CN110085650B - Display panel - Google Patents
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- CN110085650B CN110085650B CN201910439519.2A CN201910439519A CN110085650B CN 110085650 B CN110085650 B CN 110085650B CN 201910439519 A CN201910439519 A CN 201910439519A CN 110085650 B CN110085650 B CN 110085650B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel, which comprises an array substrate, wherein the array substrate is provided with a display area, and the display area is provided with sub-pixel areas and non-pixel areas positioned between the sub-pixel areas; the groove is arranged in the array substrate and corresponds to the non-pixel area; the thin film packaging layer is arranged on the array substrate; the color filter is covered on the thin film packaging layer; the protective layer covers one side of the color filter, which is far away from the thin film packaging layer; the protective layer is provided with a through hole, the through hole penetrates through the protective layer and the color filter until the thin film packaging layer is far away from one side of the array substrate, and the through hole corresponds to the groove. The invention replaces the polarizer with the structure of a color film substrate, a black matrix and a protective layer. And punching is performed on the parts of the camera shooting areas corresponding to the color film substrate and the protective layer, and a transparent material with high light transmittance is filled, so that light energy can better penetrate through the camera shooting areas and is transmitted to the camera module under the slotted area, and finally the camera shooting performance is improved.
Description
Technical Field
The invention relates to the technical field of liquid crystal display, in particular to a display panel.
Background
Due to the advent of the screen concept, the corresponding requirement for high specifications has also arisen as technology has developed. The invention provides an easy-to-fold ultrathin foldable screen design on the basis of a screen. And the appearance concept of the camera shooting area appearing on the market at the present stage is combined, further optimization is carried out, the light transmittance is improved while the thinned screen is easy to bend, and the performance of the camera module is better exerted.
Because the existing mobile phone is developed towards the trend of being light, thin, deformable and full-face screen, one of the methods is to hide the camera module in the panel, and in order to ensure that the camera module can receive more light, the requirement on the light transmittance of the stacked panels is high. Because the camera module is in the below of Polyimide Film (Polyimide Film) layer, and the PI material is transparent organic material, is double-deck PI structure as the base usually, not only can not cause the influence to other layers with the moderate amount attenuate of PI thickness, and can be because after the thickness attenuation, the luminousness can promote.
As shown in fig. 1, the structure of the current OLED display screen improves the light extraction efficiency of light through a Polarizer (POL). However, the thickness of the polarizer is generally 80-120 μm, so that the manufactured display panel is thick and not easy to bend.
Disclosure of Invention
The invention aims to provide a display panel which can effectively solve the problems of thick panel thickness, poor light extraction rate, unfavorable performance exertion of camera module performance and the like.
In order to solve the above technical problem, the present invention provides a display panel, including an array substrate having a display region, wherein the display region includes sub-pixel regions and non-pixel regions located between the sub-pixel regions; the groove is arranged in the non-pixel area; the thin film packaging layer is arranged on the array substrate; the color filter is arranged on the thin film packaging layer; the protective layer covers one side of the color filter, which is far away from the thin film packaging layer; the color filter is provided with a through hole, and the through hole corresponds to the groove.
Further, the through hole is filled with a transparent material.
Furthermore, the open slot is provided with a slot bottom and peripheral walls arranged on two sides of the slot bottom; the thin film encapsulation layer includes, corresponding to the non-pixel region: the first inorganic layer is arranged on the bottom of the groove and the peripheral wall; and the first organic layer is arranged on the first inorganic layer and fills the groove.
Further, the array substrate further comprises a thin film transistor layer and a pixel defining layer; and the groove is arranged on the pixel limiting layer and corresponds to the sub-pixel area.
Further, the thin film encapsulation layer includes, corresponding to the sub-pixel region: a second inorganic layer formed on the array substrate; a second organic layer formed on the second inorganic layer; wherein the first inorganic layer is formed together with the second inorganic layer; the first organic layer is formed together with the second organic layer.
Further, the thin film encapsulation layer further includes a third inorganic layer disposed on the first inorganic layer and the second inorganic layer.
Furthermore, the sub-pixel area comprises a first sub-pixel, a second sub-pixel and a third sub-pixel, the color filter comprises a first color film correspondingly arranged on the first pixel, a second color film correspondingly arranged on the second sub-pixel, a third color film correspondingly arranged on the third sub-pixel and a reflecting layer arranged among the first color film, the second color film and the third color film, and the through hole is arranged on the reflecting layer.
Further, the array substrate further includes: the thin film transistor layer is arranged on the substrate, the substrate is provided with a first area and a second area connected with the first area, the first area corresponds to the groove, and the thickness of the first area is smaller than that of the second area.
Further, the array substrate further includes: the planarization layer is covered on the surface of the thin film transistor layer; the pixel defining layer covers one side of the planarization layer far away from the thin-film transistor layer.
Further, the trench penetrates through the pixel defining layer and the planarization layer to the surface of the thin-film transistor layer.
The invention has the beneficial effects that: the invention provides a display panel, which is characterized in that a substrate is thinned through laser cutting, the width of a thinned area of the substrate is finally matched with the width of a groove, the light transmittance is improved, a polarizer area of the display panel is replaced by a color film substrate, a black matrix and a protective layer, holes are punched in a non-sub-pixel area corresponding to the color film substrate, a high-light-transmittance viscous material is filled, light energy can better penetrate through the holes and is transmitted to a camera module under the groove area, and the shooting performance is finally improved. And the structural thicknesses of the color film substrate, the black matrix and the protective layer are smaller than that of the polarizer, so that the whole panel is thinned and can be bent more easily.
Drawings
The invention is further described below with reference to the figures and examples.
FIG. 1 is a schematic structural diagram of a conventional display panel;
FIG. 2 is a schematic diagram of a display panel structure according to the present invention;
prime reference numerals
An array substrate 200; a display area 201; a sub-pixel region 202;
a non-pixel region 203; first region 204 and second region 205
Thin-film-transistor layer 206; a thin film encapsulation layer 207; a substrate 21;
a buffer layer 22; a first gate insulating layer 23; a second gate insulating layer 24;
an interlayer insulating layer 25; a planarization layer 26; a pixel defining layer 27;
a first electrode 28; a second inorganic layer 29; a retaining wall 210;
the third inorganic layer 211; a second organic layer 212; a color filter 213;
a protective layer 214; a glass 215; a semiconductor layer 216;
a first gate metal layer 217; a second gate metal layer 218; source drain metal trace 219;
a recess 2111; a through hole 2112; a slot 2113;
a first organic layer 2121; the first inorganic layer 291.
Detailed Description
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments of the invention which may be wet. Directional phrases used herein, such as, for example, upper, lower, front, rear, left, right, inner, outer, lateral, etc., refer only to the orientation of the accompanying drawings. The names of the elements, such as the first, the second, etc., mentioned in the present invention are only used for distinguishing different elements and can be better expressed. In the drawings, elements having similar structures are denoted by the same reference numerals.
Embodiments of the present invention will be described in detail herein with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided to explain the practical application of the invention and to enable others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 2, in an embodiment, the display panel 20 of the present invention includes an array substrate 200, a thin film encapsulation layer 207, a color filter 213, a protection layer 214, and glass 215.
The array substrate 200 has a display area 201, and the display area 201 includes sub-pixel areas 202 and non-pixel areas 203 located between the sub-pixel areas 202.
As shown in fig. 2, the array substrate 200 includes a substrate 21, a thin-film transistor layer 206, a source-drain metal layer 219, a planarization layer 26, a pixel defining layer 27, a first electrode 28, and a light-emitting layer 29.
The array substrate 200 is disposed on the substrate 21, the substrate 21 has a first region 204 and a second region 205 connected to the first region 204, the first region 204 corresponds to the slot 2113, the thickness of the first region 204 is smaller than that of the second region 205, and the substrate 21 is a poly acetamide (PI).
The second area 205 of the substrate 21 can be formed by laser cutting so that the thickness of the second area 205 is smaller than that of the first area 204, and the width of the second area is the same as that of the notch 2113, so that the light transmittance is improved, the under-screen camera module can receive more light, and the camera shooting quality is improved.
The thin film transistor layer 206 includes a plurality of thin film transistors, which are low temperature polysilicon technology thin film transistors, oxide thin film transistors, or common thin film transistors.
The invention is preferably a low-temperature polysilicon technology thin film transistor, because the low-temperature polysilicon technology thin film transistor has the advantages of high resolution, high reaction speed, high brightness, high aperture ratio and the like, and because the silicon crystal arrangement of the LCD of the low-temperature polysilicon technology thin film transistor is ordered compared with a-Si, the electron mobility is relatively higher by more than 100 times, a peripheral driving circuit can be simultaneously manufactured on a glass substrate, and the system integration target, the space saving and the cost of driving an IC are achieved.
The thin-film transistor layer 206 includes a semiconductor layer 216, a first gate insulating layer 23, a first gate metal layer 217, a second gate insulating layer 24, a second gate metal layer 218, and an interlayer insulating layer 25. The semiconductor layer 216 covers one side of the buffer layer 22 away from the substrate; the first gate insulating layer 23 covers the surfaces of the semiconductor layer 216 and the buffer layer 22; the first gate metal layer 217 covers a layer of the first gate insulating layer 23 away from the buffer layer 22; the second gate insulating layer 24 covers the surfaces of the first gate metal layer 217 and the first gate insulating layer 23; the second gate metal layer 218 covers a side of the second gate insulating layer 24 away from the second insulating layer; the interlayer insulating layer 25 covers the surfaces of the second gate metal layer 218 and the second gate insulating layer 24.
In the sub-pixel region 202, the source-drain metal trace 219 includes a source trace 219a and a drain trace 219 b. The source-drain metal trace 219 covers one side of the interlayer insulating layer 25 away from the second gate insulating layer 24, and the source trace 219a and the drain trace 219b are correspondingly connected to the source region and the drain region of the semiconductor layer 216; the drain metal trace 219b of the source/drain metal trace 219 is connected to the second inorganic layer 29 through the first electrode 28.
The planarization layer 26 covers the surfaces of the source/drain metal layer 219 and the interlayer insulating layer 25; the pixel defining layer 27 covers a side of the planarization layer 26 away from the interlayer insulating layer 25.
A groove 2111 is formed in the pixel defining layer 27 and corresponding to the sub-pixel region 202; the second inorganic layer 29 is formed on the groove 2111 and the pixel defining layer 27 corresponding to the sub-pixel region.
The groove 2113 has a groove bottom and a peripheral wall disposed on the groove bottom corresponding to the non-pixel region 203, and the thin film encapsulation layer 207 includes a first inorganic layer 291 and a first organic layer 2121; the first inorganic layer 291 is provided on the groove bottom and the peripheral wall; the first organic layer 2121 is disposed on the first inorganic layer 291 and fills the groove 2113.
The first inorganic layer 291 is formed together with the second inorganic layer 29; the first organic layer 2121 is formed together with the second organic layer 212.
The thin film encapsulation layer further includes a third inorganic layer 211, the third inorganic layer 211 is formed on the first organic layer 2121 and the second organic layer 212, and the third inorganic layer 211 is disposed under the color filter 213.
In the non-pixel region, light can penetrate through the transparent material of the through hole 2112 and the second organic layer 212 of the groove 2113, so that the camera module below the substrate can receive light, and the image pickup effect of the camera module is improved.
A slot 2113 is formed in the array substrate 200 and corresponding to the non-pixel region 203; the slit 2113 penetrates the pixel defining layer 27 and the planarization layer 26 up to the surface of the interlayer insulating layer 25; the thin film encapsulation layer 207 is disposed on the array substrate 200; the color filter 213 covers one side of the thin film encapsulation layer 207 away from the array substrate 200; the protection layer 214 covers the side of the color filter 213 away from the thin film encapsulation layer 207; the optical adhesive layer 2110 covers one side of the protection layer 214 away from the color filter 213; the glass 215 covers the side of the optical adhesive layer 2110 far away from the protection layer 214.
The present invention replaces the polarizer of the conventional panel with the structure of the color filter 213 and the protection layer 214. And a transparent material is punched and filled in the part of the imaging area (area of the original black matrix) corresponding to the cf (color filter) and the protective layer 214, so that the whole panel can be thinned and can be bent more easily.
The color filter 213 has a through hole 2112, the through hole 2112 penetrates through the color filter 213 to the side of the thin film encapsulation layer 207 away from the array substrate 200, and the through hole 2112 corresponds to the notch 2113. The film encapsulation layer 207 further comprises a retaining wall 210, and the film encapsulation layer 207 has the effect of isolating water and oxygen and has a protection effect on devices of the display panel; the retaining wall 210 surrounds the display area 201, is arranged between the array substrate 200 and the packaging layer 211, plays a role in surrounding organic materials, cannot enable the organic materials to leak to other pixel areas, and influences the normal work of the display panel.
In an embodiment, the sub-pixel region 202 includes a first sub-pixel, a second sub-pixel, and a third sub-pixel, the color filter 213 includes a first color film correspondingly disposed on the first sub-pixel, a second color film correspondingly disposed on the second sub-pixel, a third color film correspondingly disposed on the third sub-pixel, and a reflective layer disposed between the first color film, the second color film, and the third color film, and the through hole 2112 is disposed on the reflective layer.
Specifically, in the preparation process of the array substrate, all the processes from the substrate 21 to the pixel defining layer 27 are completed, the distance between sub-pixels is excavated through laser hole digging, and after parts of the pixel defining layer 27 and the planarization layer 26 are removed, the subsequent processes are performed.
The present invention provides a display panel 20, which replaces the polarizer with a color filter (color filter), bm (black matrix) and a protective layer 214. And the part of the shooting area (the area of the original black matrix) corresponding to the CF (color filter) and the protective layer 214 is punched and filled with a high-transmittance viscous material, so that light can better penetrate through the camera module, the light can be transmitted to the camera module under the slotted 2113 area, and the shooting performance is finally improved.
It should be noted that many variations and modifications of the embodiments of the present invention fully described are possible and are not to be considered as limited to the specific examples of the above embodiments. The above examples are intended to be illustrative of the invention and are not intended to be limiting. In conclusion, the scope of the present invention should include those changes or substitutions and modifications which are obvious to those of ordinary skill in the art.
Claims (9)
1. A display panel, comprising
The array substrate is provided with a display area, and the display area comprises sub-pixel areas and non-pixel areas positioned between the sub-pixel areas;
the groove is arranged in the non-pixel area;
the thin film packaging layer is arranged on the array substrate;
the color filter is arranged on the thin film packaging layer;
the protective layer covers one side of the color filter, which is far away from the thin film packaging layer;
the color filter is provided with a through hole, and the through hole corresponds to the slot;
the open groove is provided with a groove bottom and peripheral walls arranged on two sides of the groove bottom;
the thin film encapsulation layer includes, corresponding to the non-pixel region:
the first inorganic layer is arranged on the bottom of the groove and the peripheral wall;
and the first organic layer is arranged on the first inorganic layer and fills the groove.
2. The display panel according to claim 1,
and transparent materials are filled in the through holes.
3. The display panel of claim 1, wherein the array substrate further comprises a thin-film-transistor layer and a pixel defining layer;
and the groove is arranged on the pixel limiting layer and corresponds to the sub-pixel area.
4. The display panel according to claim 1,
the thin film encapsulation layer comprises
A second inorganic layer formed on the array substrate;
a second organic layer formed on the second inorganic layer;
wherein the first inorganic layer is formed together with the second inorganic layer; the first organic layer is formed together with the second organic layer.
5. The display panel of claim 1, wherein the thin film encapsulation layer further comprises a third inorganic layer disposed on the first inorganic layer and the second inorganic layer.
6. The display panel of claim 1, wherein the sub-pixel region comprises a first sub-pixel, a second sub-pixel and a third sub-pixel, the color filter comprises a first color film correspondingly disposed on the first sub-pixel, a second color film correspondingly disposed on the second sub-pixel, a third color film correspondingly disposed on the third sub-pixel, and a reflective layer disposed between the first color film, the second color film and the third color film, and the through hole is disposed on the reflective layer.
7. The display panel of claim 3, wherein the array substrate further comprises:
the thin film transistor layer is arranged on the substrate, the substrate is provided with a first area and a second area connected with the first area, the first area corresponds to the groove, and the thickness of the first area is smaller than that of the second area.
8. The display panel of claim 3, wherein the array substrate further comprises:
the planarization layer is covered on the surface of the thin film transistor layer;
the pixel defining layer covers one side of the planarization layer far away from the thin-film transistor layer.
9. The display panel according to claim 8,
the groove penetrates through the pixel defining layer and the planarization layer to the surface of the thin-film transistor layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910439519.2A CN110085650B (en) | 2019-05-24 | 2019-05-24 | Display panel |
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| CN201910439519.2A CN110085650B (en) | 2019-05-24 | 2019-05-24 | Display panel |
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| CN110085650A CN110085650A (en) | 2019-08-02 |
| CN110085650B true CN110085650B (en) | 2021-07-06 |
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| CN110610965B (en) * | 2019-08-23 | 2021-11-02 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN110610966B (en) * | 2019-08-26 | 2022-03-29 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN110556409A (en) * | 2019-09-11 | 2019-12-10 | 昆山国显光电有限公司 | Display device |
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| KR20210040230A (en) * | 2019-10-02 | 2021-04-13 | 삼성디스플레이 주식회사 | Display device |
| CN110783347A (en) * | 2019-10-12 | 2020-02-11 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN111019130A (en) * | 2019-12-03 | 2020-04-17 | 武汉华星光电半导体显示技术有限公司 | Polyimide, preparation method of polyimide film and display device |
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| CN111029483B (en) * | 2019-12-19 | 2021-03-16 | 武汉华星光电半导体显示技术有限公司 | OLED panel and manufacturing method thereof |
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| CN111276516B (en) * | 2020-02-07 | 2021-06-01 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN111261800B (en) * | 2020-02-07 | 2021-07-06 | 武汉华星光电半导体显示技术有限公司 | Array substrate, preparation method thereof and display panel |
| CN111293235B (en) * | 2020-02-17 | 2023-04-07 | 京东方科技集团股份有限公司 | Preparation method of display substrate, display substrate and display device |
| CN111725427B (en) * | 2020-06-11 | 2022-04-05 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN111863892B (en) * | 2020-07-13 | 2022-08-23 | 武汉华星光电半导体显示技术有限公司 | Display device and method for manufacturing the same |
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| CN114975735A (en) * | 2022-05-23 | 2022-08-30 | 京东方科技集团股份有限公司 | Transparent display panel and preparation method thereof |
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| CN115020619B (en) * | 2022-07-08 | 2024-02-13 | 武汉华星光电半导体显示技术有限公司 | Display panel and mobile terminal |
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