CN107848076A - 包覆焊料线及其制造方法 - Google Patents

包覆焊料线及其制造方法 Download PDF

Info

Publication number
CN107848076A
CN107848076A CN201680040706.8A CN201680040706A CN107848076A CN 107848076 A CN107848076 A CN 107848076A CN 201680040706 A CN201680040706 A CN 201680040706A CN 107848076 A CN107848076 A CN 107848076A
Authority
CN
China
Prior art keywords
solder wire
solder
mass
covered
coating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680040706.8A
Other languages
English (en)
Chinese (zh)
Inventor
小林宏
宫内恭子
山边秀敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority claimed from PCT/JP2016/070135 external-priority patent/WO2017018155A1/ja
Publication of CN107848076A publication Critical patent/CN107848076A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C22C18/04—Alloys based on zinc with aluminium as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3611—Phosphates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134—Plasma spraying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/18—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2518/00—Other type of polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/20—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
CN201680040706.8A 2015-07-27 2016-07-07 包覆焊料线及其制造方法 Pending CN107848076A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015-147436 2015-07-27
JP2015147436 2015-07-27
JP2015212063A JP6471676B2 (ja) 2015-07-27 2015-10-28 被覆はんだワイヤおよびその製造方法
JP2015-212063 2015-10-28
PCT/JP2016/070135 WO2017018155A1 (ja) 2015-07-27 2016-07-07 被覆はんだワイヤおよびその製造方法

Publications (1)

Publication Number Publication Date
CN107848076A true CN107848076A (zh) 2018-03-27

Family

ID=57944738

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680040706.8A Pending CN107848076A (zh) 2015-07-27 2016-07-07 包覆焊料线及其制造方法

Country Status (3)

Country Link
EP (1) EP3330039A4 (enExample)
JP (1) JP6471676B2 (enExample)
CN (1) CN107848076A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018199147A (ja) * 2017-05-26 2018-12-20 住友金属鉱山株式会社 被覆はんだ材料の製造方法
DE102018100683A1 (de) * 2018-01-12 2019-07-18 EMIL OTTO Flux- und Oberflächentechnik GmbH Verfahren zur Herstellung eines Lotmittels
CN115743687B (zh) * 2023-01-10 2023-04-11 昆明金方金属制品有限公司 一种镀铜焊丝生产装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995032809A1 (en) * 1994-05-26 1995-12-07 Electrostatic Technology, Inc. Vertical electrostatic coater having vortex effect
JPH10166177A (ja) * 1996-12-10 1998-06-23 Tanaka Denshi Kogyo Kk 被覆半田材料及びその製造方法
CN1481970A (zh) * 2003-07-25 2004-03-17 南昌大学 一种锡锌基无铅钎料合金及其制备工艺
CN103990916A (zh) * 2014-05-21 2014-08-20 李佛妹 一种抑制气孔产生的电焊条
JP2014195831A (ja) * 2013-03-08 2014-10-16 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004339583A (ja) * 2003-05-16 2004-12-02 Sony Corp 錫又は錫合金材の表面処理剤、錫又は錫合金材及びその表面処理方法、錫合金系はんだ材料及びこれを用いたはんだペースト、錫合金系はんだ材料の製造方法、電子部品、プリント配線板、並びに電子部品の実装構造
JP2006255762A (ja) * 2005-03-18 2006-09-28 Uchihashi Estec Co Ltd 電子部品用線状はんだ
WO2007058969A2 (en) * 2005-11-10 2007-05-24 Wolverine Tube, Inc. Brazing material with continuous length layer of elastomer containing a flux
JP2013123741A (ja) * 2011-12-15 2013-06-24 Sumitomo Metal Mining Co Ltd 塑性変形性に優れたＰｂフリーはんだ合金
CN106211763B (zh) * 2014-03-25 2019-08-27 住友金属矿山株式会社 包覆焊料材料及其制造方法
CN106164334B (zh) * 2014-04-15 2019-11-29 住友金属矿山株式会社 包覆膜的形成方法以及发光二极管器件的制造方法
JP6455187B2 (ja) * 2015-01-29 2019-01-23 住友金属鉱山株式会社 被覆はんだワイヤおよびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995032809A1 (en) * 1994-05-26 1995-12-07 Electrostatic Technology, Inc. Vertical electrostatic coater having vortex effect
JPH10166177A (ja) * 1996-12-10 1998-06-23 Tanaka Denshi Kogyo Kk 被覆半田材料及びその製造方法
CN1481970A (zh) * 2003-07-25 2004-03-17 南昌大学 一种锡锌基无铅钎料合金及其制备工艺
JP2014195831A (ja) * 2013-03-08 2014-10-16 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
CN103990916A (zh) * 2014-05-21 2014-08-20 李佛妹 一种抑制气孔产生的电焊条

Also Published As

Publication number Publication date
JP2017024074A (ja) 2017-02-02
JP6471676B2 (ja) 2019-02-20
EP3330039A4 (en) 2019-01-02
EP3330039A1 (en) 2018-06-06

Similar Documents

Publication Publication Date Title
JP6160498B2 (ja) 被覆はんだ材料およびその製造方法
EP3618107B1 (en) Ceramic circuit substrate, method for manufacturing ceramic circuit substrate, and module using ceramic circuit substrate
CN106211763B (zh) 包覆焊料材料及其制造方法
CN104066534B (zh) 接合材料及使用其的接合方法
CN101689517B (zh) 半导体装置用接合线
Soichi et al. Low-temperature and low-pressure die bonding using thin Ag-flake and Ag-particle pastes for power devices
CN107848076A (zh) 包覆焊料线及其制造方法
Xin et al. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging
TW201728761A (zh) 金屬複合粉末及其製造方法（一）
WO2017018155A1 (ja) 被覆はんだワイヤおよびその製造方法
TW201633479A (zh) 塗覆焊料線及其製造方法
JP5828618B2 (ja) コーティング膜付きＰｂフリーＺｎ系はんだ合金及びその製造方法
CN111868849A (zh) 绝缘超导线材的制造方法
CN108962860A (zh) 一种耐氧化键合铜丝材料的制备方法
CN107891214A (zh) 一种基于电弧增材的铜表面熔覆钨铜的方法
JP6455187B2 (ja) 被覆はんだワイヤおよびその製造方法
JP2011238720A (ja) Ｂｉ系はんだ接合用の電子部品と基板及び電子部品実装基板
JP2024040144A (ja) 金属セラミック基材を製造するための方法及び炉
TW201728762A (zh) 金屬複合粉末及其製造方法（二）
JP5772021B2 (ja) パワーモジュール用基板の製造方法及びパワーモジュール用基板
JP2004218055A (ja) 導電性金ペーストを用いた無電解金メッキ代替導電性金皮膜の形成方法
JP2018199147A (ja) 被覆はんだ材料の製造方法
CN116837265A (zh) 一种液态金属导热材料及其涂层与制备方法和应用
JP2011194410A (ja) コーティングされたＰｂフリーＢｉ系はんだ合金およびその製造方法
CN116759316A (zh) 一种半导体功率模块封装衬底的制备方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180327