CN107858118A - 一种led封装用耐高温导电胶 - Google Patents
一种led封装用耐高温导电胶 Download PDFInfo
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Abstract
本发明涉及一种LED封装用耐高温导电胶，属于导电胶技术领域。LED封装用耐高温导电胶，由以下重量份的各组份组成：氢化双酚A 5‑10份，聚氨酯丙烯酸酯2‑8份，聚氨酯改性环氧树脂3‑9份，气相法二氧化硅1‑4份，轻质碳酸钙2‑8份，三氧化二铝3‑6份，己二醇二丙烯酸酯2‑8份，乙醇1‑3份，锌酸钙2‑5份，对叔丁基焦儿茶酚3‑10份，反应稀释剂1‑2份，固化剂0.2‑1.6份，促进剂0.3‑2份，偶联剂0.5‑2.0份。本发明通过原料之间的复配，具有导电性能较好，尤其适宜于高端精细化电子电气元器件LED的导电粘接和封装，且有效地提高了导电胶的耐热性。
Description
技术领域
本发明涉及一种LED封装用耐高温导电胶，属于导电胶技术领域。
背景技术
导电型胶粘剂，简称导电胶，是一种既能有效地胶接各种材料，又具有导电性能的胶粘剂。导电胶按其组成可分为结构型和填充型两大类。结构型是指作为导电胶基体的高分子材料本身即具有导电性的导电胶；填充型是指通常胶粘剂作为基体，而依靠添加导电性填料使胶液具有导电作用的导电胶。目前广泛使用的均为填充型导电胶。在填充型导电胶中添加的导电性填料，通常均为金属粉末，普遍使用的是银粉填充型导电胶。
近些年来，LED( 发光二极管) 的应用在照明领域得到了飞速的发展，与传统光源相比，LED 照明具有明显的节能环保的优势，是室内照明、景观照明、车辆照明等领域的未来趋势。LED 芯片的封装技术是LED 器件制造的核心技术之一，传统的封装技术可以很好地满足传统的小功率低亮度的LED 器件的要求。但是对于新兴的高亮度大功率LED 芯片的封装，随着LED 芯片的功率越来越大，而LED 芯片在进行电光转换时，大约有80％的电能变成热量，所以LED 芯片的散热问题变得越来越严重，其主要原因是过高的工作结温将大大影响其发光效果和工作寿命，从而影响整个LED 器件的长期使用。
传统上，为了获得良好的散热效果，LED 芯片的封装工艺当中，广泛使用了导电胶来将芯片和基材粘接起来以固定芯片，同时起到导电连接和散热的作用。传统的普通导电胶热导率相对比较低，低于10W/m·K，而高亮度大功率LED 芯片的散热要求其热导率能够高于20W/m·K，因而无法使用传统的导电胶，所以需要开发出具有更高导热效率的材料，比如高导热率导电胶，同时在粘接性能，电气性能，应用性能，可靠性能等综合性能方面也必须等同于甚至优于传统的导电胶。国内已经出现了一些导电胶产品，但是真正可以充分满足耐高温高亮度大功率LED 芯片的使用要求的产品却不多。
发明内容
本发明的目的是提供一种LED封装用耐高温导电胶，本发明通过氢化双酚A，聚氨酯丙烯酸酯，聚氨酯改性环氧树脂，气相法二氧化硅，轻质碳酸钙，三氧化二铝，己二醇二丙烯酸酯，乙醇，锌酸钙，对叔丁基焦儿茶酚，反应稀释剂，固化剂，促进剂，偶联剂的复配，具有导电性能较好，尤其适宜于高端精细化电子电气元器件LED的导电粘接和封装，且有效地提高了导电胶的耐热性。
本发明的目的是通过以下技术方案实现的，一种LED封装用耐高温导电胶，其特征在于，所述导电胶由以下重量份的各组份组成：氢化双酚A 5-10份，聚氨酯丙烯酸酯 2-8份，聚氨酯改性环氧树脂 3-9份，气相法二氧化硅 1-4份，轻质碳酸钙2-8份，三氧化二铝3-6份，己二醇二丙烯酸酯 2-8份，乙醇1-3份，锌酸钙2-5份，对叔丁基焦儿茶酚3-10份，反应稀释剂 1-2份，固化剂 0.2-1.6份，促进剂 0.3-2份，偶联剂0.5-2.0份。
优选的，所述导电胶由以下重量份的各组份组成：氢化双酚A 8份，聚氨酯丙烯酸酯 5份，聚氨酯改性环氧树脂 6份，气相法二氧化硅 2.4份，轻质碳酸钙5.5份，三氧化二铝4.7份，己二醇二丙烯酸酯 5.8份，乙醇2.6份，锌酸钙3.3份，对叔丁基焦儿茶酚8.7份，反应稀释剂 1.3份，固化剂 1.1份，促进剂 1.7份，偶联剂1.5份。
优选的，所述反应稀释剂为脂肪族缩水甘油醚环氧树脂。
优选的，所述固化剂为双氰胺、改性咪唑及其衍生物和改性胺类固化剂中的一种或多种。
优选的，所述包括2，4， 6- 三（二甲胺基甲基）苯酚和氨乙基哌嗪中的一种或两种。。
优选的，所述偶联剂包括γ- 缩水甘油醚氧丙基三甲氧基硅烷和γ-（甲基丙烯酰氧）丙基三甲氧基硅烷中的一种或两种。
与现有技术相比，本发明具有以下有益效果：本发明通过氢化双酚A，聚氨酯丙烯酸酯，聚氨酯改性环氧树脂，气相法二氧化硅，轻质碳酸钙，三氧化二铝，己二醇二丙烯酸酯，乙醇，锌酸钙，对叔丁基焦儿茶酚，反应稀释剂，固化剂，促进剂，偶联剂的复配，具有导电性能较好，尤其适宜于高端精细化电子电气元器件LED的导电粘接和封装，且有效地提高了导电胶的耐热性。
具体实施方式
下面的实施例是对本发明技术方案进一步说明，但本发明的内容并不局限于此。
实施例1
一种LED封装用耐高温导电胶，按重量百分比由以下组份组成：氢化双酚A 5份，聚氨酯丙烯酸酯 8份，聚氨酯改性环氧树脂 3份，气相法二氧化硅 4份，轻质碳酸钙2份，三氧化二铝 6份，己二醇二丙烯酸酯 2份，乙醇3份，锌酸钙2份，对叔丁基焦儿茶酚10份，反应稀释剂1份，固化剂 1.6份，促进剂 0.3份，偶联剂2.0份。
反应稀释剂为脂肪族缩水甘油醚环氧树脂。固化剂为双氰胺、改性咪唑及其衍生物和改性胺类固化剂中的一种或多种。促进剂包括2，4， 6- 三（二甲胺基甲基）苯酚和氨乙基哌嗪中的一种或两种。偶联剂包括γ- 缩水甘油醚氧丙基三甲氧基硅烷和γ-（甲基丙烯酰氧）丙基三甲氧基硅烷中的一种或两种。
实施例2
一种LED封装用耐高温导电胶，按重量百分比由以下组份组成：氢化双酚A 10份，聚氨酯丙烯酸酯 2份，聚氨酯改性环氧树脂 9份，气相法二氧化硅 1份，轻质碳酸钙8份，三氧化二铝 3份，己二醇二丙烯酸酯 8份，乙醇1份，锌酸钙5份，对叔丁基焦儿茶酚3份，反应稀释剂 2份，固化剂 0.2份，促进剂 2份，偶联剂0.5份。
反应稀释剂、固化剂、促进剂、偶联剂同实施例1。
实施例3
一种LED封装用耐高温导电胶，按重量百分比由以下组份组成：氢化双酚A 8份，聚氨酯丙烯酸酯 5份，聚氨酯改性环氧树脂 6份，气相法二氧化硅 2.4份，轻质碳酸钙5.5份，三氧化二铝 4.7份，己二醇二丙烯酸酯 5.8份，乙醇2.6份，锌酸钙3.3份，对叔丁基焦儿茶酚8.7份，反应稀释剂 1.3份，固化剂 1.1份，促进剂 1.7份，偶联剂1.5份。
反应稀释剂、固化剂、促进剂、偶联剂同实施例1。
实施例4
一种LED封装用耐高温导电胶，按重量百分比由以下组份组成：氢化双酚A 6.4份，聚氨酯丙烯酸酯3.3份，聚氨酯改性环氧树脂 4.7份，气相法二氧化硅 1.6份，轻质碳酸钙3.2份，三氧化二铝 3.6份，己二醇二丙烯酸酯 4.1份，乙醇1.4份，锌酸钙2.8份，对叔丁基焦儿茶酚3.9份，反应稀释剂 1.5份，固化剂 0.7份，促进剂 0.8份，偶联剂0.9份。
反应稀释剂、固化剂、促进剂、偶联剂同实施例1。
实施例5
一种LED封装用耐高温导电胶，按重量百分比由以下组份组成：氢化双酚A 9.2份，聚氨酯丙烯酸酯 7.0份，聚氨酯改性环氧树脂 8.2份，气相法二氧化硅 3.6份，轻质碳酸钙7.4份，三氧化二铝 5.5份，己二醇二丙烯酸酯7.3份，乙醇1.8份，锌酸钙4.1份，对叔丁基焦儿茶酚8.8份，反应稀释剂 1.7份，固化剂 1.4份，促进剂 1.7份，偶联剂1.7份。
反应稀释剂、固化剂、促进剂、偶联剂同实施例1。
Claims (6)
1.一种LED封装用耐高温导电胶，其特征在于，所述导电胶由以下重量份的各组份组成：氢化双酚A 5-10份，聚氨酯丙烯酸酯 2-8份，聚氨酯改性环氧树脂 3-9份，气相法二氧化硅 1-4份，轻质碳酸钙2-8份，三氧化二铝 3-6份，己二醇二丙烯酸酯 2-8份，乙醇1-3份，锌酸钙2-5份，对叔丁基焦儿茶酚3-10份，反应稀释剂 1-2份，固化剂 0.2-1.6份，促进剂0.3-2份，偶联剂0.5-2.0份。
2.根据权利要求1所述的一种LED封装用耐高温导电胶，其特征在于，所述导电胶由以下重量份的各组份组成：氢化双酚A 8份，聚氨酯丙烯酸酯 5份，聚氨酯改性环氧树脂 6份，气相法二氧化硅 2.4份，轻质碳酸钙5.5份，三氧化二铝 4.7份，己二醇二丙烯酸酯 5.8份，乙醇2.6份，锌酸钙3.3份，对叔丁基焦儿茶酚8.7份，反应稀释剂 1.3份，固化剂 1.1份，促进剂 1.7份，偶联剂1.5份。
3.根据权利要求1所述的一种LED封装用耐高温导电胶，其特征在于，所述反应稀释剂为脂肪族缩水甘油醚环氧树脂。
4.根据权利要求1所述的一种LED封装用耐高温导电胶，其特征在于，所述固化剂为双氰胺、改性咪唑及其衍生物和改性胺类固化剂中的一种或多种。
5.根据权利要求1所述的一种LED封装用耐高温导电胶，其特征在于，所述促进剂包括2，4， 6- 三（二甲胺基甲基）苯酚和氨乙基哌嗪中的一种或两种。
6.根据权利要求1所述的一种LED封装用耐高温导电胶，其特征在于，所述偶联剂包括γ- 缩水甘油醚氧丙基三甲氧基硅烷和γ-（甲基丙烯酰氧）丙基三甲氧基硅烷中的一种或两种。
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