CN107941602A - A kind of fixing device for the test of micro-fluidic chip bond strength - Google Patents
A kind of fixing device for the test of micro-fluidic chip bond strength Download PDFInfo
- Publication number
- CN107941602A CN107941602A CN201711492115.7A CN201711492115A CN107941602A CN 107941602 A CN107941602 A CN 107941602A CN 201711492115 A CN201711492115 A CN 201711492115A CN 107941602 A CN107941602 A CN 107941602A
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- China
- Prior art keywords
- micro
- sucker
- fluidic chip
- test
- chip
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
Abstract
The invention discloses a kind of fixing device for the test of micro-fluidic chip bond strength, formed by support housing and with suctorial air valve, chip is fixed by the suction of sucker, device using when need external vacuum pump to provide the suction of sucker, air valve only could be opened after sucker is subject to certain external force and acts on and produce section shifting, realizes that the absorption to chip is fixed；The air valve for not producing displacement remains turned-off under the action of the spring；Deflate and chip can be removed from device by vacuum pump end after use, entirely using process without carrying out other processing to chip.Pass through the fixing device, chip can be fixed using the suction of sucker in the case where not destroying material surface, the test to micro-fluidic chip bond strength is realized in the measuring instruments such as tester for elongation, torductor, the device is connected simply with chip, it is easy to operate, damage is not easily caused in itself to chip, is easy to implement standardization.
Description
Technical field
The invention belongs to microflow control technique and micro-fluidic chip bond strength field, and in particular to one kind is used for micro-fluidic core
The fixing device of piece bond strength test.
Background technology
The it is proposed of micro-fluidic chip concept had for more than 20 years so far, its micromation brings good application prospect, thus
It is increasingly becoming one of direction that scientific research forward position is most paid close attention to.The host material of micro-fluidic chip mainly has various glass, quartz, silicon
Piece, polymeric material, elastic material and metal etc., its manufacturing technology is quite ripe, chip system no matter what type
Make method, main body process can be divided into nothing but two big steps of pattern transfer and bonding.Bonding is the sealing of substrate and cover plate, is completed
The main body processing of chip.The quality of bonding quality directly affects the service life and application range of chip, therefore it is micro-fluidic
Vital procedure of processing in chip fabrication processes.
In bonding techniques, bond strength is a very important parameter.It is characterize bonding effect quality one
Important technology index：Bond strength is small, and two bonding pads are likely to occur cracking, leakage etc. now during processing and use
As；Only bond strength is big, just can guarantee that the yield rate and service life of product.The many devices applied in the industry require
There are strong bond strength and the bonded interface stablized.Measurement for bond strength, now existing a variety of methods, has plenty of broken
Bad property, have plenty of nondestructive, but also there are many problems：Data are in each different process conditions, sample ruler
Obtained under very little and test equipment, lack versatility and authority；So far neither one unified standard is characterized：Have
Method is with characterizing bonded interface cracking work；Some methods are with the Li Laibiao for making bonded interface cracking
Sign.It is compared between so different characterizing methods very inconvenient.
The test of vertical pulling method bond strength refers to chip to be measured is bonded on pulling force handle using binding agent, then passes through drawing
Pulling force handle is stretched to measure maximum stress during chip bonding failure, when the method overcome blade insertion and being used for strong bonding piece
The shortcomings that blade cannot be inserted into, is a kind of common to see and strength test method.But this method receives pulling force handle and glues
The limitation of mixture, when bond strength is more than the viscous viscosity of adhesive, pulling force handle will crack prior to bonding pad and depart from key
Close piece, can not continue to measure, and be bonded binding agent after test removal and destruction to chip surface also to a certain degree
On limit the development of this method.
The content of the invention
The purpose of the invention is to overcome deficiency of the prior art, there is provided one kind is used for micro-fluidic chip bond strength
The fixing device of test.
The purpose of the present invention is what is be achieved through the following technical solutions：
A kind of fixing device for the test of micro-fluidic chip bond strength, the device is mainly by support housing 1, clamping plate 2
Gentle valve group into；The sidepiece of support housing 1 is equipped with multiple clamping plates 2, and air valve simultaneously arranges cloth in the bottom of support housing 1；Air valve by
Sucker 3, axis 4, sealing ring 5, axle sleeve 6, spring 7 and guide collar 8 form.Air valve is installed in support housing 1 by sucker 3,
Sucker 3 is connected with axis 4, and axis 4 is engaged by sealing ring 5 with axle sleeve 6, and guide collar 8 is arranged on the top of axle sleeve 6；Sealing
Spring 7 is equipped between circle 5 and guide collar 8；Sucker 3 is connected with vacuum pump.
In use, sucker 3 is in contact with micro-fluidic chip surface；Vacuum pump provides the suction of sucker 3, by micro-fluidic chip
After surface cleaning is clean, micro-fluidic chip to be measured is pressed on sucker 3 with the power more than 7 resistance of spring；Sucker 3 is made outside
Axis 4 is driven to move under the action of firmly；The sealing function of sealing ring 5 is set to fail, the gas in sucker 3 is by external vacuum pump
Siphon away, micro-fluidic chip is fixed on sucker 3, be fixed on cupping machine, tested by clamping plate 2 afterwards.Treat reality
After the completion of testing, vacuum pump is deflated, again to make gas be full of sucker 3 more than the power of 7 resistance of spring pressing micro-fluidic chip, afterwards
Just micro-fluidic chip is removed.
Air valve only could be opened after sucker 3 is subject to certain external force and acts on and produce section shifting, is realized to miniflow
The absorption of control chip is fixed；The air valve for not producing displacement remains turned-off under the action of spring 7；Pass through vacuum pump after use
End deflation can remove micro-fluidic chip from device, entirely using process without carrying out other processing to micro-fluidic chip.
Multiple clamping plates 2 are welded in support housing, by varying fixed form of the fixing device in test equipment, are realized
The bond strength test of micro-fluidic chip various ways.
Air valve is controlled by electrical equipment, by electronic systems such as programmable logic controller (PLC)s, substitutes mechanical switch control gas
The opening and closing of valve.
The quantity of sucker and air valve, material, size, arrangement mode according to sample to be tested need and test equipment size into
The corresponding adjustment of row.
Compared with prior art, beneficial effect caused by technical scheme is：
(1) fixing device in the present invention can fix any micro-fluidic chip with smooth surface, fixing device
It is fixed that destruction, stationary plane uniform force, stability height are produced to chip.It can be tested by varying the mounting means of fixing device
Such as stretch, shear various forms of chip bonding intensity.
(2) fixing device in the present invention is set suitable for common stress mornitorings such as all kinds of tester for elongation, torsion testers
Standby, generality is good, measuring method maturation specification, is beneficial to the standardization for promoting the test of micro-fluidic chip bond strength.
Brief description of the drawings
Fig. 1 is fixing device front view.
Fig. 2 is fixing device left view.
Fig. 3 is fixing device top view.
Fig. 4 is fixing device bottom view.
Fig. 5 is fixing device nature sectional view.
Fig. 6 is fixing device cross-sectional operational views.
Fig. 7 is that fixing device is used for test chip stretching bond strength schematic diagram.
Fig. 8 is the dimensional structure diagram of the present apparatus.
Embodiment
The fixing device that the core of the present invention makes offer a kind of for the test of micro-fluidic chip bond strength, to promote miniflow
Control the standardization of chip bonding strength test method.
The invention will be further described below in conjunction with the accompanying drawings, and the embodiment is being preferable to carry out for basic embodiment
Example, is not all of or unique embodiment, and those of ordinary skill in the art are by reading description of the invention and to the present invention
Any equivalent conversion that technical solution is taken, is that claim of the invention is covered.
As shown in Figure 1, the present invention provides a kind of fixing device for the test of micro-fluidic chip bond strength, the device
Multiple clamping plates 2 are mainly equipped with by the sidepiece of support housing 1,2 gentle valve group of clamping plate into, support housing 1, air valve simultaneously arranges cloth and propping up
Support the bottom of shell 1；Air valve is made of sucker 3, axis 4, sealing ring 5, axle sleeve 6, spring 7 and guide collar 8.Air valve passes through sucker
3 are installed in support housing 1, and sucker 3 is connected with axis 4, and axis 4 is engaged by sealing ring 5 with axle sleeve 6, and guide collar 8 is set
At the top of axle sleeve 6；Spring 7 is equipped between sealing ring 5 and guide collar 8；Sucker 3 is connected with vacuum pump.
In use, sucker 3 is in contact with micro-fluidic chip surface；Vacuum pump provides the suction of sucker 3, by micro-fluidic chip
After surface cleaning is clean, micro-fluidic chip to be measured is pressed on sucker 3 with the power more than 7 resistance of spring；Sucker 3 is made outside
Axis 4 is driven to move under the action of firmly；The sealing function of sealing ring 5 is set to fail, the gas in sucker 3 is by external vacuum pump
Siphon away, micro-fluidic chip is fixed on sucker 3, be fixed on cupping machine, tested by clamping plate 2 afterwards.Treat reality
After the completion of testing, vacuum pump is deflated, again to make gas be full of sucker 3 more than the power of 7 resistance of spring pressing micro-fluidic chip, afterwards
Just micro-fluidic chip is removed.
In practice, quantity, the ruler of welding position and sucker 3 of the clamping plate 2 in support housing 1 are changed according to requirement of experiment
Very little, arrangement mode.Clamping plate 2 is set perpendicularly to the installation direction of micro-fluidic chip, so as to fulfill to chip bonding maximum just
The test of stress；A diameter of 20mm of sucker 3, is arranged in juxtaposition three in support housing, and it is 25.4mm × 75.6 to be adapted to size
Standard glass slide, support minimum dimension be 20mm × 20mm style.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention,
Modification to these embodiments will be apparent for those skilled in the art, as defined herein general
Principle can be realized in other embodiments without departing from the scope of the invention, therefore meet original disclosed herein
The reason embodiment consistent with features of novelty should all be subject to this patent to protect, without being restricted to embodiment illustrated herein.
Claims (5)
- A kind of 1. fixing device for the test of micro-fluidic chip bond strength, it is characterised in that：The device is mainly outer by supporting Shell (1), clamping plate (2) gentle valve group into；The sidepiece of support housing (1) is equipped with multiple clamping plates (2), and air valve simultaneously arranges cloth outside support The bottom of shell (1)；Air valve is made of sucker (3), axis (4), sealing ring (5), axle sleeve (6), spring (7) and guide collar (8)；Gas Valve is installed in support housing (1) by sucker (3), and sucker (3) is connected with axis (4), axis (4) by sealing ring (5) and Axle sleeve (6) is engaged, and guide collar (8) is arranged on the top of axle sleeve (6)；Spring is equipped between sealing ring (5) and guide collar (8) (7)；Sucker (3) is connected with vacuum pump；In use, sucker (3) is in contact with micro-fluidic chip surface；Vacuum pump provides the suction of sucker (3), by micro-fluidic chip After surface cleaning is clean, micro-fluidic chip to be measured is pressed on sucker (3) with the power more than spring (7) resistance；Sucker (3) Axis (4) movement is driven under the action of outer active force；The sealing function of sealing ring (5) is set to fail, the gas quilt in sucker (3) External vacuum pump siphons away, and micro-fluidic chip is fixed on sucker (3), is fixed on cupping machine by clamping plate (2) afterwards On, tested；Wait after the completion of testing, vacuum pump is deflated, and is made again with pressing micro-fluidic chip more than the power of spring (7) resistance Gas is full of sucker (3), afterwards just removes micro-fluidic chip.
- A kind of 2. fixing device for the test of micro-fluidic chip bond strength according to claim 1, it is characterised in that： Air valve only could be opened after sucker (3) is subject to certain external force and acts on and produce section shifting, is realized to micro-fluidic chip Absorption fix；The air valve for not producing displacement remains turned-off under the action of spring (7)；Put after use by vacuum pump end Gas can remove micro-fluidic chip from device, entirely using process without carrying out other processing to micro-fluidic chip.
- A kind of 3. fixing device for the test of micro-fluidic chip bond strength according to claim 1, it is characterised in that： Multiple clamping plates (2) are welded in support housing, by varying fixed form of the fixing device in test equipment, are realized micro-fluidic The bond strength test of chip various ways.
- A kind of 4. fixing device for the test of micro-fluidic chip bond strength according to claim 1, it is characterised in that： Air valve is controlled by electrical equipment, by electronic systems such as programmable logic controller (PLC)s, substitutes the opening and closing of mechanical switch control air valve.
- A kind of 5. fixing device for the test of micro-fluidic chip bond strength according to claim 1, it is characterised in that： The quantity of sucker and air valve, material, size, arrangement mode are needed according to sample to be tested and the size of test equipment carries out accordingly Adjustment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711492115.7A CN107941602A (en) | 2017-12-30 | 2017-12-30 | A kind of fixing device for the test of micro-fluidic chip bond strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711492115.7A CN107941602A (en) | 2017-12-30 | 2017-12-30 | A kind of fixing device for the test of micro-fluidic chip bond strength |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107941602A true CN107941602A (en) | 2018-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711492115.7A Pending CN107941602A (en) | 2017-12-30 | 2017-12-30 | A kind of fixing device for the test of micro-fluidic chip bond strength |
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| CN (1) | CN107941602A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108709854A (en) * | 2018-08-31 | 2018-10-26 | 信利光电股份有限公司 | A kind of fixture and bonding force test method of test bonding force |
| CN112179731A (en) * | 2020-09-17 | 2021-01-05 | 长江存储科技有限责任公司 | Sample preparation method, stress detection method and sample to be detected |
Citations (7)
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| CN88202086U (en) * | 1988-03-18 | 1988-11-23 | 大连理工大学 | Vacuum suction disk stretching clamp |
| CN2053203U (en) * | 1989-04-04 | 1990-02-21 | 沈阳重型机器厂 | Vacuum suction cup |
| JP2003035658A (en) * | 2001-07-18 | 2003-02-07 | Shibaura Mechatronics Corp | Method and equipment for inspecting bonding strength |
| JP2009180620A (en) * | 2008-01-31 | 2009-08-13 | Dainippon Printing Co Ltd | Device and method for testing bond strength of ic chip |
| CN204400160U (en) * | 2014-12-25 | 2015-06-17 | 重庆勤发食品有限公司 | Automatic vacuum absorption hand |
| CN204575447U (en) * | 2015-03-11 | 2015-08-19 | 安徽省（水利部淮河水利委员会）水利科学研究院 | Sucker type glass curtain wall loading strength tester |
| CN106037576A (en) * | 2016-05-31 | 2016-10-26 | 南昌理工学院 | Adsorption device and climbing cleaning robot using adsorption device |
-
2017
- 2017-12-30 CN CN201711492115.7A patent/CN107941602A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN88202086U (en) * | 1988-03-18 | 1988-11-23 | 大连理工大学 | Vacuum suction disk stretching clamp |
| CN2053203U (en) * | 1989-04-04 | 1990-02-21 | 沈阳重型机器厂 | Vacuum suction cup |
| JP2003035658A (en) * | 2001-07-18 | 2003-02-07 | Shibaura Mechatronics Corp | Method and equipment for inspecting bonding strength |
| JP2009180620A (en) * | 2008-01-31 | 2009-08-13 | Dainippon Printing Co Ltd | Device and method for testing bond strength of ic chip |
| CN204400160U (en) * | 2014-12-25 | 2015-06-17 | 重庆勤发食品有限公司 | Automatic vacuum absorption hand |
| CN204575447U (en) * | 2015-03-11 | 2015-08-19 | 安徽省（水利部淮河水利委员会）水利科学研究院 | Sucker type glass curtain wall loading strength tester |
| CN106037576A (en) * | 2016-05-31 | 2016-10-26 | 南昌理工学院 | Adsorption device and climbing cleaning robot using adsorption device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108709854A (en) * | 2018-08-31 | 2018-10-26 | 信利光电股份有限公司 | A kind of fixture and bonding force test method of test bonding force |
| CN112179731A (en) * | 2020-09-17 | 2021-01-05 | 长江存储科技有限责任公司 | Sample preparation method, stress detection method and sample to be detected |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20180420 |