light emitting device layer 320；Wherein,
First optical film layer 341 and second optical film layer 342 fit in clear area 300b.In addition, light emitting device layer 320 and
The TFE1 layer 331 for encapsulated electroluminescent device is additionally provided between one optical film layer 341.
Display panel provided in an embodiment of the present invention, for using in any embodiment shown in above-mentioned Fig. 4 to the Figure 12 of the present invention
Production method be made, and the above-mentioned production method mainly formation to clear area in flexible and transparent display panel manufacture craft
Mode carries out improvement processing.On the one hand, it removes to form optics in the clear area 330b of the display panel 300 of the embodiment of the present invention
All film layers before film layer, the film layer removed in the 300b of clear area includes TFE1 layers, flexible base layer 312, clear area pad level
313 with rigid basal layer 311, that is, includes the flexible substrates for failing to remove in existing transparent display panel 100 in the film layer removed
312 (being equivalent to the high temperature PI film layer in Fig. 1 in the 100b of clear area) of layer, so that the clear area of the display panel 300 completed the production
Only there is optical film layer, i.e., the first optical film layer 341 and second optical film layer that 300b fits in clear area in 300b
342, improve the penetrance of clear area 300b.On the other hand, the clear area of display panel 300 provided in an embodiment of the present invention
The light transmittance of 300b is higher, and due to using clear area pad level 313 to be used as sacrificial layer in manufacturing process, is formed graphical
And in the 300a of clear area be thinned flexible base layer 312, not only contribute to remove in the subsequent process in the 300b of clear area
Flexible base layer 312 also helps and reduces the influence of segment difference caused by due to removing flexible base layer 312 in the subsequent process.
It should be noted that the setting principle of optical film layer is in the embodiment of the present invention: the second optical film layer 342 and first
The refractive index of optical film layer 341 matches, for example, the second optical film layer 342 is equal with the refractive index of the first optical film layer 341 is
Optimal situation is also possible to refractive index of the refractive index as close as the first optical film layer 341 of the second optical film layer 342,
Require light pass through two optical film layers interface when, reflection and refraction it is considerably less, not influence display effect as principle.
In addition, the protection that one layer of refractive index matches can also be arranged far from the side of the second optical film layer 342 for the first optical film layer 341
Film 343.Display panel 300 provided in an embodiment of the present invention, by the way that continuous and index matching optical film layer up and down is arranged
(including the first optical film layer 341 and second optical film layer 342), so that the light loss of clear area 300b can be in display panel 300
Reach minimum, further improves the penetrance of light in the 300b of clear area.
Display panel 300 in the embodiment of the present invention, using in any embodiment shown in above-mentioned Fig. 4 to the Figure 12 of the present invention
Production method is made, which includes luminous zone 300a and be intervally arranged transparent between the 300a of luminous zone
It include light emitting device layer 320 and the flexible base layer for being set to 320 backlight side of light emitting device layer in area 300b, luminous zone 300a
312, which is provided with the first optical film layer 341, the flexible base layer far from the side of flexible base layer 312
312 sides far from light emitting device layer 320 are provided with the second optical film layer 342, first optical film layer 341 and second optics
Film layer 342 fits in clear area 300b.The display panel 300 of above structure, due to passing through rigid substrate in its manufacture craft
The clear area pad level 313 every arrangement being arranged on layer 311 can be formed patterned and is thinned in clear area 300b soft
Property basal layer 312, is conducive to remove the flexible base layer 312 in the 300b of clear area in the subsequent process, and be conducive to rear
Reducing segment difference caused by due to removing flexible base layer 312 in continuous technique influences, in improving 300 clear area 300b of display panel
While light light transmittance, the production yield of display panel 300 is also improved.In addition, the first optical film that refractive index matches
Layer 341 and the second optical film layer 342, so that the light loss of clear area 300b can achieve minimum in display panel 300, further
Ground improves the penetrance of light in the 300b of clear area.
Optionally, Figure 14 is the structural schematic diagram of another display panel provided in an embodiment of the present invention.Shown in Figure 13
In the structure basis of display panel 300, in display panel 300 provided in an embodiment of the present invention, light emitting device layer 320 may include
It is set to luminous zone backsheet layer 321 of the flexible base layer 312 far from 311 side of rigid basal layer, and is set to luminous zone back
Luminescent layer 322 of the plate layer 321 far from 312 side of flexible base layer.
In embodiments of the present invention, luminous zone backsheet layer 321 is the group for controlling the transistor of the switch of luminescent layer 322
Structure is closed, the structure of transistor can be with reference to film layer AA121 to the SD layer 127 in Fig. 1 in luminous zone backsheet layer 321, can also be with
For the transistor of other process structures, the embodiment of the present invention is with no restrictions.In addition, luminescent layer 322 can be and pass through evaporation process
It is formed, which is used to form the RGB sub-pixel of display panel 300.
It is stated that can use difference have to mode shape in the embodiment of the production method of the above-mentioned display panel of the present invention
At the first optical film layer 341.One way in which is coated optical glue and solidifies, to form the first optical film layer 341, such as Figure 13
Shown in the first optical film layer 341, be single layer structure.Another way is to be initially formed (i.e. TFE2 layers of the second thin-film encapsulation layer
341a), optical film layer 341b is re-formed, i.e. the first optical film layer 341 includes TFE2 layers of 341a and optical film layer 341b, such as Figure 14
It is shown, and require the refractive index of TFE2 layers of 341a and optical film layer 341b to match, such as the refractive index of TFE2 layers of 341a is equal to
Or the refractive index close to optical film layer 341b, so that light is in the generation reflection as few as possible of the intersection of two kinds of film layers and folding
It penetrates, to improve the penetrance of light.In addition, optical film layer 341b can also be arranged far from the side of the flexible base layer 312
The protective film 343 for thering is refractive index to match.
Based on the display panel that the above embodiment of the present invention provides, the embodiment of the present invention also provides a kind of display device, should
It include the display panel during this sends out embodiment any of the above-described in display device, and the display panel is by any of the above-described implementation of the present invention
The production method for the display panel that example provides is made.The manufacture craft and this hair of display device provided in an embodiment of the present invention
The manufacture craft of display panel is identical in bright the various embodiments described above, and technical effect having the same, therefore details are not described herein.
Although disclosed herein embodiment it is as above, the content only for ease of understanding the present invention and use
Embodiment is not intended to limit the invention.Technical staff in any fields of the present invention is taken off not departing from the present invention
Under the premise of the spirit and scope of dew, any modification and variation, but the present invention can be carried out in the form and details of implementation
Scope of patent protection, still should be subject to the scope of the claims as defined in the appended claims.
Claims (15)
1. a kind of production method of display panel characterized by comprising
The clear area pad level being intervally arranged is formed on rigid basal layer, and is padded in the rigid basal layer and the clear area
Flexible base layer is formed on high level, the clear area pad level is located at the clear area of the display panel；
Light emitting device layer and the first film encapsulated layer are sequentially formed in the flexible base layer, the light emitting device layer is formed in
The luminous zone of the display panel；
The first film encapsulated layer being located in the clear area and the flexible base layer are successively removed, is exposed after removal
The clear area pad level；
The first light is formed far from the side of the rigid basal layer in the first film encapsulated layer and the clear area pad level
Learn film layer；
The rigid basal layer and the clear area pad level are successively removed, and in the flexible base layer far from first light
The side for learning film layer forms the second optical film layer, and second optical film layer and first optical film layer of formation are described
Area pellucida fits.
2. the production method of display panel according to claim 1, which is characterized in that described successively to remove positioned at described
The first film encapsulated layer and the flexible base layer in area pellucida, comprising:
Remove the first film encapsulated layer being located in the clear area；
Using the figure of the first film encapsulated layer after removing as exposure mask, the flexible substrates being located in the clear area are removed
Layer.
3. the production method of display panel according to claim 1, which is characterized in that described to be encapsulated in the first film
The first optical film layer of side formation of layer and the clear area pad level far from the rigid basal layer, comprising:
The second thin-film encapsulation layer is formed on the first film encapsulated layer and the clear area pad level；
Optical film layer, the refraction of the optical film layer and second thin-film encapsulation layer are formed in second thin-film encapsulation layer
Rate matches.
4. the production method of display panel according to claim 3, which is characterized in that second thin-film encapsulation layer is spray
Ink printing IJP layers or optically clear adhesive OCA glue-line.
5. the production method of display panel according to claim 1, which is characterized in that described to be encapsulated in the first film
The first optical film layer of side formation of layer and the clear area pad level far from the rigid basal layer, comprising:
Coated optical glue and solidify on the first film encapsulated layer and the clear area pad level；
Protective film is attached on the optical cement after the solidification, the refractive index of the protective film and the optical cement matches.
6. the production method of display panel according to claims 1 to 5, which is characterized in that described in the flexible substrates
Light emitting device layer is formed on layer, comprising:
The luminous zone backsheet layer and luminescent layer positioned at the luminous zone are sequentially formed in the flexible base layer.
7. the production method of display panel according to claims 1 to 5, which is characterized in that wrapped in the flexible base layer
Multiple spaced grooves are included, the depth of the groove is identical as the height of the clear area pad level, and the groove
Depth is 60% to the 99% of the height of the flexible base layer.
8. the production method of display panel according to claims 1 to 5, which is characterized in that the first film encapsulated layer
For single layer or the atomic layer deposition ALD layer of lamination.
9. the production method of display panel according to claims 1 to 5, which is characterized in that second optical film layer with
The refractive index of first optical film layer matches.
10. the production method of display panel according to claims 1 to 5, which is characterized in that the clear area pad level
Shape includes one or more of: circle, rectangle, diamond shape and polygon.
11. a kind of display panel, which is characterized in that using the production method such as any one of claim 1~10 display panel
Produce the display panel, the display panel includes: luminous zone and the clear area that is intervally arranged between the luminous zone；
The luminous zone includes light emitting device layer and the flexible base layer for being set to the light emitting device layer backlight side, described to shine
Device layer is provided with the first optical film layer far from the side of the flexible base layer, and the flexible base layer is far from light emitting device layer
Side be provided with the second optical film layer；Wherein, first optical film layer and second optical film layer are in the clear area
It fits.
12. display panel according to claim 11, which is characterized in that the light emitting device layer is described soft including being set to
Property luminous zone backsheet layer of the basal layer far from the rigid basal layer side, and be set to the luminous zone backsheet layer far from institute
State the luminescent layer of flexible base layer side.
13. display panel according to claim 11, which is characterized in that second optical film layer and first optics
The refractive index of film layer matches.
14. display panel according to claim 11, which is characterized in that first optical film layer includes refractive index phase
The second thin-film encapsulation layer and optical film layer matched.
15. a kind of display device characterized by comprising the display panel as described in any one of claim 11~14.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110634935A (en) * | 2019-09-29 | 2019-12-31 | 武汉天马微电子有限公司 | Array substrate and display device |
| CN111682049A (en) * | 2020-06-19 | 2020-09-18 | 京东方科技集团股份有限公司 | Display substrate, display device and mask |
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Cited By (6)
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| CN110634935A (en) * | 2019-09-29 | 2019-12-31 | 武汉天马微电子有限公司 | Array substrate and display device |
| CN111682049A (en) * | 2020-06-19 | 2020-09-18 | 京东方科技集团股份有限公司 | Display substrate, display device and mask |
| CN111682049B (en) * | 2020-06-19 | 2023-08-22 | 京东方科技集团股份有限公司 | Display substrate, display device and mask |
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| US11770952B2 (en) * | 2020-07-01 | 2023-09-26 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
| WO2023226865A1 (en) * | 2022-05-23 | 2023-11-30 | 京东方科技集团股份有限公司 | Transparent display panel and preparation method therefor, and display apparatus |
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