M3 61021 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種晶片測試插座，特別係關於一種具 有清潔模組之晶片測試插座，俾便去除不潔物。 【先前技術】 一般而言，晶圓上的積體電路元件必須先行測試其電 氣特性，藉以判定積體電路元件是否良好。良好的積體電 路將被選出以進行後續之封裝製程，而不良品將被捨棄以 避免增加額外的封裝成本。完成封裝之積體電路元件必須 再進行另一次電性測試以篩選出封裝不良品，進而提升最 終成品良率。換言之，積體電路元件在製造的過程中，必 須進行數次的電氣特性測試。 傳統上，完成封裝之半導體晶片測試使用具有彈簧針 之測試插a，彈簧針（POGOpins)係用以傳送測試訊號及接 收半導體W之反應訊號。彈簀針已廣泛地使用於測試插 座内’用以電氣接觸待測晶片之焊球並消除接觸待測晶片 之針Μ。美國專利US 7,202,686及us 6,624,647揭示使用曰彈 普針之測試插座。 在電氣測試過程中，彈簧針接觸不同的待測晶片以來 成電氣連接。彈簧針重覆地伸縮以有效地消除接觸待測晶 片時產生之針屡。然而，彈簧針之重覆伸縮動作產生制落 物或微粒於測試插座上，其可能在鄰近之彈簣針間^ 【新型内容】 134950.doc M361021 本創作提供一:¾ _1_ t、、*· 'iv 4«. 種具有β泳模組之晶片測試插座，俾便 去除不潔物，例如劎4W们 」落物（flakes)、微粒（particles)或碎片 (debris) ° 本創作之曰曰片測試插座之一實施例包含一電路板、設 置於該電路板上方且具有複數個上導孔之—上導引板、炎 置於該電路板與該上導引板間且具有複數個下導孔之一下 i引板a置於5亥上導孔及該下I孔内之複I根彈性探針 、以及-清潔模組。該彈性探針係被建構以電氣連接該電 :板及-待測晶片。該下導引板具有一上表面，朝向該上 V引板。該清潔模組包含至少一流體線路， 入-清潔流體至該下導引板之上表面，藉以去二: 之不潔物。 本創作之晶片測試插座之另一實施例包含一電路板、 設置於該電路板上方之—彈簧針組件、以及_清潔模組。 该彈簧針組件包含二導引板及複數根彈性探針，該彈性探 針設置於該二導引板内且被建構以電氣連接該電路板及一 待測晶片。該清潔模組包含至少一流體線路，其被建構以 導入一清潔流體至該下導引板之上表面，藉以去除該上表 面之不潔物。 上文已相當廣泛地概述本創作之技術特徵及優點，俾 使下文之本創作詳細描述得以獲得較佳瞭解。構成本創作 之申請專利範圍標的之其它技術特徵及優點將描述於下文 。本創作所屬技術領域中具有通常知識者應瞭解，可相當 134950.doc M361021 容易地利用下文揭示之概念與特定實施例可作為修改或設 汁其它結構或製程而實現與本創作相同之目的。本創作所 屬技術領域中具有通常知識者亦應瞭解，這類等效建構無 法脫離後附之申請專利範圍所界定之本創作的精神和範圍 0 【實施方式】 圖1例示本創作一實施例之晶片測試插座1〇。該晶片測 試插座10包含一電路板70、設置於該電路板7〇上方之一彈 簧針組件（例如晶片插座）20、以及一清潔模組6〇。該電路板 70可為一印刷電路板，其包含複數層堆疊層板％、嵌設於 該層板76内部之導線78、—上表面72、以及複數個設置於 該上表面72之接墊74。該清潔模組6〇包含至少一流體線路 62,其被建構以導入一清潔流體料至該彈簧針組件2〇，藉 以去除該彈簧針組件2〇之不潔物12。該彈簀針組件2〇包含 設置於該電路板70上方之一上導引板3〇、夾置於該電路板 70與該上導引板3G間之-下導引板4〇、分隔該上導引板3q 及該下導板40之間隔器14、以及夾置於該上導引板3〇及該 下導板40間之複數根彈性探針5〇。 該上導引板30具有複數個上導孔μ，該下導引板4〇具 有複數個下導孔42及朝向該上導引板3〇之—上表面44，該 彈性探針50係設置於該上導孔32及該下導孔〇内。該彈性 探針50包含-殼體52、設置於殼體52中之—彈簧54、以及 分別連接於該彈簧5仁末端之上連㈣56與下連接梢58。 134950.doc M361021 該上連接梢5 6係被建構以接觸一待測晶片（例如積體電路 元件）90之焊球92，該下連接梢58係被建構以接觸該電路板 70之接墊74，如此該彈性探針50即可在該電路板川與該待 測晶月90之間形成電氣連接，而將該電路板7〇提供之測試 訊號傳送至該待測晶片90。此外，該清潔模組6〇之流體線 路62係耦接於一流體供應器8〇之出口 84，如此即可將加壓 之清潔流體64經由該流體線路62導入該上表面44。再者， 該晶片測試插座10可包含一控制閥82，其被建構以控制該 流體供應器80輸出至該出口 84之加壓清潔流體64的流量。 在電氣測試過程中，該彈性探針5〇接觸不同的待測晶 片90以便在該電路板7〇與該待測晶片9〇之間形成電氣連接 ，而a亥彈性探針5〇之彈簧54重覆地伸縮以有效地消除該彈 性探針50接觸該待測晶片9〇時產生之針壓（應力”惟，該彈 簧54之重覆伸縮動作產生該不潔物12(例如剝落物、微粒或 碎片）於該下導引板40之上表面44，而該不潔物12可能在鄰 近之弹性探針5 〇間形成短路。 為了解決此一問題，本創作之一實施例藉由該清潔模 組60去除該上表面44之不潔物丨2。該清潔模組6〇係藉由將 加壓之清潔流體64吹向該上表面44，藉以去除該彈簧針組 件20内之不潔物丨2。在本創作之一實施例中，該流體線路 62係經由該上導引板3〇之一開口 34將該清潔流體（包含氣 體、液體或氣液混合物）64導引至該下導引板4〇之上表面44 。除了藉由將加壓之清潔流體64吹向該上表面44以去除該 134950.doc M3 61021 不篇物12之外，本創作之另一實施例亦可選擇性地以吸附 方式去除該上表面44之不潔物12 ’例如將該清潔模組齡 流體線路62搞接於-負壓產生器⑽如馬達），而將該上表面 44之不潔物12予以吸附去除。 圖2例不本創作另—實施例之晶片測試插座10〇。該晶 片測試插座100包含一電路板7〇、設置於該電路板7〇上方之 一彈簣針組件（例如晶片插座）12〇、以及一清潔模組160。該 電路板70可為-印刷電路板，其包含複數層堆疊層板％、 嵌設於該層板76内部之導線78、一上表面72、以及複數個 設置於該上表面72之接墊74。該清潔模組160包含至少一流 體線路162，其被建構以導入一清潔流體164至該彈簣針組 件120,藉以去除該彈簧針組件12〇之不潔物12。該彈簧針 組件120包含設置於該電路板7〇上方之一上導引板13〇、夾 置於該電路板70與該上導引板〖別間之一下導引板4〇、以及 夾置於該上導引板130及該下導板4〇内之複數根彈性探針 50 ° 該上導引板130具有複數個上導孔132，該下導引板4〇 具有複數個下導孔42及朝向該上導引板3〇之一上表面44， 該彈性探針50係設置於該上導孔丨32及該下導孔42内。該彈 性探針50包含一殼體52、設置於殼體52中之一彈簣54、以 及分別連接於該彈簧54二末端之一上連接梢56與一下連接 梢5 8。該上連接梢5 6係被建構以接觸一待測晶片（例如積體 電路元件）90之焊球92，該下連接梢58係被建構以接觸該電 134950.doc -9- M3 61021 路板70之接墊74，如此該彈性探針50即可在該電路板7〇與 s亥待測晶片90之間形成電氣連接’而將該電路板7〇提供之 測s式§扎號傳送至該待測晶片9 〇。此外，該清潔模纟且16 〇之流 體線路162係耦接於一流體供應器18〇之出口丨84，如此即可 將加壓之清潔流體1 64經由該流體線路162導入該上表面44 。此外，該晶片測試插座100可包含一控制閥丨82，其被建 構以控制該流體供應器1 8〇輸出至該出口 i 84之加壓清潔流 體164的流量。 在電氣測試過程中，該彈性探針5 〇接觸不同的待測晶 片90以便在該電路板7〇與該待測晶片9〇之間形成電氣連接 ，而該彈性探針50之彈簧54重覆地伸縮以有效地消除該彈 性探針50接觸該待測晶片9〇時產生之針壓（應力惟，該彈 簧54之重覆伸縮動作產生該不潔物12(例如剝落物、微粒或 碎片）於該下導引板40之上表面44 ’而該不潔物12可能在鄰 近之彈性探針50間形成短路。 為了解決此一問題，本創作之一實施例藉由該清潔模 組160去除該上表面44之不潔物12。該清潔模組⑽係藉由 將加壓之清潔流體64吹向該上表面44，藉以去除該彈菁針 、且件120内之不潔物12。纟本創作之一實施例中，該流體線 =162係經由該上導引板130及該下導板4〇之側邊（即該彈 菁針組件12 〇之側邊）將該清潔流體16 4導引至該下導引板 之上表面44。除了藉由將加壓之清潔流體丨64吹向該上表 乂去除D亥不泳物丨2之外，本創作之另一實施例亦可選 i34950.doc • 10*-· M3 61021 擇I·生地以吸附方式去除該上表面44之不潔物工2，例如將該 清潔模組160之流體線路162叙接於一負壓產生器（例如= 達）’而將該上表面44之不潔物12予以吸附去除。 本創作之技術内容及技術特點已揭示如上，然而本創 作所屬技術領域中具有通常知識者應瞭解，在不背離後附 申請專利範圍所^之本創作精神和範圍内，本創作之教 示及揭示可作種種之替換及修飾。例如，上文揭示之許多 製程可以不同之方法實施或以其它製程予以取代，或者採 用上述二種方式之組合。 此外，本案之權利範圍並不侷限於上文揭示之特定實 施例的製程、機台、製造、物質之成份、裝置、方法或步 驟。本創作所屬技術領域中具有通常知識者應療解，基於 本創作教示及揭示製程、機台、製造、物質之成份、裝置 、方法或步驟’無論現在已存在或日後開發者，i鱼本案 實施例揭示者係以實質相同的方式執行實質相同的功能， 而達到實質相同的結果，亦可使用於本創作。因此，以下 之申請專利範圍係用以涵蓋用以此類製程、機台、製造、 物質之成份、裝置、方法或步驟。 【圖式簡單說明】 f由參照前述說明及下列圖式，本創作之技術特徵及 優點得以獲得完全瞭解。 圖1例示本創作一實施例之晶片剩試插座；以及 圖2例示賴作另—實補之晶片測試插座。 134950.doc M3 61021 【主要元件符號說明】 10 晶片測試插 12 不潔物 14 間隔器 20 彈簧針組件 30 上導引板 32 上導孔 34 開口 40 下導引板 42 下導孔 44 上表面 50 彈性探針 52 殼體 54 彈簧 56 上連接梢 58 下連接梢 60 清潔模組 62 流體線路 64 清潔流體 70 電路板 72 上表面 134950.doc -12 M3 61021 74 76 78 80 82 84 90 92 100 120 130 132 160 162 164 180 182 184 接墊 層板 導線 流體供應器 控制閥 出口 待測晶片 焊球 晶片測試插座 彈簧針組件 上導引板 上導孔 清潔模組 流體線路 清潔流體 流體供應器 控制閥 出口 134950.doc -13M3 61021 V. New Description: [New Technology Field] This is a wafer test socket, especially for a wafer test socket with a cleaning module to remove impurities. [Prior Art] In general, an integrated circuit component on a wafer must first be tested for its electrical characteristics to determine whether the integrated circuit component is good. A good integrated circuit will be selected for subsequent packaging processes, and defective products will be discarded to avoid additional packaging costs. The completed packaged circuit components must be subjected to another electrical test to screen for defective packages, which in turn improves the final yield. In other words, the integrated circuit component must be tested for electrical characteristics several times during the manufacturing process. Traditionally, the completed semiconductor wafer test uses a test plug a with a pogo pin, which is used to transmit the test signal and receive the reaction signal of the semiconductor W. The magazine pin has been widely used in the test socket to electrically contact the solder balls of the wafer to be tested and to eliminate the pinholes contacting the wafer to be tested. U.S. Patent No. 7,202,686 and U.S. Patent 6,624,647, the disclosure of which are incorporated herein by reference. During the electrical test, the spring pins are electrically connected to the different wafers to be tested. The pogo pins are repeatedly telescoped to effectively eliminate the occurrence of stitches when contacting the wafer to be tested. However, the repeated telescopic action of the pogo pins produces a falling object or particles on the test socket, which may be between the adjacent magazine pins. [New content] 134950.doc M361021 This creation provides one: 3⁄4 _1_ t,, *· 'iv 4«. A wafer test socket with a beta-tube module that removes impurities, such as f4W" flakes, particles or debris. One embodiment of the socket includes a circuit board, an upper guiding plate disposed above the circuit board and having a plurality of upper guiding holes, and an inflammation between the circuit board and the upper guiding plate and having a plurality of lower guiding holes One of the i lead plates a is placed in the 5th upper guide hole and the lower I elastic probe in the lower I hole, and the cleaning module. The elastic probe is constructed to electrically connect the electricity: the board and the wafer to be tested. The lower guide plate has an upper surface facing the upper V-lead. The cleaning module comprises at least one fluid line, the in-cleaning fluid to the upper surface of the lower guiding plate, so as to remove the impurities. Another embodiment of the wafer test socket of the present invention comprises a circuit board, a pogo pin assembly disposed above the circuit board, and a cleaning module. The pogo pin assembly includes two guiding plates and a plurality of elastic probes. The elastic probes are disposed in the two guiding plates and are configured to electrically connect the circuit board and a wafer to be tested. The cleaning module includes at least one fluid circuit configured to introduce a cleaning fluid to the upper surface of the lower guide plate to remove impurities from the upper surface. The technical features and advantages of the present invention have been broadly summarized above, and the detailed description of the present disclosure is better understood. Other technical features and advantages of the subject matter of the patent application of this creation will be described below. It will be appreciated by those of ordinary skill in the art to which the present invention pertains that it is readily possible to utilize the concepts disclosed below and the specific embodiments as a modification or designing other structures or processes to achieve the same objectives as the present invention. It should be understood by those of ordinary skill in the art to which the present invention pertains that such equivalent construction cannot be deviated from the spirit and scope of the present invention as defined by the appended claims. [Embodiment] FIG. 1 illustrates an embodiment of the present invention. Wafer test socket 1〇. The wafer test socket 10 includes a circuit board 70, a spring pin assembly (e.g., a wafer socket) 20 disposed above the circuit board 7A, and a cleaning module 6A. The circuit board 70 can be a printed circuit board comprising a plurality of stacked layers, a wire 78 embedded in the interior of the layer 76, an upper surface 72, and a plurality of pads 74 disposed on the upper surface 72. . The cleaning module 6A includes at least one fluid line 62 that is configured to introduce a cleaning fluid to the pogo pin assembly 2 to remove the impurities 12 of the pogo pin assembly 2 . The magazine assembly 2 includes a guiding plate 3 disposed on one of the upper boards 70, and a lower guiding plate 4〇 sandwiched between the circuit board 70 and the upper guiding plate 3G. The upper guiding plate 3q and the spacer 14 of the lower guiding plate 40, and a plurality of elastic probes 5 夹 sandwiched between the upper guiding plate 3 〇 and the lower guiding plate 40. The upper guiding plate 30 has a plurality of upper guiding holes 4, and the lower guiding plate 4 has a plurality of lower guiding holes 42 and an upper surface 44 facing the upper guiding plate 3, the elastic probe 50 is arranged In the upper guide hole 32 and the lower guide hole 。. The elastic probe 50 includes a housing 52, a spring 54 disposed in the housing 52, and a connecting portion (56) 56 and a lower connecting portion 58 connected to the ends of the spring 5, respectively. 134950.doc M361021 The upper connection tip 56 is configured to contact a solder ball 92 of a wafer to be tested (eg, integrated circuit component) 90, the lower connector 58 being configured to contact the pad 74 of the circuit board 70. Therefore, the elastic probe 50 can form an electrical connection between the circuit board and the crystal 90 to be tested, and the test signal provided by the circuit board 7 is transmitted to the wafer 90 to be tested. In addition, the fluid line 62 of the cleaning module 6 is coupled to the outlet 84 of a fluid supply port 8 such that the pressurized cleaning fluid 64 can be introduced into the upper surface 44 via the fluid line 62. Moreover, the wafer test socket 10 can include a control valve 82 that is configured to control the flow of the pressurized cleaning fluid 64 output by the fluid supply 80 to the outlet 84. During the electrical test, the elastic probe 5 is in contact with a different wafer 90 to be tested to form an electrical connection between the circuit board 7 and the wafer 9 to be tested, and a spring 54 of the elastic probe 5 Repetitively expanding and contracting to effectively eliminate the needle pressure (stress) generated when the elastic probe 50 contacts the wafer to be tested 9 . However, the repeated telescopic action of the spring 54 generates the impurity 12 (eg, flaking, particles, or The debris is on the upper surface 44 of the lower guiding plate 40, and the impurity 12 may form a short circuit between the adjacent elastic probes 5. In order to solve this problem, an embodiment of the present invention uses the cleaning module. The cleaning module 6 is removed by blowing a pressurized cleaning fluid 64 toward the upper surface 44 to remove the impurities 2 in the pogo pin assembly 20. In one embodiment of the present invention, the fluid line 62 guides the cleaning fluid (including a gas, liquid or gas-liquid mixture) 64 to the lower guide plate 4 via an opening 34 of the upper guide plate 3〇. Upper surface 44. except by blowing a pressurized cleaning fluid 64 thereto In addition to the surface 44 to remove the 134950.doc M3 61021, the other embodiment of the present invention may also selectively remove the unclean material of the upper surface 44 by adsorption. For example, the cleaning module fluid is cleaned. The line 62 is connected to a negative pressure generator (10) such as a motor, and the unclean 12 of the upper surface 44 is adsorbed and removed. Fig. 2 illustrates the wafer test socket 10 of the other embodiment. 100 includes a circuit board 7A, a cartridge assembly (such as a wafer socket) 12A disposed above the circuit board 7A, and a cleaning module 160. The circuit board 70 can be a printed circuit board including A plurality of stacked laminates, a wire 78 embedded in the interior of the laminate 76, an upper surface 72, and a plurality of pads 74 disposed on the upper surface 72. The cleaning module 160 includes at least one fluid line 162. It is configured to introduce a cleaning fluid 164 to the magazine pin assembly 120 to remove the impurities 12 of the pogo pin assembly 12. The pogo pin assembly 120 includes a guide plate disposed above one of the circuit boards 7A. 13〇, sandwiched between the circuit board 70 and the The guiding plate 〖one lower guiding plate 4 〇, and a plurality of elastic probes 50 θ sandwiched between the upper guiding plate 130 and the lower guiding plate 4 该 the upper guiding plate 130 has a plurality of a guiding hole 132, the lower guiding plate 4 has a plurality of lower guiding holes 42 and an upper surface 44 facing the upper guiding plate 3, and the elastic probe 50 is disposed on the upper guiding hole 32 and the lower portion The elastic probe 50 includes a housing 52, a magazine 54 disposed in the housing 52, and a connecting end 56 and a lower connecting end 58 respectively connected to one of the two ends of the spring 54. The upper connecting tip 56 is configured to contact a solder ball 92 of a wafer to be tested (eg, integrated circuit component) 90, the lower connecting tip 58 being constructed to contact the electrical 134950.doc -9-M3 61021 circuit board The pad 74 of the 70, so that the elastic probe 50 can form an electrical connection between the circuit board 7 and the wafer to be tested 90, and transmit the measured value of the circuit board 7 to the The wafer to be tested is 9 〇. In addition, the cleaning die and 16 流 fluid line 162 are coupled to an outlet port 84 of a fluid supply 18, such that pressurized cleaning fluid 1 64 can be introduced into the upper surface 44 via the fluid line 162. Additionally, the wafer test socket 100 can include a control valve 82 that is configured to control the flow of the fluid supply 18 to the pressurized cleaning fluid 164 of the outlet i 84. During the electrical test, the elastic probe 5 is in contact with a different wafer 90 to be tested to form an electrical connection between the circuit board 7 and the wafer to be tested 9 while the spring 54 of the elastic probe 50 is repeated. Flexing to effectively eliminate the needle pressure generated when the elastic probe 50 contacts the wafer to be tested 9 (stress, only the repeated telescopic action of the spring 54 generates the impurity 12 (such as flaking, particles or debris) The upper surface 44' of the lower guide plate 40 may be short-circuited between the adjacent elastic probes 50. To solve this problem, an embodiment of the present invention removes the upper portion by the cleaning module 160. The surface of the cleaning element (10) is obtained by blowing a pressurized cleaning fluid 64 toward the upper surface 44, thereby removing the elastomeric needle and the unclean material 12 in the member 120. One of the creations In an embodiment, the fluid line 162 is guided to the cleaning fluid 16 4 via the side of the upper guiding plate 130 and the lower guiding plate 4 (ie, the side of the elastic needle assembly 12 〇) Lowering the upper surface 44 of the plate, except by blowing a pressurized cleaning fluid 丨 64 toward the In addition to the D 亥 不 泳 , 2, another embodiment of the present creation is also optional i34950.doc • 10*-· M3 61021 Select I·sheng to remove the upper surface 44 by the adsorption method 2 For example, the fluid line 162 of the cleaning module 160 is connected to a negative pressure generator (for example, =), and the unclean 12 of the upper surface 44 is adsorbed and removed. The technical content and technical features of the present invention have been disclosed. As above, it should be understood by those of ordinary skill in the art that the present teachings can be replaced and modified by various teachings and disclosures without departing from the spirit and scope of the appended claims. Many of the processes disclosed above may be implemented in different ways or in other processes, or a combination of the two. The scope of the present disclosure is not limited to the process, machine, or Manufacture, material composition, device, method or step. Those who have ordinary knowledge in the technical field of this creation should be treated, based on the creation and disclosure of the process, machine, manufacturing, The composition, device, method or procedure of the substance 'whoever exists or is a developer in the future, the embodiment disclosed in the embodiment of the present invention performs substantially the same function in substantially the same manner, and achieves substantially the same result, and can also be used in the present invention. Therefore, the following patent application scope is intended to cover such processes, machines, manufactures, components, devices, methods or steps of the invention. [Simplified description of the drawings] f By referring to the foregoing description and the following figures, The technical features and advantages of the present invention are fully understood. Fig. 1 illustrates a wafer test socket of an embodiment of the present invention; and Fig. 2 illustrates a wafer test socket which is a separate and practical complement. 134950.doc M3 61021 [Main component symbol Description] 10 wafer test insert 12 unclean 14 spacer 20 spring pin assembly 30 upper guide plate 32 upper guide hole 34 opening 40 lower guide plate 42 lower guide hole 44 upper surface 50 elastic probe 52 housing 54 spring 56 Connecting tip 58 lower connecting tip 60 cleaning module 62 fluid line 64 cleaning fluid 70 circuit board 72 upper surface 134950.doc -12 M3 61021 74 7 6 78 80 82 84 90 92 100 120 130 132 160 162 164 180 182 184 Pad laminate wire fluid supply control valve outlet to be tested wafer solder ball wafer test socket spring pin assembly upper guide plate guide hole cleaning module fluid Line cleaning fluid fluid supply control valve outlet 134950.doc -13