CN203323735U - Wafer surface flatness measuring device - Google Patents
Wafer surface flatness measuring device Download PDFInfo
- Publication number
- CN203323735U CN203323735U CN2013204008450U CN201320400845U CN203323735U CN 203323735 U CN203323735 U CN 203323735U CN 2013204008450 U CN2013204008450 U CN 2013204008450U CN 201320400845 U CN201320400845 U CN 201320400845U CN 203323735 U CN203323735 U CN 203323735U
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- China
- Prior art keywords
- wafer surface
- contact pilotage
- calibration plate
- wafer
- contact
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- A Measuring Device Byusing Mechanical Method (AREA)
Abstract
The utility model discloses a wafer surface flatness measuring device. The wafer surface flatness measuring device comprises a contact pin array which is composed of a plurality of horizontally-arranged contact pins which are parallelly distributed side by side, and a contact pin supporting base used for supporting the contact pins; horizontally-arranged through holes which are parallelly distributed side by side are arranged inside the contact pin supporting base; the plurality of contact pins correspondingly penetrate the through holes and can move rightwards and leftwards along an axial direction inside the through holes; one end of each contact pin is a testing end and is used for contacting with the surface of a wafer, and the other end of each contact pin is provided with a displacement sensor; the wafer surface flatness measuring device further comprises a calibration plate which is detachably arranged before the testing ends of the contact pins; and the surface of the calibration plate is flat. Before the utilization of the wafer surface flatness measuring device, the calibration plate is arranged before the testing ends of the contact pins, and then, the contact pins are pushed forwards such that the contact pins can be jacked on the calibration plate, and the surface of the calibration plate is flat, so the leveling of the testing ends of the contact pins can be realized, and therefore, follow-up measurement operation can be facilitated.
Description
Technical field
The utility model relates to LED wafer production process equipment, particularly relates to a kind of wafer surface planeness measuring apparatus.
Background technology
Existing a kind of wafer surface planeness measuring apparatus, as shown in Figure 1, comprise the contact pilotage array 1 formed by a plurality of levels and the parallel contact pilotage be set up in parallel, and for supporting the contact pilotage supporting seat 2 of contact pilotage, be provided with a plurality of levels and the parallel through hole be set up in parallel in this contact pilotage supporting seat 2, a plurality of contact pilotages are corresponding to be passed described through hole and can move left and right vertically in described through hole; One end of described contact pilotage is test lead, for wafer 6 Surface Contacts, its other end is provided with the displacement transducer (not shown).During use, wafer is holded up to the test lead that rear level is shifted to contact pilotage, smooth if wafer shows, wafer will be touched whole contact pilotages simultaneously, and along with wafer continues mobile, the promotion contact pilotage moves forward, and now the displacement transducer of the contact pilotage other end is by the Mobile data of recording stylus, for gauger's reference; If wafer surface out-of-flatness, wafer will be not identical with the time of contact pilotage contact, so the contact pilotage displacement that each displacement transducer is sensed is not identical yet, now the gauger just can conclude that eyeglass shows out-of-flatness according to the displacement transducer recorded data.
Yet there is defect in said structure: at first will make the test lead of a plurality of contact pilotages in same plane before measurement, otherwise measure, have very large error, and measurement mechanism of the prior art lacks the means of making uniform, the operating personnel has to by manually making uniform, error is larger, poor effect.
The utility model content
The technical problems to be solved in the utility model is to provide a kind of wafer surface planeness measuring apparatus that a plurality of contact pilotage test leads can be made uniform fast.
For addressing the above problem, wafer surface planeness measuring apparatus of the present utility model, comprise the contact pilotage array formed by a plurality of levels and the parallel contact pilotage be set up in parallel, and for supporting the contact pilotage supporting seat of contact pilotage, be provided with a plurality of levels and the parallel through hole be set up in parallel in this contact pilotage supporting seat, a plurality of contact pilotages are corresponding to be passed described through hole and can move left and right vertically in described through hole; One end of described contact pilotage is test lead, and for contacting with wafer surface, its other end is provided with displacement transducer; Described wafer surface planeness measuring apparatus also comprises the calibration plate that is removably disposed in described contact pilotage test lead front side, this calibration plate surfacing.
Described wafer surface planeness measuring apparatus also comprises the axial consistent slideway of direction and contact pilotage, is provided with slide block on slideway, and a wafer rack is fixed on slide block, and measured wafer can vertically be fixed on the eyeglass rack.
Described calibration plate is fixed on a calibration plate rack, and this calibration plate rack upper end and a leading screw vertically arranged fix, and on leading screw, cover has a feed screw nut; This leading screw screw outer face is gear-like, and is meshed with a gear, and this gear is connected with a motor power output terminal.
Adopt wafer surface planeness measuring apparatus of the present utility model, before using, calibration plate is put into to contact pilotage test lead front side, then promoting forward contact pilotage withstands on described calibration plate contact pilotage, surfacing due to calibration plate, thereby can be made uniform to the contact pilotage test lead, be facilitated follow-up measurement operation.
The accompanying drawing explanation
Fig. 1 is existing wafer surface planeness measuring apparatus structural representation;
Fig. 2 is wafer surface planeness measuring apparatus schematic diagram of the present utility model.
Embodiment
In order to make those skilled in the art person understand better technical solutions of the utility model, below in conjunction with drawings and embodiments, the utility model is described in further detail.
As shown in Figure 2, the wafer surface planeness measuring apparatus, comprise the contact pilotage array formed by a plurality of levels and the parallel contact pilotage be set up in parallel 101, and for supporting the contact pilotage supporting seat 2 of contact pilotage, be provided with a plurality of levels and the parallel through hole be set up in parallel in this contact pilotage supporting seat 2, a plurality of contact pilotages are corresponding to be passed described through hole and can move left and right vertically in described through hole; One end of described contact pilotage is test lead, and for contacting with wafer surface, its other end is provided with the displacement transducer (not shown).
Described wafer surface planeness measuring apparatus also comprises the calibration plate 7 that is removably disposed in described contact pilotage test lead front side, this calibration plate surfacing.Described wafer surface planeness measuring apparatus also comprises the axial consistent slideway 3 of direction and contact pilotage, is provided with slide block 4, one wafer racks 5 on slideway and is fixed on slide block, and measured wafer 6 can vertically be fixed on the eyeglass rack.Described calibration plate is fixed on a calibration plate rack 8, and these calibration plate rack 8 upper ends and a leading screw 9 vertically arranged fix, and on leading screw, cover has a feed screw nut 10; This leading screw screw outer face is gear-like, and is meshed with a gear 11, and this gear is connected with motor 12 clutch ends.Rotate by the driven by motor leading screw, calibration plate 7 is moved up and down, be convenient for measuring operation.
Claims (3)
1. a wafer surface planeness measuring apparatus, it is characterized in that: comprise the contact pilotage array formed by a plurality of levels and the parallel contact pilotage be set up in parallel, and for supporting the contact pilotage supporting seat of contact pilotage, be provided with a plurality of levels and the parallel through hole be set up in parallel in this contact pilotage supporting seat, a plurality of contact pilotages are corresponding to be passed described through hole and can move left and right vertically in described through hole; One end of described contact pilotage is test lead, and for contacting with wafer surface, its other end is provided with displacement transducer; Described wafer surface planeness measuring apparatus also comprises the calibration plate that is removably disposed in described contact pilotage test lead front side, this calibration plate surfacing.
2. wafer surface planeness measuring apparatus as claimed in claim 1, it is characterized in that: described wafer surface planeness measuring apparatus also comprises the axial consistent slideway of direction and contact pilotage, be provided with slide block on slideway, one wafer rack is fixed on slide block, and measured wafer can vertically be fixed on the eyeglass rack.
3. wafer surface planeness measuring apparatus as claimed in claim 2, it is characterized in that: described calibration plate is fixed on a calibration plate rack, and this calibration plate rack upper end and a leading screw vertically arranged fix, and on leading screw, cover has a feed screw nut; This leading screw screw outer face is gear-like, and is meshed with a gear, and this gear is connected with a motor power output terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013204008450U CN203323735U (en) | 2013-07-05 | 2013-07-05 | Wafer surface flatness measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013204008450U CN203323735U (en) | 2013-07-05 | 2013-07-05 | Wafer surface flatness measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203323735U true CN203323735U (en) | 2013-12-04 |
Family
ID=49663075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013204008450U Expired - Fee Related CN203323735U (en) | 2013-07-05 | 2013-07-05 | Wafer surface flatness measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203323735U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107032066A (en) * | 2017-05-09 | 2017-08-11 | 浙江硕和机器人科技有限公司 | A kind of guide plate flatness detecting device |
| CN110715638A (en) * | 2019-11-27 | 2020-01-21 | 湖南大合新材料有限公司 | Method for detecting flatness of crystal |
-
2013
- 2013-07-05 CN CN2013204008450U patent/CN203323735U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107032066A (en) * | 2017-05-09 | 2017-08-11 | 浙江硕和机器人科技有限公司 | A kind of guide plate flatness detecting device |
| CN107032066B (en) * | 2017-05-09 | 2022-10-04 | 浙江硕和机器人科技股份有限公司 | Guide plate flatness detection device |
| CN110715638A (en) * | 2019-11-27 | 2020-01-21 | 湖南大合新材料有限公司 | Method for detecting flatness of crystal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 Termination date: 20140705 |
|
| EXPY | Termination of patent right or utility model |