CN203299342U - Self-cleaning test apparatus - Google Patents
Self-cleaning test apparatus Download PDFInfo
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- CN203299342U CN203299342U CN2013202209703U CN201320220970U CN203299342U CN 203299342 U CN203299342 U CN 203299342U CN 2013202209703 U CN2013202209703 U CN 2013202209703U CN 201320220970 U CN201320220970 U CN 201320220970U CN 203299342 U CN203299342 U CN 203299342U
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- cleaning
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- test
- proving installation
- semiconductor element
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Abstract
The utility model discloses a self-cleaning test apparatus, comprises a bench turret, a plurality of test units and a cleaning unit. The bench turret comprises a mobile arm and an absorber; each test unit comprises a test seat, a test groove and a plurality of probes, and the test seat is arranged surrounding a turning axle; and the cleaning unit comprises a disposing seat, a disposing groove and a cleaning pad. The absorbers passing the bench turret clean the probes of the cleaning pad disposed in the test groove, test interruption caused by shutdown of the bench turret is prevented, and the test yield rate is enhanced.
Description
Technical field
The utility model relates to a kind of proving installation, particularly relevant for a kind of self-cleaning proving installation.
Background technology
Along with developing rapidly of semiconductor industry, make the manufacture of integrated package carry out toward less live width, to strengthen the function of integrated package, and reduce the cost that unit uses.at semiconductor integrated block in process of production, need utilize a proving installation to test, during test, described semiconductor integrated block is put into to a test jack of described proving installation, the mutual interlock of metal pin of the metal lead wire of wherein said semiconductor integrated block and described test jack bottom is to carry out testing electrical property, when the metal pin relative sliding friction of the metal lead wire of described semiconductor integrated block and described test jack bottom, because the hardness difference makes to produce metal filings between the two, described metal filings not only easy and dust foreign material mixes, more can with airborne aqueous vapor and oxygen reaction, described insulation foreign matter can cause the metal pin electric conductivity of described test jack bottom to reduce, and affect the sensitivity of testing electrical property.
Want to improve the test fraction defective of described test jack, must remove the insulation foreign matter that bottom produces, in the prior art, to change and be positioned over described test jack in alcohol liquid, use ultrasound wave to shake cleaning, or with the described test jack of cotton ball soaked in alcohol wiping, it adopt artificial clean mode, not only cleaning frequency is high, and labor intensive man-hour.Simultaneously, tester table also must be shut down and manually clean, and after completing artificial cleaning, could again start shooting, and this measure will cause the interruption of test jobs, affect continuity and the efficiency of testing process.
Therefore, be necessary to provide a kind of self-cleaning proving installation, to solve the existing problem of prior art.
The utility model content
In view of this, the utility model provides a kind of self-cleaning proving installation, the mode that manually cleans to solve present employing, and produce the labor intensive problem in man-hour.
Fundamental purpose of the present utility model is to provide a kind of self-cleaning proving installation, and it can be undertaken by cleaning unit autologous clean.
for reaching aforementioned purpose of the present utility model, the utility model one embodiment provides a kind of self-cleaning proving installation, described self-cleaning proving installation comprises a board capstan head, several test cells and at least one cleaning unit, described board capstan head comprises a turning axle, at least one transfer arm and at least one adsorber, described transfer arm is fixed on described turning axle, described adsorber is arranged on described transfer arm, each described test cell respectively comprises a test bench, one test trough and several probe, described test bench is arranged on around described turning axle, described test trough is formed on described test bench, use for semiconductor element and place, described probe is arranged on described test trough bottom, in order to be electrically connected described semiconductor element, described cleaning unit comprises a holder, one putting groove and a cleaning pad, described holder is arranged on around described turning axle, described putting groove is formed on described holder end face, it is standby or be positioned in described test trough clean described probe that described cleaning pad is positioned over described putting groove.
In one embodiment of this invention, described cleaning pad comprises a body and an elastic body, and described body is used for described adsorber absorption, and described elastic body is arranged on a bottom surface of described body, in order to contact described probe.
In one embodiment of this invention, described cleaning pad is identical with the size of described test trough.
In one embodiment of this invention, described self-cleaning proving installation also comprises a feeding end, described feeding end is arranged on around described board capstan head, and comprises a feed chute, in order to input described semiconductor element to be tested, for the adsorber on described transfer arm, takes.
In one embodiment of this invention, described cleaning unit is between described feeding end and described test cell.
In one embodiment of this invention, described self-cleaning proving installation also comprises a steady arm, described steady arm is arranged on around described board capstan head, and comprises a locating slot, uses the direction of placing to judge and adjust described semiconductor element for described semiconductor element.
In one embodiment of this invention, described steady arm is between described cleaning unit and described test cell.
In one embodiment of this invention, described steady arm is between described feeding end and described cleaning unit.
In one embodiment of this invention, described self-cleaning proving installation also comprises a discharge end, described discharge end is arranged on around described board capstan head, and comprises a blow tank, uses for the adsorber on described transfer arm, to draw the described semiconductor element complete test and be placed into described blow tank.
In one embodiment of this invention, the quantity of described test cell be 3 or more than.
As mentioned above; in the process of described self-cleaning proving installation operation test jobs; adsorber by described board capstan head is positioned over clean described probe in described test trough by described cleaning pad; can avoid described board capstan head to shut down the interruption that causes test jobs; in addition by the periodic automated cleaning of adsorber of described board capstan head; not only can reduce manpower man-hour, described test cell is maintained in the clean condition, be conducive to test the lifting of yield.
The accompanying drawing explanation
Fig. 1 is the stereographic map of the utility model one embodiment self-cleaning proving installation.
Fig. 2 is the cut-open view of the cleaning unit of the utility model one embodiment self-cleaning proving installation.
Fig. 3 is the stereographic map of the cleaning unit of the utility model one embodiment self-cleaning proving installation.
Fig. 4,5 is the use schematic diagram of the utility model one embodiment self-cleaning proving installation.
Embodiment
please refer to Fig. 1, shown in 2, the self-cleaning proving installation 100 of the utility model one embodiment can be applicable to the board capstan head of different test specifications and be used to testing various semiconductor package products, described self-cleaning proving installation 100 mainly comprises a board capstan head 2, several test cells 3, one cleaning unit 4 (or a plurality of), one steady arm 5, one feeding end 6 and a discharge end 7, wherein said feeding end 6, cleaning unit 4, steady arm 5, test cell 3 and discharge end 7 sequentially be arranged at described turning axle 20 around, and form the self-cleaning proving installation 100 of a central rotary type tower, , the utility model will be in hereinafter describing one by one the detail structure of above-mentioned each element of the present embodiment in detail, assembled relation and operation principles thereof.
Please refer to shown in Figure 1, described board capstan head 2 comprises a turning axle 20, at least one transfer arm 21 and at least one adsorber 22, the rotatable movement of described transfer arm 21, described adsorber 22 is arranged on described transfer arm 21, and connect the motor of bleeding (not illustrating), use so that described adsorber 22 produces suction adsorption one object surfaces.
Please refer to shown in Fig. 1,5, the quantity of the described test cell 3 of the present embodiment is 3, also the test cell 3 more than 3 can be set according to the project of testing electrical property, described test cell 3 is arranged on around described turning axle 20 and is the equi-spaced apart arrangement, described test cell 3 respectively comprises a test bench 31, a test trough 32 and several probe 33, wherein said test trough 32 is formed on the surface of described test bench 31, uses for semiconductor element (not illustrating) and places; Described probe 33 is arranged on described test trough 32 bottoms, in order to be electrically connected described semiconductor element, so that described semiconductor element is carried out to various testing electrical properties one by one.Described semiconductor element can be semiconductor package product or semi-conductor chip, in addition, the quantity of described transfer arm 21 and described adsorber 22, preferably identical with the quantity of described test bench 31 (Fig. 1,4 only illustrates a transfer arm 21 and adsorber 22 representative explanations), to improve the work efficiency of the described semiconductor element of test.
Please refer to shown in Fig. 1,2,3, described cleaning unit 4 is between described feeding end 6 and described test cell 3, and described cleaning unit 4 comprises a holder 41, a putting groove 42 and a cleaning pad 43, and wherein said holder 41 is arranged on around described turning axle 20; Described putting groove 42 is formed on described holder 41 end faces; Described cleaning pad 43 is positioned over described putting groove 41 standby (seeing Fig. 2) or is positioned over clean described probe 33 in described test trough 32, wherein said cleaning pad 43 comprises a body 431 and an elastic body 432, and described body 431 use are for described adsorber 22 absorption; Described elastic body 432 is arranged on a bottom surface of described body 431, in order to contact described probe 33.In the present embodiment, the size of described cleaning pad 43, described test trough 32 and described putting groove 42 is identical.And described elastic body 432 is that at least one rubber layer (not indicating) or at least one sponge layer (not indicating) are made; described elastic body 432 bottoms are tacky surfaces; and be provided with abrasive grains or form hole, to strengthen the clean function of described cleaning pad 43 decontaminations.In addition, as shown in Figure 3, the holder 41 of each cleaning unit 4 also comprises several guide channels 44, described guide channel 44 is formed on described holder 41 end faces, and be communicated with described putting groove 42, described guide channel 44 and putting groove 42 are made moulding with mechanical miller, and can overcome the rising-heat contracting-cold variation of described holder 41 material structures, to facilitate described semiconductor element fixed placement in described putting groove 42.
please refer to shown in Figure 1, described feeding end 6 and described discharge end 7 are separately positioned on around described turning axle 20, described feeding end 6 comprises a feed chute 61, in order to input described semiconductor element (not illustrating) to be tested, for the adsorber 22 on described transfer arm 21, take, described discharge end 7 comprises a blow tank 71, use and for the adsorber 22 on described transfer arm 21, draw the described semiconductor element (not illustrating) that completes test and be placed into described blow tank 71, because the concrete structure of described feeding end 6 and described discharge end 7 has shown in the prior art, therefore no longer describe in detail.
Continuous with reference to shown in Figure 1, described steady arm 5 is arranged on around described turning axle 20 and between described feeding end 6 and described cleaning unit 3, or between the holder 41 and described test cell 3 of described cleaning unit 4.Described steady arm 5 comprises a locating slot 51, uses the direction of placing to judge and adjust described semiconductor element for described semiconductor element.
please refer to Fig. 1, shown in 2, the self-cleaning proving installation 100 of the utility model one embodiment can be in the process of described board capstan head 2 fortune, repeatedly test and cleaning operation, when testing, described semiconductor element to be tested can be sequentially by described feeding end 6 inputs, and be positioned over one by one described feed chute 61, adsorber 22 absorption of following described board capstan head 2 are positioned over the described semiconductor element of described feed chute 61, it is moved in the locating slot 51 of described steady arm 5, whether the orientation that is positioned at semiconductor element described in described locating slot 51 by described steady arm 5 detectings is correct, if the detecting orientation is incorrect, described steady arm 5 can rotate described semiconductor element to correct angle, the adsorber 22 of following described board capstan head 2 can adsorb the described semiconductor element that is positioned over described locating slot 51, its test trough 32 that moves to described test cell 3 is carried out to testing electrical property, after described adsorber 22 sequentially is positioned over the test trough 32 of 3 described test cells 3 by 3 semiconductor elements, can to described 3 semiconductor elements, carry out identical testing electrical property simultaneously, perhaps, described adsorber 22 can first be positioned over a semiconductor element first described test trough 32 and carry out the first testing electrical property, more sequentially mobile same semiconductor element to second, third described test trough 32 is carried out second, third road testing electrical property.
Please refer to shown in Fig. 4,5, after test completes, by the adsorber 22 of described board capstan head 2, described semiconductor element is moved to the blow tank 71 of described discharge end 7, to carry out subsequent job.When described test cell 3 has carried out the test (as 2000-3000 time) of pre-determined number in the time of need cleaning afterwards, adsorber 22 absorption of described board capstan head 2 are positioned over the described cleaning pad 43 in described putting groove 41, and it is moved in the test trough 32 of described test cell 3.At this moment, described cleaning pad 43 is pressed down (for example 3 times) for several times, makes the described probe 33 of its elastic body 432 contact, so that described probe 33 is cleaned.Therefore, the utility model self-cleaning proving installation 100 can be by the mobile of described board capstan head 2 set, the cleaning action of execution cycle property.
As mentioned above; in the process of described self-cleaning proving installation 100 operation test jobs; the described cleaning pad 43 that adsorber 22 by described board capstan head 2 will be positioned over described putting groove 41 is positioned over clean described probe 33 in described test trough 32; can avoid described board capstan head 2 to shut down the interruption that causes test jobs; in addition by the periodic automated cleaning of adsorber 22 of described board capstan head 2; not only can reduce manpower man-hour; described test cell 3 is maintained in the clean condition, is conducive to test the lifting of yield.
The utility model is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present utility model.Must be pointed out that, published embodiment does not limit scope of the present utility model.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in scope of the present utility model.
Claims (10)
1. self-cleaning proving installation, it is characterized in that: described self-cleaning proving installation comprises:
One board capstan head, comprise a turning axle, at least one transfer arm and at least one adsorber, and described transfer arm is fixed on described turning axle, and described adsorber is arranged on described transfer arm;
Several test cells, each described test cell respectively comprises a test bench, a test trough and several probe, described test bench is arranged on around described turning axle, described test trough is formed on described test bench, use for semiconductor element and place, described probe is arranged on described test trough bottom, in order to be electrically connected described semiconductor element; And
At least one cleaning unit, comprise a holder, a putting groove and a cleaning pad, described holder is arranged on around described turning axle, and described putting groove is formed on described holder end face, and it is standby or be positioned in described test trough clean described probe that described cleaning pad is positioned over described putting groove.
2. self-cleaning proving installation as claimed in claim 1, it is characterized in that: described cleaning pad comprises a body and an elastic body, and described body is used for described adsorber absorption, and described elastic body is arranged on a bottom surface of described body, in order to contact described probe.
3. self-cleaning proving installation as claimed in claim 1, it is characterized in that: described cleaning pad is identical with the size of described test trough.
4. self-cleaning proving installation as claimed in claim 1, it is characterized in that: described self-cleaning proving installation also comprises a feeding end, described feeding end is arranged on around described board capstan head, and comprise a feed chute, in order to input described semiconductor element to be tested, for the adsorber on described transfer arm, take.
5. self-cleaning proving installation as claimed in claim 4, it is characterized in that: described cleaning unit is between described feeding end and described test cell.
6. self-cleaning proving installation as claimed in claim 4, it is characterized in that: described self-cleaning proving installation also comprises a steady arm, described steady arm is arranged on around described board capstan head, and comprise a locating slot, use the direction of placing to judge and adjust described semiconductor element for described semiconductor element.
7. self-cleaning proving installation as claimed in claim 6, it is characterized in that: described steady arm is between described cleaning unit and described test cell.
8. self-cleaning proving installation as claimed in claim 6, it is characterized in that: described steady arm is between described feeding end and described cleaning unit.
9. self-cleaning proving installation as claimed in claim 1, it is characterized in that: described self-cleaning proving installation also comprises a discharge end, described discharge end is arranged on around described board capstan head, and comprise a blow tank, use and for the adsorber on described transfer arm, draw the described semiconductor element complete test and be placed into described blow tank.
10. self-cleaning proving installation as claimed in claim 1 is characterized in that: the quantity of described test cell be 3 or more than.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202209703U CN203299342U (en) | 2013-04-26 | 2013-04-26 | Self-cleaning test apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202209703U CN203299342U (en) | 2013-04-26 | 2013-04-26 | Self-cleaning test apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203299342U true CN203299342U (en) | 2013-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202209703U Expired - Fee Related CN203299342U (en) | 2013-04-26 | 2013-04-26 | Self-cleaning test apparatus |
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| CN (1) | CN203299342U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107003352A (en) * | 2017-03-22 | 2017-08-01 | 深圳市汇顶科技股份有限公司 | The clean method and test system of measuring head |
-
2013
- 2013-04-26 CN CN2013202209703U patent/CN203299342U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107003352A (en) * | 2017-03-22 | 2017-08-01 | 深圳市汇顶科技股份有限公司 | The clean method and test system of measuring head |
| WO2018170806A1 (en) * | 2017-03-22 | 2018-09-27 | 深圳市汇顶科技股份有限公司 | Test head cleaning method and test system |
| CN107003352B (en) * | 2017-03-22 | 2020-11-06 | 深圳市汇顶科技股份有限公司 | Cleaning method of test head and test system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20210426 |