CN107858117A - 一种led封装用导电胶 - Google Patents

一种led封装用导电胶 Download PDF

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CN107858117A
CN107858117A CN201711205867.0A CN201711205867A CN107858117A CN 107858117 A CN107858117 A CN 107858117A CN 201711205867 A CN201711205867 A CN 201711205867A CN 107858117 A CN107858117 A CN 107858117A
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刘冬寅
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Jiangsu Ruibo Photoelectric Technology Co Ltd
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Abstract

本发明涉及一种LED封装用导电胶，属于导电胶技术领域。导电胶，由以下重量份的各组份组成：乙烯‑醋酸乙烯共聚体2‑15份，香豆酮‑茚树脂3‑6份，聚乙烯醇缩丁醛2‑7份，有机钛改性环氧树脂1‑10份，聚吡咯1‑3份，氧化锌0.2‑2.6份，2,4,6‑三甲基苯甲酰基‑二苯基氧化膦 2‑8份，滑石粉0.2‑1.8份，己二酸酰肼1‑2份，环氧大豆油2‑4份，反应稀释剂1‑2份，固化剂0.2‑1.6份，促进剂0.3‑2份，偶联剂0.5‑2.0份。本发明通过原料之间的复配，具有导电性能较好，尤其适宜于高端精细化电子电气元器件LED的导电粘接和封装。

Description

一种LED封装用导电胶
技术领域
本发明涉及一种LED封装用导电胶，属于导电胶技术领域。
背景技术
导电型胶粘剂，简称导电胶，是一种既能有效地胶接各种材料，又具有导电性能的胶粘剂。导电胶按其组成可分为结构型和填充型两大类。结构型是指作为导电胶基体的高分子材料本身即具有导电性的导电胶；填充型是指通常胶粘剂作为基体，而依靠添加导电性填料使胶液具有导电作用的导电胶。目前广泛使用的均为填充型导电胶。在填充型导电胶中添加的导电性填料，通常均为金属粉末，普遍使用的是银粉填充型导电胶。
近些年来，LED( 发光二极管) 的应用在照明领域得到了飞速的发展，与传统光源相比，LED 照明具有明显的节能环保的优势，是室内照明、景观照明、车辆照明等领域的未来趋势。LED 芯片的封装技术是LED 器件制造的核心技术之一，传统的封装技术可以很好地满足传统的小功率低亮度的LED 器件的要求。但是对于新兴的高亮度大功率LED 芯片的封装，随着LED 芯片的功率越来越大，而LED 芯片在进行电光转换时，大约有80％的电能变成热量，所以LED 芯片的散热问题变得越来越严重，其主要原因是过高的工作结温将大大影响其发光效果和工作寿命，从而影响整个LED 器件的长期使用。
传统上，为了获得良好的散热效果，LED 芯片的封装工艺当中，广泛使用了导电胶来将芯片和基材粘接起来以固定芯片，同时起到导电连接和散热的作用。传统的普通导电胶热导率相对比较低，低于10W/m·K，而高亮度大功率LED 芯片的散热要求其热导率能够高于20W/m·K，因而无法使用传统的导电胶，所以需要开发出具有更高导热效率的材料，比如高导热率导电胶，同时在粘接性能，电气性能，应用性能，可靠性能等综合性能方面也必须等同于甚至优于传统的导电胶。国内已经出现了一些导电胶产品，但是真正可以充分满足耐高温高亮度大功率LED 芯片的使用要求的产品却不多。
发明内容
本发明的目的是提供一种LED封装用导电胶，本发明通过乙烯-醋酸乙烯共聚体，香豆酮-茚树脂，聚乙烯醇缩丁醛，有机钛改性环氧树脂，聚吡咯，氧化锌，2,4,6- 三甲基苯甲酰基- 二苯基氧化膦，滑石粉，己二酸酰肼，环氧大豆油，反应稀释剂，固化剂，促进剂，偶联剂的复配，具有导电性能较好，尤其适宜于高端精细化电子电气元器件LED的导电粘接和封装。
本发明的目的是通过以下技术方案实现的，一种LED封装用导电胶，其特征在于，所述导电胶由以下重量份的各组份组成：乙烯-醋酸乙烯共聚体 2-15份，香豆酮-茚树脂3-6份，聚乙烯醇缩丁醛 2-7份，有机钛改性环氧树脂1-10份，聚吡咯1-3份，氧化锌0.2-2.6份，2,4,6- 三甲基苯甲酰基- 二苯基氧化膦 2-8份，滑石粉 0.2-1.8份，己二酸酰肼 1-2份，环氧大豆油2-4份，反应稀释剂 1-2份，固化剂 0.2-1.6份，促进剂 0.3-2份，偶联剂0.5-2.0份。
优选的，所述导电胶由以下重量份的各组份组成：乙烯-醋酸乙烯共聚体 13份，香豆酮-茚树脂 4.3份，聚乙烯醇缩丁醛 5.4份，有机钛改性环氧树脂6.7份，聚吡咯2.2份，氧化锌 1.8份，2,4,6-三甲基苯甲酰基-二苯基氧化膦 4.6份，滑石粉 1.4份，己二酸酰肼1.6份，环氧大豆油2.8份，反应稀释剂 1.3份，固化剂 0.9份，促进剂1.4份，偶联剂1.3份。
优选的，所述反应稀释剂为脂肪族缩水甘油醚环氧树脂。
优选的，所述固化剂为双氰胺、改性咪唑及其衍生物和改性胺类固化剂中的一种或多种。
优选的，所述促进剂包括2，4， 6- 三（二甲胺基甲基）苯酚和氨乙基哌嗪中的一种或两种。
优选的，所述偶联剂包括γ- 缩水甘油醚氧丙基三甲氧基硅烷和γ-（甲基丙烯酰氧）丙基三甲氧基硅烷中的一种或两种。
与现有技术相比，本发明具有以下有益效果：本发明通过乙烯-醋酸乙烯共聚体，香豆酮-茚树脂，聚乙烯醇缩丁醛，有机钛改性环氧树脂，聚吡咯，氧化锌，2,4,6- 三甲基苯甲酰基- 二苯基氧化膦，滑石粉，己二酸酰肼，环氧大豆油，反应稀释剂，固化剂，促进剂，偶联剂的复配，具有导电性能较好，尤其适宜于高端精细化电子电气元器件LED的导电粘接和封装。
具体实施方式
下面的实施例是对本发明技术方案进一步说明，但本发明的内容并不局限于此。
实施例1
一种LED封装用导电胶，按重量百分比由以下组份组成：乙烯-醋酸乙烯共聚体 2份，香豆酮-茚树脂 6份，聚乙烯醇缩丁醛 2份，有机钛改性环氧树脂10份，聚吡咯1份，氧化锌2.6份，2,4,6- 三甲基苯甲酰基- 二苯基氧化膦 2份，滑石粉 1.8份，己二酸酰肼 1份，环氧大豆油4份，反应稀释剂 1份，固化剂 1.6份，促进剂 0.3份，偶联剂2.0份。
反应稀释剂为脂肪族缩水甘油醚环氧树脂。固化剂为双氰胺、改性咪唑及其衍生物和改性胺类固化剂中的一种或多种。促进剂包括2，4， 6- 三（二甲胺基甲基）苯酚和氨乙基哌嗪中的一种或两种。偶联剂包括γ- 缩水甘油醚氧丙基三甲氧基硅烷和γ-（甲基丙烯酰氧）丙基三甲氧基硅烷中的一种或两种。
实施例2
一种LED封装用导电胶，按重量百分比由以下组份组成：乙烯-醋酸乙烯共聚体 15份，香豆酮-茚树脂 3份，聚乙烯醇缩丁醛 7份，有机钛改性环氧树脂1份，聚吡咯3份，氧化锌0.2份，2,4,6- 三甲基苯甲酰基- 二苯基氧化膦 8份，滑石粉 0.2份，己二酸酰肼 2份，环氧大豆油2份，反应稀释剂 2份，固化剂 0.2份，促进剂 2份，偶联剂0.5份。
反应稀释剂、固化剂、促进剂、偶联剂同实施例1。
实施例3
一种LED封装用导电胶，按重量百分比由以下组份组成：乙烯-醋酸乙烯共聚体 13份，香豆酮-茚树脂 4.3份，聚乙烯醇缩丁醛 5.4份，有机钛改性环氧树脂6.7份，聚吡咯2.2份，氧化锌 1.8份，2,4,6-三甲基苯甲酰基-二苯基氧化膦 4.6份，滑石粉 1.4份，己二酸酰肼1.6份，环氧大豆油2.8份，反应稀释剂 1.3份，固化剂 0.9份，促进剂1.4份，偶联剂1.3份。
反应稀释剂、固化剂、促进剂、偶联剂同实施例1。
实施例4
一种LED封装用导电胶，按重量百分比由以下组份组成：乙烯-醋酸乙烯共聚体 2.9份，香豆酮-茚树脂 3.5份，聚乙烯醇缩丁醛 2.9份，有机钛改性环氧树脂3.4份，聚吡咯1.4份，氧化锌0.8份，2,4,6- 三甲基苯甲酰基- 二苯基氧化膦 3.7份，滑石粉 0.9份，己二酸酰肼1.3份，环氧大豆油2.7份，反应稀释剂 1.1份，固化剂 0.6份，促进剂 0.8份，偶联剂0.8份。
反应稀释剂、固化剂、促进剂、偶联剂同实施例1。
实施例5
一种LED封装用导电胶，按重量百分比由以下组份组成：乙烯-醋酸乙烯共聚体 13.4份，香豆酮-茚树脂 5.2份，聚乙烯醇缩丁醛 6.3份，有机钛改性环氧树脂9.1份，聚吡咯2.7份，氧化锌2.1份，2,4,6- 三甲基苯甲酰基- 二苯基氧化膦 7.3份，滑石粉 1.4份，己二酸酰肼1.7份，环氧大豆油3.4份，反应稀释剂 1.7份，固化剂1.3份，促进剂 1.6份，偶联剂1.7份。
反应稀释剂、固化剂、促进剂、偶联剂同实施例1。

Claims (6)

1.一种LED封装用导电胶，其特征在于，所述导电胶由以下重量份的各组份组成：乙烯-醋酸乙烯共聚体 2-15份，香豆酮-茚树脂 3-6份，聚乙烯醇缩丁醛 2-7份，有机钛改性环氧树脂1-10份，聚吡咯1-3份，氧化锌0.2-2.6份，2,4,6- 三甲基苯甲酰基- 二苯基氧化膦 2-8份，滑石粉 0.2-1.8份，己二酸酰肼 1-2份，环氧大豆油2-4份，反应稀释剂 1-2份，固化剂0.2-1.6份，促进剂 0.3-2份，偶联剂0.5-2.0份。
2.根据权利要求1所述的一种LED封装用导电胶，其特征在于，所述导电胶由以下重量份的各组份组成：乙烯-醋酸乙烯共聚体 13份，香豆酮-茚树脂 4.3份，聚乙烯醇缩丁醛5.4份，有机钛改性环氧树脂6.7份，聚吡咯2.2份，氧化锌 1.8份，2,4,6-三甲基苯甲酰基-二苯基氧化膦 4.6份，滑石粉 1.4份，己二酸酰肼 1.6份，环氧大豆油2.8份，反应稀释剂1.3份，固化剂 0.9份，促进剂1.4份，偶联剂1.3份。
3.根据权利要求1所述的一种LED封装用导电胶，其特征在于，所述反应稀释剂为脂肪族缩水甘油醚环氧树脂。
4.根据权利要求1所述的一种LED封装用导电胶，其特征在于，所述固化剂为双氰胺、改性咪唑及其衍生物和改性胺类固化剂中的一种或多种。
5.根据权利要求1所述的一种LED封装用导电胶，其特征在于，所述促进剂包括2，4， 6-三（二甲胺基甲基）苯酚和氨乙基哌嗪中的一种或两种。
6.根据权利要求1所述的一种LED封装用导电胶，其特征在于，所述偶联剂包括γ- 缩水甘油醚氧丙基三甲氧基硅烷和γ-（甲基丙烯酰氧）丙基三甲氧基硅烷中的一种或两种。
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Publication number Priority date Publication date Assignee Title
CN108624259A (zh) * 2018-06-05 2018-10-09 汪逸凡 一种导电eva热熔胶

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CN102408856A (zh) * 2011-08-09 2012-04-11 烟台德邦电子材料有限公司 一种用于led封装的导电胶及其制备方法

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CN102408856A (zh) * 2011-08-09 2012-04-11 烟台德邦电子材料有限公司 一种用于led封装的导电胶及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108624259A (zh) * 2018-06-05 2018-10-09 汪逸凡 一种导电eva热熔胶

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