WO2021035550A1

WO2021035550A1 - Manufacturing method of color filter layer, and display substrate and manufacturing method thereof

Info

Publication number: WO2021035550A1
Application number: PCT/CN2019/102901
Authority: WO
Inventors: 董永发; 黄冠达; 杨盛际; 卢鹏程; 王青; 童慧; 王宇; 申晓斌; 袁雄; 李东升; 邹荣园
Original assignee: 京东方科技集团股份有限公司
Priority date: 2019-08-27
Filing date: 2019-08-27
Publication date: 2021-03-04
Also published as: EP4024467A1; CN112714957A; EP4024467A4; US20210066400A1; US11587988B2

Abstract

A manufacturing method of a color filter layer, and a display substrate and a manufacturing method thereof. The display substrate comprises a carrier layer and multiple repeating units. Each repeating unit comprises a green film layer, a red film layer and a blue film layer. The green film layer, the red film layer and the blue film layer are provided at the carrier layer and directly contact a first surface of the carrier layer. On a plane parallel to the first surface of the carrier layer, in each repeating unit, the red film layer is provided at a first side of the green film layer, and the blue film layer is provided at a second side of the green film layer opposite to the first side. At least one of the red film layer and the blue film layer partially covers the green film layer. At least a portion of the green film layer does not overlap with the red film layer and the blue film layer. The display substrate can reduce the probability that color film layers will separate from a carrier layer.

Description

Preparation method of color film layer, display substrate and preparation method thereof

Technical field

The embodiment of the present disclosure relates to a preparation method of a color film layer, a display substrate and a preparation method thereof.

Background technique

Organic Light Emitting Display (OLED) has a wide range of applications in the display field due to its advantages of self-luminescence, wide viewing angle and fast response speed. Silicon-based OLED micro-displays are particularly widely used. They can be applied to head-mounted video players, head-mounted home theaters, head-mounted virtual reality simulators, head-mounted game consoles, pilot helmet systems, and head-mounted medical diagnostics System etc.

The performance of silicon-based OLED microdisplays is better than that of conventional silicon-based liquid crystal microdisplays. Silicon-based OLED microdisplays have the advantages of extremely fast response speed, good low-temperature characteristics, low power consumption, good mechanical properties, and strong shock resistance. The silicon-based OLED microdisplay includes an anode, a cathode, and a functional layer of organic materials between the anode and the cathode. The light-emitting process and principle of the silicon-based OLED microdisplay are to inject holes from the anode and electrons from the cathode. After the injected holes and electrons are transported to the light-emitting center through the carrier transport layer in the organic material functional layer, the holes and electrons Recombination then radiates light.

Summary of the invention

At least one embodiment of the present disclosure provides a display substrate that includes a carrier layer and a plurality of repeating units, wherein each repeating unit includes a green film layer, a red film layer, and a blue film layer, wherein the The green film layer, the red film layer and the blue film layer are arranged on the carrier layer and are in direct contact with the first surface of the carrier layer, and are parallel to the first surface of the carrier layer. On the plane, in each repeating unit, the red film layer is disposed on the first side of the green film layer, and the blue film layer is disposed on the first side of the green film layer opposite to the first side. Two sides; at least one of the red film layer and the blue film layer covers part of the green film layer; at least part of the green film layer does not overlap with the red film layer and the blue film layer .

For example, in the display substrate provided by at least one embodiment of the present disclosure, the adhesion of the green film layer is greater than the adhesion of the red film layer and the adhesion of the blue film layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, in each of the repeating units, the green film layer is located between the red film layer and the blue film layer, and the green film layer And the red film layer at least partially does not overlap, the green film layer and the blue film layer do not overlap at least partially, and the red film layer and the blue film layer do not overlap at all, at least one The blue film layer of the repeating unit partially covers the red film layer of the repeating unit adjacent thereto.

For example, in the display substrate provided by at least one embodiment of the present disclosure, in each of the repeating units, the red film layer and a part of the green film layer overlap to form a first overlap region; the blue The film layer overlaps a part of the green film layer to form a second overlap area.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the first overlap area and the second overlap area respectively account for 5%-20% of the total area of the green film layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the first overlapping area and the second overlapping area each account for 10% of the total area of the green film layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, there is no overlap between the first overlapping area and the second overlapping area.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the cross-sectional shape of the green film layer perpendicular to the carrier layer is a rounded rectangle; the red film layer overlaps part of the green film layer The part of the blue film layer is convex to the side away from the green film layer; the part of the blue film layer that overlaps part of the green film layer is convex to the side away from the carrier layer, and the blue film layer The overlapping part of the film layer and the red film layer of the repeating unit adjacent to the film layer protrudes toward the side away from the carrier layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the edges on both sides of the blue film layer are convex and concave in the middle; The height of the overlapping portion gradually decreases in the direction away from the green film layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the red film layer and the green film layer are formed at the first overlap region formed by overlapping the red film layer and a portion of the green film layer The total thickness of the stack is respectively greater than the thickness of the middle region of the red film layer and the thickness of the middle region of the green film layer, and the first overlap region formed by overlapping the red film layer and part of the green film layer The thickness of the red film layer is smaller than the thickness of the middle region of the red film layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the blue film layer and the green film layer at the second overlap region formed by overlapping the blue film layer and a portion of the green film layer The total thickness of the film layer stack is respectively greater than the thickness of the middle region of the blue film layer and the thickness of the middle region of the green film layer, and the second layer formed by overlapping the blue film layer and part of the green film layer The thickness of the blue film layer at the two overlapping regions is smaller than the thickness of the middle region of the blue film layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the surface of the blue film layer away from the carrier layer is recessed toward the carrier layer, and the blue film layer is positioned on the carrier layer. The projection is a rectangle with rounded corners, and the thickness of the peripheral edge area of the blue film layer is smaller than the thickness of the middle area of the blue film layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the surface of the green film layer away from the carrier layer is convex away from the carrier layer, and the orthographic projection of the green film layer on the carrier layer It is a rectangle with rounded corners, and the thickness of the peripheral edge area of the green film layer is smaller than the thickness of the middle area of the green film layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the orthographic projection of the red film layer on the carrier layer is a rounded rectangle, and the thickness of the peripheral edge area of the red film layer is smaller than that of the red film layer. The thickness of the middle region, and in each repeating unit, along the direction from the blue film layer to the red film layer, the thickness of the red film layer first increases and then decreases.

At least one embodiment of the present disclosure further provides a display substrate, the display substrate comprising: a base substrate; a light-emitting element and a color filter layer arranged on the base substrate are sequentially stacked; wherein, the color filter layer includes: The first color film layer and the second color film layer of the light-emitting element on the side away from the base substrate, the second color film layer partially covering the first color film layer, and the first color film layer The adhesion of the film layer is greater than the adhesion of the second color film layer.

For example, the display substrate provided by at least one embodiment of the present disclosure further includes a third color film layer, wherein the third color film layer partially covers the first color film layer, and the second color film layer partially covers the Covering the third color film layer; the adhesion of the third color film layer is greater than the adhesion of the second color film layer and less than the adhesion of the first color film layer.

For example, a display substrate provided by at least one embodiment of the present disclosure includes a display area and a peripheral area surrounding the display area, wherein the first color film layer, the second color film layer, and the third color film layer The color film layer is provided in the display area, the peripheral area is provided with a black matrix, the black matrix includes a first sublayer and a second sublayer that are stacked, the first sublayer and the first color film Layer, one of the second color film layer and the third color film layer is set in the same layer and with the same material, and the second sub-layer is the same as the first color film layer and the second color film layer It is arranged in the same layer and with the same material as the other of the third color film layers.

For example, a display substrate provided by at least one embodiment of the present disclosure includes a display area and a peripheral area surrounding the display area, wherein the first color film layer, the second color film layer, and the third color film layer The film layer is arranged in the display area, the peripheral area is arranged with a black matrix, and the black matrix includes a first sublayer, a second sublayer, and a third sublayer that are stacked, the first sublayer and the The first color film layer is arranged in the same layer, the second sublayer and the second color film layer are arranged in the same layer, and the third sublayer and the third color film layer are arranged in the same layer.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the display area includes a plurality of pixel units, and each pixel unit includes the first color film layer, the second color film layer, and the The third color film layer, in each of the pixel units, the first color film layer is located between the second color film layer and the third color film layer, and the first color film layer and the The second color film layer is at least partially non-overlapping, the first color film layer and the third color film layer are at least partially non-overlapping, and the second color film layer and the third color film layer are completely Without overlapping, the second color film layer of at least one pixel unit partially covers the third color film layer of the adjacent pixel unit.

For example, in the display substrate provided by at least one embodiment of the present disclosure, in each of the pixel units, the second color film layer partially covers the first color film layer to form a first overlap area, and The third color film layer partially covers the first color film layer to form a second overlap area, and both the first overlap area and the second overlap area have a light-shielding effect.

For example, in the display substrate provided by at least one embodiment of the present disclosure, in the display area, the first color film layer, the second color film layer, and the third color film layer are arranged in an array; In the peripheral area, the pattern of the black matrix is ring-shaped.

For example, the display substrate provided by at least one embodiment of the present disclosure further includes a filling material and a cover plate disposed on a side of the color filter layer away from the base substrate.

For example, in the display substrate provided by at least one embodiment of the present disclosure, the material of the base substrate is a silicon-based material.

At least one embodiment of the present disclosure provides a method for preparing a color film layer, the color film layer includes a plurality of repeating units, and forming each repeating unit includes: forming a first color film layer; and forming the first color film After layering, a second color film layer partially covering the first color film layer is formed; wherein the adhesion of the first color film layer is greater than that of the second color film layer; a plurality of the The first color film layers of the repeating unit are formed in the same patterning process, the second color film layers of the multiple repeating units are formed in the same patterning process, and the third color film layers of the multiple repeating units are formed in the same patterning process. The color film layer is formed in the same patterning process.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the air permeability of the second color film layer is greater than the air permeability of the first color film layer.

For example, the preparation method provided by at least one embodiment of the present disclosure further includes: after forming the first color film layer and before forming the second color film layer, forming a third color film layer, wherein the first color film layer is formed. A three-color film layer partially covers the first color film layer, and the second color film layer partially covers the third color film layer; the adhesion of the third color film layer is greater than that of the second color film layer The adhesiveness is less than that of the first color film layer.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the air permeability of the third color film layer is greater than the air permeability of the first color film layer and less than the air permeability of the second color film layer.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the first color film layer is a green film layer, the second color film layer is a blue film layer, and the third color film layer is a red film layer.膜层。 Film layer.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the material of the first color film layer includes a base material and a first color material; the material of the second color film layer includes the base material and a second color film. Color material; and the material of the third color film layer includes the base material and a third color material.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the matrix material includes propylene glycol monomethyl ether ester, 3-methoxybutyl acetate and acrylic resin; the first color material includes C ₃₂ Cl ₁₆ CuN ₈ , C ₁₆ H ₁₁ N ₅ O ₄ and auxiliary green pigments; the second color material includes 2-butanone, phthalocyanine blue and auxiliary blue pigment; the third color material includes 2-butanone , C ₂₈ H ₁₆ N ₂ O ₄ , C ₁₆ H ₉ N ₅ O ₆ and auxiliary red pigments.

For example, in the preparation method provided by at least one embodiment of the present disclosure, in terms of mass percentage, the material of the first color film layer includes 50 wt% to 60 wt% of propylene glycol monomethyl ether ester, and 20 wt% to 25 wt% 3-methoxybutyl acetate, 1wt%-10wt% acrylic resin, 5wt%-11wt _{% C 32} Cl ₁₆ _{CuN 8} , 3wt%-10wt% C ₁₆ H ₁₁ N ₅ O ₄ , 1wt %～10wt% of auxiliary green pigment; the material of the second color film layer includes 60wt%～75wt% of propylene glycol monomethyl ether ester, 9wt%～14wt% of 3-methoxybutyl acetate, 5wt% %-10wt% acrylic resin, 0.05wt%-0.5wt% 2-butanone, 3wt%-10wt% phthalocyanine blue, 1wt%-10wt% auxiliary blue pigment; and the third color film layer The materials include 60wt%～70wt% propylene glycol monomethyl ether ester, 10wt%～30wt% 3-methoxybutyl acetate, 2wt%～10wt% acrylic resin, 0.05wt%～0.5wt% 2-Butanone, 2wt%-10wt% C ₂₈ H ₁₆ N ₂ O ₄ , 0.5wt%-3wt% C ₁₆ H ₉ N ₅ O ₆ , 1wt%-10wt% auxiliary red pigment.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the viscosity of the material of the first color film layer is 8.1 mPa·s to 9.0 mPa·s, and the viscosity of the material of the second color film layer is 7.5. mPa·s to 8.0 mPa·s, and the viscosity of the material of the third color film layer is 4 mPa·s to 4.6 mPa·s.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the viscosity of the material of the first color film layer is 8.4 mPa·s, and the viscosity of the material of the second color film layer is 7.8 mPa·s, and The viscosity of the material of the third color film layer is 4.4 mPa·s.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the areas of the first color film layer, the second color film layer, and the third color film layer are all less than 20 μm ² ; The preparation temperature of the film layer, the second color film layer and the third color film layer is less than 90°C.

For example, in the preparation method provided by at least one embodiment of the present disclosure, a spin coating process is used to form a first color film, a second color film, and a third color film, and then the first color film and the second color film are respectively processed. The film and the third color film are subjected to a patterning process to form the first color film layer, the second color film layer, and the third color film layer.

For example, at least one embodiment of the present disclosure further provides a method for preparing a display substrate, the preparation method includes: providing a base substrate; forming a light-emitting element on the base substrate; The preparation method forms a color film layer on the side of the light-emitting element away from the base substrate.

For example, the preparation method provided by at least one embodiment of the present disclosure further includes forming a passivation layer on the side of the light-emitting element away from the base substrate before forming the color filter layer; After that, the method further includes sequentially forming a filling material and a cover plate on the side of the color filter layer away from the base substrate.

For example, in the preparation method provided by at least one embodiment of the present disclosure, the material of the base substrate is a silicon-based material.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present invention more clearly, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present invention, rather than limit the present invention. .

Figure 1 is a schematic diagram of a cross-sectional structure of a silicon-based OLED microdisplay;

2 is a flowchart of a method for preparing each repeating unit of a color film layer according to an embodiment of the present disclosure;

3A to 3B are process diagrams of a method for preparing each repeating unit of a color film layer according to an embodiment of the present disclosure;

4 is a flowchart of another method for preparing each repeating unit of a color film layer according to an embodiment of the present disclosure;

5A to 5C are process diagrams of another method for preparing each repeating unit of a color film layer according to an embodiment of the present disclosure;

6A is a schematic diagram of a cross-sectional structure of a display substrate provided by an embodiment of the present disclosure;

6B is an electron microscope diagram of a cross-sectional structure of a color filter layer included in a display substrate according to an embodiment of the present disclosure;

FIG. 7 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the present disclosure;

8A to 8E are process diagrams of a method for manufacturing a display substrate according to an embodiment of the present disclosure;

9A is a schematic diagram of a cross-sectional structure of a display substrate provided by an embodiment of the present disclosure;

9B is a schematic diagram of a cross-sectional structure of still another display substrate provided by an embodiment of the present disclosure;

10A is a schematic diagram of a cross-sectional structure of another display substrate provided by an embodiment of the present disclosure;

10B is a schematic cross-sectional view of still another display substrate provided by an embodiment of the present disclosure;

11 is a schematic partial cross-sectional view of still another display substrate provided by an embodiment of the present disclosure;

FIG. 12A is a schematic diagram of a planar structure of a display substrate provided by an embodiment of the present disclosure;

FIG. 12B is a schematic diagram of a cross-sectional structure of the display substrate in FIG. 12A;

FIG. 13 is a schematic diagram of area division of a display substrate provided by an embodiment of the present disclosure; and

FIG. 14 is a schematic cross-sectional view of a display substrate provided by an embodiment of the disclosure.

Reference signs:

1-silicon-based substrate; 2- spacer; 3- luminescent layer and functional layer; 4- thin film encapsulation layer; 5- color filter; 6-curing glue; 7-glass cover plate; 100-carrying layer; 108-repeating unit; 201, 3041-first color film layer; 202, 3042-second color film layer; 203-third color film layer; 300-display substrate; 101, 301-base substrate; 102-first Insulation layer; 302-light-emitting element; 3021, 115-anode; 3022, 116, 105-light-emitting functional layer; 3023, 117- cathode; 303-passivation layer; 200, 304, 119- color film layer; 3043-third color film Layer; 305-filling material; 306-cover plate; 10-display area; 12, 20, 140-peripheral area; 50-black matrix; 501-first sub-layer; 502-second sub-layer; 503-third sub-layer Layer; 110-array substrate; 113-silicon substrate; 410-light emitting element; 420-silicon base substrate; 430-pixel circuit; 440-light reflection layer; 450-insulating layer; 451-metal member; 452-via 453-pad; 454-opening; 107,211-first thin-film encapsulation layer; 118-second thin-film encapsulation layer; 120-cover plate; 12a-connection electrode area; 121-first dummy area; 122-second dummy area 103-first electrode pattern; 1030-first electrode; 103a-connection electrode pattern; 103a0-connection electrode; de1-first dummy electrode pattern; de10-first dummy electrode; 106-second electrode; 103b-sensor electrode Pattern; 103b0-sensor electrode; de2-second dummy electrode pattern; de20-second dummy electrode; 1211-first dummy sub-region; 1212-second dummy sub-region; 104a-first filling layer; 104c-insulating wrapping layer 103e-edge first electrode; 104-pixel definition layer; 1040-pixel definition part; 104b-second filling layer; 104b0-second filling part; 1043-third filling layer; 10430-third filling part; 109- Conductive pattern; 1091-first conductive part; 1092-second conductive part; 1093-third conductive part; 601-power line; 602-data line; 603-gate insulating layer; 604-first insulating layer; 605-th Two insulating layer.

detailed description

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

Unless otherwise defined, the technical or scientific terms used in the present disclosure shall have the usual meanings understood by those with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "include" and other similar words mean that the elements or items appearing before the word cover the elements or items listed after the word and their equivalents, but do not exclude other elements or items. Similar words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right", etc. are only used to indicate the relative position relationship. When the absolute position of the described object changes, the relative position relationship may also change accordingly.

Silicon-based organic light-emitting diode (OLED) micro-displays have a wide range of applications in the display field because of their high integration, small size, ultra-high contrast, and ultra-high PPI display. Colored silicon-based OLED microdisplays are generally thin-film encapsulated immediately after the silicon-based OLED microdisplay is prepared, and then the color filter is prepared, that is, the color filter is directly formed on the packaged silicon-based OLED microdisplay . For example, FIG. 1 is a schematic diagram of a cross-sectional structure of a colored silicon-based OLED microdisplay. As shown in Figure 1, a silicon-based substrate 1 is provided with a light-emitting layer that emits white light and an auxiliary functional layer 3 (for example, a hole injection layer, a hole transport layer, an electron transport layer and/or an electron injection layer). Layer), spacers 2 separating pixels, thin-film encapsulation layer 4 arranged on the light-emitting layer and functional layer 3, color filters 5 arranged on the thin-film encapsulation layer 4, arranged on the color filters 5 The glass cover plate 7 is used to bond the silicon-based substrate 1 and the curing glue 6 of the glass cover plate 7. Since the color filter 5 is formed on the silicon-based OLED micro-display, a lower temperature (<90° C.) needs to be used in the process of manufacturing the color filter 5, otherwise it will have an adverse effect on the silicon-based OLED micro-display. At present, the process for preparing large-size color filters 5 under high temperature conditions is relatively mature, and the process for preparing color filters 5 with an area of a few square microns and a thickness of a few microns under the condition of a process temperature of less than 90°C is still not enough. It is not very mature, and when the color filter 5 is prepared at a lower temperature, the problem of poor adhesion between the color filter 5 and the glass cover 7 is likely to occur, and the thickness of the color filter 5 may also be uneven. And in the subsequent display process, the moiré is serious and other problems.

At least one embodiment of the present disclosure provides a method for preparing a color film layer, the color film layer includes a plurality of repeating units, and forming each repeating unit includes: forming a first color film layer; and after forming the first color film layer, Forming a second color film layer partially covering the first color film layer; wherein the adhesion of the first color film layer is greater than that of the second color film layer; the first color of the plurality of repeating units The film layers are formed in the same patterning process, the second color film layers of the multiple repeating units are formed in the same patterning process, and the third color film layers of the multiple repeating units are formed in the same patterning process Formed, the color filter layer prepared by this method can reduce the risk of peeling of the color filter layer from the carrier layer.

It should be noted that the adhesion of the first color film layer is greater than that of the second color film layer, which is relative to the same carrier layer, that is, the first color film layer and the second color film layer are located on the same carrier layer. On the layer, the adhesion between the first color film layer and the carrier layer is greater than the adhesion between the second color film layer and the carrier layer.

For example, the first color film layer with high adhesion is formed first, and the second color film layer with low adhesion is formed later, and the second color film layer with low adhesion is partially covered on the first color with high adhesion. On the film layer, this can reduce the contact area between the second color film layer with low adhesion and the carrier layer. The first color film layer and the second color film layer have similar properties. The adhesion force between the first color film layer and the second color film layer is greater than the adhesion force between the second color film layer and the carrier layer. Compared with the case where the two-color film layer does not cover the first color film layer at all, the second color film layer partially covers the first color film layer to reduce the overall occurrence of the first color film layer and the second color film layer from the carrier layer Possibility of peeling.

In addition, due to the low adhesion of the second color film layer and good fluidity, in the process of forming the second color film layer, the overall distance of the first color film layer and the second color film layer away from the carrier layer can be reduced. The content of surface bubbles can improve the uniformity of the film thickness of the entire first color film layer and the second color film layer at the position where the two overlap.

For example, FIG. 2 is a flowchart of a method for preparing a color film layer according to an embodiment of the present disclosure. As shown in Figure 2, the color film layer includes multiple repeating units, and the preparation method of each repeating unit includes the following steps:

Step S11: forming a first color film layer.

Step S12: after forming the first color film layer, forming a second color film layer partially covering the first color film layer, wherein the adhesion of the first color film layer is greater than that of the second color film layer.

For example, the first color film layers of multiple repeating units are formed in the same patterning process, the second color film layers of multiple repeating units are formed in the same patterning process, and the third color film layers of multiple repeating units are formed in the same patterning process. Formed in the process.

It should be noted that "the second color film layer that partially covers the first color film layer" means that when the color film layer is used in a display device, there is only a part of the second color film layer in each pixel unit. Covering the first color film layer, and the part of the second color film layer continuously covers the surface of one side of the first color film layer, instead of the second color film layer covering all the first color film layer, Nor is the second color film layer covering the first color film layer at intervals.

For example, adhesiveness is also called adhesiveness or tackiness, which refers to the force of bonding when two or more objects are in contact with each other. The adhesiveness of the first color film layer is greater than that of the second color film layer. Attachment means that when the first color film layer and the carrier layer (for example, the cathode of the light-emitting element mentioned later) are in contact with each other, the combined force is greater than that of the second color film layer and the carrier layer (for example, the light-emitting element mentioned later). When the cathode is in contact with each other, it means that the first color film layer is less likely to peel off the carrier layer than the second color film layer.

For example, the air permeability of the second color film layer is greater than the air permeability of the first color film layer. Since the adhesion of the second color film layer is less than that of the first color film layer, in the process of forming the second color film layer, the fluidity of the material of the second color film layer is better, and the second color film layer is finally formed. The air permeability of the color film layer is also better.

It should be noted that the above-mentioned air permeability refers to the permeability of gas to the first color film layer or the permeability to the second color film layer. For example, the first color film layer and the second color film layer are both microporous and breathable films. For example, the air permeability of the first color film layer per minute per square meter is 10 ml to 300 ml; the air permeability of the second color film layer per minute per square meter is 500 ml to 1000 ml.

For example, FIGS. 3A to 3B are process diagrams of a method for preparing each repeating unit of a color filter layer according to an embodiment of the present disclosure.

As shown in FIG. 3A, a first color film layer 201 spaced apart from each other is formed on the carrier layer 100. In FIG. 3A, the distance between any two adjacent first color film layers 201 is equal. According to different requirements, the distance between two adjacent first color film layers 201 may also be unequal, which is not limited here.

For example, as shown in FIG. 3B, a second color film layer 202 is formed between any two adjacent first color film layers 201, and the second color film layer 202 is at the edge of the boundary with the first color film layer 201 Cover the two adjacent first color film layers 201. For example, the first color film layer 201 and the second color film layer 202 constitute the color film layer 200.

For example, in the process of forming the color film layer 200, the first color film layer 201 with higher adhesion is formed first, the second color film layer 202 with lower adhesion is formed later, and the second color film layer 202 with lower adhesion is formed later. The film layer 202 partially covers the first color film layer 201 with high adhesion, so that the contact area between the second color film layer 202 with low adhesion and the carrier layer 100 can be reduced. The base material of the first color film layer 201 and the base material of the second color film layer 202 are approximately the same, so that the adhesion between the first color film layer 201 and the second color film layer 202 is greater than that between the second color film layer 202 and the second color film layer 202. Adhesion between the load-bearing layers 100. For example, the base materials of the first color film layer 201 and the second color film layer 202 may both include propylene glycol monomethyl ether ester, 3-methoxybutyl acetate and acrylic resin, so that it is compatible with the second color film layer 202. Compared with the case where the first color film layer 201 is not covered at all, the second color film layer 202 partially covering the first color film layer 201 can reduce the overall separation of the first color film layer 201 and the second color film layer 202 from the carrier layer 100. Possibility of peeling.

In addition, because the second color film layer 202 has low adhesion and good fluidity, in the process of forming the second color film layer 202, the overall weight of the first color film layer 201 and the second color film layer 202 can be reduced. The content of air bubbles on the surface away from the carrier layer 100 can improve the uniformity of the film thickness of the entire first color film layer 201 and the second color film layer 202 at the position where the two overlap. As shown in FIG. 3B, the surface of the second color film layer 202 is flat at the position where the second color film layer 202 covers the first color film layer 201.

At present, no black matrix (BM) is provided in the color film layer fabricated on the silicon-based OLED microdisplay. This is because in the process of forming the metal black matrix (formed from low-reflectivity chromium) by the sputtering process, it will adversely affect the thin-film encapsulation layer in the silicon-based OLED microdisplay, and then adversely affect the light-emitting element; and The use of resin materials to form the black matrix cannot achieve high accuracy. However, the lack of a black matrix reduces the contrast of the silicon-based OLED microdisplay and affects the display effect. When the color film layer is integrated on the silicon-based OLED micro-display, although the integration of the silicon-based OLED micro-display is improved, from the perspective of industrialization, it will affect the qualification rate of the final product. Once there is a problem in the filming process, the silicon-based OLED microdisplay will be scrapped, thereby increasing the production cost.

For example, when the color film layer shown in FIG. 3B is used in a display device, in a pixel unit, one edge of the second color film layer 202 overlaps with the edge of the adjacent first color film layer 201, such that The overlapping position of the second color film layer 202 and the first color film layer 201 can block the light from passing through, which can play a role similar to the black matrix, thereby solving the problem caused by the lack of the black matrix and avoiding the problem. The risk of scrapping of silicon-based OLED micro-displays brought about by the preparation of the black matrix.

For example, as shown in FIG. 3B, in two adjacent pixel units, the two edges of the second color film layer 202 overlap with the edges of the two adjacent first color film layers 201 respectively, that is, the second One edge of the color film layer 202 covers the first color film layer 201 included in the pixel unit where it is located, so that the edges of the two sub-pixel units in a pixel unit overlap, so as to block light from passing through, and play a Similar to the role of the black matrix. The other edge of the second color film layer 202 covers the first color film layer 201 included in the pixel unit adjacent to the pixel unit in which it is located, so that the edges of two adjacent pixel units can be overlapped, which can block The light passes through and acts like a black matrix.

For example, FIG. 4 is a flowchart of another method for preparing each repeating unit of a color film layer provided by an embodiment of the present disclosure. As shown in Fig. 4, the preparation method of the color film layer includes the following steps:

Step S21: forming a first color film layer.

Step S22: forming a third color film layer partially covering the first color film layer, wherein the adhesion of the third color film layer is lower than that of the first color film layer.

Step S23: forming a second color film layer partially covering the first color film layer and a second color film layer partially covering the third color film layer, wherein the adhesion of the second color film layer is less than that of the first color film layer, The adhesion of the second color film layer is less than the adhesion of the third color film layer.

It should be noted that the adhesion of the second color film layer is less than that of the third color film layer, which is also relative to the same carrier layer, that is, the second color film layer and the third color film layer are located on the same carrier layer. On the layer, the adhesion between the second color film layer and the carrier layer is less than the adhesion between the third color film layer and the carrier layer.

For example, the manufacturing method shown in FIG. 4 is different from the manufacturing method shown in FIG. 2 in that after forming the first color film layer and before forming the second color film layer, it further includes forming a third color film layer. The third color film layer partially covers the first color film layer, and the second color film layer partially covers the third color film layer; the adhesion of the third color film layer is greater than that of the second color film layer and smaller than that of the first color film layer. Adhesion of the color film.

It should be noted that "the third color film layer partially covering the first color film layer" means that when the color film layer is used in a display device, in each pixel unit, only a part of the third color film layer Covered on the first color film layer, and the part of the third color film layer is continuously covered on the surface of one side of the first color film layer, instead of the third color film layer being completely covered on the first color film layer , Nor is the third color film layer covering the first color film layer at intervals.

It should also be noted that "the second color film layer partially covering the first color film layer and the second color film layer partially covering the third color film layer" means that when the color film layer is used in a display device, in each pixel unit , Only a part of the second color film layer is covered on the first color film layer, instead of the second color film layer being completely covered on the first color film layer, and this part of the second color film layer continuously covers the first color film layer. On the surface of one side of the color film layer, the second color film layer does not cover the first color film layer at intervals; only another part of the second color film layer covers the third color film layer, and the other part The second color film layer continuously covers the surface of the third color film layer on the side close to the first color film layer, instead of the second color film layer covering all of the third color film layer, nor the second color film layer. The color film layer covers the third color film layer at intervals.

For example, when the color film layer is used in a display device, in a pixel unit, the first color film layer and the third color film layer are separated from each other, and the second color film layer is formed on the first color film layer and the third color film layer. In the area between the film layers, one edge of the second color film layer overlaps with the edge of the adjacent first color film layer, and the other edge of the second color film layer overlaps with the adjacent third color The edges of the film overlap.

For example, FIGS. 5A to 5C are process diagrams of another method for preparing each repeating unit of a color film layer provided by an embodiment of the present disclosure.

As shown in FIG. 5A, a first color film layer 201 spaced apart from each other is formed on the carrier layer 100. In FIG. 5A, the distance between any two adjacent first color film layers 201 is equal. According to different designs, the distance between two adjacent first color film layers 201 may also be unequal, which is not limited here.

As shown in FIG. 5B, a third color film layer 203 is formed between any two adjacent first color film layers 201, and a certain gap is still reserved between any two adjacent first color film layers 201. A second color film layer is subsequently formed. The third color film layer 203 covers the adjacent first color film layer 201 at the edge of the boundary with the first color film layer 201. The third color film layer 203 partially covering the first color film layer 201 can reduce the risk of the third color film layer 203 and the first color film layer 201 being peeled off the carrier layer 100. For the reason, please refer to the relevant description above. , I won’t repeat it here.

For example, as shown in FIG. 5C, when the color film layer 200 is placed in a display device, the second color film layer 202 is formed on the first color film layer 201 included in one pixel unit and the pixels adjacent to the one pixel unit. The third color film layer 203 included in the unit. The second color film layer 202 covers the adjacent first color film layer 201 at the edge of the boundary with the first color film layer 201, and the second color film layer 202 is at the edge boundary with the third color film layer 203 Cover the third color film layer 203 adjacent thereto.

For example, the adhesion of the second color film layer 202 is less than that of the first color film layer 201, and the adhesion of the second color film layer 202 is less than the adhesion of the third color film layer 203. The second color film layer 202 with the least adhesiveness partially covers the first color film layer 201 with the highest adhesiveness on both sides and the first color film layer 201 with the adhesion between the first color film layer 201 and the second color film layer 202. The three-color film layer 203 can reduce the contact area between the second color film layer 202 and the carrier layer 100 compared with the case where the second color film layer 202 is completely covered on the carrier layer 100. The base material of the first color film layer 201, the base material of the second color film layer 202, and the base material of the third color film layer 203 are approximately the same, so that the adhesion between the second color film layer 202 and the first color film layer 201 The adhesion force is greater than the adhesion force between the second color film layer 202 and the carrier layer 100, and the adhesion force between the second color film layer 202 and the third color film layer 203 is greater than the adhesion force between the second color film layer 202 and the carrier layer 100 Adhesion between. For example, the base materials of the first color film layer 201, the second color film layer 202, and the third color film layer 203 all include propylene glycol monomethyl ether ester, 3-methoxybutyl acetate, and acrylic resin, such that Compared with the case where the second color film layer 202 does not cover the first color film layer 201 and the third color film layer 203 at all, the second color film layer 202 partially covers the first color film layer 201 and partially covers the third color film layer 203 It is possible to reduce the possibility that the whole of the first color film layer 201, the second color film layer 202, and the third color film layer 203 will peel off from the carrier layer 100.

For example, due to the low adhesion of the second color film layer 202, its fluidity is the best. In the process of forming the second color film layer 202, the first color film layer 201, the second color film layer 202 and the second color film layer 202 can be reduced. The content of air bubbles on the surface of the three-color film layer 203 far away from the carrier layer 100 as a whole can be increased in any two of the first color film layer 201, the second color film layer 202, and the third color film layer 203. The uniformity of the film thickness at the overlapping position. As shown in FIG. 5C, at a position where the second color film layer 202 overlaps the first color film layer 201, the surface of the second color film layer 202 is flat. At the position where the second color film layer 202 overlaps the third color film layer 203, the surface of the second color film layer 202 is also flat.

For example, when the color film layer shown in FIG. 5C is used in a display device, in a pixel unit, one edge of the second color film layer 202 overlaps with the edge of the adjacent first color film layer 201, The other edge of the two-color film layer 202 overlaps with the edge of the adjacent third-color film layer 203, so that at the position where the second-color film layer 202 and the first-color film layer 201 overlap, and the second color The overlapping positions of the film layer 202 and the third color film layer 203 can block light from passing through, which can act like a black matrix, thereby solving the problem caused by the lack of a black matrix and eliminating the need for preparing a black matrix. The risk of silicon-based OLED micro-displays being scrapped.

For example, the air permeability of the third color film layer 203 is greater than the air permeability of the first color film layer 201 and less than the air permeability of the second color film layer 202. Since the adhesion of the second color film layer 202 is smaller than that of the first color film layer 201 and the third color film layer 203, during the process of forming the second color film layer 202, the second color film layer 202 has The fluidity of the material is the best, and the air permeability of the finally formed second color film layer 202 is also the best.

For example, the first color film layer 201, the second color film layer 202, and the third color film layer 203 are all microporous and breathable films. For example, the air permeability of the first color film layer 201 per minute per square meter is 10 ml to 300 ml; the air permeability of the third color film layer 202 per minute per square meter is 300 ml to 500 ml; The air permeability of the color film layer is 500ml～1000ml.

For example, in the structure shown in FIG. 5C, the first color film layer 201 is a green film layer, the second color film layer 202 is a blue film layer, and the third color film layer 203 is a red film layer.

For example, the material of the first color film layer 201 includes a base material and a first color material; the material of the second color film layer 202 includes a base material and a second color material; and the material of the third color film layer 203 includes a base material. Material and third color material.

For example, the matrix material includes propylene glycol monomethyl ether ester, 3-methoxybutyl acetate and acrylic resin; the first color material includes C ₃₂ Cl ₁₆ CuN ₈ , C ₁₆ H ₁₁ N ₅ O ₄ and auxiliary green pigments ; The second color material includes 2-butanone, phthalocyanine blue and auxiliary blue pigment; the third color material includes 2-butanone, C ₂₈ H ₁₆ N ₂ O ₄ , C ₁₆ H ₉ N ₅ O ₆ and auxiliary red pigment.

For example, in terms of mass percentage, the material of the first color film layer 201 includes 50 wt% to 60 wt% of propylene glycol monomethyl ether ester, 20 wt% to 25 wt% of 3-methoxybutyl acetate, 1 wt% ~10wt% of acrylic resin, 5wt% to 11wt% of C ₃₂ Cl ₁₆ CuN ₈ , 3wt% to 10wt% of C ₁₆ H ₁₁ N ₅ O ₄ , 1wt% to 10wt% of auxiliary green pigments.

For example, in terms of mass percentage, the material of the second color film layer 202 includes 60 wt% to 75 wt% of propylene glycol monomethyl ether ester, 9 wt% to 14 wt% of 3-methoxybutyl acetate, 5 wt% ~10wt% of acrylic resin, 0.05wt% to 0.5wt% of 2-butanone, 3wt% to 10wt% of phthalocyanine blue, 1wt% to 10wt% of auxiliary blue pigment.

For example, in terms of mass percentage, the material of the third color film layer 203 includes 60 wt% to 70 wt% of propylene glycol monomethyl ether ester, 10 wt% to 30 wt% of 3-methoxybutyl acetate, 2 wt% ～10wt% acrylic resin, 0.05wt%～0.5wt% 2-butanone, 2wt%～10wt% C ₂₈ H ₁₆ N ₂ O ₄ , 0.5wt%～3wt% C ₁₆ H ₉ N ₅ O ₆ , 1wt% to 10wt% of auxiliary red pigments.

For example, the viscosity of the material of the first color film layer 201 is 8.1mPa·s～9.0mPa·s, the viscosity of the material of the second color film layer 202 is 7.5mPa·s～8.0mPa·s, and the third color film layer The viscosity of the 203 material is 4 mPa·s to 4.6 mPa·s.

For example, in an example, in terms of mass percentage, the material of the first color film layer 201 includes 55 wt% of propylene glycol monomethyl ether ester, 23 wt% of 3-methoxybutyl acetate, and 5 wt% of Acrylic resin, 5wt% C ₃₂ Cl ₁₆ CuN ₈ , 7wt% C ₁₆ H ₁₁ N ₅ O ₄ , 5wt% auxiliary green pigment. For example, the viscosity of the material of the first color film layer 201 is 8.4 mPa·s.

For example, in an example, in terms of mass percentage, the material of the second color film layer 202 includes 68 wt% of propylene glycol monomethyl ether ester, 12 wt% of 3-methoxybutyl acetate, and 6 wt% of Acrylic resin, 0.3wt% 2-butanone, 6wt% phthalocyanine blue, 7.7% by weight auxiliary blue pigment. For example, the viscosity of the material of the second color film layer 202 is 7.8 mPa·s.

For example, in an example, in terms of mass percentage, the material of the third color film layer 203 includes 65 wt% of propylene glycol monomethyl ether ester, 15 wt% of 3-methoxybutyl acetate, and 6 wt% of Acrylic resin, 0.3% by weight of 2-butanone, 8% by weight of C ₂₈ H ₁₆ N ₂ O ₄ , 1.7% by weight of C ₁₆ H ₉ N ₅ O ₆ , 4% by weight of auxiliary red pigment. For example, the viscosity of the material of the third color film layer 203 is 4.4 mPa·s.

For example, the areas of the first color film layer 201, the second color film layer 202, and the third color film layer 203 provided on one carrier layer are all less than 20 μm ² , for example, 10 μm ² to 20 μm ² .

For example, the areas of the first color film layer 201, the second color film layer 202, and the third color film layer 203 are equal or not equal. The areas of the first color film layer 201, the second color film layer 202, and the third color film layer 203 may all be 10 μm ² , 15 μm ² or 20 μm ² .

For example, the temperature used when preparing the first color film layer 201, the second color film layer 202, and the third color film layer 203 are all less than 90°C, for example, the temperature is 10°C, 20°C, 25°C, 30°C, 35℃, 40℃, 45℃, 60℃, 65℃, 70℃, 85℃ or 90℃ etc.

For example, the preparation process of the first color film layer 201, the second color film layer 202, and the third color film layer 203 includes: forming a first color film, a second color film, and a third color film by a spin coating process, and then separately The first color film, the second color film, and the third color film are patterned to form the first color film layer 201, the second color film layer 202, and the third color film layer 203.

For example, at least one embodiment of the present disclosure further provides a display substrate. FIG. 6A is a schematic diagram of a cross-sectional structure of a display substrate provided by an embodiment of the present disclosure. As shown in FIG. 6A, the display substrate includes a carrier layer 100 and a plurality of repeating units 108. Each repeating unit 108 includes a green film layer G, a red film layer R, and a blue film layer B. The green film layer G, the red film layer The layer R and the blue film layer B are disposed on the carrier layer 100 and are in direct contact with the first surface of the carrier layer 100. 6B is an electron microscope diagram of a cross-sectional structure of a color filter layer included in a display substrate provided by an embodiment of the present disclosure. As shown in FIGS. 6A and 6B, the color film layer includes a green film layer G, a red film layer R and a blue film layer B. The green film layer G, the red film layer R and the blue film layer B are arranged on the carrier layer 100 And it is in direct contact with the first surface of the carrier layer 100. On a plane parallel to the first surface of the carrier layer 100, in each repeating unit 108, the red film layer R is arranged on the first side of the green film layer G, The blue film layer B is arranged on the second side of the green film layer G opposite to the first side, that is, the green film layer G is arranged between the red film layer R and the blue film layer B; the red film layer R and the blue film layer At least one of the layers B covers part of the green film layer G; at least part of the green film layer G does not overlap with the red film layer R and the blue film layer B, so as to realize the green film layer G, the red film layer R and the blue film layer B respectively allows part of the green light, red light and blue light to pass through so as to be subsequently mixed into white light.

For example, as shown in FIGS. 6A and 6B, the adhesion of the green film layer G is greater than the adhesion of the red film layer R and the adhesion of the blue film layer B. In this way, the green film layer G is formed at the bottom layer, and the red film layer R and the blue film layer B respectively cover part of the green film layer G. This can enhance the gap between the red film layer R and the blue film layer B and the carrier layer 100 Adhesion.

It should be noted that the adhesion of the green film layer G is greater than the adhesion of the red film layer R and the adhesion of the blue film layer B, and is relative to the same carrier layer 100, that is, the green film layer G, The red film layer R and the blue film layer B are located on the same carrier layer 100. The adhesion between the green film layer G and the carrier layer 100 is greater than the adhesion between the red film layer R and the carrier layer 100, and is greater than The adhesion between the blue film layer B and the carrier layer 100.

For example, the green film layer G with high adhesion is formed first, the red film layer R with the second highest adhesion is formed later, and the blue film layer B with the least adhesion is formed last. The red film layer R is partially covered on the green film layer G, so that the contact area between the red film layer R with low adhesion and the carrier layer can be reduced. The blue film layer B is partially covered on the green film layer G, so that the contact area between the blue film layer B with low adhesion and the carrier layer can be reduced. The properties of the green film layer G, the red film layer R and the blue film layer B are similar, the adhesion between the green film layer G and the red film layer R, and the adhesion between the green film layer G and the blue film layer B The adhesion force is greater than the adhesive force between the red film layer R or the blue film layer B and the carrier layer 100. Compared with the case where the red film layer R or the blue film layer B does not cover the green film layer G at all, the red film layer The film layer R or the blue film layer B partially covering the green film layer G can reduce the overall peeling of the red film layer R and the green film layer G or the whole blue film layer B and the green film layer G from the carrier layer 100 possibility.

In addition, since the red film layer R and the blue film layer B have low adhesion and good fluidity, in the process of forming the red film layer R or the blue film layer B, the green film layer G and the red film layer can be reduced. The whole of R or the whole of the green film G and the blue film B is far away from the content of the surface air bubbles of the carrier layer 100, so as to increase the whole of the green film G and the red film R or the green film G and the blue film The uniformity of the film thickness of the whole layer B at the position where the two overlap.

For example, each repeating unit (only one repeating unit is shown in FIG. 6B) includes a green film layer G, a red film layer R, and a blue film layer B. In each repeating unit, the green film layer G is located on the red film layer. Between R and blue film layer B, green film layer G and red film layer R do not overlap at least partly, green film layer G and blue film layer B do not overlap at least partly, and red film layer R and blue film layer The layer B does not overlap at all, and the blue film layer B of at least one repeating unit partially covers the red film layer R of the adjacent repeating unit. In this way, blue light, green light and red light can be emitted in the same repeating unit, and it can be ensured that the blue film layer B in one repeating unit and the other repeating unit are at the junction of the two repeating units. The red film layer R has an overlapping area, from which no light can pass through it can also play a role similar to a black matrix.

For example, as shown in FIGS. 6A and 6B, in each repeating unit, the red film layer R and part of the green film layer G overlap to form a first overlap region; the blue film layer B and part of the green film layer G overlap To form a second overlapping area; no light is transmitted from the first overlapping area and the second overlapping area, the first overlapping area and the second overlapping area can act like a black matrix, At the same time, it can distinguish two subunits in a repeating unit.

For example, the first overlap area and the second overlap area account for 5%-20% of the total area of the green film layer G, respectively. That is, 10%-40% of the surface area of the green film layer G is covered by other color films with poor adhesion, and 60%-90% of the surface area of the green film layer G is exposed to allow green light to pass through.

For example, the first overlap area and the second overlap area account for 10% of the total area of the green film G, respectively. In this way, 80% of the surface area of the green film G is exposed to allow the green light to pass through.

For example, there is no overlap between the first overlap area and the second overlap area.

For example, as shown in FIGS. 6A and 6B, the cross-sectional shape of the green film layer G perpendicular to the carrier layer 100 is a rounded rectangle; the portion of the red film layer R overlapping with part of the green film layer G is facing away from the green film layer G One side is convex; the part of the blue film layer B that overlaps the part of the green film layer G is convex to the side away from the carrier layer, and the red film layer of the blue film layer B and the adjacent repeating unit The overlapping part of R protrudes toward the side away from the bearing layer.

For example, as shown in FIGS. 6A and 6B, the edges on both sides of the blue film layer B are convex and concave in the middle; with respect to the carrier layer 100, the red film layer R moves away from the green film layer G from where it overlaps with the green film layer G. The height gradually decreases in the direction. The height here refers to the surface of the carrier layer 100 used to form the green film layer, the red film layer and the blue film layer. In the part where the red film layer and the green film layer overlap, although the thickness of the red film layer is relatively small , But due to the presence of the green film layer below, compared to the middle area of the red film layer, the overall height of the overlapping part of the red film layer and the green film layer is higher than other areas of the red film layer. If the spin coating process is used to form the green film, the red film and the blue film, due to the fluidity of the liquid, the surface of the red film will form a relatively gentle slope. An overlapping area is inclined to the opposite side edge, that is, along the direction from the blue film layer to the red film layer, the surface of the red film layer away from the carrier layer 100 forms a slowly descending inclined surface. For the blue film layer, since at least two opposite sides overlap with other color film layers, the surface of the blue film layer may be a surface descending from the overlapped two sides to the middle area respectively. For example, the thickness of the overlap area between the blue film layer and the red film layer is approximately equal to the thickness of the second overlap area formed by the overlap of the blue film layer and the green film layer, and the blue film layer overlaps the other film layers. The two sides are roughly symmetrical, and the lowest point of the height of the blue film layer relative to the surface of the carrier layer is approximately in the center area of the blue film layer.

For example, as shown in FIGS. 6A and 6B, the total thickness of the red film layer R and the green film layer G at the first overlap area formed by the overlap of the red film layer R and part of the green film layer G is larger than the middle of the red film layer R. The thickness of the region and the thickness of the middle region of the green film layer G, and the thickness of the red film layer R at the first overlapping region formed by overlapping the red film layer R and part of the green film layer G is smaller than the thickness of the middle region of the red film layer R.

For example, as shown in FIGS. 6A and 6B, the total thickness of the blue film layer B and the green film layer G at the second overlapping area formed by the overlap of the blue film layer B and a part of the green film layer G is larger than that of the blue film layer. The thickness of the middle area of layer B and the thickness of the middle area of green film G, and the thickness of blue film B at the second overlapping area formed by overlapping blue film B and part of green film G is smaller than that of blue film The thickness of the middle area of B.

For example, the surface of the blue film layer B away from the carrier layer 100 is recessed toward the carrier layer, the orthographic projection of the blue film layer B on the carrier layer 100 is a rounded rectangle, and the thickness of the peripheral edge area of the blue film layer is smaller than that of the blue film layer. The thickness of the middle area of the film. For example, on a plane parallel to the first surface of the carrier layer 100, the direction from the blue film layer to the red film layer in a repeating unit is the first direction, and the second direction is the direction perpendicular to the first direction. In one direction, the two sides of the blue film layer are directly adjacent to the red film layer and the green film layer. In the second direction, the two sides of the blue film layer directly adjacent to each other are the red film layer and the green film layer. , Then the edge areas of the four sides of the blue film layer overlap with other color film layers.

For example, the surface of the green film layer G away from the carrier layer 100 is convex away from the carrier layer, the orthographic projection of the green film layer G on the carrier layer 100 is a rounded rectangle, and the thickness of the peripheral edge area of the green film layer G is smaller than that of the green film layer G The thickness of the middle area.

For example, the orthographic projection of the red film layer R on the carrier layer 100 is a rectangle with rounded corners, the thickness of the peripheral edge area of the red film layer R is less than the thickness of the middle area of the red film layer R, and in each repeating unit, along the blue From the film layer B to the red film layer R, the thickness of the red film layer R first increases and then decreases.

For example, the display substrate may be an organic light emitting diode display substrate, and the carrying layer may be an encapsulation layer for encapsulating the organic light emitting diode, or may be a base substrate. Of course, the display substrate can also be other types of display substrates, and the carrier layer can also be other film layers, such as a protective layer, a touch control layer, an optical layer, and the like.

For example, at least one embodiment of the present disclosure also provides a method for preparing a display substrate. FIG. 7 is a flowchart of a manufacturing method of a display substrate provided by an embodiment of the present disclosure. As shown in FIG. 7, the manufacturing method includes the following steps:

Step S31: Provide a base substrate;

Step S32: forming a light-emitting element on the base substrate;

Step S33: forming a color filter layer on the side of the light-emitting element away from the base substrate. The method for preparing the color filter layer includes: forming a first color film layer; and after forming the first color film layer, forming a partial covering of the first color film layer. The second color film layer of the color film layer, the adhesion of the first color film layer is greater than the adhesion of the second color film layer.

For example, for the properties of the color film layer including the first color film layer and the second color film layer, please refer to the relevant description in the above, and will not be repeated here.

For example, the preparation method of the display substrate further includes forming a passivation layer and an encapsulation layer on the side of the light-emitting element away from the base substrate to reduce or avoid the adverse effects of water and oxygen on the performance of the light-emitting element.

For example, the preparation method of the display substrate further includes sequentially forming a filling material and a cover plate on the side of the color filter layer away from the base substrate.

For example, FIGS. 8A to 8E are process diagrams of a method for preparing a display substrate 300 according to an embodiment of the present disclosure. The color film layer includes a first color film layer, a second color film layer, and a third color film layer as Examples to illustrate.

As shown in FIG. 8A, a base substrate 301 is provided, and the material of the base substrate 301 is a silicon-based material.

As shown in FIG. 8B, a light-emitting element 302 is formed on a base substrate 301.

For example, the light-emitting element 302 includes an anode 3021, a light-emitting functional layer 3022, a cathode 3023, etc., which are sequentially stacked on a base substrate 301.

For example, the material of the anode 3021 may be a transparent conductive material, the transparent conductive material includes indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), gallium zinc oxide (GZO), zinc oxide (ZnO) , Indium oxide (In ₂ O ₃ ), aluminum oxide zinc (AZO) and carbon nanotubes.

For example, the material of the cathode 3023 may include silver, magnesium, aluminum, lithium monometal or magnesium aluminum alloy (MgAl), lithium aluminum alloy (LiAl), and the like.

For example, the light-emitting functional layer 3022 may include: a hole transport layer, a light-emitting layer, and an electron transport layer. In order to improve the efficiency of electron and hole injection into the light-emitting layer, the light-emitting functional layer may also include a layer disposed between the cathode and the electron transport layer. An organic functional layer such as an electron injection layer between the anode and the hole injection layer provided between the anode and the hole transport layer.

As shown in FIG. 8C, a passivation layer 303 is formed on the side of the light-emitting element 302 away from the base substrate 301 to reduce or prevent water, oxygen, etc. from adversely affecting the performance of the cathode 3023 and the light-emitting functional layer 3022.

For example, the material of the passivation layer 303 includes silicon nitride or silicon oxide.

For example, in order to better prevent water, oxygen, etc. from adversely affecting the performance of the cathode 3023 and the light-emitting function layer 3022, an encapsulation layer may be formed on the side of the passivation layer 303 away from the cathode 3023. For example, the material of the encapsulation layer may be silicon nitride (SiN _x ), silicon oxide (SiO _x ), acrylic resin, or the like.

As shown in FIG. 8D, a color film layer 304 is formed on the side of the passivation layer 303 away from the base substrate 301. It should be noted that when the encapsulation layer disposed on the side of the passivation layer away from the cathode is also included, the The color filter layer 304 is arranged on the side of the packaging layer away from the base substrate 301.

For example, in each pixel unit, the color film layer 304 includes a first color film layer 3041, a second color film layer 3042 partially covering one side surface of the first color film layer 3041, and a second color film layer 3042 partially covering the first color film layer 3041. The third color film layer 3043 on the other side surface of the layer 3041. In two adjacent pixel units, the second color film layer 3042 in one pixel unit partially covers the third color film layer 3043 in the pixel unit adjacent to the one pixel unit. The adhesion of the third color film layer 3043 is greater than that of the second color film layer 3042 and less than that of the first color film layer 3041.

For example, in the process of preparing the color film layer 304, the materials of the first color film layer 3041, the second color film layer 3042, and the third color film layer 3043 can be referred to the relevant description in the above-mentioned related embodiments. Go into details again.

As shown in FIG. 8E, a filling material 305 and a cover plate 306 are sequentially formed on the side of the color filter layer 304 away from the base substrate 301.

For example, the filling material 305 is AB glue, which is a two-component mixed hardening glue, and its main components are acrylic, epoxy and polyurethane. For example, the filling material 305 mainly plays a role of bonding the color film layer 304 and the cover plate 306, as well as a role of planarization.

For example, the cover plate 306 is a glass cover plate, and the material of the cover plate 306 can also be other materials, as long as the cover plate 306 can play a protective role and has a transparent property.

At least one embodiment of the present disclosure further provides a display substrate. FIG. 9A is a schematic cross-sectional structure diagram of a display substrate provided by an embodiment of the present disclosure. The display substrate 300 shown in FIG. 9A is illustrated by taking the color film layer 304 including the first color film layer 3041 and the second color film layer 3042 as an example.

For example, as shown in FIG. 9A, the display substrate 300 includes: a base substrate 301; a light-emitting element 302 and a color filter layer 304 are sequentially stacked on the base substrate 301. The color film layer 304 includes a first color film layer 3041 and a second color film layer 3042. The second color film layer 3042 partially covers the first color film layer 3041. The adhesion of the first color film layer 3041 is greater than Adhesion of the second color film layer 3042.

For example, the light-emitting element 302 includes an anode 3021, a light-emitting functional layer 3022, and a cathode 3023 which are sequentially stacked on a base substrate 301. The light-emitting functional layer 3022 may include: a hole transport layer, a light-emitting layer, and an electron transport layer. In order to improve the efficiency of injection of electrons and holes into the light-emitting layer, the light-emitting functional layer may also include a layer disposed between the cathode and the electron transport layer. Organic functional layers such as an electron injection layer and a hole injection layer provided between the anode and the hole transport layer.

For example, the second color film layer 3042 with low adhesion is partially covered on the first color film layer 3041 with high adhesion, so that the second color film layer 3042 with low adhesion and the cathode 3023 of the light-emitting element can be reduced. The contact area between. The base material of the first color film layer 3041 and the base material of the second color film layer 3042 are approximately the same, and the adhesion between the first color film layer 3041 and the second color film layer 3042 is greater than that of the second color film layer 3042 and the light emitting The adhesion between the cathodes 3023 of the element 302, compared with the case where the second color film layer 3042 does not cover the first color film layer 3041 at all, the second color film layer 3042 partially covers the first color film layer 3041 to reduce There is a possibility that the whole of the first color film layer 3041 and the second color film layer 3042 may be peeled off from the cathode 3023 of the upper light-emitting element 302. In addition, since the adhesion of the second color film layer 3042 is small and its fluidity is good, in the process of forming the second color film layer 3042, the overall weight of the first color film layer 3041 and the second color film layer 3042 can be reduced. The content of air bubbles on the surface away from the light-emitting element 302 can improve the uniformity of the film thickness of the entire first color film layer 3041 and the second color film layer 3042 at the position where the two overlap.

For example, in a pixel unit, an edge of the second color film layer 3042 overlaps with the edge of the adjacent first color film layer 3041, so that the second color film layer 3042 overlaps the first color film layer 3041 The position can block light from passing through, so that it can play a role similar to a black matrix, thereby solving the problem of missing black matrix, and also eliminating the risk of scrapping of silicon-based OLED micro-displays caused by the preparation of black matrix.

For example, the display substrate shown in FIG. 9A may also include a passivation layer (not shown) and an encapsulation layer (not shown) disposed between the light-emitting element 302 and the color film layer 304 to reduce or avoid water, oxygen, etc. It adversely affects the performance of the cathode 3023 and the light-emitting functional layer 3022.

For example, the display substrate shown in FIG. 9A may further include a filling material and a cover plate sequentially arranged on the side of the color filter layer away from the base substrate.

For example, the materials and properties of the passivation layer, the encapsulation layer, the filling material and the cover plate can be referred to the relevant description in the above-mentioned embodiment, which will not be repeated here.

For example, FIG. 9B is a schematic cross-sectional structure diagram of still another display substrate provided by an embodiment of the present disclosure. The display substrate 300 shown in FIG. 9B is illustrated by taking the color film layer 304 including the first color film layer 3041, the second color film layer 3042, and the third color film layer 3043 as an example.

As shown in FIG. 9B, the display substrate 300 includes: a base substrate 301; a light-emitting element 302, a passivation layer 303, a color film layer 304, a filling material 305, and a cover plate 306 are sequentially stacked on the base substrate 301. For example, the base substrate 301 is a silicon substrate, and the materials of the other layers mentioned above can be referred to the relevant description in the above description, which will not be repeated here.

For example, in each pixel unit, the color film layer 304 includes a first color film layer 3041, a second color film layer 3042 partially covering one side surface of the first color film layer 3041, and a second color film layer 3042 partially covering the first color film layer 3041. The third color film layer 3043 on the other side surface of the layer 3041. In two adjacent pixel units, the second color film layer 3042 in one pixel unit partially covers the third color film layer 3043 in the adjacent pixel unit. The adhesion of the third color film layer 3043 is greater than that of the second color film layer 3042 and less than that of the first color film layer 3041.

For example, FIG. 10A is a schematic cross-sectional view of another display substrate provided by an embodiment of the present disclosure. As shown in FIG. 10A, the display substrate 300 includes a display area 10 and a peripheral area 20 surrounding the outside of the display area 10. The first color film layer 3041, the second color film layer 3042, and the third color film layer 3043 are arranged on the display In the region 10, the peripheral region 20 is provided with a black matrix 50. The black matrix 50 includes a first sublayer 501 and a second sublayer 502 which are stacked, the first sublayer 501 and the first color film layer 3041, the second color film One of the layer 3042 and the third color film layer 3043 is set in the same layer and with the same material, and the second sub-layer 502 is set with the other of the first color film layer 3041, the second color film layer 3042 and the third color film layer 3043 Same layer and same material settings. For example, in FIG. 10A, the first sub-layer 501 and the second color film layer 3042 are set in the same layer and the same material, and the second sub-layer 502 and the third color film layer 3043 are set in the same layer and the same material as an example. Illustrative.

It should be noted that in the peripheral area 20, the first sublayer 501 and the second sublayer 502 are stacked so that the first sublayer 501 and the second sublayer 502 are almost completely overlapped, or the first sublayer 501 and the second sublayer 502 The overlap rate of the sub-layer 502 is approximately 80%.

For example, FIG. 10B is a schematic cross-sectional view of another display substrate provided by an embodiment of the disclosure. As shown in FIG. 10B, the display substrate includes a display area 10 and a peripheral area 20 surrounding the display area 10. The first color The film layer 3041, the second color film layer 3042, and the third color film layer 3043 are provided in the display area 10, and the peripheral area 20 is provided with a black matrix 50. The black matrix 50 includes a first sub-layer 501 and a second sub-layer 502 that are stacked. And the third sublayer 503, the first sublayer 501 and the first color film layer 3041 are arranged in the same layer, the second sublayer 502 and the second color film layer 3042 are arranged in the same layer, and the third sublayer 503 and the third color film Layer 3043 is set on the same layer.

For example, the display area 10 includes a plurality of pixel units, and each pixel unit includes a first color film layer 3041, a second color film layer 3042, and a third color film layer 3043. In each pixel unit, the first color film layer 3041 is located between the second color film layer 3042 and the third color film layer 3043, the first color film layer 3041 and the second color film layer 3042 do not overlap at least partially, the first color film layer 3041 and the third color film layer 3043 At least part of it does not overlap, and the second color film layer 3042 and the third color film layer 3043 do not overlap at all, so as to ensure that the first color film layer 3041, the second color film layer 3042 and the third color film layer 3043 can all be Emit a monochromatic light of the corresponding color. The second color film layer 3042 of at least one pixel unit partially covers the third color film layer 3043 of the adjacent pixel unit, so as to ensure that the overlapping position of adjacent pixel units can also prevent light from passing through. Function, so as to solve the problem caused by the lack of black matrix.

For example, in each pixel unit, the second color film layer 3042 partially covers the first color film layer 3041 to form a first overlap area, and the third color film layer 3043 partially covers the first color film layer 3041 to form a second overlap area. The overlap area, the first overlap area and the second overlap area are opaque, that is, as shown in FIGS. 10A and 10B, one edge of the second color film layer 3042 and the edge of the first color film layer 3041 adjacent to it Overlap, the other edge of the second color film layer 3042 overlaps with the edge of the third color film layer 3043 adjacent to it, so that the position where the second color film layer 3042 and the first color film layer 3041 overlap is The first overlap area and the position where the second color film layer 3042 and the third color film layer 3042 overlap, that is, the second overlap area, can block light from passing through, which can act like a black matrix, thereby solving The problem caused by the missing black matrix is also eliminated, and the risk of scrapping of the silicon-based OLED micro-display caused by the preparation of the black matrix is also eliminated.

For example, in the display area 10, the first color film layer 3041, the second color film layer 3042, and the third color film layer 3043 are arranged in an array; in the peripheral area 20, the pattern of the black matrix 50 is a ring.

For example, FIG. 11 is a schematic partial cross-sectional view of a display substrate provided by another embodiment of the present disclosure. The display substrate includes a display area 10. The display area 10 includes a plurality of pixel units and is used for display, and the display area 10 is, for example, an AA area (Active Area). For example, the display area 10 is provided with pixel circuits, organic light-emitting materials, etc., so that display is performed under the driving of scan signals and data signals.

For example, as shown in FIG. 11, the display substrate includes an array substrate 110, and the array substrate 110 includes a silicon substrate 113 and a light emitting element 410. For example, the silicon substrate 113 includes a silicon-based base substrate 420, a pixel circuit 430, a light reflection layer 440, and an insulating layer 450 that are sequentially stacked. The light-emitting element 410 includes an anode 115 (ie, a first electrode of the light-emitting element), a light-emitting functional layer 116, and a cathode 117 (ie, a second electrode of the light-emitting element) that are sequentially stacked on an insulating layer 450 included in the silicon substrate 113. The anode 115 is a transparent electrode layer. For example, the insulating layer 450 is light-transmissive so that light emitted by the light-emitting function layer 116 penetrates therethrough and reaches the light reflection layer 440 to be reflected by the light reflection layer 440. For example, the material of the light reflection layer 440 is metallic aluminum.

For example, the insulating layer 450 includes a via 452 filled with a metal member 451, and the light reflection layer 440 is electrically connected to the anode 115 through the metal member 451. In this way, by forming a conductive channel between the light reflective layer 440 and the anode 115 in the insulating layer 450, it is advantageous to transmit the electrical signal provided by the pixel circuit 430 in the silicon substrate 113 to the anode 115 through the light reflective layer 440. In this way, it is not only beneficial to realize the control of the light-emitting element 410 by the pixel circuit 430, but also makes the structure of the display substrate more compact, which is beneficial to the miniaturization of the display substrate. Further, for example, the metal member 451 is made of a metal material, such as tungsten metal, and a via filled with tungsten metal is also called a tungsten via (W-via). For example, in the case where the thickness of the insulating layer 450 is large, the formation of tungsten vias in the insulating layer 450 can ensure the stability of the conductive path. Moreover, due to the mature process of making the tungsten vias, the surface of the resulting insulating layer 450 The flatness is good, which is beneficial to reduce the contact resistance between the insulating layer 450 and the anode 115. It can be understood that the tungsten via is not only suitable for realizing the electrical connection between the insulating layer 450 and the anode 115, but also for the electrical connection between the light reflection layer 440 and the pixel circuit 430, and other wiring layers, such as in the pixel circuit. The electrical connection between each electrode of the driving transistor, the switching transistor and the capacitor and the layer where the signal line is located.

For example, the silicon substrate 113 includes a pixel circuit 430, the pixel circuit 430 and the light reflection layer 440 are electrically connected to each other, and the pixel circuit 430 is used to drive the light emitting element 410 to emit light. The pixel circuit 430 includes at least a driving transistor T1 and a switching transistor (not shown in the figure), and the driving transistor T1 and the light reflection layer 440 are electrically connected to each other. Thus, the electrical signal for driving the light-emitting element 410 can be transmitted to the anode 115 through the light reflection layer 440, thereby controlling the light-emitting element 410 to emit light. For example, the driving transistor T1 includes a gate electrode G, a source electrode S, and a drain electrode D. The source electrode S of the driving transistor T1 is electrically connected to the light reflection layer 440. When the driving transistor T1 is in the on state and in the saturated state, under the control of the data voltage applied by the gate electrode, the driving current provided by the pixel circuit can be transmitted to the anode through the source electrode S of the driving transistor T1 and the light reflection layer 440 115. Since a voltage difference is formed between the anode 115 and the cathode 117, holes and electrons are respectively injected into the light-emitting function layer 116 and recombine, so that the light-emitting function layer 116 emits light under the action of the electric field. It can be understood that, in the driving transistor T1, the positions of the source electrode S and the drain electrode D are interchangeable. Therefore, one of the source electrode S and the drain electrode D and the light reflection layer 440 may be electrically connected to each other.

For example, FIG. 12A is a schematic diagram of a planar structure of a display substrate provided by an embodiment of the present disclosure, and FIG. 12B is a schematic diagram of a cross-sectional structure of the display substrate in FIG. 12A. As shown in FIG. 12A and FIG. 12B, the silicon substrate 113 further includes a power line 601, a data line 602, and a gate line (not shown) connected to the gate G of the driving transistor T1, which are arranged on the silicon base substrate 420. A pixel circuit is provided in the area defined by the intersection of the gate line and the data line 602. The pixel circuit includes a switching transistor T0, a driving transistor T1, and a light-emitting element (including an anode 115, a cathode 117 and a light-emitting function layer 116). The switching transistor T0 includes a gate The gate electrode of the switching transistor T0 is connected to the gate line, the drain electrode of the switching transistor T0 is connected to the data line 602, and the source electrode of the switching transistor T0 is connected to the gate G of the driving transistor. The driving transistor T1 is connected to the switching transistor T0, the power supply line 601, and the light emitting element. The driving transistor T1 also includes an active layer A. A gate insulating layer 603, a gate G, and a first insulating layer 604 are formed on the active layer A, and a source S and a drain D are formed on the first insulating layer 604. . The source electrode S and the drain electrode D are electrically connected to the active layer A, respectively. A second insulating layer 605 is formed on the source electrode S and the drain electrode D, and an anode 115 is formed on the second insulating layer 605. The light-emitting element further includes a pixel defining layer 104 formed between the anode 115 and the cathode 117. The pixel defining layer 104 can be used to isolate two adjacent sub-pixel units, and the pixel defining layer 104 includes a plurality of openings. The material used for evaporating the light-emitting functional layer to form the light-emitting functional layer.

For example, the power line 601 and the data line 602 can be formed of the same layer and the same material as the source electrode and the drain electrode.

For example, the display substrate includes a plurality of sub-pixels (or pixel units), and three sub-pixels, namely, a red sub-pixel SP1, a green sub-pixel SP2, and a blue sub-pixel SP3 are exemplarily shown in FIG. 11. Each sub-pixel corresponds to a sub-pixel area of the display substrate. That is, each sub-pixel is provided with an independent light-emitting element 410 and a driving transistor T1.

For example, the insulating layer 450 in the three sub-pixels is integrally formed to facilitate manufacturing. For example, as shown in FIG. 11, the insulating layer 450 further includes an opening 454 exposing the pad 453, and the arrangement of the opening 454 facilitates the electrical connection and signal communication between the pad 453 and an external circuit. For example, the opening 454 of the exposed pad 453 is located in the peripheral area 140. The color of the sub-pixels in the display substrate is only illustrative, and may also include other colors such as yellow and white.

For example, as shown in FIG. 11, the array substrate 110 further includes a second thin film encapsulation layer 118, a color filter layer 119 and a first thin film encapsulation layer 211 which are sequentially disposed on the cathode 117. That is, the color film layer 119 is sandwiched between the first thin film encapsulation layer 211 and the second thin film encapsulation layer 118. The display substrate further includes a cover plate 120, and the cover plate 120 is disposed on the second film encapsulation layer 211. For example, the first thin-film encapsulation layer 211 is located on the side of the cathode 117 away from the silicon-based substrate 420. The color film layer 119 is located on the side of the first thin film encapsulation layer 118 away from the silicon-based substrate 420, and includes a first color film layer (for example, a green film layer) and a second color film layer (for example, a blue film layer) , And a third color film layer (for example, a red film layer). The second thin film encapsulation layer 211 and the cover plate 120 are located on the side of the color filter layer 119 away from the silicon base substrate 420. The specific materials of the first thin-film encapsulation layer 118, the color filter layer 119, the second thin-film encapsulation layer 211 and the cover 120 can be conventional materials in the art, which will not be described in detail here.

For example, in the display substrate provided by the embodiment of the present disclosure, the light emitting element 410 including the anode 115, the light emitting function layer 116 and the cathode 117, the first thin film encapsulation layer 118, the color film layer 119, the second thin film encapsulation layer 211, and the cover The board 120 can be separately prepared on the silicon substrate 113. In addition, in the same process, the insulating layer 450 above the pad 453 can also be etched to expose the pad 453 and make it compatible with the flexible printed circuit board ( FPC) bonding or wiring (Wire) bonding. Therefore, in the embodiments of the present disclosure, for example, the silicon substrate 113 including the light reflection layer 440 and the insulating layer 450 and suitable for forming the light-emitting element 430 may be fabricated by a fab, and then prepared on the silicon substrate in a display substrate factory. This structure not only reduces the difficulty of manufacturing the light reflective layer 440, but also facilitates the subsequent process of the panel factory.

For example, FIG. 13 is a schematic diagram of area division of a display substrate provided by an embodiment of the present disclosure. As shown in FIG. 13, the display substrate includes a display area 10 and a peripheral area 12. The peripheral area 12 includes a connecting electrode area 12a. Therefore, the peripheral area 12 includes three areas: a connecting electrode area 12a, a first dummy area 121, and a second dummy area.区122. The first dummy area 121 is located between the connection electrode area 12 a and the display area 10, and the second dummy area 122 is located on the side of the connection electrode area 12 a away from the display area 10. As shown in FIG. 12, the second dummy area 122 is located on the side of the connection electrode area 12 a away from the first dummy area 121.

For example, FIG. 14 is a schematic cross-sectional view of a display substrate provided by an embodiment of the present disclosure. As shown in FIG. 14, the display substrate 300 includes: a first electrode pattern 103 located in the display area 10 of the display substrate, and includes a plurality of first electrodes 1030 (for example, anodes) spaced apart from each other; and a connecting electrode pattern 103a located in the display area. The connection electrode area 12a of the substrate includes a plurality of connection electrodes 103a0; and the first dummy electrode pattern de1 is located in the first dummy area 121 of the display substrate and includes a plurality of first dummy electrodes de10.

As shown in FIGS. 13 and 14, the connection electrode area 12 a surrounds the display area 10, and the first dummy area 121 is located between the connection electrode area 12 a and the display area 10. The connection electrode pattern 103 a surrounds the first electrode pattern 103, and the first dummy electrode pattern de1 surrounds the first electrode pattern 103. The first dummy electrode pattern de1 is located between the connection electrode pattern 103a and the first electrode pattern 103.

For example, as shown in FIG. 14, the display substrate provided by an embodiment of the present disclosure further includes a second electrode 106 (for example, a cathode), the second electrode 106 is connected to the connecting electrode 103a0; the peripheral area 12 of the display substrate surrounds the display area 10, The peripheral area 12 includes a connecting electrode area 12a and a first dummy area 121; the second electrode 106 is located in the display area 10 and the peripheral area 12, and the second electrode 106 and the first electrode pattern 103 are spaced apart from each other.

For example, in the connection electrode area 12a of the display substrate, the projection (not shown) of the color filter layer on the base substrate completely covers the projection of the multiple connection electrodes 103a0 on the base substrate.

For example, the orthographic projection of the first electrode pattern 103 and the second electrode 106 on the base substrate 101 is within the orthographic projection of the color filter layer (not shown) on the base substrate 101.

For example, the pattern density of the first electrode pattern 103, the pattern density of the connection electrode pattern 103a, and the pattern density of the first dummy electrode pattern de1 are the same, and the shape of the first electrode 1030 of the first electrode pattern 103 and the connection of the connection electrode pattern 103a The shape of the electrode 103a0 is the same as the shape of the first dummy electrode de10 of the first dummy electrode pattern de1, which can facilitate the consumption rate of the etching solution or developer in each area during etching or development to be roughly equivalent to ensure the uniformity of the process .

For example, as shown in FIG. 14, the display substrate further includes a sensor electrode pattern 103b. The sensor electrode pattern 103b is located in the sensor region R1 of the display substrate and includes a plurality of sensor electrodes 103b0. For example, the pattern density of the sensor electrode pattern 103b is the same as the pattern density of the first electrode pattern 103, and the pattern shape of the sensor electrode 103b0 is the same as the pattern shape of the first electrode pattern 103.

It should be noted that the pixel structure of the sensor region R1 is the same as the pixel structure of the display region 10, and the sensor electrode 103b0 in the sensor region R1 is electrically connected to the pixel circuit through the tungsten via V3 and the via V31. The pixel structure of the sensor region R1 is different from the pixel structures of the first dummy sub-region 1211, the second dummy sub-region 1212, and the second dummy region 122. The first dummy electrode pattern de1 and the second dummy sub-region 1211 are The first dummy electrode de10 of the region 1212 and the second dummy electrode pattern de2 of the second dummy region 122 are not connected to other circuits through via holes.

For example, the pixel structure of the sensor area R1 is used to sense the voltage of the first electrode 1030 of the display area 10, and is used to implement circuit compensation. For example, a compensation transistor can be connected to a temperature sensor to perform a correction on the first electrode of the display area 10. The voltage of 1030 is sensed.

For example, as shown in FIG. 14, the second dummy sub-region 1212 in the first dummy region 121 is used to isolate the sensor region R1 and the display region 10. The first dummy sub-region 1211 in the first dummy region 121 is used for transition, so that the second electrode 106 and the connecting electrode 103a0 in the connecting electrode region 12a better overlap.

For example, as shown in FIG. 14, the display substrate further includes a second dummy electrode pattern de2, which is located in the second dummy area 122 of the display substrate, and includes a plurality of second dummy electrodes de20; the second dummy area 122 is located in the connection electrode area 12a The side away from the display area 10. For example, the pattern density of the second dummy electrode pattern de2 and the pattern density of the first electrode pattern 103 are the same, and the second dummy electrode pattern de2 and the first electrode pattern 103 are spaced apart by the pixel defining layer.

For example, the virtual pixels in the first dummy sub-region 1211 of the first dummy region 121 and the second dummy region 122 are both in two rows. For example, the side in the row direction has two rows, and the side in the column direction has two columns.

For example, as shown in FIG. 14, the second dummy sub-region 1212 is located between the sensor region R1 and the display region 10; the part of the first dummy region 121 located between the sensor region R1 and the connecting electrode region 12a is the first dummy sub-region. 1211; A first filling layer 104a is formed in the first dummy sub-region 1211. The first filling layer 104a includes a plurality of first dummy electrodes de10 and an insulating wrap layer 104c. The first electrode pattern 103 includes an edge adjacent to the connecting electrode 103a0. An electrode 103e and an insulating coating layer 104c are respectively in contact with the connecting electrode 103a0 and the edge first electrode 103e. For example, the insulating coating layer 104c and the pixel defining layer are made of the same material.

For example, as shown in FIG. 14, the second electrode 106 is in contact with the insulating coating 104c.

For example, as shown in FIG. 14, a first thin-film encapsulation layer 107 is also provided on the side of the second electrode 106 away from the base substrate 101. The first thin-film encapsulation layer 107 can prevent water and oxygen from entering the light-emitting function layer 105. The role of.

For example, as shown in FIG. 14, the edge first electrode 103e and the plurality of first dummy electrodes de10 are insulated from each other.

For example, as shown in FIG. 14, the display substrate further includes a pixel defining layer 104, and the pixel defining layer 104 includes a plurality of pixel defining portions 1040, and each of the plurality of pixel defining portions 1040 is located between adjacent first electrodes 1030.

For example, as shown in FIG. 14, the insulating wrap layer 104c and the pixel definition layer 104 are located in the same layer, and can be formed by the same film layer using the same patterning process to save manufacturing process.

For example, as shown in FIG. 14, the first electrode pattern 103 and the connecting electrode pattern 103a are located on the same layer, and can be formed by the same film layer using the same patterning process to save manufacturing process.

For example, as shown in FIG. 14, the display substrate further includes a second filling layer 104b, the second filling layer 104b includes at least one second filling portion 104b0, and the second filling portion 104b0 is located between adjacent connecting electrodes 103a0. For example, the second filling layer 104b is an insulating layer. For example, as shown in FIG. 14, the second filling portions 104b0 are in contact with adjacent connection electrodes 103a0, respectively.

For example, as shown in FIG. 14, the second filling layer 104b and the first filling layer 104a are located in the same layer, and can be formed by the same film layer using the same patterning process to save manufacturing process.

For example, as shown in FIG. 14, the display substrate further includes a third filling layer 1043. The third filling layer 1043 includes a plurality of third filling portions 10430, and the third filling portions 10430 are located at adjacent sensor electrodes 103b0 and adjacent sensor electrodes. 103b0 and at least one of the first dummy electrodes. FIG. 14 illustrates an example in which the third filling portion 10430 is located between adjacent sensor electrodes 103b0.

For example, as shown in FIG. 14, the third filling layer 1043 and the pixel definition layer 104 are located in the same layer, and can be formed by the same film layer using the same patterning process to save manufacturing process.

For example, as shown in FIG. 14, the display substrate further includes a light-emitting functional layer 105, which is located between the first electrode pattern 103 and the second electrode 106, and the light-emitting functional layer 105 is in contact with the first filling layer 104a. For example, the light-emitting function layer 105 is in contact with a part of the first filling layer 104a. For example, in the display area, a color film layer (not shown) covers the light-emitting function layer 105.

For example, as shown in FIG. 14, the light-emitting function layer 105 is in contact with the sensor electrode pattern 103b. The light-emitting function layer 105 is in contact with the first dummy electrode located in the second dummy sub-region 1212.

As shown in FIG. 14, an insulating layer IS is further provided on the base substrate 101, and a conductive pattern 109 is provided on the insulating layer IS. The conductive pattern 109 includes a first conductive portion 1091, a second conductive portion 1092, and a third conductive portion 1093. . The insulating layer IS includes a via hole V11, a via hole V21, and a via hole V31. The via hole V11, the via hole V21, and the via hole V31 are respectively filled with conductive materials to form a connection member. The first electrode 1030 is connected to the connector in the via hole V21 through the first conductive portion 1091. The connection electrode 103a0 is connected to the connection member in the via hole V11 through the second conductive portion 1092. The sensor electrode 103b0 is connected to the connector in the via hole V31 through the third conductive portion 1093.

For example, the portion of the first insulating layer 102 that overlaps the plurality of first dummy electrodes de10 in the direction perpendicular to the base substrate 101 is not provided with via holes.

For example, the portion of the first insulating layer 102 that overlaps the plurality of second dummy electrodes de20 in the direction perpendicular to the base substrate 101 is not provided with via holes.

For example, a portion of the first insulating layer 102 that overlaps the plurality of connection electrodes 103a0 in a direction perpendicular to the base substrate 101 is provided with a via hole V1.

For example, a portion of the first insulating layer 102 that overlaps the plurality of first electrodes 1030 in a direction perpendicular to the base substrate 101 is provided with a via hole V2.

For example, a portion of the first insulating layer 102 that overlaps the plurality of sensor electrodes 1030 in a direction perpendicular to the base substrate 101 is provided with a via V3.

The embodiments of the present disclosure provide a color film layer and a preparation method thereof, and a display substrate and a preparation method thereof have at least one of the following beneficial effects:

(1) The method for preparing the color film layer provided by at least one embodiment of the present disclosure can reduce the possibility of peeling of the color film layer from the carrier layer.

(2) The preparation method of the color film layer provided by at least one embodiment of the present disclosure can reduce the content of air bubbles on the surface of the first color film layer and the second color film layer far away from the carrier layer as a whole, thereby improving the first color film layer. The uniformity of the film thickness of the whole layer and the second color film layer at the position where the two overlap.

(3) In the display substrate provided by at least one embodiment of the present disclosure, both the position where the second color film layer and the first color film layer overlap, and the position where the second color film layer and the third color film layer overlap It can block the light from passing through, so that it can play a role similar to the black matrix, thereby solving the problem caused by the lack of the black matrix, and avoiding the risk of the silicon-based OLED micro-display being scrapped due to the preparation of the black matrix.

(4) In the display substrate provided by at least one embodiment of the present disclosure, the peripheral area includes a black matrix, and the black matrix includes a first sublayer and a second sublayer that are stacked, the first sublayer and the first color film layer, and the second sublayer. One of the color film layer and the third color film layer is set in the same layer and with the same material, and the second sub-layer is the same layer and the same layer as the other of the first color film layer, the second color film layer, and the third color film layer. The material setting reduces the process of specially preparing the black matrix in the peripheral area, thereby simplifying the process steps.

(5) The display substrate provided by at least one embodiment of the present disclosure is provided with a black matrix in the peripheral area, and the black matrix includes a first sub-layer, a second sub-layer and a third sub-layer arranged in a stack, the first sub-layer and the first sub-layer The color film layer is set in the same layer, the second sub-layer and the second color film layer are set in the same layer, and the third sub-layer and the third color film layer are set in the same layer, reducing the process of specially preparing the black matrix in the peripheral area, thereby simplifying The process steps.

The following points need to be explained:

(1) The drawings of the embodiments of the present invention only refer to the structures related to the embodiments of the present invention, and other structures can refer to the usual design.

(2) For the sake of clarity, in the drawings used to describe the embodiments of the present invention, the thicknesses of layers or regions are enlarged or reduced, that is, these drawings are not drawn according to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or "under" the other element. Or there may be intermediate elements.

(3) In the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other to obtain a new embodiment.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

A display substrate includes a bearing layer and a plurality of repeating units, wherein each repeating unit includes a green film layer, a red film layer and a blue film layer, wherein the green film layer, the red film layer and The blue film layer is disposed on the supporting layer and is in direct contact with the first surface of the supporting layer,

On a plane parallel to the first surface of the carrier layer, in each repeating unit, the red film layer is disposed on the first side of the green film layer, and the blue film layer is disposed on the A second side of the green film layer opposite to the first side;

At least one of the red film layer and the blue film layer covers a part of the green film layer;

At least part of the green film layer does not overlap with the red film layer and the blue film layer.
The display substrate according to claim 1, wherein the adhesion of the green film layer is greater than the adhesion of the red film layer and the adhesion of the blue film layer.
The display substrate according to claim 1 or 2, wherein:

In each of the repeating units, the green film layer is located between the red film layer and the blue film layer, the green film layer and the red film layer are at least partially non-overlapping, and the green film layer The film layer and the blue film layer do not overlap at least partially, and the red film layer and the blue film layer do not overlap at all,

The blue film layer of at least one of the repeating units partially covers the red film layer of the repeating unit adjacent thereto.
The display substrate according to claim 3, wherein, in each of the repeating units, the red film layer and a part of the green film layer overlap to form a first overlap region; the blue film layer and Part of the green film layer is overlapped to form a second overlap area.
4. The display substrate according to claim 4, wherein the first overlap area and the second overlap area respectively occupy 5%-20% of the total area of the green film layer.
The display substrate according to claim 5, wherein the first overlap area and the second overlap area respectively account for 10% of the total area of the green film layer.
7. The display substrate according to any one of claims 4 to 6, wherein there is no overlap between the first overlapping area and the second overlapping area.
The display substrate according to any one of claims 4 to 7, wherein the cross-sectional shape of the green film layer perpendicular to the carrier layer is a rounded rectangle; the red film layer and a part of the green film The overlapping part of the layer is convex to the side away from the green film layer; the part of the blue film layer that overlaps part of the green film layer is convex to the side away from the carrier layer, and The overlapping part of the blue film layer and the red film layer of the repeating unit adjacent to the blue film layer protrudes toward the side away from the carrier layer.
The display substrate according to any one of claims 4 to 8, wherein the edges on both sides of the blue film layer are convex and concave in the middle; relative to the carrier layer, the red film layer is in contact with the The height of the overlap of the green film layer gradually decreases in the direction away from the green film layer.
8. The display substrate according to any one of claims 4 to 9, wherein the red film layer and the red film layer and the first overlap area formed by overlapping part of the green film layer The total thickness of the green film layer stack is greater than the thickness of the middle region of the red film layer and the thickness of the middle region of the green film layer respectively, and the first layer formed by overlapping the red film layer and part of the green film layer The thickness of the red film layer at the overlap region is smaller than the thickness of the middle region of the red film layer.
8. The display substrate according to any one of claims 4-9, wherein the blue film layer and a portion of the green film layer overlap at the second overlap area where the blue film layer and The total thickness of the green film layer stack is greater than the thickness of the middle region of the blue film layer and the thickness of the middle region of the green film layer respectively, and the blue film layer and part of the green film layer are formed by overlapping The thickness of the blue film layer at the second overlap region is smaller than the thickness of the middle region of the blue film layer.
8. The display substrate according to any one of claims 4 to 8, wherein a surface of the blue film layer away from the carrier layer is recessed toward the carrier layer, and the blue film layer is on the carrier layer. The orthographic projection above is a rectangle with rounded corners, and the thickness of the peripheral edge area of the blue film layer is smaller than the thickness of the middle area of the blue film layer.
The display substrate according to claim 12, wherein the surface of the green film layer away from the carrier layer is convex away from the carrier layer, and the orthographic projection of the green film layer on the carrier layer is rounded Rectangle, the thickness of the peripheral edge area of the green film layer is smaller than the thickness of the middle area of the green film layer.
The display substrate according to claim 12, wherein the orthographic projection of the red film layer on the carrier layer is a rectangle with rounded corners, and the thickness of the peripheral edge area of the red film layer is smaller than that of the middle area of the red film layer. In each repeating unit, along the direction from the blue film layer to the red film layer, the thickness of the red film layer first increases and then decreases.
A display substrate includes:

Base substrate

The light-emitting element and the color film layer arranged on the base substrate are sequentially laminated; wherein,

The color film layer includes a first color film layer and a second color film layer disposed on a side of the light-emitting element away from the base substrate, and the second color film layer partially covers the first color film On the layer, the adhesion of the first color film layer is greater than the adhesion of the second color film layer.
The display substrate according to claim 15, further comprising a third color film layer, wherein the third color film layer partially covers the first color film layer, and the second color film layer partially covers the On the third color film layer; the adhesion of the third color film layer is greater than the adhesion of the second color film layer and less than the adhesion of the first color film layer.
The display substrate according to claim 16, comprising a display area and a peripheral area surrounding the outside of the display area, wherein,

The first color film layer, the second color film layer and the third color film layer are arranged in the display area,

The peripheral area is provided with a black matrix, the black matrix includes a first sub-layer and a second sub-layer that are stacked, the first sub-layer and the first color film layer, the second color film layer and One of the third color film layers is set in the same layer and with the same material, and the second sub-layer and the first color film layer, the second color film layer and the third color film layer are The other is set on the same layer and with the same material.
The display substrate according to claim 16, comprising a display area and a peripheral area surrounding the outside of the display area, wherein,

The first color film layer, the second color film layer and the third color film layer are arranged in the display area,

The peripheral area is provided with a black matrix, and the black matrix includes a first sub-layer, a second sub-layer and a third sub-layer arranged in a stack, and the first sub-layer and the first color film layer are arranged in the same layer, The second sublayer and the second color film layer are arranged in the same layer, and the third sublayer and the third color film layer are arranged in the same layer.
The display substrate according to claim 17 or 18, wherein:

The display area includes a plurality of pixel units,

Each of the pixel units includes the first color film layer, the second color film layer, and the third color film layer,

In each of the pixel units, the first color film layer is located between the second color film layer and the third color film layer, and the first color film layer and the second color film layer At least partially not overlapped, the first color film layer and the third color film layer are at least partially not overlapped, and the second color film layer and the third color film layer do not overlap at all,

The second color film layer of at least one pixel unit partially covers the third color film layer of the adjacent pixel unit.
18. The display substrate according to claim 19, wherein, in each of the pixel units, the second color film layer partially covers the first color film layer to form a first overlap region, and the third color film layer The film layer partially covers the first color film layer to form a second overlapping area, and both the first overlapping area and the second overlapping area have a light-shielding effect.
The display substrate according to any one of claims 15 to 20, wherein, in the display area, the first color film layer, the second color film layer, and the third color film layer are in an array Arrangement; In the peripheral area, the pattern of the black matrix is a ring.
22. The display substrate according to any one of claims 15 to 21, further comprising a filling material and a cover plate provided on a side of the color filter layer away from the base substrate.
The display substrate according to any one of claims 15 to 22, wherein the material of the base substrate is a silicon-based material.
A method for preparing a color film layer, the color film layer includes a plurality of repeating units, and forming each repeating unit includes:

Forming a first color film layer; and

After forming the first color film layer, forming a second color film layer partially covering the first color film layer;

Wherein, the adhesion of the first color film layer is greater than the adhesion of the second color film layer;

The first color film layers of a plurality of the repeating units are formed in the same patterning process, the second color film layers of a plurality of the repeating units are formed in the same patterning process, and the plurality of repeating units are formed in the same patterning process. The third color film layer is formed in the same patterning process.
The preparation method according to claim 24, wherein the air permeability of the second color film layer is greater than the air permeability of the first color film layer.
The preparation method according to claim 25, further comprising:

After forming the first color film layer and before forming the second color film layer, a third color film layer is formed, wherein the third color film layer partially covers the first color film layer, and The second color film layer partially covers the third color film layer; the adhesion of the third color film layer is greater than that of the second color film layer and less than the adhesion of the first color film layer Sex.
26. The preparation method of claim 26, wherein the air permeability of the third color film layer is greater than the air permeability of the first color film layer and less than the air permeability of the second color film layer.
The preparation method according to claim 26 or 27, wherein the first color film layer is a green film layer, the second color film layer is a blue film layer, and the third color film layer is a red film layer. Floor.
The manufacturing method according to claim 28, wherein the material of the first color film layer includes a base material and a first color material; the material of the second color film layer includes the base material and a second color material; And the material of the third color film layer includes the base material and the third color material.
The preparation method according to claim 29, wherein the base material comprises propylene glycol monomethyl ether ester, 3-methoxybutyl acetate and acrylic resin; the first color material comprises C 32 Cl 16 CuN 8. C 16 H 11 N 5 O 4 and auxiliary green pigments; the second color material includes 2-butanone, phthalocyanine blue and auxiliary blue pigment; the third color material includes 2-butanone, C 28 H 16 N 2 O 4 , C 16 H 9 N 5 O 6 and auxiliary red pigments.
The preparation method according to claim 30, wherein, in terms of mass percentage,

The material of the first color film layer includes 50wt% to 60wt% of propylene glycol monomethyl ether ester, 20wt% to 25wt% of 3-methoxybutyl acetate, 1wt% to 10wt% of acrylic resin, 5wt% %～11wt% C 32 Cl 16 CuN 8 , 3wt%～10wt% C 16 H 11 N 5 O 4 , 1wt%～10wt% auxiliary green pigment;

The material of the second color film layer includes 60 wt% to 75 wt% of propylene glycol monomethyl ether ester, 9 wt% to 14 wt% of 3-methoxybutyl acetate, 5 wt% to 10 wt% of acrylic resin, 0.05 wt% wt% to 0.5 wt% of 2-butanone, 3 wt% to 10 wt% of phthalocyanine blue, 1 wt% to 10 wt% of auxiliary blue pigment; and

The material of the third color film layer includes 60wt% to 70wt% of propylene glycol monomethyl ether ester, 10wt% to 30wt% of 3-methoxybutyl acetate, 2wt% to 10wt% of acrylic resin, 0.05 wt%～0.5wt% 2-butanone, 2wt%～10wt% C 28 H 16 N 2 O 4 , 0.5wt%～3wt% C 16 H 9 N 5 O 6 , 1wt%～10wt% auxiliary Red paint.
The preparation method according to any one of claims 26 to 31, wherein the viscosity of the material of the first color film layer is 8.1 mPa·s to 9.0 mPa·s, and the material of the second color film layer has a viscosity of 8.1 mPa·s to 9.0 mPa·s. The viscosity is 7.5 mPa·s to 8.0 mPa·s, and the viscosity of the material of the third color film layer is 4 mPa·s to 4.6 mPa·s.
The preparation method according to claim 32, wherein the viscosity of the material of the first color film layer is 8.4 mPa·s, the viscosity of the material of the second color film layer is 7.8 mPa·s, and the first color film layer has a viscosity of 7.8 mPa·s, and The viscosity of the material of the three-color film layer is 4.4 mPa·s.
The preparation method according to claim 33, wherein:

The areas of the first color film layer, the second color film layer and the third color film layer are all less than 20 μm 2 ;

The preparation temperature of the first color film layer, the second color film layer and the third color film layer is less than 90°C.
The preparation method according to any one of claims 26 to 34, comprising: forming a first color film, a second color film, and a third color film by a spin coating process, and then separately applying the first color film and the third color film to the The second color film and the third color film are subjected to a patterning process to form the first color film layer, the second color film layer and the third color film layer.
A method for preparing a display substrate includes:

Provide base substrate;

Forming a light-emitting element on the base substrate;

The preparation method according to any one of claims 24 to 35 is used to form a color film layer on the side of the light-emitting element away from the base substrate.
36. The preparation method according to claim 36, wherein before forming the color filter layer, it further comprises forming a passivation layer on a side of the light-emitting element away from the base substrate; after forming the color filter layer , Further comprising sequentially forming a filling material and a cover plate on a side of the color filter layer away from the base substrate.
The preparation method according to claim 36 or 37, wherein the material of the base substrate is a silicon-based material.